CN105934089B - Multiple-printed-panel for circuit board and its manufacturing method - Google Patents
Multiple-printed-panel for circuit board and its manufacturing method Download PDFInfo
- Publication number
- CN105934089B CN105934089B CN201610380517.7A CN201610380517A CN105934089B CN 105934089 B CN105934089 B CN 105934089B CN 201610380517 A CN201610380517 A CN 201610380517A CN 105934089 B CN105934089 B CN 105934089B
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- Prior art keywords
- technique edges
- pcb single
- protrusion
- dowel
- single board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of multiple-printed-panel for circuit board, including at least two PCB single boards, two the first technique edges being oppositely arranged and at least one the second technique edges being connected between two first technique edges, at least two PCB single board is respectively arranged at the opposite sides of second technique edges and between two first technique edges, each described PCB single board is connect by the first dowel with adjacent first technique edges, each described PCB single board also passes through the second dowel and connect with second technique edges, wherein, the side that at least one described PCB single board is connect with second technique edges is nonlinear type side.In addition, the present invention also provides a kind of manufacturing methods of multiple-printed-panel for circuit board.The multiple-printed-panel for circuit board has preferable integral strength and stability.
Description
Technical field
The present invention relates to printed-board technology field more particularly to a kind of multiple-printed-panel for circuit board and its manufacturing methods.
Background technique
In printed circuit board (Printed Circuit Board, PCB) manufacturing process, to promote the electricity such as resistance, capacitor
The lesser PCB single board of multiple sizes is usually pieced together larger-size multiple-printed-panel for circuit board by the patch efficiency of sub- component, is constituted
It is connected mostly by dowel between each PCB single board of multiple-printed-panel for circuit board, and work is set in the surrounding of whole circuit board jigsaw
Skill side, to promote the integral strength of multiple-printed-panel for circuit board.The floor map of multiple-printed-panel for circuit board in the prior art as shown in Figure 1,
For the PCB single board with regular rectilinear type side, when forming multiple-printed-panel for circuit board, the gap between PCB single board is compared
Uniformly, so as to which matched dowel is easily arranged between PCB single board, to realize the company between PCB single board
It connects.
However, for the PCB single board with irregular nonlinear type side, when forming multiple-printed-panel for circuit board, due to
Gap between the side of adjacent PCB single board is simultaneously uneven, connects this so as to cause that can not be arranged the dowel that matches
PCB single board so will lead to the integral strength for being unfavorable for promoting multiple-printed-panel for circuit board, influence the quality of the multiple-printed-panel for circuit board.
Summary of the invention
In view of the above-mentioned problems in the prior art, the present invention provides a kind of multiple-printed-panel for circuit board, is not advised with solving edge
The problem of when forming jigsaw the dowel to match can not be arranged in PCB single board then, to improve by irregular non-rectilinear
The integral strength and stability for the multiple-printed-panel for circuit board that the PCB single board of type side is formed.
In addition, the present invention also provides a kind of manufacturing methods of multiple-printed-panel for circuit board.
A kind of multiple-printed-panel for circuit board, the first technique edges being oppositely arranged including at least two PCB single boards, two and is connected to institute
At least one the second technique edges between two the first technique edges are stated, at least two PCB single board is respectively arranged at described
The opposite sides of two technique edges and between two first technique edges, each described PCB single board pass through the first connection
Muscle is connect with adjacent first technique edges, each described PCB single board also passes through the second dowel and second technique
Side connection, wherein the side that at least one described PCB single board is connect with second technique edges is nonlinear type side.
Wherein, each described PCB single board include opposite first side and second side and opposite third side and
Four side, the first side and the second side are linear type side, and are parallel to the first technique edges setting, institute
It states third side and the four side is nonlinear type side, and be arranged along the extending direction of second technique edges.
Wherein, the first side and second side adjacent with first technique edges pass through the first dowel and described first
Technique edges connection, is connected between the first side and second side of two adjacent PCB single boards by third dowel.
Wherein, the third side and the four side respectively include multiple spaced protrusions, and adjacent is described
Recessed portion is formed between protrusion, being parallel between the protrusion of the third side and the protrusion of the four side
The interlaced arrangement in direction for stating the second technique edges, between the recessed portion of the third side and the recessed portion of the four side
In the interlaced arrangement in direction for being parallel to second technique edges.
Wherein, second dowel is set to the protrusion of the third side and/or the protrusion of the four side
In portion, the PCB single board by be set on the protrusion of the third side and/or the protrusion of the four side
Two dowels are connect with second technique edges.
A kind of manufacturing method of multiple-printed-panel for circuit board, comprising:
At least two PCB single boards, two the first technique edges and at least one the second technique edges are provided；
Two first technique edges are oppositely arranged, and at least one second technique edges are connected to described two
Between first technique edges；
At least two PCB single board is set to second technique edges two sides, and is located at two first technique
Between side；
Each described PCB single board is connect by the first dowel with adjacent first technique edges；
Each described PCB single board is also passed through the second dowel to connect with second technique edges, wherein at least one
The side that the PCB single board is connect with second technique edges is nonlinear type side.
Wherein, each described PCB single board include opposite first side and second side and opposite third side and
Four side, the first side and the second side are linear type side, and are parallel to the first technique edges setting, institute
It states third side and the four side is nonlinear type side, and be arranged along the extending direction of second technique edges.
Wherein, the first side and second side adjacent with first technique edges pass through the first dowel and described first
Technique edges connection, is connected between the first side and second side of two adjacent PCB single boards by third dowel.
Wherein, the third side and the four side respectively include multiple spaced protrusions, and adjacent is described
Recessed portion is formed between protrusion, being parallel between the protrusion of the third side and the protrusion of the four side
The interlaced arrangement in direction for stating the second technique edges, between the recessed portion of the third side and the recessed portion of the four side
In the interlaced arrangement in direction for being parallel to second technique edges.
Wherein, second dowel is set to the protrusion of the third side and/or the protrusion of the four side
In portion, the PCB single board by be set on the protrusion of the third side and/or the protrusion of the four side
Two dowels are connect with second technique edges.
In the multiple-printed-panel for circuit board and its manufacturing method that the embodiment of the present invention provides, by be oppositely arranged at two articles the
At least one the second technique edges of setting between one technique edges, so as to which at least two PCB single boards are respectively arranged at institute
State the second technique edges two sides so that the nonlinear type side of each PCB single board with the second technique edges phase
Neighbour, and then connect the nonlinear type side of each PCB single board with second technique edges by dowel, it can solve
The problem of certainly when forming jigsaw the dowel to match can not be arranged in the irregular PCB single board in edge, to effectively improve
By the integral strength and stability of the multiple-printed-panel for circuit board that the PCB single board of irregular nonlinear type side is formed.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the floor map of multiple-printed-panel for circuit board in the prior art；
Fig. 2 is the floor map for the multiple-printed-panel for circuit board that first embodiment of the invention provides；
Fig. 3 is the floor map for the multiple-printed-panel for circuit board that second embodiment of the invention provides；
Fig. 4 is the flow chart of the manufacturing method of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
For ease of description, may be used herein such as " ... under ", " ... below ", "lower", " ... on ", "upper"
Spaces relative terms are waited to describe the relationship of an elements or features and another (a little) elements or features as illustrated in the drawing.
It is appreciated that be referred to as in another element or layer "upper", " being connected to " or " being couple to " another element when an element or layer or
When layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or there may be occupy
Between element or layer.
It is appreciated that terminology used here is merely to description specific embodiment, is not intended to limit the present invention.Herein
In use, clearly stating unless the context otherwise, otherwise singular " one " and "the" are also intended to including plural form.Further
Ground, when used in this manual, term " includes " and/or "comprising" show the feature, entirety, step, element and/or
The presence of component, but the presence that is not excluded for other one or more features, entirety, step, element, component and/or combination thereof or
Increase.
Referring to Fig. 2, first embodiment of the invention provides a kind of multiple-printed-panel for circuit board 10, including at least two printed circuit boards
It 11, two the first technique edges 13 relatively disposed in parallel of (Printed Circuit Board, PCB) veneer and is connected to described
At least one the second technique edges 15 between two the first technique edges 13.In the present embodiment, with the quantity of the PCB single board 11
Quantity for two, the first technique edges 13 is two, the quantity of the second technique edges 15 is illustrated for being one.
In the present embodiment, the PCB single board 11 is between two first technique edges 13, and each PCB is mono-
Plate 11 is connect by the first dowel 111 with adjacent first technique edges 13.At least two PCB single board 11 is set to
The opposite sides of second technique edges 15 and between two first technique edges 13, and each described PCB single board
11 are also connect by the second dowel 113 with second technique edges 15.Wherein, at least one described PCB single board 11 with it is described
The side of second technique edges 15 connection is nonlinear type side.The nonlinear type side refers to the side of the PCB single board
It is upper that there is protrusion and sunk structure, and be not a smooth, continuous straight line.
In the present embodiment, each described PCB single board 11 includes opposite first side 1101 and second side 1102
And opposite third side 1103 and four side 1104, wherein the first side 1101 and the second side 1102 are
Linear type side, and be parallel to first technique edges 13 and be arranged, the third side 1103 and the four side 1104 are
Nonlinear type side, and be arranged along the extending direction of second technique edges 15.The third side 1103 and the 4th side
Side 1104 respectively includes multiple spaced protrusion T, forms recessed portion O, the third side between the adjacent protrusion T
In the direction for being parallel to second technique edges 15 between the protrusion T on side 1103 and the protrusion T of the four side 1104
Interlaced arrangement, similarly, between the recessed portion O of the third side 1103 and the recessed portion O of the four side 1104
It is parallel to the interlaced arrangement in direction of second technique edges 15.
Wherein, the PCB single board 11 by be set to the third side 1103 protrusion T and/or the 4th side
The second dowel 113 on the protrusion T on side 1104 is connect with second technique edges 15.For example, working as the multiple-printed-panel for circuit board
10 include second technique edges 15 when, the PCB single board 11 positioned at 15 side of the second technique edges passes through setting
It is connect in the second dowel 113 on the protrusion T of the third side 1103 with second technique edges 15, meanwhile, it is located at
The PCB single board 11 of second technique edges, 15 other side is then by being set on the protrusion T of the four side 1104
The second dowel 113 connect with second technique edges 15.In other embodiments, when the multiple-printed-panel for circuit board 10 includes more
Described in item when the second technique edges 15, the PCB single board 11 between second technique edges 15 adjacent positioned at two is by being set to
The second dowel 113 on the protrusion T of the third side 1103 is connect with wherein one second technique edges 15, and is led to
The second dowel 113 crossed on the protrusion T for being set to the four side 1104 connects with another article of second technique edges 15
It connects.
It is appreciated that in other embodiments, the multiple-printed-panel for circuit board 10 may include three the second technique edges 15, wherein one
As shown in Figure 2, two other the second technique edges (not shown) is connected to two and is oppositely arranged the second technique edges of item 15
The end of first technique edges 13, to collectively form the knot of closed box shape with the first technique edges 13 that two are oppositely arranged
Structure.In other words, three the second technique edges are successively spaced setting, and the second technique edges 15 shown in Fig. 2 are located at two other
Between two technique edges, and the PCB single board 11, i.e., the described PCB single board are provided between two the second adjacent technique edges
11 are sequentially arranged at intervals setting with second technique edges.It is appreciated that one in the second technique edges described in two other is logical
It crosses second dowel to connect with the protrusion T of the third side 1103 of PCB single board 11 described in one of them, two other institute
Another article in the second technique edges is stated by second dowel and the four side 1104 of another PCB single board 11
Protrusion T connection.
Referring to Fig. 3, second embodiment of the invention provides a kind of multiple-printed-panel for circuit board 20, including the identical PCB of four shapes
Veneer 21, two the first technique edges 23 and second technique edges 25 being oppositely arranged, the vertically connection of the second technique edges 25
A dies are collectively formed between two first technique edges 23, and with two first technique edges 23.Four
A PCB single board 21 is arranged in matrix, and two of them PCB single board 21 is located at the side of second technique edges 25, and in addition two
A PCB single board 21 is located at the other side of second technique edges 25.Wherein, the PCB single board adjacent with first technique edges 23
21 are connect by the first dowel 211 with first technique edges 23, positioned at described second technique edges, 25 the same side and adjacent
It is connected between two PCB single boards 21 by third dowel 215, each described PCB single board 21 passes through the second connection
Muscle 213 is connect with second technique edges 25.Wherein, at least one described PCB single board 21 is connect with second technique edges 25
Side be nonlinear type side.The nonlinear type side refers to thering is protrusion and recess on the side of the PCB single board
Structure, and be not a smooth, continuous straight line.
In the present embodiment, each described PCB single board 21 includes opposite first side 2101 and second side 2102
And opposite third side 2103 and four side 2104, wherein the first side 2101 and the second side 2102 are
Linear type side, and be parallel to first technique edges 23 and be arranged, the third side 2103 and the four side 2104 are
Nonlinear type side, and be arranged along the extending direction of second technique edges 25.The third side 2103 and the 4th side
2014 sides respectively include multiple spaced protrusion T, form recessed portion O, the third side between the adjacent protrusion T
In the direction for being parallel to second technique edges 25 between the protrusion T on side 2103 and the protrusion T of the four side 2104
Interlaced arrangement, similarly, between the recessed portion O of the third side 2103 and the recessed portion O of the four side 2104
It is parallel to the interlaced arrangement in direction of second technique edges 25.
Wherein, the PCB single board 21 by be set to the third side 2103 protrusion T and/or the 4th side
The second dowel 213 on the protrusion T on side 2104 is connect with second technique edges 25.It is appreciated that in other embodiments
In, the multiple-printed-panel for circuit board 20 may also include two other the second technique edges (not shown), be connected to two phases
To the end of the first technique edges 23 of setting, to be collectively formed with the first technique edges 23 that described two are oppositely arranged closed
The structure of box shape.In other words, three the second technique edges are successively spaced setting, and the second technique edges 25 shown in Fig. 3 are located at
Between the second technique edges of two other, and a PCB single board 21, i.e., the described PCB are provided between two the second adjacent technique edges
Veneer 21 and the second technique edges are sequentially arranged at intervals setting.Wherein, second technique edges of two other and the PCB single board 21
Between connection relationship and Fig. 3 shown in connection relationship between the second technique edges 25 and the PCB single board 21 it is identical, herein not
It repeats again.
It is appreciated that the PCB single board is not limited to shape as shown in Figure 2 or Figure 3, triangle, five sides can also be
The polygons such as shape, hexagon.The PCB single board includes at least one nonlinear type side, when multiple PCB single boards form electricity
When the plate jigsaw of road, if the nonlinear type side is adjacent with first technique edges, the nonlinear type side passes through first
Dowel is directly connect with first technique edges；If the nonlinear type side of one of them PCB single board and other PCB are mono-
The linear type side or nonlinear type side of plate are adjacent, then in the nonlinear type side of wherein PCB single board and its
The second technique edges are set between the linear type side or nonlinear type side of his PCB single board, and each by the second dowel
It is connect with second technique edges.I.e. the nonlinear type side of one of them PCB single board by the second dowel with it is described
The connection of second technique edges, the linear type side or nonlinear type side of other PCB single boards adjacent with the nonlinear type side
Connect also by the second dowel with second technique edges, with guarantee two adjacent PCB single boards nonlinear type side it
Between or two adjacent PCB single boards in a PCB single board nonlinear type side and another PCB single board linear type side
Between be provided with the second technique edges, and second technique edges are connect by the second dowel with two adjacent PCB single boards.
Referring to Fig. 4, in an embodiment of the invention, also providing a kind of manufacturing method of multiple-printed-panel for circuit board, the system
The method of making includes at least:
Step S101: at least two PCB single boards, two the first technique edges and at least one the second technique edges are provided；
Step S102: being arranged in parallel two first technique edges are opposite, and by least one second technique edges
It is connected between two first technique edges；
Step S103: at least two PCB single board is set to second technique edges two sides, and is located at described two
Between first technique edges；
Step S104: each described PCB single board is connect by the first dowel with adjacent first technique edges；
Step S105: also passing through the second dowel for each described PCB single board and connect with second technique edges,
In, the side that at least one described PCB single board is connect with second technique edges is nonlinear type side.
Preferably, each described PCB single board includes opposite first side and second side and opposite third side
With four side, the first side and the second side are linear type side, and are parallel to the first technique edges setting,
The third side and the four side are nonlinear type side, and are arranged along the extending direction of second technique edges.
Preferably, the first side and second side adjacent with first technique edges pass through the first dowel and described the
The connection of one technique edges, is connected between the first side and second side of two adjacent PCB single boards by third dowel.
Preferably, the third side and the four side respectively include multiple spaced protrusions, adjacent institute
It states and forms recessed portion between protrusion, be parallel between the protrusion of the third side and the protrusion of the four side
The recessed portion of the interlaced arrangement in direction of second technique edges, the recessed portion of the third side and the four side it
Between in the interlaced arrangement in direction for being parallel to second technique edges.
Preferably, second dowel be set to the third side protrusion and/or the four side it is convex
Out in portion, the PCB single board is by being set on the protrusion of the third side and/or the protrusion of the four side
Second dowel is connect with second technique edges.
It is appreciated that each step of the manufacturing method of the multiple-printed-panel for circuit board and its specific implementation can also be referring to Fig. 2
With the associated description in embodiment illustrated in fig. 3, details are not described herein again.
Multiple-printed-panel for circuit board provided in an embodiment of the present invention and its manufacturing method pass through the first technique being oppositely arranged at two
At least one the second technique edges of setting between side, so as to which at least two PCB single boards are respectively arranged at described second
Technique edges two sides, so that the nonlinear type side of each PCB single board is adjacent with second technique edges, in turn
The nonlinear type side of each PCB single board is connect with second technique edges by second dowel, it can be with
Solve the problems, such as that the dowel to match can not be arranged when forming jigsaw in the irregular PCB single board in edge, to effectively be promoted
The integral strength and stability of the multiple-printed-panel for circuit board formed by the PCB single board of irregular nonlinear type side.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.In addition, the embodiments of the present invention
It is for illustration only, it does not represent the advantages or disadvantages of the embodiments.
Above disclosed is only presently preferred embodiments of the present invention, cannot limit the right of the present invention with this certainly
Range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and according to right of the present invention
Equivalent variations made by it is required that, still belongs to the scope covered by the invention.
Claims (6)
1. a kind of multiple-printed-panel for circuit board, including at least two PCB single boards, which is characterized in that the multiple-printed-panel for circuit board further includes two
The first technique edges for being oppositely arranged and at least one the second technique edges being connected between two first technique edges, it is described extremely
Few two PCB single boards are respectively arranged at the opposite sides of second technique edges and between two first technique edges,
Each described PCB single board is connect by the first dowel with adjacent first technique edges, each described PCB single board is also
It is connect by the second dowel with second technique edges, wherein at least one described PCB single board and second technique edges connect
The side connect is nonlinear type side；
Wherein, each described PCB single board includes opposite first side and second side and opposite third side and the 4th
Side, the first side and the second side are linear type side, and are parallel to first technique edges setting, described the
Three sides and the four side are nonlinear type side, and are arranged along the extending direction of second technique edges；
The third side and the four side respectively include multiple spaced protrusions, between the adjacent protrusion
Recessed portion is formed, is being parallel to second technique between the protrusion of the third side and the protrusion of the four side
The interlaced arrangement in the direction on side, being parallel between the recessed portion of the third side and the recessed portion of the four side
State the interlaced arrangement in direction of the second technique edges.
2. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the first side adjacent with first technique edges and
Second side is connect by the first dowel with first technique edges, the first side of two adjacent PCB single boards with
It is connected between second side by third dowel.
3. multiple-printed-panel for circuit board as claimed in claim 1 or 2, which is characterized in that second dowel is set to the third side
On the protrusion of the protrusion on side and/or the four side, the PCB single board is by being set to the protrusion of the third side
The second dowel on the protrusion of portion and/or the four side is connect with second technique edges.
4. a kind of manufacturing method of multiple-printed-panel for circuit board, which is characterized in that the manufacturing method includes:
At least two PCB single boards, two the first technique edges and at least one the second technique edges are provided；
Two first technique edges are oppositely arranged, and at least one second technique edges are connected to described two first
Between technique edges；
At least two PCB single board is set to second technique edges two sides, and be located at two first technique edges it
Between；
Each described PCB single board is connect by the first dowel with adjacent first technique edges；
Each described PCB single board is also connect by the second dowel with second technique edges, wherein at least one institute
Stating the side that PCB single board is connect with second technique edges is nonlinear type side；
Wherein, each described PCB single board includes opposite first side and second side and opposite third side and the 4th
Side, the first side and the second side are linear type side, and are parallel to first technique edges setting, described the
Three sides and the four side are nonlinear type side, and are arranged along the extending direction of second technique edges；
The third side and the four side respectively include multiple spaced protrusions, between the adjacent protrusion
Recessed portion is formed, is being parallel to second technique between the protrusion of the third side and the protrusion of the four side
The interlaced arrangement in the direction on side, being parallel between the recessed portion of the third side and the recessed portion of the four side
State the interlaced arrangement in direction of the second technique edges.
5. manufacturing method as claimed in claim 4, which is characterized in that the first side adjacent with first technique edges and
Dual side-edge is connect by the first dowel with first technique edges, the first side of two adjacent PCB single boards and the
It is connected between dual side-edge by third dowel.
6. manufacturing method as described in claim 4 or 5, which is characterized in that second dowel is set to the third side
On the protrusion of the protrusion on side and/or the four side, the PCB single board is by being set to the protrusion of the third side
The second dowel on the protrusion of portion and/or the four side is connect with second technique edges.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810743569.5A CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
| CN201610380517.7A CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380517.7A CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810743569.5A Division CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105934089A CN105934089A (en) | 2016-09-07 |
| CN105934089B true CN105934089B (en) | 2019-01-04 |
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| CN201810743569.5A Expired - Fee Related CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
| CN201610380517.7A Expired - Fee Related CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195324A (en) * | 2016-05-31 | 2019-01-11 | 广东欧珀移动通信有限公司 | Multiple-printed-panel for circuit board and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708301B (en) * | 2017-09-27 | 2019-06-18 | Oppo广东移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
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| CN201230401Y (en) * | 2008-07-07 | 2009-04-29 | 林益明 | Electronic circuit brace board |
| CN102194715A (en) * | 2010-03-16 | 2011-09-21 | 南亚电路板股份有限公司 | Packaging substrate module and strip-shaped packaging substrate |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
| CN202262067U (en) * | 2011-09-02 | 2012-05-30 | 深圳市福祺斯电子有限公司 | Printed circuit board |
| CN203775530U (en) * | 2014-03-14 | 2014-08-13 | 华为终端有限公司 | Splicing board |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
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| US6574862B1 (en) * | 1999-02-23 | 2003-06-10 | Samsung Electro-Mechanics Co., Ltd. | Method for coupling PCB sheet |
| CN109195324B (en) * | 2016-05-31 | 2020-06-02 | Oppo广东移动通信有限公司 | Circuit board jointed board and manufacturing method thereof |
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2016
- 2016-05-31 CN CN201810743569.5A patent/CN109195324B/en not_active Expired - Fee Related
- 2016-05-31 CN CN201610380517.7A patent/CN105934089B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201230401Y (en) * | 2008-07-07 | 2009-04-29 | 林益明 | Electronic circuit brace board |
| CN102194715A (en) * | 2010-03-16 | 2011-09-21 | 南亚电路板股份有限公司 | Packaging substrate module and strip-shaped packaging substrate |
| CN202262067U (en) * | 2011-09-02 | 2012-05-30 | 深圳市福祺斯电子有限公司 | Printed circuit board |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
| CN203775530U (en) * | 2014-03-14 | 2014-08-13 | 华为终端有限公司 | Splicing board |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195324A (en) * | 2016-05-31 | 2019-01-11 | 广东欧珀移动通信有限公司 | Multiple-printed-panel for circuit board and its manufacturing method |
| CN109195324B (en) * | 2016-05-31 | 2020-06-02 | Oppo广东移动通信有限公司 | Circuit board jointed board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109195324B (en) | 2020-06-02 |
| CN105934089A (en) | 2016-09-07 |
| CN109195324A (en) | 2019-01-11 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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