CN105925227A - Special mildew-inhibiting glue and preparation method thereof - Google Patents
Special mildew-inhibiting glue and preparation method thereof Download PDFInfo
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- CN105925227A CN105925227A CN201610518930.5A CN201610518930A CN105925227A CN 105925227 A CN105925227 A CN 105925227A CN 201610518930 A CN201610518930 A CN 201610518930A CN 105925227 A CN105925227 A CN 105925227A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a special mildew-inhibiting glue which is composed of the following components in percentage by weight: 25-35% of special-type resin, 3-8% of anti-mildew diluter, 3-8% of anti-mildew agent, 2-5% of aid, 40-60% of filler, 1-3% of color paste and 5-10% of modifier. The preparation technique of the special-type resin comprises the following steps: adding an auxiliary material into a bisphenol A epoxy resin, and reacting at 80 DEG C for 12 hours, wherein the weight ratio of the auxiliary material to the bisphenol A epoxy resin is 1:1, and the auxiliary material is composed of 5 wt% of organic solvent and 95 wt% of polymerization inhibitor. The invention also discloses a preparation method of the special mildew-inhibiting glue. The preparation method comprises the following steps: (1) synthesizing the special-type resin; (2) treating the filler; and (3) mixing. By adding the anti-mildew agent and anti-mildew diluter into the special-type resin, the produced glue has excellent mildew resistance, and can simultaneously resist corrosion of multiple mildews under extreme conditions.
Description
Technical field
The invention belongs to binding agent and manufacture field, be specifically related to one and press down mycete glue special.
Background technology
If it is known that various electronic product uses in moister environment, in electronic product throughout the year
Casting glue be easily subject to the infringement of the microorganism such as antibacterial, mycete, surface easily forms various mycete, these
The existence of mycete, can cause that casting glue is mouldy, variable color, come off, lose sealing water-proof function, largely effect on
The performance and used life of product, the military electronic product used the most in the wild, because wild environment is multiple
Miscellaneous, multiple mycete can be had to corrode casting glue simultaneously simultaneously, this just promotes the casting glue of electronic product surface encapsulation
Need the resistance to fungi with excellence.
Summary of the invention
The technical problem to be solved is just to provide one and under extreme conditions can resist multiple mould simultaneously
What bacterium corroded presses down mycete glue special.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that one presses down mycete glue special,
Its composition is formed by following percentage by weight:
The preparation technology of Special Resin is to add auxiliary material in bisphenol A epoxide resin, the temperature of 80 DEG C
Lower reaction 12 hours, the weight ratio of auxiliary material and bisphenol A epoxide resin is 1:1, the composition of auxiliary material
It is organic solvent and the polymerization inhibitor of 95% of 5% count by weight percentage.
Further its composition is formed by following percentage by weight:
Further antimycotic agent is in sodium benzoate solvent, sodium bicarbonate solvent or dehydroactic acid sodium solvent
A kind of.
Further antifungal diluent is glycidyl oxirane solvent, glycidyl oxirane and the body of water
Long-pending ratio is 1:1.
Further the volume ratio mixing of 1:1:1 pressed by auxiliary agent by defoamer, levelling agent and toner.
Further the weight ratio mixing of 7:1 pressed by filler by aluminium hydroxide and silicon powder.
Further filler also includes silane coupler, silane coupler and aluminium hydroxide and silicon powder mixture
Weight ratio be 1:100.
Further organic solvent is styrene solvent.
Further modifying agent is titanate esters.
Present invention also offers one and press down mycete glue special preparation method, comprise the steps:
(1) synthesis of Special Resin: add styrene solvent and polymerization inhibitor reaction in bisphenol A epoxide resin.
(2) process of filler: use the preprocess method of silane coupler that filler is carried out wetting and dispersing.
(3) mixing: Special Resin and antifungal diluent, mill base and the auxiliary agent of pre-synthesis are first put into production
Premix in equipment, it is ensured that the fusion completely of fluent material, make performed polymer；After performed polymer is cooled down,
Put into modifying agent and the filler through pretreatment, after mixing, resin compound is carried out fineness test；Will be thin
Spend qualified resin-filler mix to continue to heat, then antimycotic agent is added stirring；Finally carry out vacuum
Processing, after intermediate detection is qualified, discharging is packed.
Compared with prior art, the invention has the beneficial effects as follows:
1, antifungal diluent reduces the viscosity of Special Resin, improves the operability of resin, resists simultaneously
Mycete diluent has facilitation to antimycotic agent, and through the dilution of antifungal diluent, antimycotic agent is
Can preferably play a role, compared to only with the addition of the epoxy resin of antimycotic agent, by pre-synthesis containing
The Special Resin of polymerization inhibitor, can effectively prevent bisphenol A epoxide resin because of antimycotic agent generation polyreaction
Hardening.Because organic solvent can increase the degree of polymerization of resin, so by the synthesis step of Special Resin, increasing
The degree of polymerization of big epoxy resin and surface tension, but lead for preventing epoxy resin from automatically occurring to be polymerized completely
Cause resin is hardening, so adding polymerization inhibitor.
2, Special Resin is in the curing process, and surface can produce pit, and the levelling agent in auxiliary agent can eliminate surface
Pit, minute surface is made on surface the same；Defoamer in auxiliary agent can make surface tension reduce rapidly, disappears
Except the bubble produced in stirring solidification process, prevent the electrical property of aeration later stage colloid；Increasing in auxiliary agent
Toner has compensated for the problem that in resin curing process, produced surface colourity is inadequate.
Compared with prior art, the present invention is by adding antimycotic agent and antifungal diluent in Special Resin
Make the glue produced be provided with the Anti-mildew capability of excellence, multiple mycete can be resisted the most simultaneously
Corrode.
Detailed description of the invention
Embodiment one:
One presses down mycete glue special, and its composition is formed by following percentage by weight:
The preparation technology of Special Resin is to add auxiliary material in bisphenol A epoxide resin, the temperature of 80 DEG C
Lower reaction 12 hours, the weight ratio of auxiliary material and bisphenol A epoxide resin is 1:1, the composition of auxiliary material
It is organic solvent and the polymerization inhibitor of 95% of 5% count by weight percentage.
Antimycotic agent is sodium benzoate solvent, and antifungal diluent is glycidyl oxirane solvent, and epoxy contracts
Water glycerin ether is 1:1 with the volume ratio of water, and auxiliary agent is pressed the volume of 1:1:1 by defoamer, levelling agent and toner
Than mixing, filler is pressed the weight ratio mixing of 7:1 by aluminium hydroxide and silicon powder, is also included silane coupler, silicon
Alkane coupling agent is 1:100 with the weight ratio of aluminium hydroxide and silicon powder mixture, and organic solvent is styrene solvent,
Modifying agent is titanate esters.
One presses down mycete glue special, and main technological steps is as follows:
1, the synthesis of Special Resin
Styrene solvent and the polymerization inhibitor of 95% of 5% is added, the temperature of 80 DEG C in bisphenol A epoxide resin
The lower reaction of degree 12 hours, it is ensured that insert styrene in the segment of epoxy resin so that segment is complete with styrene
Linking.
2, the process of filler
The intermolecular gap of common fillers is relatively big and irregularly shaped in the majority, can cause resin cured matter surface
Microscopic voids is more, is formed " empty ", by using the preprocess method of silane coupler to carry out filler
Wetting and dispersing, improves the adhesion of itself and resin, and coupling agent is 1:100 with the weight ratio of filler.Filler is hydrogen
Aluminium oxide and the mixture of silicon powder, aluminium hydroxide has fire-retardant effect, can increase the machinery of later stage colloid
Performance ensures to use the insulating properties of the electrical equipment of colloid simultaneously.
3, mixed process
The Special Resin of pre-synthesis and antifungal diluent, mill base and auxiliary agent are first put into production and carries out in equipment
Premix, temperature controls between 90～95 DEG C, and the time is 3 hours, it is ensured that the fusion completely of fluent material, does
Become performed polymer, performed polymer is cooled to 60 DEG C, put into as the titanate esters of modifying agent and filling out through pretreatment
Material, rotating speed controls at 150 revs/min, and temperature controls at 75～80 DEG C, because the deactivation temperature of titanate esters is 100 DEG C,
So the too high meeting of mixing temperature causes the inactivation of modifying agent, the too low meeting of mixing temperature to cause modifier treatment effect
Decline, 75～80 DEG C is tried optimal mixing temperature, mixing 3 hours after, to resin compound
Carry out fineness test, next process can being entered less than 22 microns, otherwise continuing stirring, because working as mixture
Fineness more than 22 microns time, then mixture has coarse granule, coarse granule can settle, and affects the table of mixture
Face effect, it is uneven that the most coarse grained sedimentation explanation mixes, and the dispersion of antifungal diluent is inadequate,
Affect the antibiotic property of mixture.
Resin-filler mix qualified for fineness is continued to be heated up to 130 DEG C, then using sodium benzoate solvent as
Antimycotic agent adds, it is ensured that the release completely of antimycotic agent at high temperature molecular structure, is formed at resin surface
Layer protecting film, rotating speed remains in that to be 150 revs/min, and mixing time is 2 hours, and finally the time of carrying out is
The application of vacuum of 1.5 hours, eliminates with the bubble produced during by stirring, prevents the surface of aeration solidfied material
With electricapparatus performance, after intermediate detection is qualified, discharging is packed.
Use sodium benzoate solvent as antimycotic agent, be because sodium benzoate in slant acidity environment, sterilization,
Bacteriostasis is strong, can reach mould proof effect, and sodium benzoate is stable in the air simultaneously, the most volatile or
Decomposing reaction, the feature that its toxicity is less can prevent the toxic waste that causes in production process and flue gas
Pollute.
Antifungal diluent reduces the viscosity of Special Resin, improves the operability of resin, simultaneously anti-mildew
Bacterium diluent has facilitation to antimycotic agent, through the dilution of antifungal diluent, antimycotic agent ability
Preferably playing a role, the glycidyl oxirane as antifungal diluent is the most also provided with toughness reinforcing merit
Effect so that be provided with more preferable impact resistance after the glue solidifies.
Because the cinnamic degree of polymerization is good, so by the synthesis step of Special Resin, by the chain of epoxy resin
Embed styrene in Duan, it is possible to increase the degree of polymerization of epoxy resin and surface tension, but be because adding styrene
Resins synthesis after, be at high temperature susceptible to polyreaction and hardening, thus add polymerization inhibitor in case
Stop ring epoxy resins occurs to be polymerized completely and cause resin hardening automatically.If by antimycotic agent and bisphenol-A epoxy tree
Fat directly mixes, and antimycotic agent can cause bisphenol A epoxide resin polyreaction can occur and hardening, by advance
First the synthesis Special Resin containing polymerization inhibitor, effectively prevents resin auto-polymerization.
In the curing process, surface can produce pit to Special Resin, and the levelling agent in auxiliary agent can eliminate surface
Pit, makes minute surface by surface the same；Defoamer in auxiliary agent can make surface tension reduce rapidly, eliminates
The bubble produced in stirring solidification process, prevents the electrical property of aeration later stage colloid；Hyperchromic in auxiliary agent
Agent has compensated for the problem that in resin curing process, produced surface colourity is inadequate.
Use titanate esters as modifying agent, add the adhesion of performed polymer and filler.
Embodiment two:
One presses down mycete glue special, and its composition is formed by following percentage by weight:
The preparation technology of Special Resin is to add auxiliary material in bisphenol A epoxide resin, the temperature of 80 DEG C
Lower reaction 12 hours, the weight ratio of auxiliary material and bisphenol A epoxide resin is 1:1, the composition of auxiliary material
It is organic solvent and the polymerization inhibitor of 95% of 5% count by weight percentage.
Antimycotic agent is dehydroactic acid sodium solvent, and antifungal diluent is glycidyl oxirane solvent, epoxy
Glycidyl ether is 1:1 with the volume ratio of water, and auxiliary agent is pressed the body of 1:1:1 by defoamer, levelling agent and toner
The mixing of long-pending ratio, the weight ratio that filler is pressed 7:1 by aluminium hydroxide and silicon powder mixes, and also includes silane coupler,
Silane coupler is 1:100 with the weight ratio of aluminium hydroxide and silicon powder mixture, and organic solvent is that styrene is molten
Agent, modifying agent is titanate esters.
Use dehydroactic acid sodium solvent as antimycotic agent, be because dehydroactic acid sodium and there is the antibacterial energy of wide spectrum
Power, extremely strong to the antibacterial action of mycete, dehydroactic acid sodium water solution does not changes at 120 DEG C, in 120 DEG C
Heat 2 hours and still keep stable in neutral or alkalescence, fast light, heat-resist, it is suitable as antimycotic agent
Put into batch production.
Embodiment three:
One presses down mycete glue special, and its composition is formed by following percentage by weight:
The preparation technology of Special Resin is to add auxiliary material in bisphenol A epoxide resin, the temperature of 80 DEG C
Lower reaction 12 hours, the weight ratio of auxiliary material and bisphenol A epoxide resin is 1:1, the composition of auxiliary material
It is organic solvent and the polymerization inhibitor of 95% of 5% count by weight percentage.
Antimycotic agent is sodium bicarbonate solvent, and antifungal diluent is glycidyl oxirane solvent, and epoxy contracts
Water glycerin ether is 1:1 with the volume ratio of water, and auxiliary agent is pressed the volume of 1:1:1 by defoamer, levelling agent and toner
Than mixing, filler is pressed the weight ratio mixing of 7:1 by aluminium hydroxide and silicon powder, is also included silane coupler, silicon
Alkane coupling agent is 1:100 with the weight ratio of aluminium hydroxide and silicon powder mixture, and organic solvent is styrene solvent,
Modifying agent is titanate esters.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to
Stating embodiment, all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.Should refer to
Go out, for those skilled in the art, without departing from the principles of the present invention some
Improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (10)
1. one kind is pressed down mycete glue special, it is characterised in that: its composition is formed by following percentage by weight:
The preparation technology of described Special Resin is to add auxiliary material in bisphenol A epoxide resin, the temperature of 80 DEG C
Lower reaction 12 hours, the weight ratio of auxiliary material and bisphenol A epoxide resin is 1:1, the composition of auxiliary material
It is organic solvent and the polymerization inhibitor of 95% of 5% count by weight percentage.
One the most according to claim 1 presses down mycete glue special, it is characterised in that: its composition is by following heavy
Amount percentage ratio composition:
One the most according to claim 1 and 2 presses down mycete glue special, it is characterised in that: described antifungal
Agent is the one in sodium benzoate solvent, sodium bicarbonate solvent and dehydroactic acid sodium solvent.
One the most according to claim 3 presses down mycete glue special, it is characterised in that: described antifungal is dilute
Releasing agent is glycidyl oxirane solvent, and glycidyl oxirane is 1:1 with the volume ratio of water.
One the most according to claim 1 and 2 presses down mycete glue special, it is characterised in that: described auxiliary agent by
The volume ratio mixing of 1:1:1 pressed by defoamer, levelling agent and toner.
One the most according to claim 1 and 2 presses down mycete glue special, it is characterised in that: described filler by
Aluminium hydroxide and silicon powder press the weight ratio mixing of 7:1.
One the most according to claim 6 presses down mycete glue special, it is characterised in that: described filler also includes
Silane coupler, described silane coupler is 1:100 with the weight ratio of aluminium hydroxide and silicon powder mixture.
One the most according to claim 1 and 2 presses down mycete glue special, it is characterised in that: described organic molten
Agent is styrene solvent.
One the most according to claim 1 and 2 presses down mycete glue special, it is characterised in that: described modifying agent
For titanate esters.
10. one kind is pressed down mycete glue special preparation method, it is characterised in that: comprise the steps:
(1) synthesis of Special Resin: add styrene solvent and polymerization inhibitor reaction in bisphenol A epoxide resin.
(2) process of filler: use the preprocess method of silane coupler that filler is carried out wetting and dispersing.
(3) mixing: first put into production equipment by the Special Resin of pre-synthesis and antifungal diluent, mill base and auxiliary agent
Inside premix, it is ensured that the fusion completely of fluent material, make performed polymer；After performed polymer is cooled down, put into
Modifying agent and through the filler of pretreatment, after mixing, carries out fineness test to resin compound；Fineness is closed
The resin-filler mix of lattice continues to heat, and then antimycotic agent is added stirring；Finally carry out application of vacuum,
After intermediate detection is qualified, discharging is packed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610518930.5A CN105925227A (en) | 2016-06-28 | 2016-06-28 | Special mildew-inhibiting glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610518930.5A CN105925227A (en) | 2016-06-28 | 2016-06-28 | Special mildew-inhibiting glue and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
| CN105131879A (en) * | 2015-09-14 | 2015-12-09 | 烟台德邦科技有限公司 | Pouring sealant and preparation method for same |
-
2016
- 2016-06-28 CN CN201610518930.5A patent/CN105925227A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
| CN105131879A (en) * | 2015-09-14 | 2015-12-09 | 烟台德邦科技有限公司 | Pouring sealant and preparation method for same |
Non-Patent Citations (2)
| Title |
|---|
| 程天恩、张一宾: "《防菌防霉剂手册》", 31 March 1993, 上海科学技术文献出版社 * |
| 贾红兵等: "《高分子材料》", 31 December 2013, 南京大学出版社 * |
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