CN105935290A - Flexible temperature plaster - Google Patents
Flexible temperature plaster Download PDFInfo
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- CN105935290A CN105935290A CN201610224512.5A CN201610224512A CN105935290A CN 105935290 A CN105935290 A CN 105935290A CN 201610224512 A CN201610224512 A CN 201610224512A CN 105935290 A CN105935290 A CN 105935290A
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- body temperature
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- flexible body
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6813—Specially adapted to be attached to a specific body part
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- Health & Medical Sciences (AREA)
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- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
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- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
The invention discloses a flexible temperature plaster. The flexible temperature plaster comprises a flexible basal layer having a first surface and a second surface opposite to the first surface and a function circuit layer at least used for monitoring body temperature. The function circuit layer comprises a conducting circuit and a function device arranged on the first surface. The function device is electrically combined with the conducting circuit. The overall thickness of the temperature plaster is less than 2 mm. The function device further comprises a power supply management module, a temperature-sensing element, a control and wireless communication module and the like. The flexible temperature plaster has following beneficial effects: the flexible temperature plaster is manufactured by adoption of printing electronic technology and features thinness, smoothness and small size; a person can feel more comfortable to wear; and by the integration of wireless transmission technology, real-time monitor and transmission of human temperature can be achieved.
Description
Technical field
The present invention relates to a kind of temperature monitoring equipment, particularly to a kind of ultrathin flexible body temperature patch, belong to wearable device technology neck
Territory.
Background technology
Body temperature refers to the mean temperature in human body, is the product of substance metabolism.The temperature of normal human is relative constancy, has
Certain temperature range.The change of body temperature can reflect the change of human body physiological characteristics, and abnormal body temperature is often the performance of numerous disease,
The change grasping sufferer body temperature in clinical practice has great importance.
At present, conventional temperature check position includes oral temperature, rectal temperature and axillary temperature.In real life, for
Health considers, is most commonly used that axillary temperature is measured.And conventional temperature check instrument is mercurial thermometer, it is easily broken draws
Play mercury pollution, be held on during detection at axillary fossa, be unfavorable for wearing and continuous temperature check.
Along with the development of modern science and technology, people have also been developed various electronic clinical thermometer, such as infrared thermometer, critesistor body
Temperature meter etc..But these clinical thermometers are all based on conditional electronic technological development, substantially it is required for using hardboard circuit to be prepared.
Such as, CN204581243U discloses a kind of body temperature detector, and it is by being integrated in body temperature trans and circuit in a shell,
Simplified the size of whole Circuits System, but owing to whole detector is hard material, thickness be the thickest, have impact on wear relax
Adaptive.The most such as, CN105046299A discloses a kind of wearable Intellectual temperature detecting system based on NFC technique, this temperature
Scale label use passive label to prepare, and are suitable for dressing, but owing to this labeling requirement near-field readers is powered reading with temperature data
Take, be not therefore suitable for the temperature survey of axillary fossa etc., and be inconvenient to carry out continuous print temperature detection.
In recent years, the proposition of wearable electronic concept and development, occur in that some can monitor the intelligent hands of quantity of motion and pulse in real time
Ring, but these products can't accurately measure body temperature, well can not fit with body curve, and comfort is poor.
Thus, it is provided that a kind of flexibility, wearing comfort, ultra-thin small-sized apparatus for testing body temperature have become as and realize wearable physiology prison
The important subject surveyed.
Summary of the invention
Present invention is primarily targeted at a kind of flexible body temperature patch of offer, to overcome deficiency of the prior art.
For achieving the above object, present invention employs following technical scheme:
Embodiments provide a kind of flexible body temperature patch, comprising:
Have first surface and with first surface back to the flexible base layer of second surface,
At least for monitoring the functional circuit layer of body temperature, including being arranged at conducting wire and the functional device of described first surface, institute
State functional device to be electrically combined with described conducting wire；
Further, the integral thickness of described body temperature patch is less than 2mm.
Further, described functional device includes temperature-sensing element.
In some preferred embodiments, described body temperature patch also includes that sealing coat, described sealing coat are arranged at described functional circuit layer
Surface and with functional circuit layer electric insulation, and at least can affect the impurity entered function of described functional circuit layer performance for stoping
Circuit layer.
In some preferred embodiments, described flexible base layer is less than 1.5mm with the thickness of functional circuit layer.
In some preferred embodiments, the thickness of described flexible base layer be less than 100 μm, preferably smaller than 60 μm, the most excellent
Choosing is less than 30 μm.
In some preferred embodiments, described functional circuit layer be smaller in size than 3cm*3cm.
In some embodiments, described first surface is distributed groove, and groove described in the locally embedding of described conducting wire or
Described conducting wire entirety is accommodated in described groove.
In some preferred embodiments, described body temperature patch wirelessly coordinates with external equipment, and described wireless mode includes
Any one in bluetooth, Zigbee, wifi, GPRS.
In some preferred embodiments, the thickness of described functional device is less than 1.5mm, wherein being smaller in size than of discrete device
7mm*7mm。
In some preferred embodiments, described functional device is selected from miniature patch device or the functional device of solutionization printing preparation.
Compared with prior art, the invention have the advantages that the flexible body temperature patch of offer has the spies such as ultra-thin, flexible and size is little
Point, well can fit with human body, and comfortableness is good, and can monitor body temperature in real time, accurately, and easily prepared, is suitable to
Large-scale production.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or prior art
In description, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only the one of the present invention
A little embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to according to this
A little accompanying drawings obtain other accompanying drawing.
Fig. 1 a is the cross-sectional view of a kind of flexible body temperature patch in one embodiment of this invention；
Fig. 1 b is the cross-sectional view of a kind of flexible body temperature patch including screen layer in one embodiment of this invention；
Fig. 1 c is the cross-sectional view of a kind of flexible body temperature patch including anti-skid structure in one embodiment of this invention；
Fig. 1 d is the cross-sectional view of a kind of flexible body temperature patch including adhered layer in one embodiment of this invention；
Fig. 1 e is the cross-sectional view of a kind of flexible body temperature patch including drying layer in one embodiment of this invention；
Fig. 2 is the cross-sectional view of a kind of conducting wire in one embodiment of this invention；
Fig. 3 is the cross-sectional view of another kind of conducting wire in one embodiment of this invention；
Fig. 4 is the sectional view of the integrated morphology of a kind of functional device and conducting wire in one embodiment of this invention；
Fig. 5 is the cross-sectional view of the conducting wire of a kind of multiple structure in one embodiment of this invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives
The better embodiment of the present invention.But, the present invention can be realized by many different forms, however it is not limited to is retouched below
The embodiment stated.On the contrary, provide the purpose of these embodiments be make to the disclosure understand more thorough
Comprehensively.
Unless otherwise defined, the technology people of all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that member is generally understood that is identical.The term used the most in the description of the invention is intended merely to describe concrete enforcement
The purpose of mode, it is not intended that in limiting the present invention.Term as used herein "and/or" includes one or more relevant institute
Arbitrary and all of combination of list of items.
Embodiments provide a kind of flexible body temperature patch, including:
Have first surface and with first surface back to the flexible base layer of second surface,
At least for monitoring the functional circuit layer of body temperature, including being arranged at conducting wire and the functional device of described first surface, institute
State functional device to be electrically combined with described conducting wire；
Further, the integral thickness of described body temperature patch is less than 2mm.
Described body temperature pastes because of its flexible and ultra-thin feature, is affixed on human body and does not interferes with comfortableness, and it is bent to well adapt to human body
Line and the most firm fit on human body, and less there will be because of scraping the unexpected problem such as come off from human body.
Described " being arranged at " may be implemented in a variety of ways, such as: described functional circuit layer can be integrally molded in described first surface；
Or, described functional circuit layer also adheres to described first surface；Or, described functional circuit layer is known also by industry
Other suitable method be attached to described first surface, be not described in detail herein.
In some preferred embodiments of the present invention, functional circuit layer shape can be made by modes such as printing, physical/chemical depositions
Become described first surface, to reduce described body temperature patch integral thickness, and simplify the processing procedure of described body temperature patch.
Further, in some embodiments, the conducting wire in described functional circuit layer can use printed pattern technology system
Standby, it is formed directly in the first surface of described flexible substrates.
Further, in some embodiments, the first surface of described flexible substrates also can be formed with groove, described function electricity
Conducting wire in the floor of road can be embedded in described groove with a part or whole part, and this kind is designed with and helps reduce described body temperature further
The thickness of patch.
Further, described conducting wire can use printing technology to prepare, including silk screen printing, ink jet printing, intaglio printing,
Letterpress, trans-printing, aerosol printing and mixed printing etc., and it is not limited to this, and the patterned conductive line being consequently formed
Road can be dispensed directly onto the first surface of described flexible substrates or a part or whole part is located at what the first surface of described flexible substrates was formed
In groove, and surface, conducting wire has good electric conductivity, is beneficial to functional device integrated.
Further, described conducting wire also can be imprinted with the groove that technology preparation is formed at the first surface of described flexible substrates
In.
Further, described functional device can be combined by suitable method multiple known to industry between conducting wire.Such as,
In some preferred embodiments of the present invention, low-temperature bounding method can be used to realize the integrated of functional device and conducting wire and shape
Become described functional circuit layer.Wherein, described soldered temperature is preferably shorter than 160 DEG C, to reduce functional device and conduction
The damage etc. of circuit, and ensure both the most in electrical contact and bond strength.
Further, the functional device in described functional circuit layer can be selected for the functional device of suitable type known to industry, especially
Being the functional device of one or more miniaturization, these functional devices connect formation by conducting wire and have temperature-monitoring function
Performance loop.Such as, described functional device preferably uses miniature patch device or the functional device of solutionization printing preparation, its
Thickness is preferably smaller than 1.5mm, and wherein the size of discrete device is preferably smaller than 7mm*7mm.
Further, the functional device in described functional circuit layer can include temperature sensor, power module, control module,
One or more in communication module, display module etc., the most also can also include other functional module.
Further, described flexible base layer can use polymer thin-film material or composite film material, and its thickness is preferably smaller than
100 μm, are further preferably no larger than 60 μm, particularly preferably less than 30 μm.
Wherein, described polymer thin-film material include polydimethylsiloxane, polymethyl methacrylate, polyethylene, polypropylene,
Polrvinyl chloride, polyethylene terephthalate, Merlon, PEN and polyimides etc., but be not limited to
This.And described composite film material can include mixing material or the multilayer polymer film material of different polymer.
More preferred, described flexible base layer is less than 1.5mm with the thickness of functional circuit layer.
More preferred, described functional circuit layer be smaller in size than 3cm*3cm, so that described body temperature patch can be affixed on all easily
Such as positions such as human body axillary fossas, and then realize the accurate measurement to body temperature, and do not affect the regular event of human body.
Further, in some embodiments of the present invention, for enabling users to more get information about relevant body temperature information, also
Can described body temperature stick also can integrally disposed information display module etc., such as can pass through color change, numeral, word etc. to
User shows the module of body temperature information, particularly flexible information display module (such as flexible display screen) etc..
Further, in some embodiments of the present invention, it is possible to wireless communication module etc. is set in described body temperature pastes, makes
Obtain described body temperature patch and wirelessly temperature information can be transferred to external equipment.Wherein, described wireless mode include bluetooth,
Zigbee, wifi, GPRS etc., but it is not limited to this.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include sealing coat, and described sealing coat is arranged
In described functional circuit layer surface and with functional circuit layer electric insulation, at least can affect described functional circuit layer performance for prevention
Impurity (such as steam etc., but be not limited to this) entered function circuit layer.
More preferred, described sealing coat can be membrane structure, and its thickness is less than 0.5mm, and on the one hand it have aforementioned function,
I.e. isolation steam and the impurity of other influences circuit performance, on the other hand, this sealing coat also can be strengthened functional circuit layer and tie with other
Adhesion between structure layer (encapsulated layer the most hereafter will addressed).
Wherein, the material of described sealing coat can selected from insulation, the organic or inorganic material with good water vapor rejection performance or
Suitable polymeric material etc. known to its composite etc., such as industry, but it is not limited to this.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include encapsulated layer, in order to described body temperature
The internal structure of patch is packaged and protects.
Wherein, described encapsulated layer can cover in the first surface of described flexible base layer, and by functional circuit layer and that may be present
Sealing coat is coated with, and forms single-face packaging structure, functional circuit layer to be formed good protection, and less increase described body temperature patch
Thickness.
Wherein, described encapsulated layer also can be coated with described flexible base layer, functional circuit layer and sealing coat, particularly can be by described
The overall parcel such as flexible base layer, functional circuit layer and sealing coat, with the overall structure that described body temperature is pasted formed well packaged and
Protection.
Preferably, remaining component in described flexible body temperature pastes, in addition to described encapsulated layer is all wrapped in described encapsulation by entirety
In layer.
Wherein, described encapsulated layer can be selected for the material formation that industry is known, have good flexibility and biological safety.Preferably,
The composition material of described sealing coat all can should have with the composition material of the composition material of described encapsulated layer and flexible base layer preferably
The compatibility, so that the combination that described encapsulated layer can be the best with remaining structure division in described body temperature patch.
More preferred, described encapsulated layer can use the flexible silicon glue material of food stage or medical grade to be formed, and it is safe and harmless, energy
Directly and human body good fit, the problems such as allergy will not be produced, and the comfort level of human body skin can be promoted.
Further, at least one also it is distributed at least one structure sheaf in described flexible body temperature pastes, in addition to described encapsulated layer
Blind hole or at least one through hole, described encapsulated layer local is located at and (is also formed anchor structure in this at least one blind hole or this at least one through hole
It is regarded as a kind of anti-skid structure), nationality is mutually disengaged with flexible base layer etc. preventing described encapsulated layer.
More preferred, at least one blind hole or at least one through hole are distributed in described flexible base layer and/or described functional circuit layer,
Described encapsulated layer local is located at into forming anchor structure in this at least one blind hole or this at least one through hole.
In certain embodiments, described anchor structure can include being formed at the blind hole in described flexible base layer or through hole, passes through
Encapsulating material is injected described blind hole or through hole and solidify to form rivet-like structure, can effectively by the encapsulated layer that formed with soft
The combination that property basal layer more fastens, and without adding other auxiliary anti-slipping material etc..
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include screen layer, and nationality is to eliminate the external world
Electronic interferences signal etc..
Wherein, described screen layer may be disposed at first surface and/or the second surface of described flexible base layer, preferably second surface,
Or also can be coated with described body temperature patch, but it is mutual with the information of external device should not affect described body temperature patch.
Wherein, described screen layer can be attached to first surface and/or the second surface of described flexible base layer, it is possible to is directly formed
The first surface of described flexible base layer and/or second surface.More preferred, described screen layer is packaged in described encapsulated layer.
Further, described screen layer can be such as by shapes such as metal, material with carbon element, conducting polymers in a variety of forms
The conductive network become, can also be the patterned structures layer etc. of these materials formation.
In some embodiments, described screen layer includes the conductive network mainly formed by transparent or opaque conductive material.Example
As, the conductive network formed by metal, CNT, Graphene, ITO etc. can be used, it can be effectively isolated extraneous electricity
The interference that functional circuit layer is caused by magnetic signal.These conductive networks can be formed by printing (such as silk screen printing), it is possible to
Interweaved by linear conductance material etc. and formed, it is possible to by continuous print two dimension planar conductive material is carried out machining or physics,
Chemical etching forms (such as photoetching, dry or wet etch).
In some embodiments, described screen layer may also comprise that mainly formed by transparent or opaque conductive material, have and set
Determine the conductive layer of graphic structure.It is for instance possible to use by metal film, carbon nano-tube film, graphene film, ITO layer etc. through machinery
The laminate structure with patterned structures that processing or physics, chemical etching (such as photoetching, dry or wet etch) are formed,
Can also be formed by modes such as printings (such as silk screen printing).
Particularly, form described screen layer according to transparent material, the outward appearance that described flexible body temperature patch is the most unique can be given.
And if described functional circuit layer comprises photoelectric cell, during the most miniature photovoltaic device etc., it additionally aids ambient transmission and enters
In described flexible body temperature patch.
In some embodiments, described screen layer can be attached at the second of described flexible base layer by modes such as adhesion, bondings
On surface or described second surface and described functional circuit layer.
In some embodiments, described screen layer is also wholely set with described flexible base layer, such as, can pass through physics, change
Learn the modes such as deposition (such as plating, metal sputtering, coating) to be attached directly to by conductive material in described flexible base layer, from
And form described screen layer.Use such set-up mode, screen layer and flexible base layer etc. on the one hand can be made more to fasten
In conjunction with and ensure device performance, on the other hand also contribute to preferably controlling the integral thickness of described flexible body temperature patch.
One of embodiment as the embodiment of the present invention, described conducting wire can have single or multiple lift structure.Wherein, institute
The circuit stating multiple structure can use the techniques such as multi-sheet printed method to prepare, it is possible to by needing the circuit table of line or gap bridge
The upper insulating barrier of face printing, republishes conduction cross-line to realize connection and multiple structure.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include at least one drying layer, described dry
Layer may be disposed at described body temperature and pastes the side surface fitted with human body, also may be provided at this side surface phase pasted with described body temperature
Back to opposite side surface, certainly, it is possible to this both side surface pasted at described body temperature arranges described drying layer simultaneously.By described
Drying layer, can intercept steam, prevents steam to the functional device (such as temperature sensor) in described functional circuit layer and leading
The impact of electric line.Wherein, can have multiple in order to form the material of described drying layer, such as, can be fibre plate or silica gel material
Material etc..Preferably, the thickness of described drying layer is less than 0.2mm.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include adhered layer, and described adhered layer can set
It is placed in described body temperature and pastes the side surface fitted with human body, can be easily by the most square for described body temperature patch by described adhered layer
The most firm fits with human body skin.
Wherein, described adhered layer preferably by safety non-toxic, non-stimulated, can the cohesive material that remove of noresidue be formed, the most raw
Thing medical aquogel etc..
Further, the present invention also can cover release layer on described adhered layer, in order to avoid described adhered layer pastes not at described body temperature
Tarnish in the case of being used and lost efficacy.
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is further illustrated, so that innovation essence of the present invention is easy to reason
Solve, but these relevant embodiment explanations are not intended that the restriction to range of the present invention.
Referring to be a kind of flexible body temperature patch in a preferred embodiment of the invention shown in Fig. 1 a, it includes flexible base layer
101, functional circuit layer 102, sealing coat 103 and encapsulated layer 104.
Foregoing soft basal layer 101 include first surface and with this first surface back to second surface, on described first surface
It is provided with described functional circuit layer 102.
Foregoing soft basal layer 101 uses polymer thin-film material or composite film material, and its thickness is less than 100 μm, the least
In 60 μm, it is further preferably no larger than 30 μm.Further, aforementioned polymer thin-film material can use poly terephthalic acid second two
Ester (PET) etc..
Conducting wire that aforementioned functional circuit layer 102 includes being arranged at the first surface of described flexible base layer and with described conductor wire
The functional device that road electrically combines.
Aforesaid conductive circuit can be to prepare formation on the first surface of flexible base layer 101 by printing technology.Such as, may be used
Electrocondution slurry is graphically printed on the first surface of flexible substrates 101 by screen printing technique etc., more post-treated make
Electrocondution slurry solidifies, and forms live width and is less than the described conducting wire of 30 μm more than 50 μm, thickness more than 0.5 μm.
Aforementioned functional device includes one or more in temperature-sensing element, control module, power module etc., and such as electricity
Other elements such as resistance, electric capacity, but it is not limited to this.
More preferred, for ensureing normal work and the electric performance stablity of aforementioned functional circuit layer, also can be at described functional circuit
The first surface of layer 102 arranges sealing coat 103, and the thickness of described sealing coat 103 is less than 0.5mm, has the work of isolation steam
With, prevent steam entered function circuit layer 102 and affect the normal work of circuit, the most also in order in insulation package layer 104 its
His impurity is on conducting wire in functional circuit layer 102 and the impact of functional device.It addition, aforementioned sealing coat 103 also has regulation and control
Aforementioned functional circuit layer 102 and the effect at encapsulated layer 104 interface, make aforementioned functional circuit layer 102 by sealing coat 103 and envelope
Dress layer 104 strong bonded.
Aforementioned encapsulation layer 104 preferably employs the flexible silicon glue material of food stage or medical grade and is formed, in order to wrap flexible base layer
101, functional circuit layer 102 and sealing coat 103, plays protection and the effect of encapsulation.Have the most soft because of silica gel itself simultaneously
Property, make whole body temperature patch have flexibility, and well can fit with human body.
Preferably, the thickness of described encapsulated layer is less than 1mm, and the integral thickness of described body temperature patch is less than 2mm, so can be big
The described body temperature of big raising pastes the comfortableness worn.
More preferred, for improving stability and the anti-interference of aforementioned functional circuit layer 102, it is also possible in described flexible substrates
The second surface of layer 101 covers a screen layer 105 (refering to Fig. 1 b) by coating method etc..
More preferred, in the present embodiment, refering to shown in Fig. 1 c, some blind holes also can be set in flexible base layer 101
106 (or through holes), described encapsulated layer local is located at into forming anchor structure (or claiming anti-skid structure) in these blind holes, and nationality is with effectively
The combination that the encapsulated layer formed and flexible base layer are more fastened by ground.Or, it is possible in described flexible substrates 101 and merit
Can arrange one or more through hole or blind hole on the overall structure layer of circuit layer formation, encapsulating material is fed into described through hole or blind hole
And it solidify to form anchor structure.Or, it is possible to described flexible base layer 101, functional circuit layer 102 and sealing coat 103 (and
/ or drying layer, screen layer) etc. the overall structure layer that formed of functional layer one or more through hole or blind hole be set, encapsulating material irrigates
Enter described through hole or blind hole and solidify to form anchor structure.
More preferred, in the present embodiment, on encapsulated layer 104, also can be covered with adhered layer 107, such as, see Fig. 1 d
Shown in, thereby adhered layer 107, flexible body temperature patch can be directly adhered to body surface in use, simple to operation,
This adhered layer can use conventional sticky stuff, the most medical or food stage cohesive material to be formed.
More preferred, in the present embodiment, on functional circuit layer 102, also can be covered with drying layer 108, such as, see
Shown in Fig. 1 e, thereby drying layer 108 can intercept steam, prevents steam to the functional device in described functional circuit layer (such as
Temperature sensor) and the impact of conducting wire.Wherein, can have multiple in order to form the material of described drying layer, the most permissible
It is fibre plate or silica gel material etc..Preferably, the thickness of described drying layer is less than 0.2mm.
Referring to shown in Fig. 2, in one embodiment of the invention, the conducting wire 202 in described flexible body temperature patch can be straight
Connect the surface being formed at flexible base layer 201.
More preferred, for making, between described conducting wire 202 and flexible base layer 201, there is good adhesion, Ke Yi
Before conductive circuit 202, the first surface to described flexible base layer 101 carries out oxygen plasma pre-treatment, thereby can increase structure
Become described flexible base layer base material surface can and itself and electrocondution slurry between molecular binding affinities.
On the surface, conducting wire 202 of the first surface formation of described flexible base layer 201, there is good leading by previous process
Electrical and flexible.
Further, functional device electrically can be combined with described conducting wire 202 and form described functional circuit layer.Such as,
By low-temperature bounding method, functional device can be integrated on the flexible electrical polar curve in described conducting wire 202.
Refer to shown in Fig. 4, in one embodiment of the invention, Silkscreen print technology can be used solder 403
It is printed on the surface of the conducting wire 402 being formed at flexible base layer 401 first surface, then by paster technique by discrete merit
Can be accurately placed on the flexible electrical polar curve in conducting wire 402 by device.Because solder 403 itself has certain viscosity,
The functional device 404 that is placed on conducting wire 402 can be sticked to prevent it from vibrating landing, then after post processing, low temperature
Solder 403 solidify to form solid-state conductive layer, makes the pin of functional device electrically connect with conducting wire 402 and fix functional device
404。
The circuit good for obtaining flex capability, the functional device 404 in aforementioned functional circuit layer has preferably employed miniature patch device
Functional device prepared by part or solution, the thickness of functional device 404 (can use discrete device) is less than 1mm, is smaller in size than
7mm*7mm.Owing to the size of these functional devices 404 is little, it is evenly distributed, and then makes functional circuit layer still have fine flexibility.
Referring to shown in Fig. 5, in one embodiment of the invention, in flexible body temperature patch, aforesaid conductive circuit also can be adopted
Use multilamellar line structure.Described multilamellar line structure can use repeatedly print process to prepare, for example, it is possible to first wire 502 is prepared in printing,
Between two electrodes 502, need inkjet printing insulating barrier 503 below the circuit that cross-line interconnects, insulating barrier 503 cover needs by
On the electrode 502 ' striden across.Then, then by silk screen printing preparation bridging wire 504, odt circuit structure is formed.Equally,
Circuit is also dependent on demand, it is achieved three layers and above circuit structure, and its method is similar to.
In previously-described implementation of the present invention, when described flexible body temperature is attached to application, the portion such as axillary fossa of human body can be attached at
Position, the temperature-sensing element sensing temperature signal in its functional circuit layer, and it is sent to control module, more wirelessly (example
Such as bluetooth approach etc.) temperature signal is sent to external smart terminal (such as mobile phone, panel computer etc.), thus body temperature can be realized
Real-time continuous monitoring.
In another preferred embodiment of the present invention, the structure of a kind of flexible body temperature patch also see shown in Fig. 1 a, i.e. also
Flexible base layer 101, functional circuit layer 102, sealing coat 103 and encapsulated layer 104 can be included.
Described flexible base layer 101 include first surface and with this first surface back to second surface, on described first surface
It is provided with described functional circuit layer 102.
Described flexible base layer 101 uses polymer thin-film material or composite film material, and its thickness is less than 100 μm, it is preferred that
Thickness is less than 60 μm, it is further preferred that thickness is less than 30 μm.Wherein, described polymer thin-film material can use poly-methyl
Acrylic acid methyl ester. etc..Same, for improving stability and anti-interference, the described flexible base layer of described functional circuit layer 102
The second surface of 101 also can be coated with a screen layer by coating process.
Conducting wire that described functional circuit layer 102 includes being formed at described flexible base layer 101 first surface and with described conduction
The functional device that circuit electrically combines.
More preferred, for ensureing normal work and the electric performance stablity of aforementioned functional circuit layer, also can be at described functional circuit
The first surface of layer 102 arranges sealing coat 103, and the thickness of described sealing coat 103 is less than 0.5mm, has the work of isolation steam
With, prevent steam entered function circuit layer 102 and affect the normal work of circuit, the most also in order in insulation package layer 104 its
His impurity is on conducting wire in functional circuit layer 102 and the impact of functional device.It addition, aforementioned sealing coat 103 also has regulation and control
Aforementioned functional circuit layer 102 and the effect at encapsulated layer 104 interface, make aforementioned functional circuit layer 102 by sealing coat 103 and envelope
Dress layer 104 strong bonded.
Aforementioned encapsulation layer 104 preferably employs the flexible silicon glue material of food stage or medical grade and is formed, in order to wrap flexible base layer
101, functional circuit layer 102 and sealing coat 103, plays protection and the effect of encapsulation.Have the most soft because of silica gel itself simultaneously
Property, make whole body temperature patch have flexibility, and well can fit with human body.
Preferably, the thickness of described encapsulated layer is less than 1mm, and the integral thickness of described body temperature patch is less than 2mm, so can be big
The described body temperature of big raising pastes the comfortableness worn.
Referring to shown in Fig. 3, in one embodiment of the invention, the conducting wire 302 in described flexible body temperature patch can set
In groove on the first surface of described flexible base layer 301.Hot pressing in the preparation, can be passed through in described conducting wire 302
Or UV method for stamping imprints out groove at the first surface of flexible base layer 301, then by consent technology, electrocondution slurry is filled up
Groove, through post processing, electrocondution slurry solidify to form conducting wire 302.Owing to conducting wire 302 is formed at flexible base layer
In 301 so that it is with flexible base layer 301, there is good adhesion, improve the anti-around folding endurance energy of flexible circuitry.
The surface, conducting wire 302 being formed in described flexible base layer 301 groove has good electric conductivity, can lead to subsequently
Cross low-temperature bounding method etc. to be integrated on conducting wire 302 by functional device.
Refer to shown in Fig. 4, in one embodiment of the invention, Silkscreen print technology can be used anisotropic glue 403
It is printed on the surface of the conducting wire 402 being formed at flexible base layer 401 first surface, then by paster technique by discrete merit
Can be accurately placed on the flexible electrical polar curve in conducting wire 402 by device.Because anisotropic glue 403 itself has certain viscosity,
The functional device 404 that is placed on conducting wire 402 can be sticked to prevent it from vibrating landing, then after post processing, every
Opposite sex glue 403 solidify to form solid-state conductive layer, makes the pin of functional device electrically connect with conducting wire 402 and fix effector
Part 404.
The circuit good for obtaining flex capability, the functional device 404 in aforementioned functional circuit layer has preferably employed miniature patch device
Functional device prepared by part or solution, the thickness of functional device 404 (can use discrete device) is less than 1mm, is smaller in size than
5mm*5mm.Owing to the size of these functional devices 404 is little, it is evenly distributed, and then makes functional circuit layer still have fine flexibility.
Referring to shown in Fig. 5, in one embodiment of the invention, in flexible body temperature patch, aforesaid conductive circuit also can be adopted
Use multilamellar line structure.Described multilamellar line structure can use repeatedly print process to prepare, for example, it is possible to first wire 502 is prepared in printing,
Between two electrodes 502, need inkjet printing insulating barrier 503 below the circuit that cross-line interconnects, insulating barrier 503 cover needs by
On the electrode 502 ' striden across.Then, then by silk screen printing preparation bridging wire 504, odt circuit structure is formed.Equally,
Circuit is also dependent on demand, it is achieved three layers and above circuit structure, and its method is similar to.
In previously-described implementation of the present invention, when described flexible body temperature is attached to application, the portion such as axillary fossa of human body can be attached at
Position, the temperature-sensing element sensing temperature signal in its functional circuit layer, and it is sent to control module, more wirelessly (example
Such as bluetooth approach etc.) temperature signal is sent to external smart terminal (such as mobile phone, panel computer etc.), thus body temperature can be realized
Real-time continuous monitoring.
In previously-described implementation of the present invention, flexible body temperature patch uses printed electronics to be prepared, and has thin, soft, little
Feature, substantially increase the comfortableness that human body is worn, be integrated with Radio Transmission Technology simultaneously, it is possible to achieve to human body temperature believe
The monitoring in real time of breath and transmission.
It should be noted that in this article, the relational terms of such as first and second or the like be used merely to an entity or
Operation separate with another entity or operating space, and not necessarily require or imply these entities or operate between exist any this
Plant actual relation or order.And, term " includes ", " comprising " or its any other variant are intended to nonexcludability
Comprise so that include that the process of a series of key element, method, article or equipment not only include those key elements, but also
Including other key elements being not expressly set out, or also include want intrinsic for this process, method, article or equipment
Element.In the case of there is no more restriction, statement " including ... " key element limited, it is not excluded that including described wanting
Process, method, article or the equipment of element there is also other identical element.
The above is only the detailed description of the invention of the application, it is noted that for those skilled in the art,
On the premise of without departing from the application principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as this Shen
Protection domain please.
Claims (23)
1. a flexible body temperature patch, it is characterised in that including:
Have first surface and with first surface back to the flexible base layer of second surface,
At least for monitoring the functional circuit layer of body temperature, including being arranged at conducting wire and the functional device of described first surface, institute
State functional device to be electrically combined with described conducting wire；
Further, the integral thickness of described body temperature patch is less than 2mm.
Flexible body temperature patch the most according to claim 1, it is characterised in that: described body temperature patch also includes sealing coat, described every
Absciss layer be arranged at described functional circuit layer surface and with functional circuit layer electric insulation, and at least can affect described function for prevention
The impurity entered function circuit layer of circuit layer performance.
Flexible body temperature patch the most according to claim 2, it is characterised in that also include covering in the encapsulation of described insulation surface
Layer.
Flexible body temperature patch the most according to claim 3, it is characterised in that: the described encapsulated layer described flexible base layer of cladding,
Functional circuit layer and sealing coat.
Flexible body temperature patch the most according to claim 4, it is characterised in that: in described flexible body temperature patch, except described encapsulation
Remaining component beyond Ceng is all wrapped in described encapsulated layer by entirety.
6. paste according to the flexible body temperature according to any one of claim 1-5, it is characterised in that: the material selection of described encapsulated layer
The shore hardness A flexible material less than 60, it is preferred that described flexible material is selected from medical grade or the flexible silica gel material of food stage
Material.
Flexible body temperature patch the most according to claim 1, it is characterised in that: at least at the second surface of described flexible base layer
It is provided with screen layer.
Flexible body temperature patch the most according to claim 1, it is characterised in that: described flexible base layer and the thickness of functional circuit layer
Degree is less than 1.5mm.
9. paste according to the flexible body temperature described in claim 1 or 8, it is characterised in that: the thickness of described flexible base layer is less than
100 μm, preferably smaller than 60 μm, particularly preferably less than 30 μm.
10. paste according to the flexible body temperature described in claim 1 or 8, it is characterised in that: being smaller in size than of described functional circuit layer
3cm*3cm。
11. flexible body temperature patches according to claim 1, it is characterised in that: the material of described flexible base layer includes polymerization
Thing material, described polymeric material includes polydimethylsiloxane, polymethyl methacrylate, polyethylene, polypropylene, polychlorostyrene
In ethylene, polyethylene terephthalate, Merlon, PEN and polyimides any one or two
Plant above combination.
12. flexible body temperature patches according to claim 1, it is characterised in that: described conducting wire is by printing technology system
For being formed at described first surface, described printing technology includes silk screen printing, ink jet printing, intaglio printing, letterpress, turns
Any one in bat printing brush, aerosol printing and mixed printing technology.
13. flexible body temperature patches according to claim 12, it is characterised in that: before printing described conducting wire, described
First surface is through oxygen plasma treatment.
14. flexible body temperature patches according to claim 1, it is characterised in that: described first surface is distributed groove, described
Groove described in the locally embedding of conducting wire or described conducting wire entirety are accommodated in described groove.
15. flexible body temperature patches according to claim 14, it is characterised in that: described conducting wire is to be imprinted with technology system
For being formed in the groove of described first surface.
16. paste according to the flexible body temperature according to any one of claim 1,12-15, it is characterised in that: described conducting wire has
There is single or multiple lift structure.
17. flexible body temperature patches according to claim 16, it is characterised in that: the described conducting wire with multiple structure is
Formed by the preparation of multi-sheet printed method.
18. flexible body temperature patches according to claim 1, it is characterised in that: described functional device and conducting wire are by low
Temperature welding is integrated, and the temperature of described soldered is below 160 DEG C.
19. flexible body temperature patches according to claim 1, it is characterised in that: described body temperature patch wirelessly with outside
Equipment coordinates, and described wireless mode includes any one in bluetooth, Zigbee, wifi, GPRS.
20. flexible body temperature patches according to claim 1, it is characterised in that: described functional device include power management module,
Temperature-sensing element, control and wireless communication module, described power management module, temperature-sensing element, control and wireless telecommunications
Module is electrically combined with described conducting wire.
21. flexible body temperature patches according to claim 1, it is characterised in that: the thickness of described functional device is less than 1.5mm,
Wherein discrete device be smaller in size than 7mm*7mm.
22. paste according to the flexible body temperature described in claim 1 or 21, it is characterised in that: described functional device is selected from miniature patch
Device or the functional device of solutionization printing preparation.
23. flexible body temperature patches according to claim 1, it is characterised in that: described sealing coat is membrane structure, its thickness
Less than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224512.5A CN105935290A (en) | 2016-04-12 | 2016-04-12 | Flexible temperature plaster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610224512.5A CN105935290A (en) | 2016-04-12 | 2016-04-12 | Flexible temperature plaster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105935290A true CN105935290A (en) | 2016-09-14 |
Family
ID=57151303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610224512.5A Pending CN105935290A (en) | 2016-04-12 | 2016-04-12 | Flexible temperature plaster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105935290A (en) |
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| CN107280646A (en) * | 2017-07-19 | 2017-10-24 | 东南大学 | A kind of intelligent flexible companion clinical thermometer combination and its application method |
| CN108458807A (en) * | 2017-06-05 | 2018-08-28 | 索思（苏州）医疗科技有限公司 | Wearable clinical thermometer and its production method |
| CN110279412A (en) * | 2019-06-20 | 2019-09-27 | 山东大学 | A kind of paediatrics network hospital terminal device, system and method |
| CN111839472A (en) * | 2020-07-09 | 2020-10-30 | 北京服装学院 | Body temperature abnormity monitoring device and manufacturing method thereof, garment, mattress and system |
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Effective date of registration: 20180611 Address after: 315100 Jin Yuan Road, pan Huo street, Yinzhou District, Ningbo, Zhejiang 669 Applicant after: Ningbo soft print Electronic Technology Co., Ltd. Address before: 215000 room 104, A4 building, biological nano Park, 218 Xing Hu Street, Suzhou Industrial Park, Suzhou, Jiangsu. Applicant before: Suzhou NanoGrid Technology Co., Ltd. |
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