CN105934089A - Circuit board jointed board and manufacture method thereof - Google Patents
Circuit board jointed board and manufacture method thereof Download PDFInfo
- Publication number
- CN105934089A CN105934089A CN201610380517.7A CN201610380517A CN105934089A CN 105934089 A CN105934089 A CN 105934089A CN 201610380517 A CN201610380517 A CN 201610380517A CN 105934089 A CN105934089 A CN 105934089A
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- China
- Prior art keywords
- technique edges
- single board
- protuberance
- pcb single
- dowel
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a circuit board jointed board, which comprises at least two PCB (Printed Circuit Board) veneers, two opposite first craft edges and at least one second craft edge connected between the two first craft edges, wherein the at least two PCB veneers are independently arranged on two opposite sides of the second craft edge and are positioned between the two first craft edges; each PCB veneer is connected with the adjacent first craft edge through a first connection rib; and each PCB veneer is also connected with the second craft edge through a second connection rib, wherein the side edge, which is connected with the second craft edge, of at least one PCB veneer is a non-linear side edge. In addition, the invention also provides a manufacture method of the circuit board jointed board. The circuit board jointed board has good integral strength and stability.
Description
Technical field
The present invention relates to printed-board technology field, particularly relate to a kind of multiple-printed-panel for circuit board and manufacture method thereof.
Background technology
In printed circuit board (PCB) (Printed Circuit Board, PCB) manufacture process, for promoting resistance, electricity
The paster efficiency of the electronic devices and components such as appearance, generally pieces together size by PCB single board less for multiple sizes bigger
Multiple-printed-panel for circuit board, constitute multiple-printed-panel for circuit board each PCB single board between mostly connected by dowel, and
Surrounding at whole multiple-printed-panel for circuit board arranges technique edges, to promote the bulk strength of multiple-printed-panel for circuit board.Such as Fig. 1
The floor map of multiple-printed-panel for circuit board in shown prior art, for having the PCB of regular rectilinear type side
For veneer, when forming multiple-printed-panel for circuit board, the gap-ratio between PCB single board is more uniform, such that it is able to side
Matched dowel just is set between PCB single board, to realize the connection between PCB single board.
But, for there is the PCB single board of irregular nonlinear type side, forming multiple-printed-panel for circuit board
Time, due to the gap between the side of adjacent PCB single board uneven, thus cause arranging mutually
The dowel joined, to connect this PCB single board, so can cause the bulk strength being unfavorable for promoting multiple-printed-panel for circuit board,
Affect the quality of this multiple-printed-panel for circuit board.
Summary of the invention
In view of the above-mentioned problems in the prior art, the present invention provides a kind of multiple-printed-panel for circuit board, to solve limit
The irregular PCB single board of edge cannot arrange the problem of the dowel matched when forming jigsaw, thus promotes
The bulk strength of the multiple-printed-panel for circuit board formed by the PCB single board of irregular nonlinear type side and stability.
Separately, the present invention also provides for the manufacture method of a kind of multiple-printed-panel for circuit board.
A kind of multiple-printed-panel for circuit board, including at least two PCB single board, two the first technique edges being oppositely arranged and
At least one the second technique edges being connected between described two the first technique edges, described at least two PCB is mono-
Plate is respectively arranged at the opposite sides of described second technique edges and between described two the first technique edges, often
One described PCB single board is by the first dowel and adjacent described first technique edges connection, described in each
PCB single board is connected with described second technique edges also by the second dowel, wherein, and at least one described PCB
The side that veneer is connected with described second technique edges is nonlinear type side.
Wherein, each described PCB single board includes relative first side and second side and the relative the 3rd
Side and four side, described first side and described second side are linear type side, and are parallel to described
First technique edges is arranged, and described 3rd side and described four side are nonlinear type side, and along described the
The bearing of trend of two technique edges is arranged.
Wherein, adjacent with described first technique edges first side and second side are by the first dowel and institute
State the first technique edges to connect, pass through between first side and the second side of two adjacent described PCB single board
3rd dowel connects.
Wherein, described 3rd side and described four side respectively include multiple spaced protuberance, adjacent
Described protuberance between form depressed part, the protuberance of described 3rd side and the protrusion of described four side
It is being parallel to the interlaced arrangement in direction of described second technique edges, the depressed part of described 3rd side between portion
And it is being parallel to the interlaced arrangement in direction of described second technique edges between the depressed part of described four side.
Wherein, described second dowel is arranged at the protuberance of described 3rd side and/or described four side
On protuberance, described PCB single board is by being arranged at the protuberance of described 3rd side and/or described four side
Protuberance on the second dowel be connected with described second technique edges.
A kind of manufacture method of multiple-printed-panel for circuit board, including:
At least two PCB single board, two the first technique edges and at least one the second technique edges are provided；
Described two the first technique edges are oppositely arranged, and the second technique edges described at least one is connected to institute
State between two the first technique edges；
Described at least two PCB single board is arranged at described second technique edges both sides, and is positioned at described two article
Between one technique edges；
Each described PCB single board is connected with adjacent described first technique edges by the first dowel；
Each described PCB single board is connected with described second technique edges also by the second dowel, wherein,
The side that at least one described PCB single board is connected with described second technique edges is nonlinear type side.
Wherein, each described PCB single board includes relative first side and second side and the relative the 3rd
Side and four side, described first side and described second side are linear type side, and are parallel to described
First technique edges is arranged, and described 3rd side and described four side are nonlinear type side, and along described the
The bearing of trend of two technique edges is arranged.
Wherein, adjacent with described first technique edges first side and second side are by the first dowel and institute
State the first technique edges to connect, pass through between first side and the second side of two adjacent described PCB single board
3rd dowel connects.
Wherein, described 3rd side and described four side respectively include multiple spaced protuberance, adjacent
Described protuberance between form depressed part, the protuberance of described 3rd side and the protrusion of described four side
It is being parallel to the interlaced arrangement in direction of described second technique edges, the depressed part of described 3rd side between portion
And it is being parallel to the interlaced arrangement in direction of described second technique edges between the depressed part of described four side.
Wherein, described second dowel is arranged at the protuberance of described 3rd side and/or described four side
On protuberance, described PCB single board is by being arranged at the protuberance of described 3rd side and/or described four side
Protuberance on the second dowel be connected with described second technique edges.
In the multiple-printed-panel for circuit board and manufacture method thereof of embodiments of the invention offer, by relatively setting at two
At least one the second technique edges are set between the first technique edges put, such that it is able to by PCB described at least two
Veneer is respectively arranged at described second technique edges both sides, so that the non-rectilinear of each described PCB single board
Type side is all adjacent with described second technique edges, and then by non-by each described PCB single board of dowel
Linear type side is connected with described second technique edges, can solve the irregular PCB single board in edge and form spelling
The problem that the dowel matched cannot be set during plate, thus be effectively improved by irregular nonlinear type side
The bulk strength of described multiple-printed-panel for circuit board that formed of PCB single board and stability.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the floor map of multiple-printed-panel for circuit board in prior art；
Fig. 2 is the floor map of the multiple-printed-panel for circuit board that first embodiment of the invention provides；
Fig. 3 is the floor map of the multiple-printed-panel for circuit board that second embodiment of the invention provides；
Fig. 4 is the flow chart of the manufacture method of the multiple-printed-panel for circuit board that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
The every other embodiment obtained under property work premise, broadly falls into the scope of protection of the invention.
For ease of describe, can use such as here " ... under ", " ... below ", D score, " ...
On ", " on " etc. space relative terms an element or feature and another (a bit) as illustrated in the drawing are described
Element or the relation of feature.Be appreciated that when an element or layer be referred to as another element or layer " on ",
" be connected to " or " being couple to " another element or during layer, it can directly on another element or layer, straight
Connect and be connected or coupled to another element or layer, or intervening elements or layer can be there is.
It is appreciated that terminology used here merely to describe specific embodiment, is not intended to limit the present invention.
When being used herein, the most clearly state, otherwise singulative " " and " being somebody's turn to do " also purport
Including plural form.Further, when using in this manual, term " includes " and/or " bag
Contain " show the existence of described feature, entirety, step, element and/or assembly, but it is not excluded for one or more
The existence of other features, entirety, step, element, assembly and/or a combination thereof or increase.
Referring to Fig. 2, first embodiment of the invention provides a kind of multiple-printed-panel for circuit board 10, prints including at least two
First technique of printed circuit board (Printed Circuit Board, PCB) 11, two opposing parallel settings of veneer
Limit 13 and at least one the second technique edges 15 being connected between described two the first technique edges 13.In this reality
Execute in example, with the quantity of described PCB single board 11 be two, the quantity of the first technique edges 13 be two articles,
The quantity of two technique edges 15 is illustrated as a example by being one.
In the present embodiment, described PCB single board 11 is between described two the first technique edges 13, and often
One PCB single board 11 is connected with adjacent described first technique edges 13 by the first dowel 111.Described
At least two PCB single board 11 is arranged at the opposite sides of described second technique edges 15 and is positioned at described two article
Between one technique edges 13, and each described PCB single board 11 is also by the second dowel 113 and described the
Two technique edges 15 connect.Wherein, at least one described PCB single board 11 is connected with described second technique edges 15
Side be nonlinear type side.Described nonlinear type side refers to be had on the side of described PCB single board
Projection and sunk structure, and it is not smooth, a continuous print straight line.
In the present embodiment, each described PCB single board 11 includes relative first side 1101 and second
Side 1102 and the 3rd relative side 1103 and four side 1104, wherein, described first side 1101
It is linear type side with described second side 1102, and is parallel to described first technique edges 13 and arranges, described
3rd side 1103 and described four side 1104 are nonlinear type side, and along described second technique edges 15
Bearing of trend arrange.Described 3rd side 1103 and described four side 1104 respectively include that multiple interval sets
The protuberance T put, forms depressed part O between adjacent described protuberance T, described 3rd side 1103
It is being parallel to described second technique edges 15 between the protuberance T of protuberance T and described four side 1104
The interlaced arrangement in direction, in like manner, the depressed part O of described 3rd side 1103 and described four side 1104
Depressed part O between in the interlaced arrangement in direction being parallel to described second technique edges 15.
Wherein, described PCB single board 11 is by being arranged at protuberance T and/or the institute of described 3rd side 1103
The second dowel 113 stated on the protuberance T of four side 1104 is connected with described second technique edges 15.
Such as, when described multiple-printed-panel for circuit board 10 includes described second technique edges 15, it is positioned at described second work
The described PCB single board 11 of side, skill limit 15 is by being arranged on the protuberance T of described 3rd side 1103
The second dowel 113 be connected with described second technique edges 15, meanwhile, be positioned at described second technique edges 15
The described PCB single board 11 of opposite side then by be arranged on the protuberance T of described four side 1104
Two dowels 113 are connected with described second technique edges 15.In other embodiments, when described multiple-printed-panel for circuit board
10 when including a plurality of described second technique edges 15, between two adjacent described second technique edges 15
PCB single board 11 by the second dowel 113 of being arranged on the protuberance T of described 3rd side 1103 with
Wherein described second technique edges 15 connects, and by being arranged at the protuberance T of described four side 1104
On the second dowel 113 be connected with another described second technique edges 15.
Being appreciated that in other embodiments, described multiple-printed-panel for circuit board 10 can include three the second technique edges 15,
Wherein second technique edges 15 is as shown in Figure 2, and two other the second technique edges (not shown) connects respectively
Be connected to the end of two the first technique edges 13 being oppositely arranged, thus with two the first technique edges being oppositely arranged
The structure of the 13 square frame shapes collectively forming closing.In other words, three the second technique edges are spaced setting successively,
The second technique edges 15 shown in Fig. 2 between two other the second technique edges, and two adjacent second
A described PCB single board 11, the most described PCB single board 11 and described second technique it is provided with between technique edges
While be sequentially arranged at intervals setting.One be appreciated that in the second technique edges described in two other is by described
Second dowel is connected, separately with the protuberance T of the 3rd side 1103 of PCB single board one of them described 11
Another in outer two described second technique edges is by described second dowel and another described PCB single board
The protuberance T of the four side 1104 of 11 connects.
Referring to Fig. 3, second embodiment of the invention provides a kind of multiple-printed-panel for circuit board 20, including four shape phases
With the first technique edges 23 of being oppositely arranged of PCB single board 21, two and second technique edges 25, described
Second technique edges 25 is vertically connected between described two the first technique edges 23, and with described two the first works
Skill limit 23 is collectively forming a dies.Four described PCB single board 21 are arranged in matrix, wherein
Two PCB single board 21 are positioned at the side of described second technique edges 25, and two other PCB single board 21 is positioned at
The opposite side of described second technique edges 25.Wherein, adjacent with described first technique edges 23 PCB single board 21
It is connected with described first technique edges 23 by the first dowel 211, is positioned at described second technique edges 25 same
Connected by the 3rd dowel 215 between side and adjacent two described PCB single board 21, described in each
PCB single board 21 is all connected with described second technique edges 25 by the second dowel 213.Wherein, at least one
The side that individual described PCB single board 21 is connected with described second technique edges 25 is nonlinear type side.Described non-
Linear type side refers to have on the side of described PCB single board projection and sunk structure, and is not one
Smooth, continuous print straight line.
In the present embodiment, each described PCB single board 21 includes relative first side 2101 and second
Side 2102 and the 3rd relative side 2103 and four side 2104, wherein, described first side 2101
It is linear type side with described second side 2102, and is parallel to described first technique edges 23 and arranges, described
3rd side 2103 and described four side 2104 are nonlinear type side, and along described second technique edges 25
Bearing of trend arrange.Described 3rd side 2103 and described 4th limit, side 2014 respectively include that multiple interval sets
The protuberance T put, forms depressed part O between adjacent described protuberance T, described 3rd side 2103
It is being parallel to described second technique edges 25 between the protuberance T of protuberance T and described four side 2104
The interlaced arrangement in direction, in like manner, the depressed part O of described 3rd side 2103 and described four side 2104
Depressed part O between in the interlaced arrangement in direction being parallel to described second technique edges 25.
Wherein, described PCB single board 21 is by being arranged at protuberance T and/or the institute of described 3rd side 2103
The second dowel 213 stated on the protuberance T of four side 2104 is connected with described second technique edges 25.
Being appreciated that in other embodiments, described multiple-printed-panel for circuit board 20 may also include two other the second technique edges
(not shown), it is connected to the end of described two the first technique edges 23 being oppositely arranged, thus with
Described two the first technique edges 23 being oppositely arranged collectively form the structure of the square frame shape of closing.In other words,
Article three, the second technique edges is spaced setting successively, and the second technique edges 25 shown in Fig. 3 is positioned at two other second
Between technique edges, and it is provided with a PCB single board 21, the most described PCB between two the second adjacent technique edges
Veneer 21 and the second technique edges are sequentially arranged at intervals setting.Wherein, described two other the second technique edges and institute
State the annexation between PCB single board 21 and the second technique edges 25 and described PCB single board shown in Fig. 3
Annexation between 21 is identical, and here is omitted.
It is appreciated that described PCB single board is not limited to shape as shown in Figure 2 or Figure 3, it is also possible to be three
The polygons such as dihedral, pentagon, hexagon.Described PCB single board includes at least one nonlinear type side,
When multiple described PCB single board form multiple-printed-panel for circuit board, if described nonlinear type side and described first technique
Limit is adjacent, and the most described nonlinear type side is directly connected with described first technique edges by the first dowel；If
The nonlinear type side of one of them described PCB single board and the linear type side of other PCB single board or non-straight
Line style side is adjacent, the most wherein the nonlinear type side of a described PCB single board and other PCB single board
Second technique edges is set between linear type side or nonlinear type side, and each via the second dowel with
Described second technique edges connects.I.e. the nonlinear type side of one of them described PCB single board is by the second connection
Muscle is connected with described second technique edges, the linear type side of other PCB single board adjacent with this nonlinear type side
Limit or nonlinear type side are connected with described second technique edges also by the second dowel, adjacent to ensure
A PCB single board between the nonlinear type side of two PCB single board or in adjacent two PCB single board
Nonlinear type side and the linear type side of another PCB single board between be provided with the second technique edges, and should
Second technique edges is connected with adjacent two PCB single board by the second dowel.
Refer to Fig. 4, in an embodiment of the invention, also provide for the manufacture method of a kind of multiple-printed-panel for circuit board,
Described manufacture method at least includes:
Step S101: at least two PCB single board, two the first technique edges and at least one the second techniques are provided
Limit；
Step S102: by described two the first opposing parallel settings of technique edges, and by described at least one second
Technique edges is connected between described two the first technique edges；
Step S103: described at least two PCB single board is arranged at described second technique edges both sides, and is positioned at
Between described two the first technique edges；
Step S104: by each described PCB single board by the first dowel and adjacent described first technique
Limit connects；
Step S105: by each described PCB single board also by the second dowel with described second technique edges even
Connecing, wherein, the side that at least one described PCB single board is connected with described second technique edges is nonlinear type side
Limit.
It is preferred that each described PCB single board includes relative first side and second side and relative
Three sides and four side, described first side and described second side are linear type side, and are parallel to institute
Stating the first technique edges to arrange, described 3rd side and described four side are nonlinear type side, and along described
The bearing of trend of the second technique edges is arranged.
It is preferred that the first side adjacent with described first technique edges and second side by the first dowel with
Described first technique edges connects, logical between first side and the second side of two adjacent described PCB single board
Cross the 3rd dowel to connect.
It is preferred that described 3rd side and described four side respectively include multiple spaced protuberance, phase
Forming depressed part between adjacent described protuberance, the protuberance of described 3rd side is convex with described four side
Go out and be parallel to the interlaced arrangement in direction of described second technique edges, the depression of described 3rd side between portion
It is being parallel to the interlaced row in direction of described second technique edges between the depressed part of portion and described four side
Cloth.
It is preferred that described second dowel is arranged at the protuberance of described 3rd side and/or described four side
Protuberance on, described PCB single board is by being arranged at the protuberance of described 3rd side and/or described 4th side
The second dowel on the protuberance on limit is connected with described second technique edges.
It is appreciated that each step of the manufacture method of described multiple-printed-panel for circuit board and implements and can also join
According to the associated description in Fig. 2 and embodiment illustrated in fig. 3, here is omitted.
Multiple-printed-panel for circuit board that the embodiment of the present invention provides and manufacture method thereof, by be oppositely arranged at two articles the
At least one the second technique edges are set between one technique edges, such that it is able to PCB single board described at least two divided
It is not arranged at described second technique edges both sides, so that the nonlinear type side of each described PCB single board
All adjacent with described second technique edges, and then by described second dowel by each described PCB single board
Nonlinear type side is connected with described second technique edges, can solve the irregular PCB single board in edge and formed
The problem that the dowel matched cannot be set during jigsaw, thus be effectively improved by irregular nonlinear type side
The bulk strength of the described multiple-printed-panel for circuit board that the PCB single board on limit is formed and stability.
It should be noted that in this article, term " includes ", " comprising " or its any other variant are intended to contain
Comprising of lid nonexcludability, so that include the process of a series of key element, method, article or device not
Only include those key elements, but also include other key elements being not expressly set out, or also include for this
The key element that process, method, article or device are intrinsic.In the case of there is no more restriction, by statement " bag
Include one ... " key element that limits, it is not excluded that including the process of this key element, method, article or device
In there is also other identical element.Additionally, the invention described above embodiment sequence number is just to describing, not generation
The quality of table embodiment.
Above disclosed only presently preferred embodiments of the present invention, can not limit the present invention with this certainly
Interest field, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment,
And according to the equivalent variations that the claims in the present invention are made, still fall within the scope that invention is contained.
Claims (10)
1. a multiple-printed-panel for circuit board, including at least two PCB single board, it is characterised in that described circuit board is spelled
Plate also includes two the first technique edges being oppositely arranged and is connected between described two the first technique edges at least
Article one, the second technique edges, described at least two PCB single board is respectively arranged at relative the two of described second technique edges
Side and between described two the first technique edges, each described PCB single board passes through the first dowel and phase
Adjacent described first technique edges connects, and each described PCB single board is also by the second dowel and described second
Technique edges connects, and wherein, the side that at least one described PCB single board is connected with described second technique edges is non-
Linear type side.
2. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that each described PCB single board bag
Include relative first side and second side and the 3rd relative side and four side, described first side and
Described second side is linear type side, and be parallel to described first technique edges arrange, described 3rd side and
Described four side is nonlinear type side, and along the bearing of trend setting of described second technique edges.
3. multiple-printed-panel for circuit board as claimed in claim 2, it is characterised in that adjacent with described first technique edges
First side and second side be connected with described first technique edges by the first dowel, two adjacent institutes
State and connected by the 3rd dowel between the first side of PCB single board and second side.
4. multiple-printed-panel for circuit board as claimed in claim 2 or claim 3, it is characterised in that described 3rd side and institute
State four side and respectively include multiple spaced protuberance, between adjacent described protuberance, form depressed part,
It is being parallel to described second technique edges between protuberance and the protuberance of described four side of described 3rd side
The interlaced arrangement in direction, between depressed part and the depressed part of described four side of described 3rd side
It is parallel to the interlaced arrangement in direction of described second technique edges.
5. multiple-printed-panel for circuit board as claimed in claim 4, it is characterised in that described second dowel is arranged at institute
Stating on the protuberance of the 3rd side and/or the protuberance of described four side, described PCB single board is by being arranged at
The second dowel and described second on the described protuberance of the 3rd side and/or the protuberance of described four side
Technique edges connects.
6. the manufacture method of a multiple-printed-panel for circuit board, it is characterised in that described manufacture method includes:
At least two PCB single board, two the first technique edges and at least one the second technique edges are provided；
Described two the first technique edges are oppositely arranged, and the second technique edges described at least one is connected to institute
State between two the first technique edges；
Described at least two PCB single board is arranged at described second technique edges both sides, and is positioned at described two article
Between one technique edges；
Each described PCB single board is connected with adjacent described first technique edges by the first dowel；
Each described PCB single board is all connected with described second technique edges also by the second dowel, wherein,
The side that at least one described PCB single board is connected with described second technique edges is nonlinear type side.
7. manufacture method as claimed in claim 6, it is characterised in that each described PCB single board includes
Relative first side and second side and the 3rd relative side and four side, described first side and institute
Stating second side is linear type side, and is parallel to described first technique edges setting, described 3rd side and institute
Stating four side is nonlinear type side, and along the bearing of trend setting of described second technique edges.
8. manufacture method as claimed in claim 7, it is characterised in that adjacent with described first technique edges
First side and second side are connected with described first technique edges, described in adjacent two by the first dowel
Connected by the 3rd dowel between first side and the second side of PCB single board.
9. as claimed in claim 7 or 8 manufacture method, it is characterised in that described 3rd side and described
Four side respectively includes multiple spaced protuberance, forms depressed part between adjacent described protuberance,
It is being parallel to described second technique edges between protuberance and the protuberance of described four side of described 3rd side
The interlaced arrangement in direction, between depressed part and the depressed part of described four side of described 3rd side
It is parallel to the interlaced arrangement in direction of described second technique edges.
10. manufacture method as claimed in claim 7, it is characterised in that described second dowel is arranged at
On the described protuberance of the 3rd side and/or the protuberance of described four side, described PCB single board is by arranging
The second dowel on the protuberance of described 3rd side and/or the protuberance of described four side and described the
Two technique edges connect.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810743569.5A CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
| CN201610380517.7A CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380517.7A CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810743569.5A Division CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934089A true CN105934089A (en) | 2016-09-07 |
| CN105934089B CN105934089B (en) | 2019-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810743569.5A Expired - Fee Related CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
| CN201610380517.7A Expired - Fee Related CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810743569.5A Expired - Fee Related CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708301A (en) * | 2017-09-27 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195324B (en) * | 2016-05-31 | 2020-06-02 | Oppo广东移动通信有限公司 | Circuit board jointed board and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201230401Y (en) * | 2008-07-07 | 2009-04-29 | 林益明 | Electronic circuit brace board |
| CN102194715A (en) * | 2010-03-16 | 2011-09-21 | 南亚电路板股份有限公司 | Packaging substrate module and strip-shaped packaging substrate |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
| CN202262067U (en) * | 2011-09-02 | 2012-05-30 | 深圳市福祺斯电子有限公司 | Printed circuit board |
| CN203775530U (en) * | 2014-03-14 | 2014-08-13 | 华为终端有限公司 | Splicing board |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW499825B (en) * | 1999-02-23 | 2002-08-21 | Samsung Electro Mech | Method and device for coupling PCB sheet |
| CN109195324B (en) * | 2016-05-31 | 2020-06-02 | Oppo广东移动通信有限公司 | Circuit board jointed board and manufacturing method thereof |
-
2016
- 2016-05-31 CN CN201810743569.5A patent/CN109195324B/en not_active Expired - Fee Related
- 2016-05-31 CN CN201610380517.7A patent/CN105934089B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201230401Y (en) * | 2008-07-07 | 2009-04-29 | 林益明 | Electronic circuit brace board |
| CN102194715A (en) * | 2010-03-16 | 2011-09-21 | 南亚电路板股份有限公司 | Packaging substrate module and strip-shaped packaging substrate |
| CN202262067U (en) * | 2011-09-02 | 2012-05-30 | 深圳市福祺斯电子有限公司 | Printed circuit board |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
| CN203775530U (en) * | 2014-03-14 | 2014-08-13 | 华为终端有限公司 | Splicing board |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708301A (en) * | 2017-09-27 | 2018-02-16 | 广东欧珀移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109195324A (en) | 2019-01-11 |
| CN105934089B (en) | 2019-01-04 |
| CN109195324B (en) | 2020-06-02 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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