CN105954975B - A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth - Google Patents
A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth Download PDFInfo
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- CN105954975B CN105954975B CN201610495940.1A CN201610495940A CN105954975B CN 105954975 B CN105954975 B CN 105954975B CN 201610495940 A CN201610495940 A CN 201610495940A CN 105954975 B CN105954975 B CN 105954975B
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- circle
- end cap
- vacuum suction
- suction piece
- wifi
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a kind of WiFi shape end caps being exclusively used on sol evenning machine tray vacuum suction piece mouth, and WiFi shape end cap includes circular end face and lower chamber, is fixedly connected between circular end face and lower chamber；The center of circular end face is equipped with center circle, the surrounding of center circle is uniformly placed with several circle small sircle holes to external diffusion, roundlet pore diameter size on same circle is all the same, and the small sircle hole of outmost turns is diffused with the symmetrical arc groove of two column outward, and each column arc groove is arranged at WiFi shape；The center of lower chamber is equipped with aspirating hole, and aspirating hole periphery is equipped with several circle retaining plates, sets the retaining plate opposite there are two position on every circle retaining plate.The present invention passes through rotary-tray end cap, the difference of the range of arc groove is covered using retaining plate, it can be achieved that adjusting the size of vacuum adsorption force suffered by substrate, therefore be suitable for the spin coating requirement of different-thickness substrate, while meeting its spin coating performance requirement, reduce substrate deformation quantity.
Description
Technical field
The invention belongs to the technical fields of spin coating machine equipment, and in particular to one kind is exclusively used in sol evenning machine tray vacuum suction piece mouth
On WiFi shape end cap.
Background technique
Silicon wafer is sucked in existing photoresist glue evenning table by the way of vacuum suction piece, but existing silicon wafer wafer-supporting platform can not have
The blocking photoresist of effect penetrates into vacuum suction piece mouth during whipping, and reason is: in existing technology, silicon wafer and vacuum are inhaled
Piece mouth directly contacts, sol evenning machine in high-speed rotation process, synergy of the photoresist by rotary centrifugal force and surface tension, quilt
It is launched into thin film, is wherein thrown out of during whipping to the glue drop of silicon chip edge, due to silicon chip edge and wafer-supporting platform suction piece
The glue drop of the effect of the surface tension of the pressure difference and colloid of mouth, part silicon chip edge can be inhaled into vacuum along the back side of silicon wafer
In suction piece mouth, to block vacuum suction piece mouth, cause vacuum suction piece mouth suction insufficient, to cause the uniformity of photoresist film
It is deteriorated, while glue evenning table can be caused to damage.
In Patent No.: ZL 201310686050.5, patent of invention title are as follows: in the patent of sol evenning machine support holder structure, though
So by opening up storage glue groove in the centre of silicon wafer wafer-supporting platform, it is thrown out of photoresist during whipping to the glue of silicon chip back side
It first flows into storage glue groove under gravity, so that photoresist be stopped to be inhaled into vacuum suction piece mouth, solves vacuum and inhale
Piece mouth is because the problem of suction is insufficient caused by sucking photoresist or blocks.But in practice process, due to suction mouth piece
One section of space length is had between silicon wafer load plane, therefore, silicon wafer can inhale outlet for lantern slide in vacuum and bear biggish downward effect
Suction, and the top of hollow storage glue groove it is not upward support force support, lead to the discontinuity of entire silicon wafer,
The appearance of the case where to have silicon wafer downward depressed deformation, so that the silicon wafer after processing does not meet the requirement of product.
Also, above-mentioned patent, in practice process, be not fully solved vacuum suction piece mouth causes because sucking photoresist
The problem of suction is insufficient or blocking, reason is: the part glue positioned at the back side of the silicon wafer of the surface of vacuum suction piece mouth drips
It can be in the surface of vacuum suction piece mouth, can directly be dropped in vacuum suction piece mouth, or pass through the suction of vacuum suction piece mouth
Power is directly sucked in vacuum suction piece mouth, to block vacuum suction piece mouth.
During spin coating proceeding, vacuum adsorption force needed for the substrate of different-thickness is different, the pull of vacuum suffered by the substrate
Its deformation quantity will increase when excessive, therefore influence spin coating proceeding performance indicator；And when the vacuum adsorption force deficiency suffered by the substrate,
" film flying " phenomenon will occur.And existing pallet is the adsorption entails for meeting the substrate of different-thickness, needs replacing different patterns
Pallet, to increase the production cost of enterprise.
In addition, Patent No.: ZL 201310685767.8, patent of invention title are as follows: the sol evenning machine support for preventing glue from sucking
Disk；Patent No.: ZL 201310685554.5, patent of invention title are as follows: the sol evenning machine pallet with protection structure；Two patents
In, it also has 2 above-mentioned problems and exists.
Summary of the invention
Goal of the invention: in order to solve the shortcomings of the prior art, the present invention provides one kind to be exclusively used in sol evenning machine pallet
WiFi shape end cap on vacuum suction piece mouth.
Technical solution: a kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth, the WiFi shape end
Lid be fixedly mounted on the vacuum suction piece mouth of sol evenning machine pallet, the WiFi shape end cap include circular end face and with the round nose
The lower chamber that face matches；
The center of the circular end face is equipped with center circle, and the surrounding of the center circle is uniformly placed with several circles to external diffusion
Small sircle hole, the roundlet pore diameter size on same circle is all the same, and it is symmetrical that the small sircle hole of outmost turns is diffused with two column outward
Arc groove, each column arc groove are arranged at WiFi shape；
The center of the lower chamber is equipped with aspirating hole, and the aspirating hole is in a circular table shape, and the aspirating hole periphery is equipped with several
Retaining plate is enclosed, the retaining plate opposite there are two position is set on every circle retaining plate, the retaining plate of two adjacent rings is in 90 ° from each other
It is staggered；
It is rotatably fixedly connected between the circular end face and lower chamber by plug, forms cavity, the retaining plate pair
Should be immediately below arc groove, the width of retaining plate is greater than arc groove 1mm, by rotating the intracorporal ventilatory capacity of circular end face adjusting cavity
Size.
As optimization: the diameter of the center circle is 6mm-10mm.
As optimization: the circle number of the small sircle hole is 3-5, and the diameter of each small sircle hole is 0.75mm-1.5mm.
As optimization: the spacing in each column arc groove between two adjacent arc grooves is 5mm-7mm.
As optimization: the specific structure size of aspirating hole are as follows: highly lower than wafer-supporting platform 2-3mm, the gradient be 90o extremely
130o。
The utility model has the advantages that the present invention covers the difference of the range of arc groove using retaining plate by rotary-tray end cap, it can be real
The size of vacuum adsorption force suffered by substrate is now adjusted, therefore is suitable for the spin coating requirement of different-thickness substrate, is meeting its spin coating
While performance requirement, reduce substrate deformation quantity.
The present invention can solve the problems, such as 2 of glue drop blocking vacuum suction piece mouth and the downward depressed deformation of silicon wafer simultaneously, not only
The service life of vacuum suction piece mouth is extended, and the silicon wafer after processing is not in waste material, so that enterprise be greatly saved
Economic cost.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is the structural schematic diagram of circular end face of the invention；
Fig. 3 is the structural schematic diagram of lower chamber of the invention；
Fig. 4 is intracavitary vacuum degree distribution schematic diagram of the invention；
Fig. 5 is the substrate deformation contrast schematic diagram of pallet-free end cap and WiFi shape end cap in the present invention；
Fig. 6 is the substrate deformation schematic diagram of WiFi shape end cap in the present invention.
Specific embodiment
The present invention is further explained in the light of specific embodiments.
Embodiment
As shown in Figure 1-3, a kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth, the WiFi shape
End cap is fixedly mounted on the vacuum suction piece mouth of sol evenning machine pallet, the WiFi shape end cap include circular end face 1 and with the circle
The lower chamber 2 that shape end face 1 matches.
The center of the circular end face 1 is equipped with center circle 11, and the diameter of the center circle 11 is 6mm-10mm.Institute
The surrounding for stating center circle 11 is uniformly placed with several circle small sircle holes 12 to external diffusion, and 12 diameter of small sircle hole on same circle is equal
Identical, specifically, the circle number of the small sircle hole 12 can be 3-5, and the diameter of each small sircle hole 12 can be 0.75mm-
1.5mm.The small sircle holes 12 of outmost turns is diffused with the symmetrical arc groove 13 of two column outward, and each column arc groove 13 is at WiFi
Shape is arranged, and the spacing in each column arc groove 13 between two adjacent arc grooves 13 is 5mm-7mm.
The center of the lower chamber 2 is equipped with aspirating hole 21, and the aspirating hole 21 is in a circular table shape, and the aspirating hole 21 is specific
Structure size are as follows: highly lower than wafer-supporting platform 2-3mm, the gradient be 90o to 130o.21 periphery of aspirating hole is equipped with several circles
Retaining plate 22, every enclose set the retaining plate 22 opposite there are two position on retaining plate 22, the retaining plate 22 of two adjacent rings is from each other
It is staggered in 90 °.
It is rotatably fixedly connected between the circular end face 1 and lower chamber 2 by plug, forms cavity, the retaining plate
22 is corresponding immediately below arc groove 13, and the width of retaining plate 22 is greater than the 1mm of arc groove 13, is adjusted by rotation circular end face 1
The size of the intracorporal ventilatory capacity of chamber.
As shown in figure 4, intracavitary vacuum degree distribution situation of the invention is as follows: it can be seen that intracavitary negative pressure of vacuum is distributed
Uniformly, so can avoid the colloid being inhaled into is inhaled into vacuum suction room under the action of pressure difference.
As seen in figs. 5-6, show that deformation quantity is dropped from 65 μm from pallet-free end cap and the substrate deformation comparison of WiFi shape end cap
Down to 0.33 μm, the use of WiFi shape end cap substantially reduces the deformation quantity of substrate, so that spin coating proceeding performance indicator can be improved.
The present invention covers the difference of the range of arc groove, it can be achieved that adjusting base by rotary-tray end cap, using retaining plate
The size of vacuum adsorption force suffered by piece, therefore it is suitable for the spin coating requirement of different-thickness substrate, meeting its spin coating performance requirement
While, reduce substrate deformation quantity.
The present invention can solve the problems, such as 2 of glue drop blocking vacuum suction piece mouth and the downward depressed deformation of silicon wafer simultaneously, not only
The service life of vacuum suction piece mouth is extended, and the silicon wafer after processing is not in waste material, so that enterprise be greatly saved
Economic cost.
The present invention is not limited to above-mentioned preferred forms, anyone can show that other are various under the inspiration of the present invention
The product of form, however, make any variation in its shape or structure, it is all that there is skill identical or similar to the present application
Art scheme, is within the scope of the present invention.
Claims (4)
1. a kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth, the WiFi shape end cap are fixedly mounted on
On the vacuum suction piece mouth of sol evenning machine pallet, it is characterised in that: the WiFi shape end cap include circular end face (1) and with the circle
The lower chamber (2) that end face (1) matches；
The center of the circular end face (1) is equipped with center circle (11), and the surrounding of the center circle (11) is uniformly arranged to external diffusion
There are several circle small sircle holes (12), small sircle hole (12) diameter on same circle is all the same, and the small sircle hole (12) of outmost turns is outside
It is diffused with the symmetrical arc groove of two column (13), each column arc groove (13) is arranged at WiFi shape；
The center of the lower chamber (2) is equipped with aspirating hole (21), and the aspirating hole (21) is in a circular table shape, and the aspirating hole (21) is outside
It encloses and is equipped with several circle retaining plates (22), the retaining plate (22) opposite there are two position, two adjacent rings are set on every circle retaining plate (22)
Retaining plate (22) from each other in 90 ° it is staggered；
It is rotatably fixedly connected between the circular end face (1) and lower chamber (2) by plug, forms cavity, the retaining plate
(22) it corresponds to immediately below arc groove (13), the width of retaining plate (22) is greater than arc groove (13) 1mm, by rotating circular end face
(1) size of the intracorporal ventilatory capacity of adjusting cavity.
2. the WiFi shape end cap according to claim 1 being exclusively used on sol evenning machine tray vacuum suction piece mouth, it is characterised in that:
The diameter of the center circle (11) is 6mm-10mm.
3. the WiFi shape end cap according to claim 1 being exclusively used on sol evenning machine tray vacuum suction piece mouth, it is characterised in that:
The circle number of the small sircle hole (12) is 3-5, and the diameter of each small sircle hole (12) is 0.75mm-1.5mm.
4. the WiFi shape end cap according to claim 1 being exclusively used on sol evenning machine tray vacuum suction piece mouth, it is characterised in that:
Spacing in each column arc groove (13) between two adjacent arc grooves (13) is 5mm-7mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495940.1A CN105954975B (en) | 2016-06-29 | 2016-06-29 | A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495940.1A CN105954975B (en) | 2016-06-29 | 2016-06-29 | A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105954975A CN105954975A (en) | 2016-09-21 |
| CN105954975B true CN105954975B (en) | 2019-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610495940.1A Active CN105954975B (en) | 2016-06-29 | 2016-06-29 | A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107499937A (en) * | 2017-08-17 | 2017-12-22 | 中国南玻集团股份有限公司 | Adsorption method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158625A (en) * | 1984-01-27 | 1985-08-20 | Hitachi Ltd | Flat board fixing device |
| CN102386051A (en) * | 2010-09-02 | 2012-03-21 | 北京中电科电子装备有限公司 | Slice absorbing platform device |
| CN103691632A (en) * | 2013-12-16 | 2014-04-02 | 南通大学 | Tray structure of photoresist homogenizer |
| CN103706525A (en) * | 2013-12-16 | 2014-04-09 | 南通大学 | Photoresist suction prevention type spin coater tray |
| CN205096062U (en) * | 2015-10-19 | 2016-03-23 | 润奥电子(扬州)制造有限公司 | Even chuck of gluing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100549954B1 (en) * | 2004-06-10 | 2006-02-07 | 삼성전자주식회사 | Spinner apparatus for manufacturing semiconductor |
-
2016
- 2016-06-29 CN CN201610495940.1A patent/CN105954975B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158625A (en) * | 1984-01-27 | 1985-08-20 | Hitachi Ltd | Flat board fixing device |
| CN102386051A (en) * | 2010-09-02 | 2012-03-21 | 北京中电科电子装备有限公司 | Slice absorbing platform device |
| CN103691632A (en) * | 2013-12-16 | 2014-04-02 | 南通大学 | Tray structure of photoresist homogenizer |
| CN103706525A (en) * | 2013-12-16 | 2014-04-09 | 南通大学 | Photoresist suction prevention type spin coater tray |
| CN205096062U (en) * | 2015-10-19 | 2016-03-23 | 润奥电子(扬州)制造有限公司 | Even chuck of gluing |
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| Publication number | Publication date |
|---|---|
| CN105954975A (en) | 2016-09-21 |
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| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Qiang Inventor after: Wu Tingxi Inventor after: Chen Yun Inventor after: Deng Jie Inventor after: Zhu Haifeng Inventor before: Wei Cunlu Inventor before: Wang Qiang Inventor before: Hua Guoran Inventor before: Huang Qianlu |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201111 Address after: Xiting town Shachang neighborhood committee, Tongzhou District, Nantong City, Jiangsu Province 226300 Patentee after: Nantong Xinrong Machinery Parts Co.,Ltd. Address before: 226000 Jiangsu city of Nantong province sik Road No. 9 Patentee before: NANTONG University |