CN105921737A - Preparation method of copper and silver composite powder and conductive adhesive - Google Patents
Preparation method of copper and silver composite powder and conductive adhesive Download PDFInfo
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/02—Elements
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K2003/085—Copper
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Abstract
The invention discloses a preparation method of high-conductivity and anti-oxidation copper and silver composite powder. The preparation method includes the following steps that firstly, copper and silver alloy powder is prepared through a gas atomization method, and the mass percent of silver in the copper and silver alloy powder ranges from 3% to 14%; and secondly, the copper and silver alloy powder prepared in the first step is subjected to ageing treatment in vacuum or inert atmosphere to obtain the copper and silver composite powder. According to the preparation method, firstly, the copper and silver alloy powder prepared through gas atomization is spherical, the particle size range (1 micron to 120 microns) is wide in selectivity, the silver content is low, silver-rich phases are preferentially separated out at the crystal boundary and other defect positions after ageing treatment and form a continuous space network structure, a silver conductive network can be formed easily, and conductivity is enhanced to a certain extent. Meanwhile, because defects (the crystal boundary, pores and holes) and the like in a base body are covered with the separated-out silver phases, preferential oxidization of the copper and silver powder at the crystal boundary and other defect positions at high temperature is effectively inhibited, and the initial oxidization temperature of the base body can be obviously raised.
Description
Technical field
The invention belongs to powder metallurgical technology, particularly relate to a kind of high connductivity, the preparation method of antioxidative cuprum argentum composite powder
And conducting resinl.
Background technology
It is known that silver, copper are the best two kinds of metals of electric conductivity, it it is the indispensable material of electronics industry.Owing to silver has
Have high electrical and thermal conductivity performance and chemical stability (under high temperature, antioxygenic property is good), argentum powder as conductive filler the longest by one
The preferred material of used in electronic industry slurry it is considered in the section time.But, silver exist some problems self being difficult to avoid that, as
Silver ion migration and high in cost of production shortcoming is easily there is under unidirectional current effect.Especially the transport phenomena of silver ion and the circuit that causes is short
Road problem has become electronic product and has marched toward miniaturization, highly integrated a great problem.Relative to silver, copper has low price, excellent
Electric conductivity, ability of resisting to migration is significantly larger than the series of advantages such as silver, is the first-selected substitution material of conductive silver powder.But due to copper powder
The problem such as being oxidized easily in preparation and during being on active service, its electric conductivity is suppressed.How at the base keeping copper powder high connductivity
Improve its antioxygenic property on plinth, be related to it can be as conduction, one of the key technology of shielding filler.Chinese patent is public
The number of opening CN101294281A, discloses " preparation method of a kind of silver-plated copper powder for low-temperature slurry ", and the Ag content of this product is general
All over higher than 30%, but there is substantially oxidation at about 200 DEG C, affect the military service stability of this copper-silver metal powder.Chinese patent is public
The number of opening CN101664803A discloses " preparation method of coated copper-silver metal powder ", and the method is based on Publication No.
On the basis of the Chinese patent of CN101294281A, by regulating the pH value of solution, ion sequestering agent can be in optimal scope
Play it and shelter activity, promote that silver deposits on copper surface.These methods preparing cuprum argentum composite powder are the most chemically main,
It is relatively low to there is copper argentum reagent utilization rate in them, and operation is various and the common problem such as a large amount of discharging of waste liquid.Additionally, these tradition sides
Prepared by method intersperses the coating powder of structure, and surface silver content is low, do not possess antioxidation in normal temperature, causes the invalid waste of silver,
There is also that deposition velocity is the highest simultaneously, more serious, the silvering of reuniting between granule with the adhesion of copper powder the outstanding problem such as the strongest.
Summary of the invention
The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, it is provided that the preparation method of a kind of cuprum argentum composite powder, should
The cuprum argentum composite powder that method prepares is keeping while high conduction performance, and good in oxidation resistance is particularly suitable for ambient temperature relatively
Height, conductivity requirements height, the electronic device of military service stable performance and packaging aspect thereof, such as electrode, electromagnetic screen coating, surface
Assemble with conducting resinl, conducting connection point glue.
For solving above-mentioned technical problem, the technical scheme that the present invention proposes is:
The preparation method of a kind of cuprum argentum composite powder, comprises the following steps:
(1) using aerosolization method to prepare cu-ag alloy powders, in described cu-ag alloy powders, the mass percent of silver is 3%～14%；
(2) cu-ag alloy powders prepared by step (1) is carried out Ageing Treatment in vacuum or inert atmosphere and obtain cuprum argentum composite powder.
Above-mentioned preparation method, it is preferred that in described step (2), in ageing process, aging temp is 150～350 DEG C,
Aging time is 10～600min, naturally cools to less than 50 DEG C samplings after completion of prescription.
Above-mentioned preparation method, it is preferred that in described step (2), the vacuum pressure in ageing process is less than 0.1MPa.
Above-mentioned preparation method, it is preferred that in described step (2), described noble gas is argon or nitrogen.
Above-mentioned preparation method, it is preferred that described aerosolization method is nitrogen or Powder In Argon Atomization.
Above-mentioned preparation method, it is preferred that in described step (1), the particle diameter of the cu-ag alloy powders prepared is 120 microns
Below.
Above-mentioned preparation method, it is preferred that cu-ag alloy powders prepared by step (1) is sieved, filters out particle diameter and be distributed as
The powder of 10～25 microns carries out the Ageing Treatment of step (2) again.
Above-mentioned preparation method, it is preferred that in the cuprum argentum composite powder obtained after Ageing Treatment silver in copper granule along copper crystal boundary in even
Continuous shape distribution.
The present invention also provides for a kind of conducting resinl, and its raw material includes the cuprum argentum composite powder obtained by above-mentioned preparation method.
Above-mentioned conducting resinl, it is preferred that its raw material includes that mass ratio is (3～6): the cuprum argentum composite powder of 1 and organic mixture, institute
State organic mixture and include that mass ratio is (20～90): (5～50): (10～50): the E-51 type epoxy resin of (1～10), dicyandiamide,
Diluent 501,2-ethyl-4-methylimidazole.
Compared with prior art, it is an advantage of the current invention that:
(1) present invention is spherical first with cu-ag alloy powders prepared by aerosolization, and particle size range selectivity is big (1～120 μm), silver
Content is low, and after Ageing Treatment, rich silver preferentially separates out at fault locations such as crystal boundaries and forms continuous space network structure, is conducive to silver
The formation of conductive network, enhances electric conductivity to a certain extent.Simultaneously as defect (crystal boundary, hole, hole in matrix
Hole) etc. the silver that is precipitated covered mutually, effectively inhibit copper silver powder at relatively high temperatures in the preferential oxygen of the defective locations such as crystal boundary
Change, the initial oxidation temperature of matrix can be significantly improved.In consideration of it, the cuprum argentum composite powder end that the technique of the present invention prepares has concurrently excellent
Electric conductivity and non-oxidizability, be used in electronic industry slurry, preferable conductive filler, be particularly suitable for that ambient temperature is higher, lead
Electricity rate requires high, the electronic device of military service stable performance and packaging aspect thereof, as electrode, electromagnetic screen coating, surface-assembled are used
Conducting resinl, conducting connection point glue.
(2) in the intermediate products cu-ag alloy powders of the preparation method of the present invention, silver is uniformly solid-solubilized in Copper substrate, after aging strengthening model,
Silver separates out from Copper substrate, and preferentially separates out at crystal boundary position, and forms silver network continuously.Aging strengthening model of the present invention makes silver
It is segregated in the grain boundaries that energy is higher, unstable, and the position that crystal boundary powder preferential oxidation just occurs, these are distributed along crystal boundary
Silver effectively prevent the generation that powder aoxidizes at lower temperature.
(3) conducting resinl that the cuprum argentum composite powder end of the present invention prepares not only has conductivity height, moisture-proof is good, non-oxidizability is high
Advantage, resistance to silver ion migration is the Radix Achyranthis Bidentatae of pure sliver-powder conducting glue.Cuprum argentum composite powder may replace in a big way existing argentum powder,
Copper powder, has and is widely applied very much value.
(4) the preparation method processing step of the present invention is simple, is not related to the use of any chemical solvent, thus avoids producing in a large number
The environmental problem that discharging of waste liquid causes, the copper argentum reagent utilization rate in this preparation method is high simultaneously.
Accompanying drawing explanation
Fig. 1 is the pattern microgram of the Kufil powder that in embodiment 1 prepared by atomization.
Fig. 2 be the embodiment of the present invention 1 after aging strengthening model silver at granule along the distribution schematic diagram of crystal boundary.
Fig. 3 is that the mode instilling deionized water in the embodiment of the present invention 2 between electrode on a glass simulates condensation state diagram.
Fig. 4 is that the cuprum argentum composite powder granule section that silver-colored mass content is 6% obtained after timeliness 30min in the embodiment of the present invention 3 shines
Sheet.
Fig. 5 is the cuprum argentum composite powder granule section that silver-colored mass content is 6% obtained after timeliness 30min in the embodiment of the present invention 3
Silver element scattergram.
Fig. 6 is the cuprum argentum composite powder that silver-colored mass content is 6% and pure copper powder obtained after timeliness 30min in the embodiment of the present invention 3
Aerial thermogravimetric analysis figure.
Detailed description of the invention
For the ease of understanding the present invention, below in conjunction with Figure of description and preferred embodiment, the present invention is made more comprehensively, careful
Ground describes, but protection scope of the present invention is not limited to embodiment in detail below.
Except there being special instruction, the various reagent used in the present invention, raw material are can commodity commercially or permissible
The product prepared by known method.
Embodiment 1:
The preparation method of the cuprum argentum composite powder of a kind of present invention, comprises the following steps:
(1) graphite crucible that is loaded with 400g silver ingot and 3600g copper plate is put into the Hermiga that PSI company of Britain manufactures
In gas atomization device, being heated to 1150 DEG C from room temperature with the speed of 50 DEG C/min, fusing obtains homogeneous hybrid alloys liquation, makes
With high pressure nitrogen atomization the atomization of hybrid alloys liquation obtained Kufil powder that silver content is 10% (particle diameter be 120 microns with
Under).
(2) cu-ag alloy powders that step (1) obtains first is screened out the powder of-100 mesh, then uses 600 mesh and 800 mesh
Standard screen to obtain particle size distribution range be the Kufil powder of 10～25 μm, be illustrated in figure 1 subsphaeroidal powder.
(3) weigh the cu-ag alloy powders that 20g step (2) is sieving through and put into the preferable stove of sealing, re-use electronic oil
In pump is pumped to stove, vacuum reaches-0.05MPa, then starts to warm up to 350 DEG C and is incubated 180min, then naturally cooling to
50 DEG C, take out cuprum argentum composite powder, in cuprum argentum composite powder silver in copper granule along copper granule crystal boundary be sequential like distribution schematic diagram
As shown in Figure 2.
According to the amount that mass ratio is 80:8:20:2:0.5 by E-51 type epoxy resin, dicyandiamide, diluent 501,2-ethyl-4-
Methylimidazole., KH550 are added in mortar grinding 50min to being uniformly mixed to get organic mixture.Again prepared by the present embodiment
The cuprum argentum composite powder obtained is that the ratio of 4:1 mixes in mass ratio with this organic mixture, grinds 30min with pestle equal to colloid
Even, so obtain cuprum argentum composite powder be the conducting resinl of filler.By the conductive glue of mix homogeneously on stainless steel substrates, formed
The thin film of 70 × 6 × 0.05mm, carries out intermediate temperature setting afterwards and processes (solidification temperature 200 DEG C solidifies duration 1h).Re-use number
Word resistance meter surveys the resistance at its lines two ends, according to " ρ=R × (W × H)/L calculates resistivity, and (ρ is the bulk resistor of conducting resinl
Rate；R is the resistance of conducting resinl；W, H, L are followed successively by the width of conductive adhesive layer, thickness and length) ", measure and try to achieve flat five times
Average is 85 μ Ω cm, and this shows that the conducting resinl made at the cuprum argentum composite powder end of the present embodiment and sliver-powder conducting glue electric conductivity are suitable
(≤100μΩ·cm)。
Embodiment 2:
The preparation method of the cuprum argentum composite powder of a kind of present invention, comprises the following steps:
(1) graphite crucible that is loaded with 35g silver ingot and 380g copper plate is put into the Hermiga that PSI company of Britain manufactures
In gas atomization device, being heated to 1200 DEG C from room temperature with the speed of 50 DEG C/min, fusing obtains homogeneous alloy molten solution, uses height
Pressure nitrogen atomization is formed and obtains the Kufil powder (particle diameter is less than 120 microns) that silver content is 8.43%.
(2) cu-ag alloy powders that step (1) obtains first is screened out the powder of-100 mesh, then uses 600 mesh and 800 mesh
Standard screen to obtain particle size distribution range be the Kufil powder of 10～25 μm.
(3) weigh the cu-ag alloy powders that 10g step (2) obtains and put into the preferable stove of sealing, re-use electric oil pump
In being pumped to stove, vacuum reaches-0.05MPa, then starts to warm up to 300 DEG C and is incubated 260min, then naturally cooling to 50 DEG C
Hereinafter, cuprum argentum composite powder is taken out.
According to the amount that mass ratio is 90:9:18:1:0.5 by E-51 type epoxy resin, dicyandiamide, diluent 501,2-ethyl-4-
Methylimidazole., KH550 are added in mortar grinding 60min to being uniformly mixed to get organic mixture.Again prepared by the present embodiment
The cuprum argentum composite powder obtained is that the ratio of 5:1 mixes in mass ratio with this organic mixture, grinds 35min with pestle equal to colloid
Even, so obtain cuprum argentum composite powder be the conducting resinl of filler.By the conductive glue of mix homogeneously on stainless steel substrates, formed
The thin film of 70 × 6 × 0.05mm, carries out intermediate temperature setting afterwards and processes (solidification temperature 220 DEG C solidifies duration 50min).
The cuprum argentum composite powder end conductive rubber made by the present embodiment is placed on 100 DEG C, 1200h in 90%RH (relative humidity) environment
Its resistivity of rear mensuration, and by " resistance change rate=(resistance-initial stage resistance after constant temperature and humidity placement)/initial stage resistance × 100% "
Calculating resistance change rate, this conducting resinl resistance change rate actually measured is 3%, the practical target less than 10%.
The cuprum argentum composite powder end conductive rubber made by the present embodiment prints on a glass, constitutes a length of 10mm, a width of 2mm
And at a distance of two parallel poles of 2mm, this parallel pole is placed on heat preservation solidification 50min in the isoperibol of 180 DEG C, then
Electrode after solidification is accessed loop, by the way of instilling deionized water between electrode, simulates condensation state, as it is shown on figure 3,
The electromigration situation of different time under electric field action is finally taken with camera.After energising 60min conducting resinl two interpolar, from negative
Pole there is no obvious dendroid precipitate to positive pole, illustrates that the silver ion migration rate of cuprum argentum composite powder colloid is extremely low.Therefore this colloid clothes
Labour stability is high, safe and reliable.
The cuprum argentum composite powder end conducting resinl made by the present embodiment is put on rustless steel test piece, and (test piece is to beat through 180 mesh silicon carbide papers
Mill also cleans with acetone) side, stable dry at 200 DEG C of temperature will be sent into after same for two panels test piece monolateral overlap joint clamping
Dry case starts cured, takes out after 1h, be put on cupping machine and survey its shear strength.Sample preparation and test are strictly pressed
Performing according to GB/T7124-1986 standard, the shear strength of this electrocondution slurry recorded is 22MPa, meets LED and encapsulates with leading
The strong requirement more than 15MPa of shearing of plasma-based material.
Embodiment 3:
The preparation method of the cuprum argentum composite powder of the present invention, comprises the following steps:
(1) by seven equipped with silver ingot and copper plate be respectively 0.1g and 9.9g, 0.4g and 9.6g, 0.6g and 9.4g, 0.8g and
The Hermiga that PSI company of Britain manufactures put into by 9.2g, 1.0g and 9.0g, 1.2g and 8.8g, the graphite crucible of 1.4g and 8.6g
In gas atomization device, being heated to 1200 DEG C from room temperature with the speed of 50 DEG C/min, fusing obtains homogeneous alloy molten solution, uses high pressure
Nitrogen atomization forms the Kufil powder obtaining 1%, 4%, 6%, 8%, 10%, 12% and 14% silver medal mass content successively.
(2) cu-ag alloy powders that pure copper powder and step (1) obtain first is screened out the powder of-100 mesh, then uses 600 mesh
The Kufil powder that particle size distribution range is 10～25 μm is obtained with the standard screen of 800 mesh.
(3) the 8 kinds of powder that step (2) obtains that divide 3 batches to weigh, each every kind of powder 2g put into the preferable stove of sealing
In, re-use vacuum in electric oil pump is pumped to stove and reach-0.08MPa, then start to warm up to 300 DEG C and be incubated 10 respectively,
30,60min, then naturally cool to 50 DEG C, take out cuprum argentum composite powder.Use the initial oxidation temperature that thermogravimetric analyzer records such as
Shown in table 1, initial oxidation weightening finish temperature is defined as the temperature that gain in weight is 1%.As shown in Table 1, the increase of silver content and timeliness
Heat treatment can significantly improve the oxidation resistance at cuprum argentum composite powder end.Pure copper powder and different silver content cuprum argentum composite powder in the present embodiment
After 200 DEG C of oxidations, the electrical conductivity of powder is shown in Table 2, as shown in Table 2, and heat treatment time and the increase of silver content, due to
The raising of powder non-oxidizability, is conducive to improving powder electrical conductivity at high temperature.But silver content is the highest may cause silver ion
Transport phenomena increases the weight of, therefore in the cuprum argentum composite powder of the present invention, silver content controls at 3%-14%.
Pure copper powder that table 1 embodiment 3 prepares and the oxidation resistance of cuprum argentum composite powder
Pure copper powder that table 2 embodiment 3 prepares and the electrical conductivity of cuprum argentum composite powder
The cuprum argentum composite powder granule cross-section photographs that silver-colored mass content is 6% that in the present embodiment, timeliness 30min obtains as shown in Figure 4,
The silver element analysis of section is as it is shown in figure 5, from Fig. 4 and Fig. 5, after heat treatment, silver has precedence over copper crystal boundary analysis in granule
Go out and in continuous distribution state, form the conductive network based on silver.
The cuprum argentum composite powder that silver-colored mass content is 6% that in the present embodiment, timeliness 30min obtains and the aerial thermogravimetric of pure copper powder
Analyzing as shown in Figure 6, compared to fine copper powder, the oxidation resistance of the Kufil powder of nonageing is higher, through Ageing Treatment
After, alloy powder is due to silver precipitation of copper crystal boundary along granule, and the antioxygenic property of powder improves further, and now this powder can
In the case of keeping high conductivity, it is suitable for using as conducting resinl at relatively high temperatures.
Claims (9)
1. the preparation method of a cuprum argentum composite powder, it is characterised in that comprise the following steps:
(1) using aerosolization method to prepare cu-ag alloy powders, in described cu-ag alloy powders, the mass percent of silver is 3%～14%；
(2) cu-ag alloy powders prepared by step (1) is carried out Ageing Treatment in vacuum or inert atmosphere and obtain cuprum argentum composite powder.
2. preparation method as claimed in claim 1, it is characterised in that in described step (2), in ageing process,
Aging temp is 150～350 DEG C, and aging time is 10～600min.
3. preparation method as claimed in claim 1, it is characterised in that in described step (2), in ageing process
Vacuum pressure is less than 0.1MPa.
4. preparation method as claimed in claim 1, it is characterised in that in described step (2), inert atmosphere refers to argon
Or nitrogen.
5. preparation method as claimed in claim 1, it is characterised in that in described step (1), the Kufil prepared
The particle diameter of bronze is less than 120 microns.
6. preparation method as claimed in claim 1, it is characterised in that cu-ag alloy powders prepared by step (1) is sieved
Point, filter out particle diameter and be distributed as the powder of 10～25 microns and carry out the Ageing Treatment of step (2) again.
7. the preparation method as described in any one of claim 1～6, it is characterised in that the cuprum argentum composite powder obtained after Ageing Treatment
Middle silver is continuous distribution along copper crystal boundary in copper granule.
8. a conducting resinl, it is characterised in that its raw material includes being obtained by the preparation method described in any one of claim 1～7
Cuprum argentum composite powder.
9. conducting resinl as claimed in claim 8, it is characterised in that its raw material includes that mass ratio is (3～6): the copper silver of 1 is multiple
Closing powder and organic mixture, described organic mixture includes that mass ratio is (20～90): (5～50): (10～50): the E-51 of (1～10)
Type epoxy resin, dicyandiamide, diluent 501,2-ethyl-4-methylimidazole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610274044.2A CN105921737B (en) | 2016-04-28 | 2016-04-28 | The preparation method and conducting resinl of a kind of cuprum argentum composite powder |
| PCT/CN2017/089121 WO2017186192A1 (en) | 2016-04-28 | 2017-06-20 | Preparation method for copper-silver composite powder, and conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610274044.2A CN105921737B (en) | 2016-04-28 | 2016-04-28 | The preparation method and conducting resinl of a kind of cuprum argentum composite powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105921737A true CN105921737A (en) | 2016-09-07 |
| CN105921737B CN105921737B (en) | 2018-01-19 |
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|---|---|---|---|
| CN201610274044.2A Expired - Fee Related CN105921737B (en) | 2016-04-28 | 2016-04-28 | The preparation method and conducting resinl of a kind of cuprum argentum composite powder |
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| CN (1) | CN105921737B (en) |
| WO (1) | WO2017186192A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017186192A1 (en) * | 2016-04-28 | 2017-11-02 | 中南大学 | Preparation method for copper-silver composite powder, and conductive adhesive |
| CN111032912A (en) * | 2017-07-25 | 2020-04-17 | 千住金属工业株式会社 | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part |
| CN111101008A (en) * | 2019-12-26 | 2020-05-05 | 浙江杭机新型合金材料有限公司 | High-strength high-conductivity copper-silver alloy material and preparation method thereof |
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| CN118231022A (en) * | 2024-05-21 | 2024-06-21 | 深圳众诚达应用材料股份有限公司 | Copper-silver composite powder with high oxidation resistance, preparation method thereof and electronic paste |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017186192A1 (en) * | 2016-04-28 | 2017-11-02 | 中南大学 | Preparation method for copper-silver composite powder, and conductive adhesive |
| CN111032912A (en) * | 2017-07-25 | 2020-04-17 | 千住金属工业株式会社 | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part |
| CN111032912B (en) * | 2017-07-25 | 2021-03-09 | 千住金属工业株式会社 | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part |
| US11217359B2 (en) | 2017-07-25 | 2022-01-04 | Senju Metal Industry Co., Ltd. | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part |
| US12119131B2 (en) | 2017-07-25 | 2024-10-15 | Senju Metal Industry Co., Ltd. | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part |
| CN111101008A (en) * | 2019-12-26 | 2020-05-05 | 浙江杭机新型合金材料有限公司 | High-strength high-conductivity copper-silver alloy material and preparation method thereof |
| CN111101008B (en) * | 2019-12-26 | 2021-08-17 | 浙江杭机新型合金材料有限公司 | High-strength high-conductivity copper-silver alloy material and preparation method thereof |
| CN115260955A (en) * | 2022-07-26 | 2022-11-01 | 深圳市计量质量检测研究院 | Conductive additive-containing silver conductive adhesive and preparation method and application thereof |
| CN115260955B (en) * | 2022-07-26 | 2024-04-19 | 深圳市计量质量检测研究院 | Silver conductive adhesive containing conductive additive and preparation method and application thereof |
| CN118231022A (en) * | 2024-05-21 | 2024-06-21 | 深圳众诚达应用材料股份有限公司 | Copper-silver composite powder with high oxidation resistance, preparation method thereof and electronic paste |
| CN118231022B (en) * | 2024-05-21 | 2024-09-03 | 深圳众诚达应用材料股份有限公司 | Copper-silver composite powder with high oxidation resistance, preparation method thereof and electronic paste |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017186192A1 (en) | 2017-11-02 |
| CN105921737B (en) | 2018-01-19 |
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