CN1059289C - Tape attaching apparatus for semiconductor lead frame - Google Patents
Tape attaching apparatus for semiconductor lead frame Download PDFInfo
- Publication number
- CN1059289C CN1059289C CN95105170A CN95105170A CN1059289C CN 1059289 C CN1059289 C CN 1059289C CN 95105170 A CN95105170 A CN 95105170A CN 95105170 A CN95105170 A CN 95105170A CN 1059289 C CN1059289 C CN 1059289C
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- lead frame
- semiconductor lead
- attaching apparatus
- belt attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
- F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A tape attaching apparatus for a semiconductor lead frame includes a bonding tape drier to heat and dry bonding tape under a high temperature just before a tape attaching process for the semiconductor lead frame, and a bonding tape protector which protects the dried bonding tape from the ambient atmosphere until just before the bonding tape is attached to the lead frame, thereby preventing the formation of air bubbles and improving the adhesiveness of the bonding tape. The apparatus is especially effective in attaching thermoplastic bonding tape to a lead-on-chip lead frame.
Description
The present invention relates to a kind of belt attaching apparatus that is used for semiconductor lead frame.In more detail, the present invention relates to be equipped with a kind of belt attaching apparatus that is used for semiconductor lead frame of adhesive tape drier, this drier was at high temperature carrying out dried to adhesive tape joining to this belt before this semiconductor lead frame.The present invention has improved the adhesiveness of this adhesive tape.
In general, semiconductor lead frame is one of chief component of semiconductor packages.The function of semiconductor lead frame has two aspects: the one, as a kind of lead-in wire that semiconductor chip and outside are coupled together; The 2nd, as the framework that supports this chip self.Conventional semiconductor leads comprises lead, outer lead and lays the base of this semiconductor chip.This lead-in wire also comprises the center rectangular substrate that the rectangular base of laying this semiconductor chip is housed.This rectangular base is supported by two or four support bars.In addition, also the lead that connects the device wire in each end points and the chip by the lead-in wire bonding is arranged in four limits of close this base, this lead extends to the outer lead place that is used to be soldered to substrate.
In semiconductor fabrication process, in order to prevent from lead frame is carried out taking place during the processed situation of lead distortion or lateral shift, with adhesive tape joining (number of leads of this kind encapsulation is more and lead-in wire is narrower at interval) to the lead frame of dual in-line package (DIP) or square flat packaging (QFP).In these technologies, this adhesive tape is cut into rectangle, and with its paste this lead leading edge around, also this adhesive tape joining to the mid portion of this lead.Therefore, just that four to ten lead-in wires are sticky together to reach fixing purpose.
In order to adapt to the trend of semiconductor packages miniaturization and slimming, the designing technique of lead frame has had to be improved rapidly and changes.By size that enlarges this base and the length that shortens this lead, can obtain a kind of high lead-in wire density.If but the length of lead is too short since after outer lead is fixed in the encapsulation to the drawing effect of this outer lead, may pull apart this lead from this semiconductor packages.Therefore, lead there is the requirement of a shortest length.
Recently, in order to address this problem and to improve electrical property thus, developed a kind of new technology and realized commercialization.In this technology, cancelled center base and supported the bar of this center base, and replaced a kind of semiconductor lead frame with following structure, in this structure by the direct support semiconductor chip of the lead that extends internally.
Chip is contained in lead-in wire, and to go up the structure of (COL) be a kind of like this lead frame structure: wherein a two-sided adhesive tape joining is extended to the upper surface of this package center to lead, the lower surface of semiconductor chip is pasted the another side of this adhesive tape.Be referred to as lead-in wire at another kind and be contained in the structure of (LOC) on the chip, the one side of double-faced adhesive tape is pasted the lower surface of this lead that extends to this package center, and the upper surface of chip is pasted the another side of this adhesive tape.
The belt attaching apparatus that a kind of semiconductor lead frame is used is made up of a support (base frame) and a pedestal (bed frame) (can load a series of device on it) that is installed on this support.This belt attaching apparatus is installed on this punch die by a punch die that is installed in this support mid portion, one and comprises that with the drift of this punch die engagement and one a cylinder block cylinder, that be positioned on this support with support forms.Here, the action along with cylinder rises this drift and decline.In addition, in order in whole technical process, to move this adhesive tape, also a reel spindle and a take-up spool respectively are installed at each end of this pedestal.When the operation of the adhesive tape on being wound onto this reel spindle by this take-up spool is sent to the punch die place, by special this adhesive tape joining of the action of drift to lead frame.In this case, this lead frame is offered this punch die along the direction vertical with the moving direction of this adhesive tape.
A kind of conventional as mentioned above belt attaching apparatus using thermosetting that is used for semiconductor lead frame or thermoplastic resin as the adhesive of adhesive tape.The belt barbola work of using the adhesive tape of this adhesive is to carry out in 200 ℃ to 400 ℃ temperature range.The thermoplastic bonded band that is generally used for the lead frame of this LOC structure at room temperature has high moisture absorption ratio, thereby needs high-temperature technology (being about 400 ℃).
During high temperature belt barbola work, the moisture that is absorbed under the room temperature in this adhesive tape interacts with the volatile material that comprises in this adhesive tape, thereby forms the indefinite bubble of size.As a result, forming a uneven adhesion space between adhesive tape and the lead frame or between adhesive tape and chip, therefore just weakening the adhesiveness of adhesive tape and reduced the product reliability that records in the adverse circumstances test.
That is to say, observed in the thermal cycle of operate as normal that a kind of expansion and contraction repeatedly appears in the bubble that forms between the surface of adhesive tape and chip, it causes damage for the protective film of chip surface.
In order to obtain advantage of the present invention and reach purpose of the present invention (this point will be illustrated and comprehensively describe with embodiment) in this paper, the present invention includes a kind of belt attaching apparatus that is used for semiconductor lead frame, this equipment can prevent to form bubble during barbola work, thereby has improved the adhesiveness of adhesive tape.
Though belt attaching apparatus of the present invention is used for that all form easily bubbles and is not easy to make the belt barbola work of adhesive fusion with the semiconductor lead frame pasted applicable to a kind of, but when the thermoplastic bonded band of application need high-temperature technology (as in the situation of LOC lead frame), this equipment is effective especially.
In order to obtain above-mentioned and other advantage of the present invention and to reach purpose of the present invention (this point will be illustrated and comprehensively describe with embodiment in this article), the invention provides a kind of belt attaching apparatus that is used for semiconductor lead frame, this equipment is by a support that a pedestal is housed, an adhesive tape feedway that is installed on this pedestal, one is installed in the support the adhesive tape joining apparatus of adhesive tape joining on the semiconductor leads, and be installed in adhesive tape drying device between adhesive tape feedway and the adhesive tape joining apparatus, be used for before adhesive tape joining is to the semiconductor lead frame, this adhesive tape being carried out dried; Wherein, described adhesive tape feedway comprises that one is installed in reel spindle that pedestal one end carries out to do for ribbon gymnastics and one and is installed in the take-up spool that this pedestal other end is carried out take-up operation, and described adhesive tape joining apparatus comprises an adhesive tape joining punch die and drift on the semiconductor leads; And described drying device preferably includes a plurality of heating units, and the temperature of each heating unit increases gradually with respect to last heating unit, so that can farthest reduce thermal shock when this adhesive tape of heating.
Each physical length and the temperature of this heating unit preferably can be controlled according to designing requirement.Load onto the heat transfer distance control device to control to the heat transfer distance at this adhesive tape place then better at each heating unit place.
Preferably a kind of material with even heat distribution characteristic is covered on the upper surface of this adhesive tape drying device so that heat evenly distributes.
Have even heat distribution characteristic and cover the material aluminium preferably of the upper surface of this adhesive tape drying device.
This adhesive tape drying device preferably is equipped with a gas access forming a kind of atmosphere, thereby farthest reduces and the contacting of ambiance.
The gas material that is incorporated into this adhesive tape drying device is nitrogen or dry air preferably.
The dry air that is incorporated into this adhesive tape drying device preferably is made up of such air: exactly air being carried out dried by a kind of independently dehumidification equipment to it, is 55% to 65% until reaching relative temperature.
An adhesive tape protective device preferably is provided between adhesive tape drying device and belt sticker.When this drying device during away from belt, this adhesive tape protective device separates adhesive tape and ambiance.
A kind of atmosphere spacer assembly preferably is provided between adhesive tape drying device and belt sticker, thereby this adhesive tape and ambiance are separated and is protected.Preferably this adhesive tape drying device provides the gas material that has heated to this atmosphere spacer assembly.
By following description and explanation and appended claim, can be well understood to advantage of the present invention and purpose.
It goes without saying that, above general description and the following detailed description all be illustrative with illustrative, can provide about further instruction of the present invention if required.
Below in conjunction with accompanying drawing the present invention is described.These description of drawings one embodiment of the present of invention, and with text description play the explanation principle of the present invention effect.
Fig. 1 according to one embodiment of the present of invention, be used for the sketch of the belt attaching apparatus of semiconductor lead frame.
Fig. 2 is the detailed view of Fig. 1 pedestal.
Fig. 3 is the front view of Fig. 2.
Fig. 4 is the front view of the atmosphere isolated location shown in Fig. 1.
The present invention discloses a kind of belt attaching apparatus for semiconductor lead frame, this equipment Comprise a support that a pedestal is housed, (this device comprises a peace to a tape supply device Being contained in this pedestal one end carries out for the reel spindle of band operation and one and is installed in this pedestal other end Carry out the take-up spool of take-up operation) and a belt sticker (this device comprises a peace Be contained in punch die and the drift of this support core, with so that this adhesive tape joining to semiconductor On the lead-in wire).
To at length narrate preferred embodiment of the present invention now, press its example of description of drawings.In whole accompanying drawing, all possibility parts will use same label to represent same or similar parts.
According to Fig. 1, belt attaching apparatus of the present invention comprises support 10 and the pedestal 11 that is installed on the support 10, therefore can load a series of device thereon.This belt attaching apparatus also comprise the mid portion that is installed in support 10 punch die 17, be installed on the punch die 17 and with the drift 16 of its engagement be supported on the support 10 by support 20 and the cylinder block 14 that is connected with a cylinder 15.Rise and descend along with the work of cylinder 15 makes drift 16.In addition, at two ends of pedestal 11 reel spindle 18 and take-up spool 19 are installed respectively.At punch die 17 be installed in and calandria 12 is installed between the reel spindle 18 on the pedestal 11 adhesive tape that is provided is heated and dries.Also provide atmosphere isolated location 13 between this external calandria 12 and the punch die 17, be exposed in the ambiance with the adhesive tape that prevents to have dried.Therefore, by calandria 12 and after by oven dry, before just in time finishing this belt barbola work itself, this adhesive tape can pass through atmosphere isolated location 13 continuously at adhesive tape 1.
With reference to Fig. 2, calandria 12 is divided into mass part, each part has with respect to a preceding part temperature that increases is gradually arranged, so that farthest reduce the thermal shock when heater 121,122 and 123 heating and oven dry adhesive tape 1.Moreover, making the aluminium sheet 124 of keeping even heat distribution in each heater cover the heater 121,122 of calandria 12 and 123 upper surface.Control the heater 121,122 and 123 of calandria 12 by the controller (not shown) of controlling each heter temperature automatically.If the dead time of this belt barbola work surpasses a certain time limit, calandria 12 is glided to strengthen the distance between adhesive tape and heater 121,122 and 123 here.
Support the heater 121,122 and 123 of calandria 12 by a kind of heat-barrier material 125, in order that make the heat that sends from each heater 121,122 and 123 can not be delivered to pedestal 11.Provide gas access 126 to each heater 121,122 and 123, make nitrogen or the dry air introduced from the external air source (not shown) can pass through heater 121,122 and 123.Thereby heated nitrogen or dry air help the dry of adhesive tape 1 and prevent that this belt from contacting with ambiance." drying " air described here is a kind of like this air: it by one independently dehumidification equipment carry out dried, be 55% to 65% until reaching relative humidity.Finish by draught head from this drying equipment outflow nitrogen or dry air.Here, by making discharge gas enough big in the amount of these atmosphere isolated location 13 1 sides, so that in atmosphere isolated location 13, form a kind of 50 ℃ to 80 ℃ dry atmosphere, so up to beginning to prevent always that still this adhesive tape that has dehumidified from contacting with surrounding air before this belt barbola work.
In addition, under heat-barrier material 125, also be provided for being provided with the height control lever 127 of the lifting of calandria 12 and the height that pauses.
Working condition as above-mentioned mode belt attaching apparatus that constitute, that be used for semiconductor leads is described hereinafter with reference to the accompanying drawings.
Referring to figs. 1 through Fig. 4,, offer the punch die 17 of the core that is contained in support 10 by the coiling operation of take-up spool 19 the adhesive tape 1 that begins to be wound on the reel spindle 18.When adhesive tape 1 by calandria 12 and when carrying out dried, this adhesive tape with air insulated and when being protected continuously by this atmosphere isolated location 13 and finally be provided for punch die 17.At this moment, the two ends of this adhesive tape are only supported by reel spindle 18 and take-up spool 19, this adhesive tape provide be not with the contacted situation of other building block of this equipment under (that is to say that this adhesive tape is unsettled) of carrying out.When adhesive tape 1 is offered punch die 17, the operation by drift 16 and punch die 17 with this adhesive tape 1 paste with the perpendicular semiconductor lead frame (not shown) that provides of the moving direction of adhesive tape 1 on.
As mentioned above, the belt attaching apparatus that is used for semiconductor lead frame of the present invention comprises an adhesive tape drier that just in time at high temperature adhesive tape 1 was heated and dried before the belt barbola work.The present invention also comprises an adhesive tape protector; this protector is up to just in time this adhesive tape joining being protected this dry adhesive tape before this lead frame; make it to isolate the adhesiveness that prevents from thus to form bubble He improve this adhesive tape with ambiance.
With regard to one of skill in the art, the practice of the present invention of having seen this specification and having disclosed here obviously can obtain other embodiments of the invention easily.This specification and the example of being enumerated can be thought illustrative just, relevantly of the present inventionly conceive scope accurately and will be limited by following claim.
Claims (11)
1. belt attaching apparatus that is used for semiconductor lead frame, it comprises:
The support that a pedestal is housed;
Be used to supply with the device of adhesive tape on this pedestal, described adhesive tape feedway comprises a reel spindle and the take-up spool in this pedestal other end execution take-up operation carrying out to do for ribbon gymnastics at this pedestal one end,
The device of adhesive tape joining to the semiconductor lead frame, described adhesive tape joining apparatus comprises an adhesive tape joining punch die and drift on the semiconductor leads in this support, and
Between this adhesive tape feedway and this adhesive tape joining apparatus, be used for before this adhesive tape joining is to this semiconductor lead frame to the withering adhesive tape drying device of this adhesive tape, described adhesive tape drying device comprises a plurality of heating units, the temperature of each heating unit increases gradually with respect to last heating unit, so that farthest reduce thermal shock when this adhesive tape of heating.
2. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 1, wherein, described adhesive tape joining apparatus is positioned at the core of this support.
3. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 1, wherein, each temperature of described a plurality of heating units all is constant, and makes described a plurality of heating unit rise and descend according to the operation of this belt barbola work.
4. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 1 wherein, evenly distributes heat thereby cover described adhesive tape drying device with a kind of material with even heat distribution characteristic.
5. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 1, wherein, described adhesive tape drying device comprises the device that a kind of predetermined gas material is provided, thereby farthest reduces contacting between ambiance and the described adhesive tape drying device inside.
6. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 4, wherein, described material comprises an aluminium sheet.
7. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 5, wherein, described gas material comprises nitrogen.
8. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 5, wherein, described gas material comprises dry air.
9. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 8, wherein, described dry air comprise by one independently dehumidification equipment carry out drying, up to the air that reaches relative humidity 55% to 65%.
10. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 1 also is included between described adhesive tape drying device and the described adhesive tape joining apparatus, is used for this adhesive tape and ambiance is kept apart and to its atmosphere spacer assembly of protecting.
11. the belt attaching apparatus that is used for semiconductor lead frame described in the claim 10, wherein, described atmosphere spacer assembly comprises from the next gas material that has heated of described adhesive tape drying device.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR19940009600 | 1994-04-30 | ||
| KR9600/94 | 1994-04-30 | ||
| KR2019950003022U KR200174655Y1 (en) | 1994-04-30 | 1995-02-23 | General semiconductor and taping apparatus of lead frame |
| KR3022/95 | 1995-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1112290A CN1112290A (en) | 1995-11-22 |
| CN1059289C true CN1059289C (en) | 2000-12-06 |
Family
ID=26630336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95105170A Expired - Fee Related CN1059289C (en) | 1994-04-30 | 1995-04-28 | Tape attaching apparatus for semiconductor lead frame |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3628755B2 (en) |
| KR (1) | KR200174655Y1 (en) |
| CN (1) | CN1059289C (en) |
| GB (1) | GB2288909B (en) |
| TW (1) | TW308357U (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW315491B (en) * | 1995-07-31 | 1997-09-11 | Micron Technology Inc | Apparatus for applying adhesive tape for semiconductor packages |
| US6281044B1 (en) | 1995-07-31 | 2001-08-28 | Micron Technology, Inc. | Method and system for fabricating semiconductor components |
| AU7606496A (en) * | 1996-11-06 | 1998-05-29 | Micron Technology, Inc. | Apparatus for applying adhesive tape for semiconductor packages |
| EP1376658B1 (en) * | 2002-06-25 | 2011-07-06 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing semiconductor device |
| KR100929387B1 (en) * | 2003-02-18 | 2009-12-02 | 삼성테크윈 주식회사 | Taping method of lead frame and its device |
| CN1315153C (en) * | 2003-12-16 | 2007-05-09 | 广东工业大学 | Cylinder cam mechanism assembly for sticking machine lead frame feeding |
| US8693172B2 (en) | 2008-01-04 | 2014-04-08 | Milestone Av Technologies Llc | Flat panel display mount |
| KR101073698B1 (en) * | 2009-09-07 | 2011-10-14 | 도레이첨단소재 주식회사 | Lamination method of adhesive tape and lead frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985105A (en) * | 1989-01-21 | 1991-01-15 | Shinko Electric Industries Co., Ltd. | Taping apparatus for lead frame |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IE55238B1 (en) * | 1983-08-03 | 1990-07-04 | Nat Starch Chem Corp | Carrier film with conductive adhesive for dicing of semiconductor wafers |
| JPH06283573A (en) * | 1992-05-08 | 1994-10-07 | Nec Corp | Single point tab bonder provided with bump heating mechanism |
-
1995
- 1995-02-23 KR KR2019950003022U patent/KR200174655Y1/en not_active IP Right Cessation
- 1995-04-25 TW TW084205447U patent/TW308357U/en unknown
- 1995-04-26 GB GB9508509A patent/GB2288909B/en not_active Expired - Fee Related
- 1995-04-26 JP JP12714495A patent/JP3628755B2/en not_active Expired - Fee Related
- 1995-04-28 CN CN95105170A patent/CN1059289C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985105A (en) * | 1989-01-21 | 1991-01-15 | Shinko Electric Industries Co., Ltd. | Taping apparatus for lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| TW308357U (en) | 1997-06-11 |
| CN1112290A (en) | 1995-11-22 |
| GB9508509D0 (en) | 1995-06-14 |
| JP3628755B2 (en) | 2005-03-16 |
| KR950031481U (en) | 1995-11-22 |
| KR200174655Y1 (en) | 2000-03-02 |
| GB2288909B (en) | 1998-09-16 |
| GB2288909A (en) | 1995-11-01 |
| JPH07302875A (en) | 1995-11-14 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20001206 Termination date: 20120428 |