CN105960098B - A kind of preparation process of high-frequency high-speed organic substrate - Google Patents
A kind of preparation process of high-frequency high-speed organic substrate Download PDFInfo
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- CN105960098B CN105960098B CN201610343125.3A CN201610343125A CN105960098B CN 105960098 B CN105960098 B CN 105960098B CN 201610343125 A CN201610343125 A CN 201610343125A CN 105960098 B CN105960098 B CN 105960098B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The present invention provides a kind of new preparation processes of high-frequency high-speed organic substrate, unreeled, be coated with by mixing, copper foil, dried, it is secondary unreel, be laminated it is compound and winding, high frequency high-density organic substrate can be prepared, above-mentioned preparation method uses serialization, large area production method, preparation process is simple, and the high frequency high-density organic material substrate thickness of preparation is uniform and controllable, solvent volatilization is complete, pore-free and apparent defect, winding is neat, so as to realize the large area continuity steady production of high frequency high-density organic material substrate.
Description
Technical field
The present invention relates to technical field of material, more particularly, to a kind of preparation process of high-frequency high-speed organic substrate.
Background technique
The effect of high-frequency high-speed organic material substrate is to carry, fix electronic component, is formed using its surface or inside
Circuitous pattern carries out circuit connection, while having insulation, thermally conductive, isolation and protection component concurrently.As encapsulation technology is by traditional
Two-dimentional integration packaging develops to three-dimensionally integrated encapsulation direction, and high-frequency high-speed organic material substrate has become high-frequency high-speed organic group
One of preferred material of plate material.
Traditional high-frequency high-speed organic material substrate generally uses glass fabric as reinforcing material, corresponding height
Frequency high speed organic material substrate production technology is mainly impregnated in high-frequency high-speed organic material substrate slurry using by glass fabric
In material, dries and form that the copper foil covered pressure in two sides after prepreg is compound to be obtained.High-frequency high-speed organic material substrate requires substrate
Material thickness is relatively thin, therefore the high-frequency high-speed organic material substrate without glass fabric enhancing is following development trend.And show
Some organic material substrate preparation processes simultaneously can not be applied to high-frequency high-speed organic material substrate.
Summary of the invention
In view of this, being made up existing organic it is necessary to provide a kind of preparation method of the organic substrate of high-frequency high-speed
Baseplate material preparation process simultaneously can not be applied to high-frequency high-speed organic material substrate.
To achieve the above object, the present invention adopts the following technical solutions:
A kind of new preparation process of high-frequency high-speed organic substrate, successively includes the following steps:
Mixing: bismaleimide-cyanate ester resin, inorganic filler and organic solvent are uniformly mixed and obtain high frequency height
Fast organic substrate slurry；
Copper foil unreels: rotation copper foil unreels device, and the speed unreeled is cooperated to release copper foil；
Coating: the high-frequency high-speed organic substrate slurry is coated on a surface of the copper foil；
Drying: the copper foil after coating is dried to remove the solvent of the copper foil surface；
It is secondary to unreel: the copper foil after drying is unreeled；
It is laminated compound: two panels being coated with pressure roller of the coating of the high-frequency high-speed organic substrate slurry by heating and is laminated
It is compound, obtain high-frequency high-speed organic substrate；
Winding: by be laminated it is compound after high-frequency high-speed organic substrate wind.
In some embodiments, the inorganic filler is silica, boron nitride；The organic solvent be 2- butanone, third
Ketone and N ' N-dimethylformamide.
In some embodiments, the speed that the copper foil unreels is 1~20m/min.
In some embodiments, the copper foil with a thickness of 12 μm -35 μm, width 300-600mm.
In some embodiments, the speed of the coating is 1~20m/min, is coated with 5~20 μm of wet film thickness in monolayer.
In some embodiments, the drying is that the copper foil after coating is entered the long baking oven for allowing metal film to continue to pass through
It is dried.
In some embodiments, the compound temperature of the lamination is 80-200 DEG C, and lamination composite pressure is 1-20MPa.
The invention has the advantages that
The new preparation process of high-frequency high-speed organic substrate provided by the invention, unreeled, be coated with by mixing, copper foil, dried,
It is secondary to unreel, be laminated compound and winding, high frequency high-density organic substrate can be prepared, above-mentioned preparation method is using continuous
Change, large area production method, preparation process is simple, and the high frequency high-density organic material substrate thickness prepared is uniformly and controllable
Completely, pore-free and apparent defect, winding is neat, so as to realize high frequency high-density organic group plate for system, solvent volatilization
The large area continuity steady production of material.
Detailed description of the invention
Fig. 1 is the step of preparation process flow chart of high-frequency high-speed organic substrate provided in an embodiment of the present invention.
Specific embodiment
Referring to FIG. 1, a kind of preparation process of high-frequency high-speed organic substrate, successively includes the following steps:
Step S110: mixing, by bismaleimide-cyanate ester resin, inorganic filler and organic solvent in batch mixer
In be uniformly mixed obtain high-frequency high-speed organic material substrate slurry；The inorganic filler is silica, boron nitride；It is described organic
Solvent is 2- butanone, acetone and N ' N-dimethylformamide.
Step S120: copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreel speed
For 1~20m/min, copper thickness is 12 μm -35 μm, width 300-600mm.
Step S130: coating, in the high-frequency high-speed organic material substrate slurry that a surface of copper foil is coated with, coating speed is
1~20m/min is coated with 5~20 μm of wet film thickness in monolayer.
Step S140: the copper foil after coating is entered in the long baking oven for allowing metal film to continue to pass through and is dried except molten by drying
Agent, the temperature of drying are 60-150 DEG C, drying time 5-30min.
Step S150: it is secondary to unreel, the copper foil of high-frequency high-speed organic material substrate slurry will be coated on one surface of copper foil
The copper foil sent out from baking oven is cooperated to be unreeled.
Step S160: lamination is compound, and the coating that two panels is coated with high-frequency high-speed organic material substrate slurry is heated into mistake
Pressure roller lamination it is compound, lamination combined temp be 80-200 DEG C, lamination composite pressure be 1-20MPa；
Step S170: winding, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
The preparation process of high-frequency high-speed organic substrate provided by the invention, is unreeled by mixing, copper foil, is coated with, dried, two
It is secondary to unreel, be laminated compound and winding, can be prepared high frequency high-density organic substrate, above-mentioned preparation method using serialization,
Large area production method, preparation process is simple, and the high frequency high-density organic material substrate thickness prepared is uniform and controllable, molten
Completely, pore-free and apparent defect, winding is neat, so as to realize the big of high frequency high-density organic material substrate for agent volatilization
Area continuity steady production.
It is below specific embodiment part.
Embodiment 1
Bismaleimide-cyanate ester resin, silica and 2- butanone are uniformly mixed by a) mixing in batch mixer
Obtain high-frequency high-speed organic material substrate slurry；
B) copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreeling speed is 1m/
Min, copper thickness are 12 μm, width 300mm；
C) be coated with, copper foil a surface be coated with high-frequency high-speed organic material substrate slurry, coating speed 1m/min,
20 μm of wet film thickness in monolayer of coating；
D) it dries, the copper foil after coating is entered into drying in the long baking oven for allowing metal film to continue to pass through and is dried except solvent
Temperature be 60 DEG C, drying time 30min；
E) it unreels, the copper foil that high-frequency high-speed organic material substrate slurry is coated on one surface of copper foil is cooperated from baking oven
The copper foil sent out is unreeled；
F) lamination is compound, and two panels is coated with the coating of high-frequency high-speed organic material substrate slurry into the pressure roller layer of heating excessively
Press it is compound, lamination combined temp be 200 DEG C, lamination composite pressure be 1MPa；
G) wind, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
Embodiment 2
A) bismaleimide-cyanate ester resin, boron nitride and acetone are uniformly mixed in batch mixer and obtain high frequency
High speed organic material substrate slurry；
B) copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreeling speed is 20m/
Min, copper thickness are 35 μm, width 600mm；
C) it is coated with, in the high-frequency high-speed organic material substrate slurry that a surface of copper foil is coated with, coating speed 20m/
Min is coated with 5 μm of wet film thickness in monolayer；
D) it dries, the copper foil after coating is entered into drying in the long baking oven for allowing metal film to continue to pass through and is dried except solvent
Temperature be 150 DEG C, drying time 5min；
E) it unreels, the copper foil that high-frequency high-speed organic material substrate slurry is coated on one surface of copper foil is cooperated from baking oven
The copper foil sent out is unreeled；
F) lamination is compound, and two panels is coated with the coating of high-frequency high-speed organic material substrate slurry into the pressure roller layer of heating excessively
Press it is compound, lamination combined temp be 80 DEG C, lamination composite pressure be 20MPa；
G) wind, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
Embodiment 3
A) bismaleimide-cyanate ester resin, boron nitride and N ' N-dimethylformamide are mixed in batch mixer
It is even to obtain high-frequency high-speed organic material substrate slurry；
B) copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreeling speed is 10m/
Min, copper thickness are 18 μm, width 480mm；
C) it is coated with, in the high-frequency high-speed organic material substrate slurry that a surface of copper foil is coated with, coating speed 10m/
Min is coated with 10 μm of wet film thickness in monolayer；
D) it dries, the copper foil after coating is entered into drying in the long baking oven for allowing metal film to continue to pass through and is dried except solvent
Temperature be 120 DEG C, drying time 20min；
E) it unreels, the copper foil that high-frequency high-speed organic material substrate slurry is coated on one surface of copper foil is cooperated from baking oven
The copper foil sent out is unreeled；
F) lamination is compound, and two panels is coated with the coating of high-frequency high-speed organic material substrate slurry into the pressure roller layer of heating excessively
Press it is compound, lamination combined temp be 150 DEG C, lamination composite pressure be 10MPa；
G) wind, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
Embodiment 4
A) bismaleimide-cyanate ester resin, silica and acetone are uniformly mixed in batch mixer and obtain height
Frequency high speed organic material substrate slurry；
B) copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreeling speed is 5m/
Min, copper thickness are 35 μm, width 600mm；
C) it is coated with, in the high-frequency high-speed organic material substrate slurry that a surface of copper foil is coated with, coating speed is 1~20m/
Min is coated with 5~20 μm of wet film thickness in monolayer, and the copper thickness is 12 μm -35 μm, width 300-600mm；
D) it dries, the copper foil after coating is entered into drying in the long baking oven for allowing metal film to continue to pass through and is dried except solvent
Temperature be 60-150 DEG C, drying time 5-30min；
E) it unreels, the copper foil that high-frequency high-speed organic material substrate slurry is coated on one surface of copper foil is cooperated from baking oven
The copper foil sent out is unreeled；
F) lamination is compound, and two panels is coated with the coating of high-frequency high-speed organic material substrate slurry into the pressure roller layer of heating excessively
Press it is compound, lamination combined temp be 80-200 DEG C, lamination composite pressure be 5MPa；
G) wind, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
Embodiment 5
A) bismaleimide-cyanate ester resin, boron nitride and 2- butanone are uniformly mixed in batch mixer and obtain height
Frequency high speed organic material substrate slurry；
B) copper foil unreels, and copper foil is unreeled device rotation, the speed unreeled is cooperated to release metal film.Unreel speed be 1~
20m/min, copper thickness are 12 μm -35 μm, width 300-600mm；
C) it is coated with, in the high-frequency high-speed organic material substrate slurry that a surface of copper foil is coated with, coating speed is 1~20m/
Min is coated with 5~20 μm of wet film thickness in monolayer, and the copper thickness is 12 μm -35 μm, width 300-600mm；
D) it dries, the copper foil after coating is entered into drying in the long baking oven for allowing metal film to continue to pass through and is dried except solvent
Temperature be 60-150 DEG C, drying time 5-30min；
E) it unreels, the copper foil that high-frequency high-speed organic material substrate slurry is coated on one surface of copper foil is cooperated from baking oven
The copper foil sent out is unreeled；
F) lamination is compound, and two panels is coated with the coating of high-frequency high-speed organic material substrate slurry into the pressure roller layer of heating excessively
Press it is compound, lamination combined temp be 80-200 DEG C, lamination composite pressure be 10MPa；
G) wind, by be laminated it is compound after high-frequency high-speed organic substrate pack up.
Certainly the preparation process of high-frequency high-speed organic substrate of the invention can also have a variety of transformation and remodeling, not limit to
In the specific structure of above embodiment.In short, protection scope of the present invention should include those for ordinary skill people
It obviously converts or substitutes and retrofit for member.
Claims (4)
1. a kind of preparation process of high-frequency high-speed organic substrate, which is characterized in that successively include the following steps:
Mixing: bismaleimide-cyanate ester resin, inorganic filler and organic solvent are uniformly mixed and obtains high-frequency high-speed and has
Machine substrate slurry；
Copper foil unreels: rotation copper foil unreels device, and the speed unreeled is cooperated to release copper foil；
Coating: the high-frequency high-speed organic substrate slurry is coated on a surface of the copper foil；
Drying: the copper foil after coating is dried to remove the solvent of the copper foil surface；
It is secondary to unreel: the copper foil after drying is unreeled；
It is laminated compound: two panels being coated with pressure roller of the coating of the high-frequency high-speed organic substrate slurry by heating and is laminated again
It closes, obtains high-frequency high-speed organic substrate；
Winding: by be laminated it is compound after high-frequency high-speed organic substrate wind；
The inorganic filler is silica, boron nitride；The organic solvent is 2- butanone, acetone and N ' N dimethyl formyl
Amine；
The copper foil with a thickness of 12 μm -35 μm, width 300-600mm；
The speed of the coating is 1~20m/min, is coated with 5~20 μm of wet film thickness in monolayer.
2. the preparation process of high-frequency high-speed organic substrate according to claim 1, which is characterized in that the copper foil unreeled
Speed is 1~20m/min.
3. the preparation process of high-frequency high-speed organic substrate according to claim 1, which is characterized in that the drying is will to apply
Copper foil after cloth, which enters the long baking oven for allowing metal film to continue to pass through, is dried.
4. the preparation process of high-frequency high-speed organic substrate according to claim 1, which is characterized in that the lamination is compound
Temperature is 80-200 DEG C, and lamination composite pressure is 1-20MPa.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505753A (en) * | 2019-08-12 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of COP material and its preparation method and application applied to high-frequency high-speed flexible circuit board |
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| CN102152539A (en) * | 2010-11-11 | 2011-08-17 | 广东生益科技股份有限公司 | Continuous production method for aluminum-based copper-clad plate and continuous production line thereof |
| CN103173012A (en) * | 2013-03-01 | 2013-06-26 | 中国科学院深圳先进技术研究院 | Bismaleimide and triazine resin composite material, organic substrate and method for preparing organic substrate |
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| JP4136509B2 (en) * | 2001-12-18 | 2008-08-20 | 三井金属鉱業株式会社 | Manufacturing method of prepreg, manufacturing apparatus of prepreg, and manufacturing method of copper foil with insulating layer |
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- 2016-05-23 CN CN201610343125.3A patent/CN105960098B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152539A (en) * | 2010-11-11 | 2011-08-17 | 广东生益科技股份有限公司 | Continuous production method for aluminum-based copper-clad plate and continuous production line thereof |
| CN103173012A (en) * | 2013-03-01 | 2013-06-26 | 中国科学院深圳先进技术研究院 | Bismaleimide and triazine resin composite material, organic substrate and method for preparing organic substrate |
Non-Patent Citations (1)
| Title |
|---|
| 集成电路板用氰酸酯树脂复合材料研究;方芬;《中国优秀硕士学位论文全文数据库工程科技Ⅰ辑》;20070715;第1-33页 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505753A (en) * | 2019-08-12 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of COP material and its preparation method and application applied to high-frequency high-speed flexible circuit board |
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