CN105916084B

CN105916084B - The intelligence sensor of always-on operation

Info

Publication number: CN105916084B
Application number: CN201610099750.8A
Authority: CN
Inventors: O·奥利阿埃伊; F·阿斯萨德拉格赫
Original assignee: Innocence Corp
Current assignee: Innocence Corp
Priority date: 2015-02-23
Filing date: 2016-02-23
Publication date: 2019-11-12
Anticipated expiration: 2036-02-23
Also published as: CN105916084A

Abstract

It is about the intelligence sensor for including MEMS (MEMS) sensor and digital signal processor (DSP) in sensor package the present invention relates to the intelligence sensor of always-on operation.The intelligence sensor of illustration may include being accommodated in MEMS acoustic sensor or microphone and DSP including substrate and lid and package substrate, and wherein the package substrate defines the dorsal pore hole for the MEMS acoustic sensor or microphone.Provided implementation also includes the MEMS action sensor being accommodated in the package or closure member.Embodiments herein can by intelligently provided simultaneously in response to trigger event or wake events sustainable detecting this answer the normally opened sensor of trigger event or wake events and the electric energy management and battery life of improvement single charge be provided.In addition, the various Physical Configurations of intelligence sensor and MEMS sensor or microphone package are also described herein.

Description

The intelligence sensor of always-on operation

The mutual reference of related application

Present application is the continuous case in part of U.S. patent application case serial number 14/293,502, and the applying date is June 2 in 2014 Day, the intelligence sensor of entitled always-on operation, which, which is incorporated by reference, is incorporated to herein.

Technical field

Main disclosure related MEMS (MEMS) sensor.

Background technique

Traditionally, running gear becomes more and more lighter and small and exquisite.Meanwhile user provides lasting for more complicated Connectivity, and/or the requirement of the more application rich in feature are and provide the expectation contradiction of light and compact devices device, the dress It sets and also provides permissible battery life before needing to charge.Therefore, the expectation of the power consumption of these devices is reduced The various methods that device or system is placed in various " sleep " modes by a variety of methods are generated.For example, the methods of this alternative Ground stops component (for example, processor or part thereof, display, backlight, communication part), optionally slows down associated component The clock rate of (for example, processor, memory), or can provide the combination of step to reduce power consumption.

However, the signal based on trigger event or wake events is (for example, press when device is these " sleep " modes at that time Button, default time at the expiration, device action) can be used to wake up or restart device.It is made by the interaction with device At wake events in the case where, these interactions can by device sensor and/or interlock circuit (for example, button, opening Close, accelerometer) it is detected.However, because these can be detected to the sensor and/or circuit for monitoring the sensor through energization With the interaction of device, for example, in order to frequent monitoring device environment, or even when device is these " sleep " modes, this Sensor and its interlock circuit are continuously from battery drain.

In addition, the circuit to monitor the sensor generallys use its general purposes logic or specific electric energy management component, It is bigger than power consumption needed for monitoring the sensor, and provides useful trigger event or wake events.For example, deciding whether Rouser can be based on the interruption or control signal received from the circuit for including the sensor, and the electricity of the processor by device Energy management assembly is measured.Also that is, can be sent to interruption relatively based on total input from relatively indiscriminate sensor The big microprocessor of power consumption and associated circuitry.This can cause the inefficiency electric energy management of single charging and the battery of reduction Service life because entire processor can based on inaccuracy or can casual trigger event or wake events, and it is inadvertently complete Full charging.

As a result, traditional sensors, such as, acoustic sensor and microphone and/or related electric energy management scheme usually by Such as excessive electric power is consumed using continuously on microphone.In other traditional solutions, traditional sensors and/or phase Powered-down energy Managed Solution may not be compatible with existing product design.

It is therefore desirable to provide the intelligence sensors for improving these and other missings.Above-mentioned missing is intended only to provide traditional execution Some of problems general introduction, but be not intended to exhaustion.Other problems and technology related with traditional execution and described herein more The corresponding benefit of kind aspect can become apparent when looking back described below.

Summary of the invention

Following persons are presented simplifying for specification and conclude, to provide the basic understanding of some aspects of specification.This is concluded simultaneously The extensibility of non-specification is summarized.Its main points for being not intended to be identification specification or key element or description especially specification Any scope of any specific embodiment or any scope of claim.Its sole purpose is that explanation is presented in simplified form Some concepts of book, as the foreword described more in detail presented later.

According to the aspect of main disclosure, in non-limiting example, provide including MEMS (MEMS) sound The sensor of sensor.Therefore, exemplary sensor may include MEMS (MEMS) acoustic sensor.In addition, exemplary Sensor includes digital signal processor (DSP), which, which is constituted, generates control signal to can communicatively coupling Close the system processor of the sensor.In addition, exemplary sensor may include package, which includes lid and packaging knot Structure.For example, the package, which can have, is adjusted to sound wave or the received port part of acoustic pressure.In addition, the package can accommodate the MEMS sound Sensor is rung, and the dorsal pore hole of the MEMS acoustic sensor can accommodate DSP.Other exemplary sensors may include MEMS movement Sensor.

In addition, describing exemplary microphone packaging.For example, exemplary microphone package may include MEMS microphone and group Constitute the DSP of the device outside control microphone package.In non-limiting aspect, exemplary microphone package can have lid Son and package substrate.For example, microphone package can have the port part of receivable acoustic pressure or sound wave.In other aspects, Mike Bellows chamber piece installing can accommodate MEMS microphone and the DSP in the dorsal pore hole of MEMS microphone.In further non-limiting aspect, Exemplary method relevant to intelligence sensor is provided.Other exemplary microphone packages may include MEMS action sensor.

In other exemplary embodiments, provide including sound/Supersonic in group composition processing case detecting mode The exemplary intelligence sensor of the MEMS acoustic sensor of wave pressure Reeb.Exemplary intelligence sensor can further comprise that event is detectd Component is surveyed, which includes group composition detecting wave sound sound/ultrasonic pressure events relevant to sound/ultrasonic pressure wave, and And the application-specific integrated circuit of control signal is generated, it is received and the sound from the MEMS sensor/Supersonic wave pressure with response The relevant signal in Reeb.In addition, exemplary square shaped sensor device may include multiplexer and package, the multiplexer is through a group structure And the output signal through multitask is generated, the control signal and signal relevant to sound/ultrasonic pressure wave are received with response, And the package includes lid, package substrate, is adjusted to receive sound/ultrasonic pressure wave port and be adjusted to Transmit the output of the output signal through multitask, wherein the package accommodate the MEMS acoustic sensor should, multiplexer with And the case detecting component.

Further in exemplary embodiments, the exemplary system provided includes that group constitutes processing case detecting mode In sound/ultrasonic pressure wave, and including data relevant to sound/ultrasonic pressure wave and relevant with the package defeated The MEMS sensor package of output signal of the transmission of interruption on out through multitask.Exemplary system can further comprise one Or multiple sensor centers ,/decoder (coder) and/or group composition part are connect based on the output signal through multitask The output signal through multitask of a part and transmission frequency signal are received to the MEMS sensor package primary processor.Into one Exemplary embodiments system is walked, may include and one or more sensor centers, coder according to main disclosure Or the relevant demultiplexer of primary processor, wherein the demultiplexer group, which is constituted, receives the output signal and biography through multitask Defeated one or more data related to sound/ultrasonic pressure wave interrupt one or more sensor center, coder or masters Processor.

Further the offer of non-limiting specific embodiment may include in case detecting mode with MEMS sensor processing sound/ The exemplary method of ultrasonic pressure wave.Exemplary method described herein can further comprise including application-specific integrated circuit Case detecting component receive relevant to the sound from the MEMS sensor/ultrasonic pressure wave signal and；To generate control The case detecting component of signal processed detects sound/ultrasonic pressure events relevant to sound/ultrasonic pressure wave, with response Detect sound/ultrasonic pressure events；And/or include lid, package substrate, MEMS induction and the event via output The package of detection element transmits the control signal and signal relevant to sound/ultrasonic pressure wave.

These and other specific embodiments are in described below.

Detailed description of the invention

A variety of non-limiting specific embodiments further regard to attached drawing narration, in which:

Fig. 1 describes the function block diagram of MEMS (MEMS) intelligence sensor, and wherein MEMS acoustic sensor promotes It is related to generate control signal relevant to digital signal processor (DSP)；

Fig. 2 describes the other function block diagram of MEMS intelligence sensor, and wherein MEMS action sensor and the MEMS sound pass Sensor promotes to generate control signal relevant to DSP together；

Fig. 3 describes non-limiting sensor or microphone package (e.g., including MEMS acoustic sensor or microphone), Wherein DSP can and application-specific integrated circuit relevant to the MEMS acoustic sensor or microphone integration；

Fig. 4 describes other sensors or microphone package (e.g., including MEMS acoustic sensor or microphone), wherein MEMS acoustic sensor or microphone through electrical couplings and can be mechanically anchored on application-specific integrated circuit, and wherein DSP can Through integrating；

Fig. 5 describes further sensor or microphone package (e.g., including MEMS acoustic sensor or microphone), Wherein MEMS acoustic sensor or Mike through wind electrical couplings and are mechanically anchored on application-specific integrated circuit, and wherein Independent DSP is accommodated in the sensor or microphone package；

Fig. 6 describe non-limiting sensor or microphone package (e.g., including MEMS acoustic sensor or microphone and MEMS action sensor), wherein independent DSP is provided in MEMS acoustic sensor or microphone package；

Fig. 7 describe other sensors or microphone package (e.g., including MEMS acoustic sensor or microphone and MEMS Action sensor), wherein MEMS acoustic sensor or microphone through electrical couplings and are mechanically anchored in application-specific integrated circuit On, wherein DSP is through integrating；

Fig. 8 illustrates the cross-sectional view of demonstration intelligence sensor, and wherein MEMS acoustic sensor or microphone promote to produce Raw control signal relevant to DSP；

The cross-sectional view of the further exemplary intelligence sensor of explaination of Fig. 9, wherein MEMS action sensor with MEMS acoustic sensor promotes to generate control signal relevant to DSP together；

Figure 10 illustrates the block diagram for representing the example use of intelligence sensor；

Figure 11 describes the EXEMPLARY OPERATING ENVIRONMENT for being suitble to be incorporated to the exemplary embodiments of main disclosure；

Figure 12 describes specific real according to the demonstration including intelligence sensor of the non-limiting aspect of main disclosure Example is applied, which promotes to generate control signal；

Figure 13 describes the further exemplary embodiments of the intelligence sensor according to main disclosure, this is intelligently passed Sensor promotes to generate control signal；

Figure 14 describes the exemplary system including intelligence sensor of the further aspect according to main disclosure, this is System promotes to generate control signal；

Figure 15 describe the case detecting according to the non-limiting aspect of main disclosure, control signal generation and/or The exemplary scenario of model selection；

Figure 16 describes the exemplary flow chart of non-limiting method relevant to intelligence sensor；

Figure 17 describes another exemplary flow chart of non-limiting method relevant to intelligence sensor；And

Figure 18 describes the further exemplary flow chart of non-limiting method relevant to intelligence sensor.

Specific embodiment

Simplified summary is provided for the purpose of description and not of limitation and describes some aspects of the application.Therefore, device, system It is intended to suggest in scope of the present application the modification of embodiment with method.

As described above, the conventional power source management of mobile device can be by based on from relatively indiscriminate sensor The intensive microprocessor of the relative power always inputted or its power management component and associated circuit, can lead to the low of single charge The power management and reduction battery life of efficiency.

Therefore, traditional sensor, such as acoustic sensor and microphone and/or associated power management scheme are usual Excessive power is consumed, for example, by utilizing the microphone being continuously powered.In other traditional solutions, existing biography Sensor and/or associated power management scheme possibly can not be compatible with existing product design.For example, as further retouched herein It states, the application can provide sensor, intelligence sensor, microphone, sensor or microphone package and/or associated function The exemplary realization of rate Managed Solution needs specific pin or input/output number, configuration etc. and existing product design with existing Associated product design is compatible.

Therefore each aspect of intelligence sensor is described.For example, with the background of intelligence sensor describe the application device, Each embodiment of technology and methods.The exemplary embodiment of the application, which provides, to be had at self-contained (self-contained) The sensor of reason, decision and/or estimating ability being powered always.

For example, intelligence sensor may include being communicably coupled to digital signal processor in encapsulation according to an aspect (DSP) one or more MEMS (MEMS) sensor (for example, inside DSP), encapsulation include one or more MEMS Sensor and DSP.In further example, one or more MEMS sensors may include MEMS acoustic sensor or Mike Wind.In another example, one or more MEMS sensors may include mems accelerometer.

In various embodiments, DSP can handle the signal from one or more MEMS sensors to perform various functions, For example, keyword identifies, and the wake-up of external device (ED) or system processor, the control of one or more MEMS sensors etc..Into The aspect of one step, the DSP of intelligence sensor can promote the efficiency control of one or more MEMS sensors.For example, in addition to generating It controls except signal, based on one or more signals from one or more MEMS sensors, the intelligence sensor including DSP can be with It guides or otherwise executes self-contained by the self-sustaining analysis of the signal from one or more MEMS sensors Function (for example, calibration, efficiency adjustment, change operation mode) (for example, the letter about sound, movement is interrogated, carrys out the biography of auto correlation DSP The other signals and/or any combination of sensor).Therefore, intelligence sensor also may include that memory or core buffer are closed with saving Join the data or information (for example, sound or voice messaging, pattern) of one or more MEMS sensors, to be based on being associated with one or more A series of environmental factors abundant of MEMS sensor promote to generate control signal.According to an aspect, intelligence sensor can promote Into being powered always, the low power consumption operation of intelligence sensor can promote the more complete of associated external device (ED) or system processor Low-power.For example, described intelligence sensor may include clock (for example, 32 kilo hertzs of (kHz) clocks).Further Aspect, intelligence sensor as described herein can work under the supply voltage lower than 1.5 volts (V) (for example, 1.2 volts).Root According to various embodiments, DSP as described herein is compatible to 90 nanometers or lower CMOS technology node and other technologies. As non-limiting example, the independent mold of 90 nanometers or CMOS technology below and other technologies is can be used in internal DSP It realizes, and can be encapsulated with MEMS sensor (for example, the closure member or dorsal pore hole of MEMS acoustic sensor or microphone It is interior), as further described herein.

In the another aspect of the application, intelligence sensor can control the device that outside intelligence sensor and can be communicatively coupled Or system processor, for example, as by sending control signal to device or system processor, control signal be used as device or The trigger event or wake events of system processor.As a further example, can by include intelligence sensor system or Device uses the control signal from intelligence sensor as trigger event or wake events, to control relevant system or device Operation etc..Control signal can be based upon including one or more MEMS sensors (for example, the sound senses Device, action sensor, other sensors) intelligence sensor determine trigger event or wake events, can be known by DSP Not.Therefore, the various embodiments of intelligence sensor can provide autonomous wake up and determine to wake up and be in association intelligence sensor Other components of system or external device (ED).For example, DSP may include (I between integrated circuit²C) and interrupt function sends control signal To the application processor of system processor, external device (ED) associated with intelligence sensor and/or device, such as functional mobile phone, intelligence Energy phone, smartwatch, plate, E-book reader, net book, on-vehicle navigation apparatus, game pad or device can wear Computing device worn etc..

It include the audio sensor that audio communication number is operated, the exemplary embodiment of the application accordingly, due to microphone Generation control signal be can promote (for example, interrupting signal, interrupting control signal, I²C signal).In addition, the exemplary reality of the application Applying example can promote the application of power-on servicing always of microphone, such as sound detection, voice activity detection, keyword positioning, environment Phonetic analysis etc., for example, can promote generation control signal (for example, interrupting signal, interruption control news by using sonic transducer Number, I²C signal) to be sent to example processor (for example, system processor, sensor hub, main process task based on sound events detection Device, application processor etc.).

The various illustrative embodiments being detailed further below can be applied in the premise for not departing from the application The field of MEMS sensor design and encapsulation.

Specific embodiment

The each aspect or feature of the application describes with reference to the accompanying drawings, and wherein same reference numerals are to refer to identical group Part.Illustrate many concrete details, in the present specification in order to provide the thorough understanding of the application.It will be appreciated, however, that this Shen Certain aspects please can be realized in the case where not having these specific details or using other methods, component, parameter etc..At it In his example, well known construction and device describes in the form of a block diagram, with the description and explanation of the various embodiments of benefit.

Fig. 1 is painted the functional block diagram of MEMS (MEMS) intelligence sensor 100, wherein according to the application's Various non-limiting aspects, MEMS acoustic sensor or microphone 102 can promote with associated digital signal processor (DSP) 106 generate control signal 104 (for example, interrupting control signal, I²C signal).As mentioned, DSP 106 can be handled and be come from The signal of MEMS acoustic sensor or microphone 102, to perform various functions, for example, keyword identifies, external device (ED) or system Processor wakes up, the control of one or more MEMS sensors.For example, DSP 106 may include I²C and interrupt function, to send Signal 104 is controlled to system processor (not shown), is associated with the external device (ED) (not shown) of intelligence sensor and/or such as function formula Phone, smart phone, smartwatch, tablet computer, electronic reader, upper net type pen electricity, autopilot, game control Panel or device screw on the application processor (not shown) of formula computing device etc. device.

Control signal 104 can be used to control the device or system processor for being communicatively coupled intelligence sensor 100 (not It shows).For example, the device or system processor that intelligence sensor 100 can control 100 outside of intelligence sensor and can be communicatively coupled (not shown), for example, being used as device or system processing as by sending control signal 104 to device or system processor The trigger event or wake events of device.As a further example, system or dress including exemplary intelligence sensor can be passed through Set and use the control signal 104 from intelligence sensor 100 as trigger event or wake events, with control relevant system or Operation of device etc..Control signal 104 can be based upon including one or more MEMS sensors (for example, micro- Mechatronic Systems acoustic sensor or microphone 102, action sensor, other sensors) intelligence sensor 100 determine triggering Event or wake events can be identified by DSP 106.Therefore, the various embodiments of intelligence sensor 100 can provide independently It wakes up and determines to wake up other components of system or external device (ED) in association intelligence sensor 100.

Intelligence sensor 100 can further comprise buffer-amplifier 108, analog-digital converter (ADC) 110, and drop Frequency device (decimator) 112, to handle the signal from MEMS acoustic sensor or microphone 102.It is including that the MEMS sound passes The non-limiting example of the intelligence sensor 100 of sensor or microphone 102, MEMS acoustic sensor or microphone 102 can communicate Ground coupled external coder or processor 114 can use analog and/or digital audio signal as known in the art (for example, pulse density modulated (PDM) signal, sound (I2S) signal, information and/or data between integration slice).However, should manage The range of solution, external coder or the various embodiments described herein of processor 114 is not necessary.

In further aspect, the DSP 106 of intelligence sensor 100 can promote the effect of one or more MEMS sensors It can control 116.For example, in an aspect, other than generating and controlling signal 104, based on from one or more MEMS sensors One or more signals, the intelligence sensor 100 including DSP 106 can by come from one or more MEMS sensors Signal self-sustaining analysis guidance or otherwise execute self-contained function (for example, calibration, efficiency adjustment, change operation Mode) (for example, the signal from MEMS acoustic sensor or microphone 102, the signal of relevant action, always auto correlation DSP Other signals of 106 sensor, other signals from external device (ED) or system processor (not shown) and/or any group It closes).

For example, by combined in sensor or microphone package DSP 106 and MEMS sensor or microphone 102 and DSP 106 is exclusively used in MEMS sensor or microphone 102, and DSP106 can provide sensor or the additional control of 102 efficiency of microphone System.For example, MEMS sensor can be switched in DSP 106 or microphone 102 is different mode in unrestricted aspect.Example Such as, as described above, as low-power intelligence sensor 100, embodiments herein can produce trigger event or wake events.So And DSP 106 can also promote to configure the MEMS sensor or microphone 102 as high-effect microphone (for example, for voice Using) relative to inefficient energy microphone (for example, for generating trigger event or wake events).

Therefore, intelligence sensor 100 can also include that memory or core buffer (not shown) save and be associated with one or more The data or information (for example, sound or voice messaging, pattern) of MEMS sensor are in further non-limiting aspect, based on pass A series of environmental factors abundant for joining one or more MEMS sensors promote to generate control signal.

As described above, intelligence sensor 100 can promote the low-power operation of intelligence sensor 100 being powered always, It can promote the more complete downward power of associated external device (ED) (not shown) or system processor (not shown).For example, being retouched The intelligence sensor 100 stated may include clock (for example, 32 kilo hertzs of (kHz) clocks).In further aspect, intelligence sensor 100 can work under 1.5 volts of (for example, 1.2 volts) supply voltages below.As unrestricted example, by using DSP 106 provide the low-power operation of intelligence sensor 100 being powered always with MEMS acoustic sensor or microphone 102, at system Reason device or external device (ED) (not shown) can be powered off more fully, while the cognition of intelligence sensor 100 being kept to be associated with one or more A series of environmental factors abundant of MEMS sensor are (for example, one or more MEMS acoustic sensors or microphone 102, movement Sensor).

In further unrestricted aspect, MEMS acoustic sensor or microphone 102 and DSP 106 are provided common Sensor or microphone package or closure member (e.g., including lid and sensor or microphone package substrate), it is such as fixed The microphone package of adopted MEMS acoustic sensor or microphone 102, such as further described below in relation to Fig. 3-9.According to each Kind of embodiment, DSP 106 can be compatible with 90 nanometers or lower CMOS technology node and other technologies.As unrestricted The independent mold of 90 nanometers or CMOS technology below and other technologies can be used to realize in property example, DSP 106, and It can be packed with one or more MEMS sensors (for example, the closure member or dorsal pore hole of MEMS acoustic sensor or microphone 102 It is interior), as further described herein.In another aspect, DSP 106 can integrate association MEMS acoustic sensor or microphone 102 one or more buffer-amplifiers 108, ADC 110 and/or frequency demultiplier 112 to common application-specific integrated circuit, For example, as herein about Fig. 3-9 further description.

Fig. 2 is painted another functional block diagram of MEMS intelligence sensor 200, and wherein one or more MEMS sensors include MEMS action sensor 202 in conjunction with MEMS acoustic sensor or microphone 102, and can promote to generate control signal 204. In addition to above with respect to Fig. 1 described function and efficiency, Fig. 2 provides combined MEMS intelligence sensor 200, can further wrap Containing one or more of MEMS action sensor 202 (for example, MEMS accelerometer), buffer-amplifier 206, ADC 208 Signal and DSP 212 from MEMS action sensor 202 are handled with frequency demultiplier 210.

In unrestricted aspect, MEMS action sensor 202 may include MEMS accelerometer.In another aspect, MEMS adds Speed meter may include low-G accelerometer, it is characterised in that low-G accelerometer can be used to monitor relatively low acceleration in the application Degree is horizontal, such as when device is in the hand of user, user waves his or her arm, and is undergone by hand-held device.Low- G accelerometer is further characterized by the accelerometer by reference to height-G, can be used to monitor relatively high level in the application Acceleration, for instance it can be possible that car crass detection application be useful.It is understood, however, that the application's is various Embodiment is not limited to using MEMS action sensor 202 (for example, MEMS accelerometer, low-G MEMS accelerometer).

Such as above with respect to the description of Fig. 1, combination sensor 200 may be coupled to external coder or processor 114, It can be using known analog and/or digital audio signal (for example, PDM signal, I2S signal, information and/or data).In addition, Analog and/or digital news associated with MEMS action sensor 202 can be used in external coder processing 114 Number, information and/or data.It should be understood, however, that external coder or the various embodiments described herein of processor 114 Range be not necessary.

Such as above with respect to the description of Fig. 1, DSP212 can handle from one or more MEMS sensors signal (for example, One or more MEMS acoustic sensors or microphone 102, MEMS action sensor 202), to perform various functions, example Such as, keyword identification, external device (ED) or system processor wake-up, the control of one or more MEMS sensors.For example, DSP212 can Including I²C and interrupt function, with transmission control signal 204 to associated such as function formula phone, smart phone, smartwatch is put down Plate computer, electronic reader, upper net type are associated pen electricity, autopilot, game pad or device, screw on formula meter Calculate the intelligence sensor of device etc. device and/or the system processor (not shown) of application processor (not shown), external dress Set (not shown).

Control signal 204 can be used to control the device or system processing for being communicatively coupled intelligence sensor 200 Device (not shown).For example, intelligence sensor 200 can control the outside of intelligence sensor 200 and the device that can be communicatively coupled or System processor (not shown), for example, being used as device as by sending control signal 204 to device or system processor Or the trigger event or wake events of system processor.It as a further example, can be by including exemplary intelligence sensor System or device use the control signal 204 from intelligence sensor 200 as trigger event or wake events, to control phase The system of pass or the operation of device.For example, control signal 204 can be based upon and sense including one or more MEMS The intelligence of device (for example, MEMS acoustic sensor or microphone 102, MEMS action sensor 202, other sensors) passes The trigger event or wake events that sensor 200 determines, can be identified by DSP212.Therefore, the various realities of intelligence sensor 200 Autonomous wake-up decision can be provided to wake up other components of system or external device (ED) in association intelligence sensor 200 by applying example.

Embodiments herein trigger event or wake events input non-limiting example (e.g., including it is one or more A MEMS acoustic sensor or microphone 102, MEMS action sensor 202, such as MEMS accelerometer, other sensings Device) it can be the movement that mobile phone is removed from pocket.In this case, intelligence sensor 200, which can identify, is grasped Mobile phone, mobile phone are to alternative sounds of cloth of pocket etc..Intelligence sensor 200 can identify mobile electricity experienced It talks about and is grasped, is promoted, rotates and/or rotate etc. different movements, show mobile phone to user in certain angle.Although Individually any one input is (for example, the acceleration from MEMS acoustic sensor or microphone 102 or MEMS action sensor 202 Count one of the audio input of input) effective wake events are not necessarily indicative to, intelligence sensor 200 can identify the group of two inputs It is combined into effective wake events.On the contrary, abandoning much inputting (example using that may may require that in the case of indiscriminate sensor Such as, mobile phone is grasped, and to the rustle of the mobile phone of sack cloth, mobile phone experienced is grasped, is promoted, rotates And/or the different movement of rotation etc.), it is used as effective trigger event or wake events.Otherwise, use is indiscriminate Sensor in the case of may result in too many wrong report, reduce the effectiveness of the indiscriminate sensor of electric energy management, for example, Because whole system processor or external device (ED) are potentially based on inaccuracy or inadvertent free event or wake events are complete unintentionally It is fully energized.

In other example embodiments, the DSP 212 of intelligence sensor 200 can help one or more MEMS sensors (such as one or more of MEMS acoustic sensor or microphone 102, MEMS action sensor 202 and other sensors) Efficiency control 116.Such as in an aspect, the intelligence sensor 200 including DSP 212 in addition to based on from this or One or more signals of multiple MEMS sensors otherwise generate except control signal 204, can also carry out wrapping certainly The function (for example, correction, efficiency adjustment, change operation mode) of containing, the self-contained function are by from this one or more MEMS sensor letter signal (for example, from the MEMS acoustic sensor or microphone 102, MEMS action sensor 202 and One or more signals of other sensors etc., from the associated sensor of DSP212 other signals, from external dress Set or other signals of system processor (non-icon) and/or any combination above-mentioned) self-supporting analysis.

Therefore, intelligence sensor 200 also may include memory or core buffer (non-icon) to save with this one or more The associated data of MEMS sensor or information (for example, audio or acoustic information, action message, pattern) thereby help to generate base In one group quite a lot of and the one or more MEMS sensor (such as MEMS acoustic sensor or microphone 102, MEMS are acted The one or more of sensor 202 and other sensors) associated environmental factor control signal.

As previously mentioned, intelligence sensor 200 can help normally opened, the low-power operation of the intelligence sensor 200, so may be used Help associated external device (non-icon) or the more complete power decline of system processor (non-icon).For example, intelligence above-mentioned Sensor 200 may include clock (for example, the clock of 32 kilo hertzs (kHz)).In other aspects, intelligence sensor 200 can be operated It is supplied in the power supply lower than 1.5 volts (such as 1.2 volts).As unrestricted example, by using with MEMS acoustic sensor Or DSP offer intelligence sensor 200, system processor or the external device (ED) of microphone 202 and MEMS action sensor 202 Normally opened, the low-power operation of (non-icon) can more fully decline, at the same maintain 200 1 groups of intelligence sensor for quite a lot of With the one or more MEMS sensor (such as MEMS acoustic sensor or microphone 102, MEMS action sensor 202 and The one or more of other sensors) associated environmental factor warning.

In other unrestricted aspects, MEMS acoustic sensor or microphone 102 and DSP212 setting are sensing jointly Device or microphone package or closure member (for example including lid and sensor or microphone package substrate), for example, following The microphone package in the 102 dorsal pore hole of definable MEMS acoustic sensor or microphone that Fig. 3 to 9 is further described.Foundation Various implementations benefits, DSP212 can be compatible with 90 nanometers or CMOS process nodes below and other technologies.As unrestricted Property example, DSP can be realized on a other crystal grain using 90 nanometers or CMOS processing procedure below and other technologies, and can By as packaged by one or more MEMS sensors described herein (for example, in MEMS acoustic sensor or microphone 102, among the closure member or dorsal pore hole of MEMS action sensor 202 and other sensors).In other aspects, such as This is further described with reference to Fig. 3 to 9, DSP212 can with buffer-amplifier 108, ADC 110 and/or with MEMS sound Ring sensor or the associated frequency demultiplier 112 of microphone 102 and/or with buffer-amplifier 206, ADC 208 and/or and MEMS The associated frequency demultiplier 210 of action sensor 202 is integrated into application-specific integrated circuit.

According to the various unrestricted aspects of this exposure, Fig. 3 to 7 illustrates showing for 100/200 component of MEMS intelligence sensor Example fabric diagram.For example, Fig. 3 describe unrestricted sensor or microphone package 300 (e.g., including the MEMS sound Sensor or microphone 102).In an aspect, sensor or microphone package 300 may include closure member, the closure member Including sensor or microphone package substrate 302 and the back that can accommodate and define MEMS acoustic sensor or microphone 102 The lid 304 of hole 306.The closure member including sensor or microphone package substrate 302 and lid word 304 can have suitable For receiving the port part 308 of sound wave or acoustic pressure.For other group of structure of MEMS acoustic sensor or microphone 102, port part 308 Can position in lid 304, or other group of structure of one or more MEMS sensors for not needing to receive sound wave or acoustic pressure, Port part 308 can be omitted.MEMS acoustic sensor or microphone 102 can mechanical grip in sensor or microphone package substrate 302 and the sensor or microphone package substrate 302 can be communicatively coupled to.Such as about Fig. 1 in described above, sensing Device or microphone package 300 may also comprise application-specific integrated circuit 310 and DSP 312 (such as DSP106), can be held It sets in closure member, which includes sensor or microphone package substrate 302 and lid 304.In the discribed biography of Fig. 3 In sensor or microphone package 300, DSP 312 can be integrated with application-specific integrated circuit 310.Application-specific integrated circuit 310 can mechanical grip in sensor or microphone package substrate 302, and can be via sensor or microphone package substrate 302 are communicatively coupled to MEMS acoustic sensor or microphone 102.

With reference to Fig. 4, for sensor or microphone package 400, DSP 312 can and application-specific integrated circuit 310 is integrated.The application-specific integrated circuit 310 can mechanical grip in sensor or microphone package substrate 302 and can communicate It is coupled to the sensor or microphone package substrate 302.MEMS acoustic sensor or microphone 102 can mechanical grip in specific Application integrated circuit 310 simultaneously can be communicatively coupled to the application-specific integrated circuit 310.Fig. 5 describes other sensors or microphone Package 500 (e.g., including MEMS acoustic sensor or microphone 102, wherein MEMS acoustic sensor or microphone 102 can Be communicatively coupled and in mechanical grip to the top of application-specific integrated circuit 310, and wherein independent DSP 312 (for example, DSP 106) it can be placed in the sensor or microphone package 500.DSP 312 can mechanical grip to sensor or Mike's bellows chamber Piece installing substrate 302 simultaneously can be communicatively coupled to MEMS acoustic sensor or Mike via sensor or microphone package substrate 302 Wind 102.

Fig. 6 describe unrestricted sensor or microphone package 600 (e.g., including MEMS acoustic sensor or wheat Gram wind 102 and MEMS action sensor 202), wherein independent DSP 602 (for example, DSP212) may be disposed at the MEMS sound In sensor or microphone package 600.DSP 602 and MEMS action sensor 202 can mechanical grip to sensor or Mike Bellows chamber piece installing substrate 302 is simultaneously communicatively coupled to the sensor or microphone package substrate 302.Such as it is retouched about figure 2 above It states, sensor or microphone package 600 may also comprise application-specific integrated circuit 604.Such as described by figure 4 above , MEMS acoustic sensor or microphone 102 can mechanical grip be to application-specific integrated circuit 604 and to be communicatively coupled to this specific Application integrated circuit 604.Fig. 7 describe other sensors or microphone package 700 (e.g., including MEMS acoustic sensor or Microphone 102 and MEMS action sensor 202), wherein MEMS acoustic sensor or microphone 102 can be communicatively coupled and can machines Tool is pasted on the top of application-specific integrated circuit 604, and wherein DSP 602 can be integrated.

Fig. 8 illustrates the diagrammatic, cross-sectional figure of demonstration intelligence sensor 800, according to each aspect of this exposure, Yu Zhi Can in sensor 800, MEMS acoustic sensor or microphone 102 promote using associated DSP 312 (such as DSP 106) come Generate control signal 104.Intelligence sensor 800 may include MEMS acoustic sensor or microphone 102 in closure member, the closing Part includes sensor or microphone package substrate 302 and lid 304 to cover and define MEMS acoustic sensor or Mike The dorsal pore hole 306 of wind 102.Intelligence sensor 800 more may include DSP 312 (such as DSP 106), can be capped on this and include The closure member of sensor or microphone package substrate 302 and lid 304.As described above, should including package substrate 302 and The closure member of lid 304 can have port part 308 or other be suitable for receiving the component of sound wave or acoustic pressure.Application-specific integrated circuit 310 are mechanically fixed to sensor or microphone package substrate 302 and by closing line 802 and sensor or Mike's bellows chamber Piece installing substrate 302 is coupled in communication.MEMS acoustic sensor or microphone 102 are mechanically fixed to application-specific integrated circuit 310 and communicate with coupling.DSP 312 is mechanically fixed to sensor or microphone package substrate 302 and passes through engagement Line 804 is coupled in communication with sensor or microphone package substrate 302.On sensor or microphone package substrate 302 Solder 806 can be connected to external substrate, such as printed circuit board (PCB) (not shown) convenient for intelligence sensor 800.

Fig. 9 illustrates the diagrammatic, cross-sectional figure of further unrestricted intelligence sensor 900, according to other of this exposure Unrestricted aspect, in intelligence sensor 900, MEMS action sensor 202, with MEMS acoustic sensor or microphone 102 Together, promote to generate control signal 204 using associated DSP 602 (such as DSP 212).Intelligence sensor 900 can wrap It is equal in a closure member containing one or more MEMS acoustic sensors or microphone 102, MEMS action sensor 202 etc., the closing Part include sensor or microphone package substrate 302 and lid 304 with cover MEMS acoustic sensor or microphone 102 and MEMS action sensor 202 and the dorsal pore hole 306 for defining MEMS acoustic sensor or microphone 102.Intelligence sensor 900 is more It may include DSP 602 (such as DSP 212), being capped on this includes sensor or microphone package substrate 302 and lid In 304 closure members.As described above, should can have including closure member of package substrate 302 and lid 304 port part 308 or other Suitable for receiving the component of sound wave or acoustic pressure.Application-specific integrated circuit 604 is mechanically fixed to sensor or microphone packaging Part substrate 302 is simultaneously coupled in communication by closing line 902 with sensor or microphone package substrate 302.MEMS acoustic sensor Or microphone 102 is mechanically fixed to application-specific integrated circuit 604 and communicates with coupling.DSP 602 is mechanically solid It is fixed to sensor or microphone package substrate 302 and logical by closing line 904 and sensor or microphone package substrate 302 Letter coupling.MEMS action sensor 202 is mechanically fixed to sensor or microphone package substrate 302 and passes through closing line 906 are coupled in communication with sensor or microphone package substrate 302.Weldering on sensor or microphone package substrate 302 Material can be connected to external substrate, such as printed circuit board (PCB) (not shown) convenient for intelligence sensor 900.

Figure 10 illustrates the square of the Demonstration Application according to the further aspect of this exposure to indicate intelligence sensor Figure.It is described in detail, block diagram shows main system 1000, and it includes the sound port parts 1002 and intelligent sensing that are fixed to PCB 1006 Device 1004 is (for example including one or more MEMS acoustic sensors or microphone 102, MEMS action sensor 202 or other sensings Device), the hand that there is PCB 1006 hole (orifice) 1008 or other sound wave or acoustic pressure to be allowed to pass through arrival intelligence sensor 1004 Section.In addition, main system 1000 may include device 1010, such as system processor, the external dress for being associated with intelligence sensor 1004 Set and/or application processor, these be mechanically fixed to PCB 1006 and with intelligence sensor 1004 be coupled in communication in order to Control signal 104/204 and/or other information and/or data are received from intelligence sensor 1004.For example, the intelligence sensor 1004 may include intelligence sensor (as included one or more MEMS acoustic sensors or microphone 102, MEMS action sensor 202 or other sensors), such as herein in regard to the description of Fig. 1-9.Main system 1000 can be for any required intelligence sensor System, such as function formula phone, smart phone, smartwatch, tablet computer, electronic reader, upper net type pen electricity, self-navigation Device, game pad or device, screw on formula computing device, etc..

However, according to the intelligence sensor of each aspect of this exposure (for example including one or more MEMS acoustic sensors or Microphone 102, MEMS action sensor 202 and sensor) embodiment be in order to illustrate and be described in herein, not to Limitation, it will be understood that this exposure is not limited to this.Various realizations can be applied to other necks of MEMS sensor design and packaging Domain, without departing from disclosure as described herein.For example, it will be appreciated that as described herein other need intelligent sensing The application of device may include long-range monitoring and/or sensing device, no matter automatically or semi-automatically, and no matter such long-range monitoring/or Whether sensing device contains the application using acoustic sensor or microphone.For example, as described herein using DSP in sensor Various technologies in package can promote to improve the electric energy management and battery life of single charge, for example, trigger event or wake-up The more intelligent and/or Division identification of event.Therefore, the other embodiments of intelligence sensor or application may include but be not limited to one A little applications measure temperature, pressure, humidity, light and/or the sensing of other electromagnetic radiation (such as communications and liaison signal) containing being associated with Device and/or other be associated with measurement physics learn or electrical phenomena sensor.

Therefore, in each aspect, this exposure provides a kind of sensor comprising has or be associated with dorsal pore hole (such as dorsal pore hole 306) MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102), such as about Fig. 1-10.It is real in another demonstration It applies in example, as shown in above-mentioned Fig. 1 and 2, for example, the sensor can organize structure to operate lower than 1.5 volts.It, should in other aspects Sensor can organize structure to operate and open in (always-on) mode permanently, as described herein.For example, the sensor can be wrapped Contained in such as main system 1000 (such as function formula phone, smart phone, smartwatch, tablet computer, electronic reader, on Net type pen electricity, autopilot, game pad or device screw on formula computing device) device in, which includes System processor (such as device 1010), wherein system processor (such as device 1010) is positioned at the outside of the package.For example, being System processor (such as device 1010) may include the integrated circuit for controlling the function of mobile phone (such as main system 1000).

The sensor can further comprise the DSP (such as DSP 106/212) in dorsal pore hole (such as dorsal pore hole 306), should DSP can organize structure in response to from the MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102) receive signal, And control signal (such as control signal 104/204) is generated to system processor (device 1010 for the sensor that is such as coupled in communication). In addition, for example hereinbefore description as described in Fig. 3-9, which may include package, may include lid (such as lid 304) And package substrate (such as sensor or microphone package substrate 302).In an aspect, which can have port part (such as Port part 308), which may be adapted to receive sound wave or acoustic pressure.In further aspect, which can cover MEMS sound biography Sensor (such as sensor or microphone package substrate 302) and define MEMS acoustic sensor (such as sensor or microphone Package substrate 302) dorsal pore hole (such as dorsal pore hole 306).In other unrestricted aspects, which can further comprise MEMS action sensor (such as MEMS action sensor 202).

DSP (such as DSP 106/212) may include for example, application-specific integrated circuit as described above.In further aspect In, DSP (such as DSP 106/212) can organize structure to come from MEMS acoustic sensor (such as MEMS acoustic sensor in response to processing Or microphone 102, MEMS action sensor 202) signal, and generate wake up signal.Therefore, DSP (such as DSP 106/212) can Including wake-up module, trigger event or call out that group structure is recognized and/or is inferred to by DSP (such as DSP 106/212) with basis Awake event wakes up the system processor (such as device 1010).In further unrestricted aspect, DSP (such as DSP 106/ 212) structure can be organized in response to from one or more MEMS action sensors (such as MEMS action sensor 202) reception signal or certainly The MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102) receives signal, receives signal from other sensors, certainly Other devices (processor, such as system processor (such as device 1010)) receive signal, and generate control signal 104/204.

In addition, for example above-mentioned description as described in Fig. 1-2, the DSP (such as DSP 106/212) can more organize structure with or may include Sensor control block and organize structure with, control one or more MEMS action sensors (such as MEMS action sensor 202), should MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102).For example, sensor as described herein controls mould Block can organize structure to execute self-contained function (such as: calibration, changes operation mode at efficiency adjustment), by from this one or more The self-supporting analysis of the signal of MEMS sensor is guided, wherein the signal from one or more MEMS sensors for example: come from The signal of one or more MEMS acoustic sensors or microphone 102, MEMS action sensor 202, other sensors etc. comes from It is associated with other signals of the sensor of DSP (such as DSP 106/212), from external device (ED) or system processor (such as device 1010) other signals and/or aforementioned any combination.Therefore, in other further unrestricted aspects, including the sensor The DSP (such as DSP 106/212) of control module, for example, structure can be organized to execute such sensor control function, for example, in order to Response from one or more MEMS action sensors receives signal or from MEMS acoustic sensor (such as MEMS acoustic sensor or the wheat Gram wind 102) signal is received, signal is received from sensor, from other device (processors, such as system processor (such as device 1010) signal etc.) is received.Therefore, DSP (such as DSP 106/212) or it is associated in the sensing of DSP (such as DSP 106/212) Device control module can organize structure among other things, to calibrate, adjust one or more MEMS acoustic sensor (such as MEMS sounds Sensor or microphone 102), the MEMS action sensor (such as MEMS action sensor 202), other sensors efficiency or Person changes one or more the MEMS acoustic sensors (such as MEMS acoustic sensor or microphone 102), the MEMS action sensor The operation mode of (such as MEMS action sensor 202), other sensors etc..

However, sensor as described herein demonstration implementation can additionally or alternatively include sensor, intelligence sensor, Other feature or functions of microphone, sensor or microphone package etc., such as above-mentioned description as described in Fig. 1-10.

In further exemplary embodiment, this exposure provides a kind of microphone package (as included MEMS acoustic sensor Or the sensor or microphone package of microphone 102), for example, such as the above-mentioned description as described in Fig. 1-10.It is real in further demonstration It applies in example, such as above-mentioned description as described in Fig. 1 and 2, for example, the microphone package can organize structure to operate lower than 1.5 volts.In In further aspect, which can organize structure to operate and open in (always-on) mode permanently, such as this paper institute It states.For example, the microphone package may be included with such as main system 1000 (such as function formula phone, smart phone, intelligent hand Table, tablet computer, electronic reader, upper net type pen electricity, autopilot, game pad or device screw on formula meter Calculate device) device or system in, which includes system processor (such as device 1010), wherein system processor (as fill 1010) set is positioned at the outside of the package.For example, system processor (such as device 1010) may include for controlling mobile phone The integrated circuit of the function of (such as main system 1000).

Therefore, microphone package (sensor or the microphone packaging as included MEMS acoustic sensor or microphone 102 Part) it may include MEMS microphone (such as MEMS acoustic sensor or the microphone or be associated with dorsal pore hole (such as dorsal pore hole 306) 102).The microphone package can further comprise the DSP (such as DSP 106/212) in dorsal pore hole (such as dorsal pore hole 306), The DSP can organize structure to control the device except microphone package by control signal (such as control signal 104/204) (as filled It sets 1010).For example, the microphone package may include such as lid (such as lid 304) and package substrate (such as sensor Or microphone package substrate 302), such as above-mentioned description as described in Fig. 3-9.In an aspect, which can have Port (such as port part 308), the port part may be adapted to receive sound wave or acoustic pressure.In further aspect, the microphone package is fixed Justice goes out dorsal pore hole (such as dorsal pore hole 306).In other aspects, which can cover the MEMS microphone (as sensed Device or microphone package substrate 302) and the DSP (such as DSP 106/212).In other unrestricted aspects, the microphone Package can further comprise MEMS action sensor (such as MEMS action sensor 202).

DSP (such as DSP 106/212) may include for example, application-specific integrated circuit as described above.In further aspect In, DSP (such as DSP 106/212) can organize structure to come from MEMS microphone (such as MEMS acoustic sensor or wheat in response to processing Gram wind 102, MEMS action sensor 202) signal, and generate and wake up signal.Therefore, DSP (such as DSP 106/212) may include Component is waken up, group structure is according to the trigger event or wake-up thing for being recognized and/or being inferred to by DSP (such as DSP 106/212) Part wakes up the device (such as device 1010).In further unrestricted aspect, which can organize structure To receive signal from one or more MEMS action sensors (such as MEMS action sensor 202) or from the MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102) receive signal, signal received from other sensors, from other devices (processor, Such as system processor (such as device 1010)) signal is received, and generate control signal 104/204.

In addition, for example above-mentioned description as described in Fig. 1-2, which more may include sensor control group Part, group structure is to control one or more the MEMS action sensors (such as MEMS action sensor 202), the MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102).Sensor control assembly as described herein can organize structure to execute self-contained function It can (such as: calibration, efficiency adjustment, change operation mode), by the self-sufficiency to the signal from one or more MEMS sensors Analysis guided, wherein the signal from one or more MEMS sensors for example: from one or more MEMS sounds sensing The signal of device or microphone 102, MEMS action sensor 202, other sensors etc., from being associated with DSP (such as DSP 106/ 212) other signals of sensor, other signals from external device (ED) or system processor (such as device 1010) and/or preceding State any combination.Therefore, in other further unrestricted aspects, including sensor control assembly DSP (such as DSP 106/ 212), for example, structure can be organized to execute such sensor control function, for example, being passed in response to being acted from one or more MEMS Sensor receives signal or receives signal from the MEMS acoustic sensor (such as MEMS acoustic sensor or microphone 102), senses certainly Device receives signal, receives signal from other devices (processor, such as system processor (such as device 1010)).Therefore, DSP (such as DSP 106/212) or the sensor control block for being associated in DSP (such as DSP 106/212) can organize structure in addition to other Except, it calibrates, adjust one or more MEMS acoustic sensors (such as MEMS acoustic sensor or microphone 102), the MEMS is moved Make sensor (such as MEMS action sensor 202), other sensors efficiency or change one or more MEMS sounds sensing Device (such as MEMS acoustic sensor or microphone 102), the MEMS action sensor (such as MEMS action sensor 202), other biographies The operation mode etc. of sensor etc..Therefore, the sensor control assembly for being associated in DSP (such as DSP106/212) can organize structure to remove Except other, calibrate, adjust one or more MEMS acoustic sensors (such as MEMS acoustic sensor or microphone 102), should MEMS action sensor (such as MEMS action sensor 202), other sensors efficiency or change one or more MEMS sound Loud sensor (such as MEMS acoustic sensor or microphone 102), the MEMS action sensor (such as MEMS action sensor 202), The operation mode etc. of other sensors etc..

Such as unrestricted example, Figure 12-15 is painted further sensor as described herein, intelligence sensor, microphone, sensing The unrestricted aspect that the demonstration of device or microphone package etc. is implemented.

Figure 11 is painted the exemplary operational environment 1100 for being suitble to merge with the example embodiment of this exposure.For example, apprehensible Be, tradition application in sensor 1102 may include promote generate control signal 1104 (as interrupt signal, interrupt control signal, I²C signal) digital circuit (not shown), some events occur signal.The control signal 1104 (as interrupt signal, in Disconnected control signal, I²C signal) it can be sent to processor (such as processor 1106, sensor center 1108, Main Processor Unit 1110, application processor 1112 etc.) with notifier processes device, effective information is present in the sensor 1102 and in sensor Between 1102 and processor (such as processor 1106, sensor center 1108, Main Processor Unit 1110, application processor 1112) Communication requirement.As shown in figure 11, processor is in addition to including processor 1106, sensor center 1108 and/or Main Processor Unit 1110, the processor according to unrestricted aspect may include application processor 1112 (AP), for example, in running gear or platform, Such as portable electric or tablet personal computer (PC), is not limited.

Further as shown in figure 11, exemplary operational environment 1100 may include using layer architecture (layered Architecture system), wherein sensor 1102 will control signal 1104 (as interrupted signal, interrupting control signal, I2 news Number) send to sensor center (such as sensor center 1108), it may include one and (handled as main compared to Main Processor Unit Device 1110) smaller and less power consumption (power-intensive) processor is in system (such as AP).Exemplary sensor maincenter (such as sensor center 1108) can be handled convenient for a degree of signal of the execution to the data received from the sensor 1102, and Demonstration Main Processor Unit (such as Main Processor Unit 1110), which can maintain, reduces power mode (such as sleep pattern) to reduce system Power consumption.

Then, exemplary sensor maincenter (such as sensor center 1108) can determine (as according to including being associated with the sensor The data etc. of 1102 information) control signal 1116 (is such as interrupted signal, interrupts control signal, I²C signal) it sends to demonstration Main Processor Unit (such as Main Processor Unit 1110).According at least to the control signal 1116 (as interrupt signal, interrupt control signal, I²C signal), the Main Processor Unit (such as Main Processor Unit 1110) can be convenient for deciding whether to power on (power up) (as from reducing Waken up in electric energy sleep pattern) component of demonstration system, can be conducive to exemplary sensor maincenter (such as sensor center 1108) with Communication between demonstration Main Processor Unit (such as Main Processor Unit 1110).

Further as shown in figure 11, exemplary operational environment 1100 may include system, such as portable phone, tablet PC etc., It includes one or more microphones 1118.Apprehensible to be, in exemplary operational environment 1100, coder 1120 can be used for controlling One or more microphones 1118 are made, video signal data 1122 is received from microphone 1118 and/or sends processed video signal data 1124 to demonstration Main Processor Unit (such as application processor 1112).In such a system, Main Processor Unit is demonstrated (at application Reason device 1112) it can decide whether to power on the component of the demonstration system (as waken up from reduction electric energy sleep pattern), such as coder 1120 and/or indicate the coder 1120 open microphone.

Once microphone 1118 is opened, the sustainable video signal data 1122 of sending of microphone 1118 is to coder 1120.It can It is appreciated that, when microphone 1118 is persistently powered, such tradition may consume excessive electric power with this.For example, into One step is appreciated that, in order to maintain the function of bottom line, microphone 1118, coder 1120 and Main Processor Unit (are such as answered With processor 1112) it is persistently to be powered.Compared to other operating environments for sensor 1102 based on interruption of demonstrating, pass System using microphone 1118 obvious not power saving (power-efficient) of audio system.However, because microphone 1118 wraps The audio sensor operated on sound signal is included, the example embodiment of this exposure can be conducive to generate control signal (as interrupted Signal interrupts control signal, I2 signal).Furthermore the example embodiment of this exposure can convenient for microphone permanent opening operation with For applications such as the detection of such as sound detection, voice activity, keyword identification (spotting), ambient sound analyses, for example, According to the detection of sound event, it can promote to generate control signal (as interrupted signal, interrupting control signal, I by using²C news Number) acoustic sensor be transmitted to exemplary storage medium (such as processor 1106, sensor center 1108, Main Processor Unit 1110, Application processor 1112 etc.).

Figure 12 is painted showing for the intelligence sensor 1202 including generating control signal of the unrestricted aspect according to this exposure Model embodiment 1200.For example, Figure 12 is painted the model embodiment 1200 using acoustic sensor 1202, wherein acoustic sensor 1202 according to the detection of sound event, promotes to generate control signal (as interrupted signal, interrupting control signal, I²C signal) with In being transmitted to exemplary storage medium (such as processor 1204, sensor center 1206, Main Processor Unit 1208, Demonstration Application processor Deng).In example embodiment, can by include one or more demonstration control signals (as interrupt signal, interrupt control signal, I²C signal) output signal 1210 through multitask and including being associated with the sound converted by demonstration acoustic sensor 1202 The data of the signal of sound press Reeb, to transmit generated control signal.

Such as unrestricted example, about acoustic sensor 1202 and exemplary storage medium (such as processor 1204), when detecting sound The event of sound and/or when determining that the sound event indicates whether effective sound event, acoustic sensor 1202 can produce control signal (as interrupted signal, interrupting control signal, I²C signal) and transmit it to exemplary storage medium (such as processor 1204).According to place It manages device to interrupt, exemplary storage medium (such as processor 1204) can decide whether to power on (as reduced electric energy sleep mode wakeup certainly) sound Sensor and/or whether start to communicate with acoustic sensor 1202.In some example embodiments including coder 1212 In 1200, acoustic sensor 1202 can be convenient for simultaneous transmission video signal data 1214 to coder 1212.

In further unrestricted example, about acoustic sensor 1202 and exemplary storage medium (such as Main Processor Unit 1208), when detecting sound event and/or determining that the sound event indicates whether effective sound event, acoustic sensor 1202 can produce control signal (as interrupted signal, interrupting control signal, I2 signal) and be passed hub setting exemplary sensor maincenter (such as sensor center 1206).According to the interruption for being transmitted to exemplary sensor maincenter (such as sensor center 1206), exemplary trigger Device maincenter (such as sensor center 1206) can pass convenient for deciding whether to power on (as waken up from reduction electric energy sleep pattern) sound Sensor 1202 and/or whether start to communicate with acoustic sensor 1202, for example, by required to acoustic sensor 1202 and/or from Acoustic sensor 1202 receives video signal data 1214.In the embodiment 1200 that some demonstrations include coder 1212, the sound Sensor 1202 can be convenient for simultaneous transmission video signal data 1214 to coder 1212.In further embodiment, exemplary trigger Device maincenter (such as sensor center 1206) (controls signals (such as by demonstrating including one or more when receiving video signal data 1214 It interrupts signal, interrupt control signal, I²C signal) output signal 1210 through multitask and including being associated with by example acoustic Ring the data of the signal for the sound pressure wave that sensor 1202 is converted) and/or determine that the video signal data 1214 has indicated whether When imitating video signal data, exemplary sensor maincenter (such as sensor center 1206) can decide whether to power on (as slept from reduction electric energy Waken up in mode) component of demonstration system, such as exemplary storage medium (such as Main Processor Unit 1208), such as or whether power off (such as Component, which is gone back to, reduces electric energy sleep pattern, case detecting mode etc.).

Another example embodiment 1300 of the discribed intelligence sensor 1302,1304 of Figure 13, convenient for according to title public affairs It opens to generate control signal.As used herein, sensor, intelligence sensor and the analog of institute's intention, and including sensing Device, the package of intelligence sensor etc. refer to MEMS sensor, MEMS intelligence sensor etc. unless otherwise indicated.For example, showing The MEMS acoustic sensor or microphone 1306 of model may include sound film (not shown) and, for example, as further described herein, About Fig. 3-9, through group structure with handle by film the received associated signal of sound pressure wave application-specific integrated circuit.Show The application-specific integrated circuit of model may include through group structure to generate and 1306 institute of MEMS acoustic sensor or microphone by demonstrating The pre-amplifier 1308 of the received associated analog signal 1316 of sound pressure wave and/or may include to generate and demonstrate MEMS acoustic sensor or microphone 1306 the associated digital signal 1318 of received sound pressure wave 1310 (example of ADC Such as: the data of digit order number audio signal, PDM signal, I2S signal, message and/or other number formats).

Non-limiting embodiment disclosed in title may include additional circuit, as case detecting device 1312,1314, event are detectd Component etc. is surveyed, based on analog signal 1316 relevant to sound pressure wave, is based on number associated with sound pressure wave Signal 1318 etc., and can be composed to determine whether generate one or more demonstration control signal 1320 (for example, interrupt signal, Interrupt control signal, I²C signal).For example, the case detecting device 1312,1314 of demonstration, case detecting component etc., can be composed For detecting based on the signal (for example, analog signal 1316, digital signal 1318) for being associated with sound pressure wave and/or in response to from MEMS acoustic sensor or microphone 1306 the received signal for being associated with sound pressure wave (for example, analog signal 1316, number Word signal 1318) and one or more demonstration control signals 1320 are generated (for example, interrupting signal, interrupting control signal, I²C news Number).At non-limiting aspect, the case detecting device 1312,1314 of demonstration, case detecting component etc. can be constituted to detecting and appoint What various sound pressure event, including or association, but be not limited to, sound, voice, ultrasonic wave signal, keyword, sound are living Dynamic or preset sound kenel as sound pressure event etc..

In addition, example embodiment disclosed in title may include additional circuit, be conducive to combine and/or transmit one or The control signal 1320 of multiple demonstrations is (for example, interrupting signal, interrupting control signal, I²C signal) and including for example, herein Further illustrated in, about Fig. 3-9, in the list of package (for example, package includes intelligent intelligence sensor 1302,1304 etc.) The demonstration MEMS sound in one output (for example, solder pads, pin, contact etc. for being associated with signal/interrupt output 1322,1324) The associated signal of sound pressure wave that sensor or microphone 1306 are converted is (for example, analog signal 1316, digital signal 1318) data.As a non-limiting example, Figure 13 describes multiplexer (MUX) 1326 through group structure to combine and/or transmit The control signal 1320 of one or more demonstrations is (for example, interrupting signal, interrupting control signal, I²C signal) and including, for example, Further illustrated in this paper, about Fig. 3-9, package (for example, package includes intelligent intelligence sensor 1302,1304 etc.) Single output (for example, solder pads, pin, contact etc. for being associated with signal/interrupt output 1322,1324) on demonstration MEMS The associated signal of sound pressure wave that acoustic sensor or microphone 1306 are converted is (for example, analog signal 1316, number news Number 1318) data.

Disclosed in the title in other example embodiments, the implementation of intelligence sensor (for example, intelligence sensor 1304 etc.) Example further comprises additional circuit, is conducive to the MEMS in the various modes operated include in addition to standard efficiency mode The demonstration intelligence sensor 1300 of acoustic sensor or microphone 1306.As a non-limiting example, intelligence sensor (example Such as, intelligence sensor 1304 etc.) example embodiment 1300 can be conducive to operation, such as, but not limited to, about Figure 14-15 and mould Formula selects component, in case detecting mode, low electric energy message mode, standard efficiency mode, Supersonic wave mode and/or sleep pattern In intelligence sensor (for example, intelligence sensor 1304 etc.).Disclosed in the title in other example embodiment, intelligence is passed The embodiment 1300 of sensor (for example, intelligence sensor 1304 etc.) can also include, for example, but are not limited to, about Figure 14-15 and Model selection component, in favor of providing through processor 1330 (for example, processor, processor maincenter, Main Processor Unit, application Processor etc.) it can be conducive to from the intelligence sensor including MEMS acoustic sensor or microphone 1306 (for example, intelligence sensor 1304 etc.) additional circuit of the mode selection interface changed between multiple modes of the operation of example embodiment 1300.

At non-limiting aspect, various embodiments disclosed in title can be provided according to such as I²C, serial circumference interface (SPI)、(MIPI) voice-wires SM (Mobile Industry Processor(MIPI) Sound WireSM) and/or the organized structure of other self defined interfaces mode selection interface 1328.This Outside, for example, as further described herein, about model selection component and Figure 14-15, when 1330 (example of Figure 13 drawing processing device Such as, processor, sensor center, Main Processor Unit, application processor etc.) package is penetrated (for example, package includes that intelligence passes Sensor 1302,1304 etc.) model selection input 1332 (for example, solder pads, pin, contacts etc.) be coupled in mode selection interface 1328, processor 1330 (for example, processor, sensor center, Main Processor Unit, application processor etc.) also may couple to for example Clock pulse (ck) inputs another input of 1334 (for example, solder pads, pin, contacts etc.).

For example, the demonstration system 1400 that Figure 14 describes includes conducive to the control news for disclosing further aspect according to title are generated Numbers 1320 (for example, interrupting signal, interrupting control signal, I²C signal) intelligence sensor (for example, intelligence sensor 1402 Deng).In addition in Figure 13 about demonstration intelligence sensor (for example, intelligence sensor 1304 etc.) exemplary components described it Outside, demonstration intelligence sensor 1402 can also include being conducive to operation in the various modes in addition to standard efficiency mode to include MEMS The additional circuit of the demonstration intelligence sensor of acoustic sensor or microphone 1306.As non-limitative example, disclosed in title Various embodiments can be provided including being set through group structure from including foregoing one or more case detecting modes, low electric energy Message mode, standard efficiency mode, Supersonic wave mode or sleep pattern demonstration intelligence sensor 1402 several modes between One mode model selection component 1404 mode selection interface.

In further non-limitative example, the example embodiment of model selection component 1404 can further comprise through group Structure is to monitor that the clock pulse (ck) for being conducive to provide mode selection interface 1328 exports 1334 (for example, solder pads, pin, contacts etc.) State clock pulse monitor component (not shown).For example, as further described herein, it is possible to provide for intelligence sensor of demonstrating 1402 demonstration control interface, for example, being made using the state that clock pulse (ck) exports 1334 (for example, solder pads, pin, contacts etc.) The institute of the operation of demonstration intelligence sensor 1402 for indicator and/or for including MEMS acoustic sensor or microphone 1306 The control of selection mode.In the exemplary embodiments, demonstration intelligence sensor 1402 can further comprise conducive to used in the thing of operation It include the clock pulse news of the operation of the demonstration intelligence sensor 1402 of MEMS acoustic sensor or microphone 1306 in part sense mode Number generation internal oscillator (OSC) 1406.As described in Figure 14, example embodiment can further comprise working as maintenance The stability of time pulse signal 1412 and be associated with control signal 1320 (for example, interrupt signal, interrupt control signal, I²C signal Deng) and the signal including being associated with the sound pressure wave converted by demonstration MEMS acoustic sensor or microphone 1306 When the data of (for example, analog signal (not shown), digital signal 1318), through group structure to combine by internal oscillator (OSC) 1406 provide mode selection interface 1328 with the time pulse signal of external time pulse signal 1410 and/or using by including The multitask of the assembly management time pulse signal 1412 of the demonstration intelligence sensor 1402 of MEMS acoustic sensor or microphone 1306 Device 1408.

It follows that by combining and/or transmitting one or more demonstration control signals 1320 (as interrupted signal, interrupting control Signal processed, I²C signal) and comprising with by the single of package (for example, package includes intelligent intelligence sensor 1402 etc.) Export the demonstration MEMS acoustic sensor on (for example, being associated with the solder pads of signal/interrupt output 1324, pin, contact etc.) Or the associated signal of sound pressure wave that microphone 1306 is converted is (for example, 1316 (not shown) of analog signal, digital signal 1318) data, it is public that example embodiment can provide the title comprising the pin with quantity identical as conventional digital PDM microphone Open demonstration interrupt generation mechanism intelligence sensor (for example, the example embodiment of intelligence sensor with comprising five input/it is defeated Out or pin (such as clock (clock), data, L/R, supply, ground connection input/output or pin) conventional digital microphone pin It is compatible).

Therefore, demonstration system 1400 includes intelligence sensor (for example, intelligence sensor 1402 etc.), based on sound event It detects and/or judges that the sound event represents effective sound event, be conducive to generate control signal 1320 (for example, interrupting news Number, interrupt control signal, I²C signal), the demonstration intelligence sensor 1402 including MEMS acoustic sensor or microphone 1306 can To generate control signal 1320 (for example, interrupting signal, interruption control signal, I²C signal) and the extremely demonstration of transmission control signal Sensor center (for example, sensor center 1414).Based on being sent to exemplary sensor maincenter (for example, sensor center 1414) Interruption, exemplary sensor maincenter (for example, sensor center 1414) can in favor of judge whether power supply (for example, from reduce electricity Can be waken up in sleep pattern) and/or start and the demonstration intelligence sensor including MEMS acoustic sensor or microphone 1306 1402 connections, such as by request and/or to receive include by including the demonstration intelligence of MEMS acoustic sensor or microphone 1306 The data of the signal (for example, analog signal (not shown), digital signal 1318) of sensor 1402.

In some example embodiments 1400 for including codec 1416, including MEMS acoustic sensor or microphone 1306 demonstration intelligence sensor 1402 can be conducive to while transmission includes signal (for example, analog signal (not shown), digital signal 1318) data are to codec 1416.In a further embodiment, exemplary sensor maincenter is (for example, sensor center 1414), based on the data including signal (for example, analog signal (not shown), digital signal 1318) are received, for example, by packet It includes one or more demonstration control signals 1320 and (for example, interrupting signal, interrupts control signal, I²C signal) multitask export (example Such as, the solder pads, pin, contact etc. of signal/interrupt output 1324 are associated with) and including signal (for example, analog signal is (not Show), digital signal 1318) data and/or judgement include signal (for example, analog signal (not shown), digital signal 1318) whether data represent effective audible signals, and exemplary sensor maincenter (for example, sensor center 1414) can be in favor of sentencing It is disconnected whether to power (for example, being waken up from reducing in electrosleep mode), or whether power off (for example, return assembly enters reduction electric energy Sleep pattern, case detecting mode etc.) in the component of demonstration system 1400, for example, if exemplary storage medium is (for example, application processing Device 1418).

Figure 15 description is for case detecting, one or more demonstration control signals 1320 (for example, interrupting signal, interruption control Signal, I²C signal) generation and/or the model selection of non-limiting aspect according to disclosed in title exemplary architecture 1500. As described above, the example embodiment of model selection component 1404, which may further include, is configured as monitoring clock pulse (ck) input The clock pulse of 1334 state monitors component (not shown).Therefore, in step 1502, the state of clock pulse (ck) input 1334 is monitored Demonstration clock pulse monitoring component (not shown) may determine that one or more frequencies of any signal in clock pulse (ck) input 1334 (Fck) and/or voltage (Vck).For example, in exemplary architecture 1500, if it is determined that the clock pulse (ck) input 1334 is by continuously Maintain low value (for example, the Fck=0 in step 1504 and the Vck 1506 are not equal to logic-high value), including MEMS sound sensing The demonstration intelligence sensor 1402 of device or microphone 1306 can be placed into sleep pattern (for example, by model selection component 1404 etc.), clock pulse monitoring can continue 1502.

If it is determined that the clock pulse (ck) input 1334 is constantly to maintain logic-high value (for example, In in step 1506 The Vck of step 1506 is equal to logic-high value), the demonstration intelligence sensor 1402 including MEMS sonic transducer or microphone 1306 can To be placed into case detecting mode (for example, by model selection component 1404 etc.).In exemplary events sense mode, at outside Reason device (for example, application processor 1418 and/or sensor center 1414) and codec 1414 can be placed into demonstration and sleep Sleep mode, while clock pulse (ck) being kept to input 1334 (for example, Vck) in logic-high value.It should be noted that in example embodiment In, it is being short of under external clock pulse (for example, external time pulse signal 1410), showing including MEMS sonic transducer or microphone 1306 Model intelligence sensor 1420 can switch to internal oscillator (OSC) 1406, in step 1508, with operate ADC 1310 and/or Other such as model selection interfaces 1328, the equal components of case detecting device 1314.

In sound event (in such as, in step 1510, through the demonstration for including MEMS acoustic sensor or microphone 1306 Intelligence sensor 1402) detecting can produce control signal 1320 (for example, interrupt signal, interrupt control signal, I²C news Number), and control signal can be transmitted to exemplary sensor maincenter (for example, sensor center 1414) in step 1512.Such as this What text further described, control signal 1320 is (for example, interrupting signal, interrupting control signal, I²C signal) it can be by including one Or multiple demonstration control signals 1320 are (for example, interrupting signal, interrupting control signal, I²C signal) and including signal (for example, mould Quasi- signal (not shown), digital signal 1318) data export (for example, being associated with signal/interrupt output 1324 through multitask Solder pads, pin, contact etc.) be routed to exemplary sensor maincenter (for example, sensor center 1414).In example embodiment In, including one or more demonstration control signals 1320 are (for example, interrupting signal, interrupting control signal, I²C signal) and including signal The data of (for example, analog signal (not shown), digital signal 1318) are exported through multitask (for example, being associated with signal/interruption Solder pads, pin, the contact etc. of output 1324) component (for example, model selection component 1404) can be selected to control by pattern model System.The model selection component controls one or more multiplexers (MUX) 1326, exemplary internal oscillator (OSC) through group structure 1406 and/or demonstration multiplexer 1408, in favor of execute exemplary architecture 1500 for case detecting, one or more demonstration control Signal processed 1320 is (for example, interrupting signal, interrupting control signal, I²C signal) generation and/or the non-limit according to disclosed in title Model selection in terms of property processed.

If be detected in step 1510 without event, the demonstration intelligence including MEMS sonic transducer or microphone 1306 Sensor 1402 can be maintained at exemplary events sense mode (for example, by model selection component 1404 etc.) in step 1508 In.For example, in exemplary events sense mode, exemplary sensor maincenter (for example, sensor center 1414) and demonstration encoding and decoding Device (for example, codec 1416) is positively retained in demonstration sleep pattern, for the exemplary sensor maincenter (for example, sensor Maincenter 1414) and demonstration codec (such as codec 1416) its data input (for example, PDM input 1420) can be maintained On be not responding to any signal.However, if detecting event, including MEMS acoustic sensor or microphone 1306 in step 1510 Demonstration intelligence sensor 1402 can be conducive to generate control signal 1320 (for example, interrupt signal, interrupt control signal, I²C news Number) and/or by the interrupt pin 1422 of the exemplary sensor maincenter (for example, sensor center 1414), they are sent to Exemplary sensor maincenter (for example, sensor center 1414), because including the demonstration of MEMS acoustic sensor or microphone 1306 Intelligence sensor 1402, by include one or more demonstration control signal 1320 (for example, interrupt signal, interrupt control signal, I²C signal) and data including signal (for example, analog signal (not shown), digital signal 1318) through multitask export (example Such as, the solder pads, pin, contact etc. of signal/interrupt output 1324 are associated with), be connected to exemplary sensor maincenter (for example, Sensor center 1414).Therefore, in the received control signal of exemplary sensor maincenter (for example, sensor center 1414) institute 1320 (for example, interrupting signal, interrupting control signal, I²C signal), in step 1512, may be used as being conducive to instruction exemplary trigger The signal of device maincenter (for example, sensor hinge 1414) power supply (for example, being waken up from low electric energy sleep pattern).

Once receiving control signal 1320 (for example, interrupting in exemplary sensor maincenter (for example, sensor center 1414) Signal interrupts control signal, I²C signal), in step 1512, exemplary sensor maincenter (for example, sensor center 1414) can In favor of transmission low frequency clock pulse (for example, Fck=768 kHz (kHz)) to comprising MEMS system in 1516 acoustic sensors or The demonstration intelligence sensor 1402 of microphone 1306.Once by monitored through group structure clock pulse (ck) input 1334 state when Arteries and veins monitors that component (not shown) inputs on 1334 (for example, solder pads, pin, contacts etc.) at clock pulse (ck) and detects low frequency clock pulse (for example, Fck=768 kHz (kHz)), pattern model selection component 1404 can switch including MEMS acoustic sensor or wheat The demonstration intelligence sensor 1402 of gram wind 1306 from use the internal clock signal that is generated by internal oscillator (OSC) to outside Time pulse signal 1410 (e.g., including low frequency clock pulse, e.g., Fck=768 kHz (kHz)).As a result, pattern model selects Component 1404 can switch in step 1504 shows the model intelligence sensor 1402 including MEMS acoustic sensor or microphone 1306, From exemplary events sense mode to low electric energy message mode of demonstrating.Because of showing including MEMS acoustic sensor or microphone 1306 Model intelligence sensor 1402, by include one or more demonstration control signal 1320 (for example, interrupt signal, interrupt control signal, I²C signal) and data including signal (for example, analog signal (not shown), digital signal 1318) through multitask export (example Such as, the solder pads, pin, contact etc. of signal/interrupt output 1324 are associated with), be connected to exemplary sensor maincenter (for example, Sensor center 1414) (and demonstration codec (for example, codec 1416)), including MEMS acoustic sensor or Mike The demonstration intelligence sensor 1402 of wind 1306 can be transmitted in step 1518 by demonstration MEMS acoustic sensor or microphone 1306 The associated data including signal (for example, analog signal (not shown), digital signal 1318) of the sound pressure wave converted To exemplary sensor maincenter (for example, sensor center 1414) (and demonstration codec (for example, codec 1416)).

In the exemplary embodiments, in step 1512, (example is received in exemplary sensor maincenter according to including being associated in Such as, sensor center 1414) sound pressure wave signal (for example, analog signal (not shown), digital signal 1318) number According to 1514, as described further herein, exemplary sensor maincenter (for example, sensor center 1414) can be in favor of sentencing Whether disconnected sound event represents effective sound event.Based on judging whether the sound event in step 1514 represents effective sound The event of sound, exemplary sensor maincenter (for example, sensor center 1414) can be in favor of judging whether (example of powering in step 1520 Such as, waken up from the sleep pattern of low electric energy) in exemplary storage medium (such as application processor 1418).In turn, the place of demonstration It manages device (for example, application processor 1418), in step 1522, power supply can be determined whether (for example, from low electricity conducive to one or more of Waken up in the sleep pattern of energy) in demonstration codec (for example, codec 1416), for example, in step 1522, group structure demonstration Codec (for example, codec 1416) is to execute substitution or in addition to exemplary sensor maincenter is (for example, sensor center 1414) audible signals except handle task.If demonstrating codec (for example, codec 1416) in step 1522 group structure Task, In are handled with the audible signals for executing substitution or other than exemplary sensor maincenter (for example, sensor center 1414) Step 1524, demonstration codec (for example, codec 1416) can be so that in clock pulse (ck) input 1334, (solder pads are connect Foot, contact) on transmission high frequency time pulse (for example, Fck=2.4 megahertzs (MHz)) to include MEMS acoustic sensor or microphone 1306 demonstration intelligence sensor 1402, while being received in step 1522 in demonstration codec (for example, codec 1416) Including by demonstration MEMS acoustic sensor or microphone 1306 converted the associated signal of sound pressure wave (for example, simulation Signal (not shown), digital signal 1318) data.Once at clock pulse (ck) 1334 (for example, solder pads, pin, contact etc.) On high frequency time pulse (for example, Fck=2.4 megahertzs) be provided, exemplary sensor maincenter (for example, sensor center 1414) can be with Stop transmission low frequency clock pulse (for example, Fck=768 kHz (kHz)).If judging that the sound event will not generation in step 1514 The effective sound event of table, exemplary sensor maincenter (for example, sensor center 1414) can be conducive to judge whether to include MEMS sound The demonstration intelligence sensor 1402 for ringing sensor or microphone 1306 may remain in exemplary events sense mode (for example, logical Cross model selection component 1404 etc.), for example, including the MEMS sound by the pattern model selection switching of component 1404 in step 1526 Sensor or microphone 1306 demonstrate intelligence sensor 1402 by use external time pulse signal 1410 (e.g., including low frequency clock pulse, Such as, Fck=768 kHz (kHz)) to by the internal clock signal generated of internal oscillator (OSC) 1406.

Therefore, in various embodiments, title discloses the demonstration MEMS sound biography that can be provided including case detecting circuit Sensor or microphone 1306 are conducive to generate interruption.For example, example embodiment may include including MEMS acoustic sensor or Mike The demonstration intelligence sensor 1402 of wind 1306, case detecting device 1312,1314, case detecting component, etc., by including one Or multiple demonstration control signals 1320 are (for example, interrupting signal, interrupting control signal, I²C signal) and including being associated in by showing The signal for the sound pressure wave that model MEMS acoustic sensor or microphone 1306 are converted is (for example, analog signal (not shown), number Word signal 1318) data through multitask output (for example, being associated with the solder pads of signal/interrupt output 1324, pin, connecing Point etc.) and be conducive to generate.Other example embodiments described herein can provide including MEMS acoustic sensor or microphone 1306 Demonstration intelligence sensor 1402, and further comprise clock pulse monitor and model selection.In further example, including The demonstration intelligence sensor 1402 of MEMS acoustic sensor or microphone 1306 may further include, such as the further institute of this paper It states, including monitoring that clock pulse (ck) inputs the clock pulse monitoring of the state of 1334 (for example, solder pads, pin, contacts etc.) through group structure The pattern model of component (not shown) selects component 1404.

Unrestrictedly, demonstration intelligence sensor 1402 includes that MEMS acoustic sensor or microphone 1306 have including one The demonstration intelligence sensor 1402 of MEMS acoustic sensor, or microphone 1306 for promote one or more case detectings and/ Or it interrupts and generates that (such as the intelligence sensor of example embodiment is permeable draws using general number PDM microphone desktop, laptop Foot and the digital microphone generally with five input/outputs or pin (such as frequency, data supply, and are grounded input/output or pin) Wind is shared).In other embodiments, the main offer system that discloses includes that exemplary storage medium (such as answer by processor, Main Processor Unit With processor such as application processor 1418), exemplary sensor maincenter (such as sensor center 1414), exemplary compilation code device is (as compiled Decoder 1416) and demonstration intelligence sensor 1402 include that MEMS acoustic sensor or one or more events can be promoted to detect It surveys and/or interrupts and generate.

In example embodiment, main disclose provides an exemplary sensor, including MEMS acoustic sensor (such as MEMS sound Ring sensor or microphone 1306) one is further included suitable for processing sound pressure wave exemplary sensor under a case detecting mode Case detecting component (such as case detecting device 1312,1314, case detecting component etc.), case detecting component include an application integration Circuit (ASIC) is suitable for detect a sound pressure event related to sound pressure wave sound, and in response to the control signal of generation one (such as one or more demonstration control signals 1320, interrupt signal, interrupt control signal, I²C signal etc.) to receive from the MEMS sound Sensor (such as MEMS acoustic sensor or microphone 1306) and signal (such as analog signal related to the sound pressure wave 1316, digital signal 1318).

In another example embodiment, exemplary events detection element (such as case detecting device 1312,1314, a case detecting Component etc.) it is more applicable to generate control signal (such as one or more demonstration control signals 1320, interruption signal, the interruption control Signal, I²C signal etc.) to go to wake up and (such as reduce electric energy sleep mode wakeup from one) coding and decoding from the low power mode of a demonstration Device assembly (such as coder 1416), a sensor center (such as sensor center 1414), or with the sensor (as included MEMS Acoustic sensor or microphone 1306) a relevant system processor (such as processor, a Main Processor Unit), in response to processing one (such as one or more demonstration control signals (such as control signal 1320, interrupt signal, interrupt control news output signal through multitask Number, I²C signal is included by a demonstration MEMS acoustic sensor or microphone 1306 from sensor with datagram (as included MEMS sound Ring sensor or microphone 1306) transduction and a signal relevant to sound pressure wave (such as analog signal 1316, number news Number 1318).It is described in further detail, case detecting component (such as case detecting device 1312,1314, case detecting component etc.) more may be used Suitable for detecting one or more sound, voice, ultrasonic signal, keyword, voice activity, or preset sound form such as sound Unrestrictedly, case detecting component (such as case detecting device 1312,1314, case detecting component etc.) is more applicable by pressure events In detecting demonstration MEMS acoustic sensor or the transduction of microphone 1306 and the sound pressure thing related to the sound pressure wave Part.

In an example embodiment, exemplary sensor further includes multiplexer (such as multiplexer 1326) to generate once more The output signal (as penetrated signal/interrupt output 1322,1324) of task with respond the received control signal (such as one or more Demonstration control signal 1320, interrupts signal, interrupts control signal, I²C signal etc.) and signal relevant to sound pressure wave (such as analog signal 1316, digital signal 1318).For example, it is further described in this, multiplexer 1326 is applicable to It combines and/or transmits one or more demonstration control signals 1320 and (if interrupted signal, interrupt control signal, I²C signal etc.) and It is related to sound pressure wave and by demonstration MEMS acoustic sensor or 1306 signal (such as analog signal of microphone that datagram includes one 1316, digital signal 1318) transduction, such as once a package (such as package, including intelligence of the output signal of multitask Can sensor 1302,1304,1402 etc.) signal output (solder pads such as relevant to signal/interrupt output 1322,1324, connect Foot, contact etc.), it for example, is further described, with reference to Fig. 3 to 9.Therefore, an output signal of the demonstration through multitask can wrap An interruption is included, which includes that (such as one or more demonstration control signals 1320, interrupt signal, interrupt control news the control signal Number, I²C signal etc.) to datagram include signal (such as analog signal 1316, digital signal 1318) relevant with sound pressure wave.

In another example embodiment, an exemplary sensor may include a packaging with a lid and a package substrate Part, package have output of the port part to receive sound pressure wave and an output signal to transmit the multitask (solder pads such as relevant to signal/interrupt output 1322,1324, pin, contact etc.), and wherein the package accommodates the MEMS Acoustic sensor (such as demonstration MEMS acoustic sensor or microphone 1306), the multiplexer (such as multiplexer 1326), with this Case detecting component (such as case detecting device 1312,1314, case detecting component etc.), for example, is further described in this, With reference to Fig. 3-9.

In other embodiments, an exemplary sensor more may include a model selection component (such as mode selection interface 1328, Model selection component 1404 etc.) to several moulds from the sensor (including MEMS acoustic sensor or microphone 1306 of demonstrating) Formula selection one mode of setting, those modes include one or more exemplary events sense modes, low electric energy audio mode of demonstrating, demonstration Standard efficiency mode, Supersonic wave mode of demonstrating, or demonstration sleep pattern, are further described in this.It is infinite, pattern model Selection component (such as mode selection interface 1328, model selection component 1404 etc.) is more applicable to according to part or one or more It is (such as defeated in frequency with case detecting component (such as case detecting device 1312,1314, case detecting component an etc.) relevant interface Enter 1334, input 1332 in model selection, be relevant to mode selection interface 1328, be relevant to model selection component 1404 etc.) Signal goes a mode of setting sensor (as included demonstration MEMS acoustic sensor or microphone 1306), or one and the sensor (as included demonstration MEMS acoustic sensor or microphone 1306) relevant frenquency signal (such as internal oscillator 1406, external frequency Rate signal 1410 etc.) state.

It is relevant to sensor (as included demonstration MEMS acoustic sensor or microphone 1306) in another unrestricted face (such as internal oscillator 1406, foreign frequency signal 1410 etc.) may include one or more basic frequency signal (such as foreign frequency signals 1410) the signal of the oscillator or in package (such as internal oscillator 1406) accommodated is in another unrestricted face, model selection Component (such as mode selection interface 1328, model selection component 1404 etc.) can be more used for based on decision in logic low numerical value (such as Fck 1504 be equal to 0 and 1506, Vck be not equal to a logically high numerical value) the basic frequency signal (such as foreign frequency signal 1410) One demonstration sleep pattern of selection；Based on the basic frequency determined in logically high numerical value (such as Vck is equal to logically high numerical value in 1506) Signal (such as foreign frequency signal 1410) selects an exemplary events sense mode and starts by oscillator (such as internal oscillator 1406) internal frequency (such as foreign frequency signal 1410) generated；The multiplexer is controlled (such as in an exemplary events sense mode Multiplexer 1326) the output (such as once the output signal of multitask in single output, e.g., solder pads, pin, contact, Deng, it is related to message/interrupt output 1322,1324 of package, such as, package includes intelligence sensor 1302,1304, 1402 etc.) the control signal is issued on, and (such as one or more demonstration control signals 1320, interrupt signal, interrupt control signal, I²C Signal etc.), it for example and is further described, with reference to Fig. 3 to 9；Based on determining comprising low frequency signal (such as Fck= The low electric energy audio mode of one demonstration of the basic frequency signal (such as foreign frequency signal 1410) selection 768kHz), and stop by this The internal frequency that oscillator (such as internal oscillator 1406) generates；The multiplexer is controlled in the low electric energy audio mode of a demonstration (such as multiplexer 1326) the output (such as once the output signal of multitask in single output, such as with the message of package/in 1322,1324 relevant solder pads of disconnected output, pin, contact, etc.) on issue the signal relevant to the sound pressure wave (such as Analog signal 1316, digital signal 1318), and the dominant frequency based on decision comprising high-frequency signal (such as Fck=2.4MHz) Rate signal selects an exemplary criteria efficiency mode.

In other embodiments, main uncover provides an exemplary sensor, including (such as the MEMS sound senses a MEMS sensor Device or microphone 1306) in a case detecting component (such as case detecting device 1312,1314, case detecting component etc.) processing This exemplary sensor of ultrasonic pressure wave more may include that a case detecting component (such as case detecting device 1312,1314, detect by event Survey component etc.) have an application integrated circuit (ASIC) to detect ultrasonic pressure events relevant to ultrasonic pressure wave, And (such as one or more demonstration control signals 1320 interrupt signal, interruption control signal, I to one control signal of generation²C signal etc.) It is received with response from MEMS sensor (such as MEMS acoustic sensor or microphone 1306) and related to ultrasonic pressure wave A signal (such as analog signal 1316, digital signal 1318).

In another example embodiment, an exemplary events detection element (such as case detecting device 1312,1314, case detecting group Part etc.) most probably in generation one control signal (such as one or more demonstration control signals 1320, interrupt signal, interrupt control signal, I²C signal etc.) to go to wake up and (such as reduce electric energy sleep mode wakeup from one) with the sensor (such as from the low power mode of a demonstration Including MEMS acoustic sensor or microphone 1306) relevant coder component (such as coder 1416), a sensor Maincenter (such as sensor center 1414), or a system processor (such as answer by such as processor, a Main Processor Unit, an application processor With processor 1418 etc.) shown from sensor (as included MEMS acoustic sensor or microphone 1306) and with response processing by one Model MEMS acoustic sensor or microphone 1306 transduction and the output signal once multitask relevant to ultrasonic pressure wave (such as One or more demonstration control signals such as control signal 1320, interrupts signal, interrupts control signal, I²C signal, and datagram include news Number such as analog signal 1316, digital signal 1318).It is further described, case detecting component (such as case detecting device 1312, 1314, case detecting component etc.) most probably in one or more ultrasonic signals of detecting, or to default Supersonic wave mode for a Supersonic Wave pressure event.In a unrestricted face, case detecting component (such as case detecting device 1312,1314, case detecting component etc.) is more It can be based on signal (such as mould that is related to the ultrasonic pressure wave and being transduceed by a demonstration MEMS acoustic sensor or microphone 1306 Quasi- signal 1316, digital signal 1318) it goes to detect the ultrasonic pressure events.

In other example embodiments, an exemplary sensor also includes a package comprising lid and package substrate, In the package there is Single port part receiving ultrasonic pressure wave, and an output (such as solder pads, pin, contact etc. with Signal/interrupt output 1322,1324 is related) to transmit the output signal through multitask, and the accommodating of its package should MEMS sensor (such as demonstration MEMS acoustic sensor or microphone 1306) and case detecting component (such as case detecting device 1312,1314, case detecting component etc.), for example and further describe, referring to Fig. 3 to 9.In a unrestricted aspect, including One demonstration package of lid and package substrate can also accommodate a multiplexer (such as multiplexer 1326), be retouched in this It states.

In an example embodiment, an exemplary sensor more may include a multiplexer (such as multiplexer 1326) to generate Once the control signal (such as one that the output signal (as penetrated signal/interrupt output 1322,1324) of multitask is received with response Or multiple demonstrations control signal 1320, interrupt signal, interrupt control signal, I²C signal etc.) and with the ultrasonic pressure wave phase The signal (such as analog signal 1316, digital signal 1318) of pass.For example, be further described in this, multiplexer 1326 It can be used for combining or transmitting one or more demonstration control signals 1320 and (if interrupted signal, interrupt control signal, I²C signal etc.) with And datagram includes a signal related to sound pressure wave and from demonstration MEMS acoustic sensor or the transduction of microphone 1306 (such as analog signal 1316, digital signal 1318) transduction, such as (such as wrapped once the output signal of multitask in a package Piece installing, including intelligence sensor 1302,1304,1402 etc.) signal output it is (such as related to signal/interrupt output 1322,1324 Solder pads, pin, contact etc.), for example, be further described, with reference to Fig. 3 to 9.Therefore, a demonstration is through multitask Output signal may include an interruption, which includes that (such as one or more demonstration control signals 1320, interrupt news to the control signal Number, interrupt control signal, I²C signal etc.) to datagram include relevant with sound pressure wave signal (such as analog signal 1316, number Word signal 1318).

In other example embodiments, an exemplary sensor further include a model selection component (such as mode selection interface 1328, Model selection component 1404 etc.) to several moulds from the sensor (including demonstration MEMS acoustic sensor or microphone 1306) Formula selection one mode of setting, those modes include one or more exemplary events sense modes, low electric energy audio mode of demonstrating, demonstration Standard efficiency mode, Supersonic wave mode of demonstrating, or demonstration sleep pattern, are further described in this.It is infinite, pattern model Selection component (such as mode selection interface 1328, model selection component 1404 etc.) is more applicable to according to part or one or more It is (such as defeated in frequency with case detecting component (such as case detecting device 1312,1314, case detecting component an etc.) relevant interface Enter 1334, input 1332 in model selection, be relevant to mode selection interface 1328, be relevant to model selection component 1404 etc.) Signal goes a mode of setting sensor (as included demonstration MEMS acoustic sensor or microphone 1306), or one and the sensor (as included demonstration MEMS acoustic sensor or microphone 1306) relevant frenquency signal (such as internal oscillator 1406, external frequency Rate signal 1410 etc.) state.

It is relevant to sensor (as included demonstration MEMS acoustic sensor or microphone 1306) in another unrestricted face (such as internal oscillator 1406, foreign frequency signal 1410 etc.) may include one or more basic frequency signal (such as foreign frequency signals 1410) the signal of the oscillator or in package (such as internal oscillator 1406) accommodated is in another unrestricted face, model selection Component (such as mode selection interface 1328, model selection component 1404 etc.) most probably in: based on determine logic low numerical value (such as Fck 1504 be equal to 0, and 1506, Vck be not equal to a logically high numerical value) basic frequency signal (such as foreign frequency signal 1410) one demonstration sleep pattern of selection is gone；Based on decision being somebody's turn to do in logically high numerical value (such as Vck is equal to logically high numerical value in 1506) Basic frequency signal (such as foreign frequency signal 1410) removes one exemplary events sense mode of selection and starts by the oscillator (such as inside Oscillator 1406) generate internal frequency (such as foreign frequency signal 1410)；Control the multiplexer (such as multiplexer 1326) The output (such as once the output signal of multitask in single output, such as with message/interrupt output 1322,1324 of package Relevant solder pads, pin, contact, etc., such as, package includes intelligence sensor 1302,1304,1402 etc.) on issue should Controlling signal, (such as one or more demonstration control signals 1320, interrupt signal, interrupt control signal, I²C signal etc.), citing comes It says, and is further described, with reference to Fig. 3 to 9；It include the dominant frequency of low frequency signal (such as Fck=768kHz) based on decision The low power mode of one demonstration of rate signal (such as foreign frequency signal 1410) selection, and/or stop by oscillator (such as internal oscillator Device 1406) generate internal frequency；Multiplexer (such as multiplexer 1326) In is controlled in the low electric energy audio mode of a demonstration The output (such as once the output signal of multitask in single output, such as with 1322,1324 phase of message/interrupt output of package The solder pads of pass, pin, contact, etc.) on issue relevant to the ultrasonic pressure wave signal (such as analog signal 1316, it is several Word signal 1318), and/or basic frequency signal (such as external frequency based on decision comprising high-frequency signal (such as Fck=2.4MHz) Rate signal 1410) one exemplary criteria efficiency mode of selection.

In other example embodiments, it is main uncover provide demonstration system (such as demonstration system 1400 and/or part, component, and its Sub-component and any combination etc.) it include that (such as one includes one or more intelligence sensors to a demonstration MEMS sensor package 1302, intelligence sensor 1304, the equal package of intelligence sensor 1402), for example, further described in this, with reference to figure 3-9,13-15 etc..Demonstration MEMS sensor package can be used in a case detecting mode handle sound pressure wave (and/or Ultrasonic pressure wave), or transmit output signal (such as one or more demonstration control signals, such as control signal once multitask 1320, signal is interrupted, control signal, I are interrupted²C signal etc.) and datagram include by demonstration MEMS acoustic sensor or microphone 1306 transductions and relevant to sound pressure wave (and/or ultrasonic pressure wave) signal (such as analog signal 1316, digital signal 1318), the signal include with the sound pressure wave (and/or ultrasonic pressure wave) and with package (as include it is one or more A intelligence sensor 1302, intelligence sensor 1304, intelligence sensor 1402, the package waited) it is relevant output (such as with news Number/the relevant solder pads of interrupt output 1322,1324, pin, contact etc.) it interrupts, for example, and further described in this, With reference to Fig. 3-9.

In addition, the demonstration system mainly to uncover more may include one or more exemplary sensor maincenter (such as sensor centers 1414), demonstration coding/decoding digital signal processor (coder) (such as coder 1416), or one and the sensor (such as processor, a Main Processor Unit, one answers (as included MEMS acoustic sensor or microphone 1306) relevant Main Processor Unit With processor such as application processor 1418 etc.) for example, in multiple example embodiments, one or more exemplary sensors Maincenter (such as sensor center 1414), demonstration coding/decoding digital signal processor (coder) (such as coder 1416), or Main Processor Unit relevant to sensor (as included MEMS acoustic sensor or microphone 1306) is (as handled Device, a Main Processor Unit, application processor such as application processor 1418 etc.) can be used to receive it is at least part of this through multitask Output signal (such as one or more demonstration control signals as control signals 1320, interrupt signal, interrupt control signal, I²C news Number), with datagram include by demonstration MEMS acoustic sensor or the transduction of microphone 1306 and with sound pressure wave (and/or ultrasonic Pressure wave) relevant signal (such as analog signal 1316, digital signal 1318), the signal include with the sound pressure wave (and/or Ultrasonic pressure wave)；Also it can be used to based at least part of output signal (such as one or more demonstration control news through multitask Number as control signal 1320, interrupt signal, interrupt control signal, I²C signal) and including by demonstration MEMS acoustic sensor or Microphone 1306) transduction and signal relevant to sound pressure wave (and/or ultrasonic pressure wave) (such as analog signal 1316, number Word signal 1318) go transmission one frenquency signal (such as foreign frequency signal 1410) to the MEMS sensor package (such as include One or more intelligence sensors 1302, intelligence sensor 1304, the equal package of intelligence sensor 1402).

In other embodiments, the demonstration system mainly to uncover more may include a demultiplexer (not being illustrated in figure), should Demultiplexer system is relevant to one or more exemplary sensor maincenters (such as sensor center 1414), the demonstration coding/decoding Digital signal processor (coder) (such as coder 1416), or Main Processor Unit (such as processor, a Main Processor Unit, One application processor such as application processor 1418 etc.) for example, in an example embodiment, one demonstration demultiplexer can For receive this through multitask output signal (such as one or more demonstration control signals as control signals 1320, interrupt signal, in Disconnected control signal, I²C signal), with datagram include by demonstration MEMS acoustic sensor or microphone 1306 transduction and with sound pressure The relevant signal (such as analog signal 1316, digital signal 1318) in Reeb (and/or ultrasonic pressure wave)；Also it can be used to transmit one It is a or multiple to relevant with sound pressure wave (and/or ultrasonic pressure wave) signal (such as analog signal 1316, digital signal 1318) it or interrupts to one or more exemplary sensor maincenters (such as sensor center 1414), coding/decoding number of demonstrating letter Number processor (such as coder 1416), or Main Processor Unit (such as answer by such as processor, a Main Processor Unit, an application processor With processor 1418 etc.).In addition, include demonstration MEMS sensor package (such as include one or more intelligence sensors 1302, intelligence sensor 1304, the equal package of intelligence sensor 1402) demonstration system more may include an oscillator (as interior Portion's oscillator 1406 etc.) to drive at least a part of MEMS sensor package in an exemplary events sense mode (such as It include one or more intelligence sensors 1302, intelligence sensor 1304, the equal package of intelligence sensor 1402).It is unrestricted Ground, demonstration system more may include that a MEMS sensor package (such as includes one or more intelligence sensors 1302, intelligent sensing Device 1304, the equal package of intelligence sensor 1402) to wake up and (such as reduce electric energy sleep mode wakeup from one) one or more Exemplary sensor maincenter (such as sensor center 1414), the demonstration coding/decoding digital signal processor (coder) is (as compiled Decoder 1416), or Main Processor Unit (such as processor, a Main Processor Unit, an application processor such as application processor 1418 Deng), it is for example, relevant to sound pressure wave at least one interruption received with response or the output signal through multitask Data.

It (such as includes that one or more are intelligently passed that further unrestricted application, which includes demonstration MEMS sensor package, Sensor 1302, intelligence sensor 1304, the equal package of intelligence sensor 1402) demonstration system more demonstration system further include one Model selection component (such as mode selection interface 1328, model selection component 1404 etc.) is used for based on decision in logic low numerical value (such as frequency inputs 1334 to the frenquency signal of (such as Fck is equal to 0 1504 and is not equal to a logically high numerical value in 1506, Vck) Solder pads, pin, contact etc.) select a demonstration sleep pattern；Based on decision, in logically high numerical value, (such as Vck is equal in 1506 to be patrolled Volume high numerical value) frenquency signal (such as frequency input 1334 includes solder pads, pin, contact etc.) selection one exemplary events detecting Mode simultaneously starts the internal frequency generated by the oscillator (such as internal oscillator 1406)；To in an exemplary events sense mode The multiplexer (such as multiplexer 1326) is controlled (such as once the output signal of multitask in single output, e.g., to weld in the output Backing strap, pin, contact, etc. related to message/interrupt output 1322,1324 of package, package is for example including intelligent sensing Device 1302,1304,1402 etc.) on issue the control signal (such as one or more demonstration control signals 1320, interrupt signal, interrupt Control signal, I²C signal etc.), it for example and is further described, with reference to Fig. 3 to 9；It include low frequency signal based on decision The frenquency signal (such as frequency input 1334 includes solder pads, pin, contact etc.) of (such as Fck=768kHz) goes selection one to show The low power mode of model, and/or stop the internal frequency generated by the oscillator (such as internal oscillator 1406)；In the low electricity of a demonstration The energy scheme control multiplexer (such as multiplexer 1326) is in the output (such as once the output signal of multitask in single defeated Out, solder pads such as relevant to message/interrupt output 1322,1324 of package, pin, contact, etc.) on issue with the sound The relevant signal (such as analog signal 1316, digital signal 1318) of pressure wave (and/or ultrasonic pressure wave)；And/or it is based on Determine comprising high-frequency signal (such as Fck=2.4MHz) the frenquency signal (such as frequency input 1334 includes solder pads, pin, Contact etc.) one exemplary criteria efficiency mode of selection.

Based on foregoing description object content, according to aforementioned exposure with the method being embodied preferably can refer to flow chart 16 to 18.It is that method is described with a series of square for the purpose simply illustrated, embodiment and corresponding do be understood Description content is not limited to the sequence of these squares, and certain squares can be occurred with different order, and/or simultaneously with other squares Occur.The process that is non-sequential or separating from collateral branch that any flow chart indicates should be understood that, be to imply other different branches, stream Journey path, and square sequence, can all be used to implement to reach the same or similar result.In addition, and the not all side being painted Block must be all applied in following methods.

Demonstration methods

Figure 16 is painted showing for the non-limiting method relevant to intelligence sensor of various non-limiting aspects according to the present invention Model flow chart.As infinite example, demonstration methods 1600 may include receiving sound pressure or sound wave 1602.Citing comes Say, sound pressure or sound wave can be received via for example adapting to sound pressure or sound wave the sensor package (for example, Sensor comprising MEMS acoustic sensor or microphone 102 or microphone package) in port part (for example, port part 308), and By being packaged in sensor package (for example, the sensor comprising MEMS acoustic sensor or microphone 102 or microphone packaging Part) in MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 102) receive, which includes Lid (for example, lid 304) and package substrate (for example, sensor or microphone package substrate 302), it is such as above-mentioned about figure Described in 3-9.

In an aspect, as above with respect to described in Fig. 1 and 2, for example, the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 102) structure can be organized to operate in the voltage lower than 1.5 volts.In another aspect, the MEMS Acoustic sensor (for example, MEMS acoustic sensor or microphone 102) can organize structure in always on mode (always-on Mode operation in).For example, the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 102) may include In one device, the device be, for example, main system 1000 (for example, function formula phone, smart phone, smartwatch, tablet computer, Electronic reader, upper net type pen electricity, autopilot, game pad or device screw on formula computing device), it includes System processor (for example, device 1010) and the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 102), Wherein, which is position outside the sensor package.For example, system processor (example Such as, device 1010) it may include integrated circuit (IC), to control the function of mobile phone (for example, main system 1000).

Demonstration methods 1600 can further include 1604 by signal from the MEMS acoustic sensor (for example, the MEMS sound senses Device or microphone 102) it is sent to and is packaged in the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 102) DSP (for example, DSP 106/212) in dorsal pore hole (for example, dorsal pore hole 306).1606, demonstration methods 1600 are by signal from packet MEMS action sensor (for example, MEMS action sensor 202) in the sensor package be sent to the DSP (for example, DSP 106/212)。

In another non-limiting aspect, demonstration methods 1600 1608 may include by use the DSP (for example, DSP 106/212) control signal (for example, control signal 104/204) is generated, wherein the control signal (for example, DSP 106/212) It is suitable for promote control device, for example, the system processor (for example, device 1010) outside the sensor package, so What in addition place described.As a Non-limiting examples, interrogated by using the DSP (for example, DSP 106/212) to generate the control Number (for example, control signal 104/204) may include based on from MEMS action sensor (for example, MEMS action sensor 202) signal, from such as MEMS acoustic sensor or microphone 102 signal and/or a combination thereof one or more, Generate the control signal (for example, control signal 104/204).

For example, which is generated (for example, control signal 104/ with the DSP (for example, DSP 106/212) 204) it may include generating to wake up signal, promoted from low energy state supply of electrical energy with adapting to the device, for example, system is handled Device (for example, device 1010).Like this, 1610, demonstration methods 1600 can further include by the control signal (for example, control news Number it 104/204) is sent to the device from the DSP (for example, DSP 106/212), for example, system processor is (for example, device 1010), to promote the device that is switched on.In addition, 1612, demonstration methods 1600 also may include by use the DSP (for example, DSP 106/212), adjustment, the MEMS action sensor (for example, MEMS action sensor 202) or such as MEMS sound are adjusted Sensor or microphone 102) one or more efficiency or change operation mode.

Figure 17 is painted relevant non-to demonstration intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) Another example flow chart of restriction method 1700.For example, demonstration methods 1700 can be as 1702 included in case detecting mould Formula handles sound pressure wave with acoustic sensor (for example, MEMS acoustic sensor or microphone 1306).1704, demonstration methods 1700 can be in the case detecting component comprising application-specific integrated circuit (for example, case detecting device 1312,1314, case detecting Component etc.) at, it is received and the sound pressure from the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 1306) The relevant signal of wave (for example, analog signal 1316, digital signal 1318).

In addition, 1706, demonstration methods 1700 may include with the case detecting component (for example, case detecting device 1312, 1314, case detecting component etc.) detecting sound pressure event relevant to the sound pressure wave.As non-limiting examples, In 1706, demonstration methods 1700 may include detecting sound, voice, ultrasonic signal, keyword, voice activity or preset sound One or more of form, using as the sound pressure event, for example, as described herein.In another Non-limiting examples In, 1706, demonstration methods 1700 also may include based on the signal relevant to the sound pressure wave (for example, analog signal 1316, digital signal 1318), detect the sound pressure event relevant to the sound pressure wave.

Demonstration methods 1700 can 1708 further include generate control signal (for example, one or more demonstration control signals 1320, It interrupts signal, interrupt control signal, I²C signal etc.), to respond the detecting sound pressure event.As Non-limiting examples, show Model method 1700 may include generating the control signal (for example, one or more demonstration control signals 1320, interruption signal, interruption controls Signal processed, I²C signal etc.), to wake up (for example, from electric energy sleep mode wakeup is reduced) and the intelligence from low power mode of demonstrating The relevant coder (for example, coder 1416) of sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) Component, sensor center (for example, sensor center 1414) or system processor are (for example, processor, Main Processor Unit, application Processor (for example, application processor 1418) etc.), the output signal through multitask relevant to sound pressure wave is handled with response (for example, one or more demonstration control signals are (for example, control signal 1320, interruption signal, interruption control signal, I²C signal, with And the data comprising signal (for example, analog signal 1316, digital signal 1318), the sound pressure wave are by the MEMS sound of demonstrating Sensor or microphone 1306 and from the intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) institute's transducing 's.

1710, demonstration methods 1700 also may include based on the control signal (for example, one or more demonstration control signals 1320, it interrupts signal, interrupt control signal, I²C signal etc.) and the signal relevant to the sound pressure wave (for example, simulation news Number 1316, digital signal 1318), the output signal (example through multitask is generated with multiplexer (for example, multiplexer 1326) Such as, via signal/interrupt output 1322,1324).For example, as described herein, multiplexer 1326 can organize structure with group One or more demonstration control signals 1320 are closed and/or transmitted (for example, interrupting signal, interrupting control signal, I²C signal) He Yusheng The relevant signal in sound press Reeb (for example, analog signal 1316, digital signal 1318), the sound pressure wave are by MEMS sound of demonstrating Ring 1306 transducings of sensor or microphone, using as in package (for example, including intelligence sensor 1302,1304,1402 Package) single output (for example, solder pads, pin, contact etc., related to signal/interrupt output 1322,1324) on Output signal through multitask, for example, described herein such as about Fig. 3-9.As another Non-limiting examples, show Model method 1700 also may include that multi-tasking interrupts and signal 1710, the interruption include the control signal (for example, one or more Demonstration control signal 1320 interrupts signal, interrupts control signal, I²C signal etc.), and the datagram contains and the sound pressure wave The relevant signal (for example, analog signal 1316, digital signal 1318).

Demonstration methods 1700 can 1712 further include via package (for example, comprising intelligence sensor 1302,1304, 1402 equal packages) output (for example, via signal/interrupt output 1322,1324) transmit output news through multitask Number, which includes lid, package substrate, the MEMS acoustic sensor (for example, MEMS acoustic sensor or microphone 1306), the multiplexer (for example, multiplexer 1326) and the case detecting component (for example, case detecting device 1312, 1314, case detecting component etc.), for example, as Fig. 3-9 is described herein.

In addition, demonstration methods 1700 can further include from the intelligence sensor (for example, demonstration intelligence sensor 1714 1302, between several modes 1304,1402 etc.), set the intelligence sensor (for example, demonstration intelligence sensor 1302, 1304, one or more modes 1402 etc.) are (for example, via model selection component, mode selection interface 1328, model selection group Part 1404 etc., several modes include exemplary events sense mode, the low electric energy audio mode of demonstration, exemplary criteria efficiency mode, Demonstration Supersonic wave mode and/or demonstration sleep pattern, for example, as described herein.As Non-limiting examples, demonstration Method 1700 1714 may include be based partially on the case detecting component (for example, case detecting device 1312,1314, event detects Survey component etc.) relevant interface is (for example, in frequency related to mode selection interface 1328, relevant with model selection component 1404 In rate input 1334, model selection input 1332) on signal and with the intelligence sensor (for example, demonstration intelligence sensor 1302, the 1304,1402 etc.) shape of relevant frenquency signal (for example, internal oscillator 1406, foreign frequency signal 1410 etc.) State sets a mode for the intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.).As another A Non-limiting examples, frequency relevant to intelligence sensor (for example, the demonstration intelligence sensor 1302,1304,1402 etc.) are interrogated Number (for example, internal oscillator 1406, foreign frequency signal 1410 etc.) may include basic frequency signal (for example, foreign frequency signal 1410 etc.) and the signal of oscillator (for example, internal oscillator 1406 etc.) that is packaged in the package one or more.

Therefore, in another non-limiting examples, demonstration methods 1700 can further include according to decision in logic 1714 The basic frequency of the logic low numerical value of low numerical value (for example, 1504, Fck=0, and be not equal to logically high numerical value in 1506, Vck) Signal (for example, foreign frequency signal 1410 etc.) selection demonstration sleep pattern；According to decision in logically high numerical value (for example, In 1506, Vck be equal to logically high numerical value) the basic frequency signal (for example, foreign frequency signal 1410 etc.) selection exemplary events detect Survey mode, and start the internal frequency as caused by the oscillator (for example, internal oscillator 1406 etc.)；It is detected in exemplary events The scheme control multiplexer (for example, multiplexer 1326) is in the output (for example, the output through multitask in single output Signal, for example, solder pads, pin, contact etc., related to signal/interrupt output 1322,1324 of package, for example, including intelligence Can sensor 1302,1304,1402 etc. package) on issue the control signal (for example, one or more demonstration control signals 1320, it interrupts signal, interrupt control signal, I²C signal etc.)；According to decision comprising low frequency signal (for example, Fck= The low electric energy audio mode of basic frequency signal selection demonstration 768kHz), and stop by the oscillator (for example, internal oscillator Device 1406 etc.) caused by internal frequency；The multiplexer is controlled (for example, multiplexer in the low electric energy audio mode of the demonstration 1326) the output (for example, the output signal through multitask in single output, for example, solder pads, pin, contact etc., with Signal/interrupt output 1322,1324 of package is related, for example, the packaging comprising intelligence sensor 1302,1304,1402 etc. Part) on issue relevant to sound pressure wave signal (for example, analog signal 1316, digital signal 1318)；And/or based on certainly Surely the basic frequency signal (for example, foreign frequency signal 1410 etc.) comprising high-frequency signal (for example, Fck=2.4MHz) selects Exemplary criteria efficiency mode.

Figure 18 is painted show relevant to demonstration intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) Another non-limiting flow chart of model method 1800.For example, such as 1802, demonstration methods 1800 may include in case detecting mode Ultrasonic pressure wave is handled with MEMS sensor (for example, MEMS acoustic sensor or microphone 1306).1804, demonstration methods 1800 can further include in the case detecting component comprising application-specific integrated circuit (for example, case detecting device 1312,1314, thing Part detection element etc.) at from the MEMS sensor (for example, MEMS acoustic sensor or microphone 1306) receive with the ultrasonic The relevant signal of pressure wave (for example, analog signal 1316 or digital signal 1318)

In addition, 1806, demonstration methods 1800 may include with the case detecting component (for example, case detecting device 1312, 1314, case detecting component etc.) detecting ultrasonic pressure events relevant to the ultrasonic pressure wave.As Non-limiting examples, 1806, demonstration methods 1800 may include one or more for detecting ultrasonic signal or predetermined Supersonic wave morphology, to surpass as this Sound wave pressure events, for example, as described herein.In another Non-limiting examples, 1806, demonstration methods 1800 It may include being detected based on the signal (for example, analog signal 1316 or digital signal 1318) relevant to the ultrasonic pressure wave The ultrasonic pressure events relevant to the ultrasonic pressure wave.

Demonstration methods 1800 1808 can further include generate control signal (for example, one or more demonstration control signals 1320, It interrupts signal, interrupt control signal, I²C signal etc.), to respond the detecting ultrasonic pressure events.As Non-limiting examples, Demonstration methods 1800 also can produce the control signal (for example, one or more demonstration control signals 1320, interruption signal, interruption controls Signal processed, I²C signal etc.), to wake up (for example, from electric energy sleep mode wakeup is reduced) and the intelligence from low power mode of demonstrating The relevant coder of energy sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) is (for example, coder 1416) component, sensor center (for example, sensor center 1414) or system processor are (for example, processor, main processing Device, application processor (for example, application processor 1418) etc.), with respond processing through multitask output signal (for example, one or Multiple demonstration control signals are (for example, control signal 1320, interruption signal, interruption control signal, I²C signal and comprising with it is super The data of the relevant signal of sound wave pressure wave (for example, analog signal 1316 or digital signal 1318), the ultrasonic pressure wave are By demonstration MEMS acoustic sensor or microphone 1306) from the intelligence sensor (for example, demonstration intelligence sensor 1302,1304, 1402 etc.) institute transducing.

1810, demonstration methods 1800 also may include being interrogated with multiplexer (for example, multiplexer 1326) according to the control Number (for example, one or more demonstration control signals 1320, interrupt signal, interrupt control signal, I²C signal etc.) and with the ultrasonic The relevant signal (for example, analog signal 1316 or digital signal 1318) of pressure wave generates the output signal (example through multitask Such as, via signal/interrupt output 1322,1324), the multiplexer be included in package (for example, including intelligence sensor 1302,1304,1402 etc. package) in, the package include lid, package substrate, the MEMS sensor (for example, MEMS acoustic sensor or microphone 1306), the multiplexer (for example, multiplexer 1326) and the case detecting component (for example, case detecting device 1312,1314, case detecting component etc.), for example, as described in Fig. 3-9.For example, It as described herein, include in package (for example, package comprising intelligence sensor 1302,1304,1402 etc.) Multiplexer 1326 can organize structure to combine and/or transmit one or more demonstration control signals 1320 (for example, interrupting signal, interruption Control signal, I²C signal) and comprising signal relevant to ultrasonic pressure wave (for example, analog signal 1316 or digital signal 1318) data, the ultrasonic pressure wave are by 1306 transducings of MEMS acoustic sensor or microphone of demonstrating, using as packet Piece installing (for example, package comprising intelligence sensor 1302,1304,1402 etc.) single output (for example, solder pads, pin, It is contact etc., related to signal/interrupt output 1322,1324) on the output signal through multitask, for example, such as about figure Described in 3-9.As another Non-limiting examples, demonstration methods 1800 1810 also may include multi-tasking interrupt and data, The interruption includes the control signal (for example, one or more demonstration control signals 1320, interruption signal, interruption control signal, I²C Signal etc.), and the datagram contains the signal relevant to the ultrasonic pressure wave (for example, analog signal 1316 or digital signal 1318)。

1812, demonstration methods 1800 can further include via package (for example, comprising intelligence sensor 1302,1304, 1402 equal packages) output (for example, via signal/interrupt output 1322,1324) transmit the control signal (for example, one Or multiple demonstration control signals 1320, interruption signal, interruption control signal, I²C signal etc.) and it is related to the ultrasonic pressure wave The signal (for example, analog signal 1316 or digital signal 1318), the package include lid, package substrate, the MEMS Sensor (for example, MEMS acoustic sensor or microphone 1306), the multiplexer (for example, multiplexer 1326) and should Case detecting component (for example, case detecting device 1312,1314, case detecting component etc.), for example, as about Fig. 3-9 institute Description.

In addition, demonstration methods 1800 can further include from the intelligence sensor (for example, demonstration intelligence sensor 1302,1304, 1402 etc.) intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) is set between several modes One or more modes (for example, by model selection component, mode selection interface 1328, model selection component 1404 etc.), the number A mode include exemplary events sense mode, the low power mode of demonstration, exemplary criteria efficiency mode, demonstration Supersonic wave mode and/ Or demonstration sleep pattern, for example, as described herein.

As Non-limiting examples, demonstration methods 1800 can further include that monitoring (is passed with the intelligence sensor for example, demonstration is intelligent Sensor 1302,1304,1402 etc.) relevant frenquency signal (for example, internal oscillator 1406, foreign frequency signal 1410 etc.), It includes monitoring basic frequency signal (for example, foreign frequency signal 1410 etc.) or the package is packaged in (for example, comprising intelligent biography The package of sensor 1302,1304,1402 etc.) in oscillator (for example, internal oscillator 1406 etc.) signal it is one or more It is a, the package include lid, package substrate, the MEMS sensor (for example, MEMS acoustic sensor or microphone 1306), Multiplexer (for example, multiplexer 1326) and the case detecting component are (for example, case detecting device 1312,1314, event Detection element etc.), for example, as described in Fig. 3-9.Therefore, demonstration methods 1800 can further include part according to The relevant interface of the case detecting component (for example, case detecting device 1312,1314, case detecting component etc.) (for example, with mould Formula selects 1328 correlation of interface, frequency relevant to model selection component 1404 etc. input 1334, model selection to input on 1332) Signal or frenquency signal (example relevant to the intelligence sensor (for example, demonstration intelligence sensor 1302,1304,1402 etc.) Such as, internal oscillator 1406, foreign frequency signal 1410 etc.) one or more of state set the intelligence sensor (for example, showing Model intelligence sensor 1302,1304,1402 etc.) a mode.

Therefore, in another non-limiting examples, demonstration methods 1800 can further include it is following one or more: according to determine exist Basic frequency signal (the example of logic low numerical value (for example, 1504, Fck=0, and being not equal to logically high numerical value in 1506, Vck) Such as, foreign frequency signal 1410 etc.) selection demonstration sleep pattern；According to certainly in logically high numerical value, (for example, 1506, Vck is equal to Logically high numerical value) the basic frequency signal (for example, foreign frequency signal 1410 etc.), select exemplary events sense mode, and Start the internal frequency as caused by the oscillator (for example, internal oscillator 1406 etc.)；In exemplary events sense mode, control The multiplexer (for example, multiplexer 1326) the output (for example, the output signal through multitask in single output, For example, solder pads, pin, contact etc., related to signal/interrupt output 1322,1324 of package, for example, including intelligent biography The package of sensor 1302,1304,1402 etc.) on issue the control signal (for example, one or more demonstration control signals 1320, It interrupts signal, interrupt control signal, I²C signal etc.)；According to decision being somebody's turn to do comprising low frequency signal (for example, Fck=768kHz) The low power mode of basic frequency signal selection demonstration, and stop produced by the oscillator (for example, internal oscillator 1406 etc.) Internal frequency；In the low power mode of the demonstration, control the multiplexer (for example, multiplexer 1326) the output (for example, The output signal through multitask in single output, for example, solder pads, pin, contact etc., signal/interruption with package Output 1322,1324 is related, for example, the package comprising intelligence sensor 1302,1304,1402 etc.) on, it issues and the sound The relevant signal (for example, analog signal 1316 or digital signal 1318) of pressure wave；And/or include high-frequency according to decision The basic frequency signal (for example, foreign frequency signal 1410 etc.) of signal (for example, Fck=2.4MHz) selects exemplary criteria effect It can mode.

However, as described demonstration methods 1600,1700 and/or 1800 various exemplary implementations can extraly or hand over Alternately comprising it is related with the feature or function of sensor, intelligence sensor, microphone, sensor or microphone package etc. its Its fabrication steps, as described in detail by Fig. 1-15.

The above-mentioned described example comprising the embodiment of the present invention.It is, of course, not possible to describe each and conceivable be The combination of description group structure of the invention, component and/or method, however, it should be noted that may have the another of a kind of embodiment of grade Outer combination and arrangement.Therefore, requested invention, which is intended to, covers all this variations fallen in the scope of the claims, repairs Just and variant.Although specific embodiment and example are for illustrative description in the present invention, this field is familiar with technology Person, it should be recognized that the various amendments fallen in the range of this embodiment and example are also possible.

As used in this application, " component ", " module ", " device " and " system " these terms are intended to finger and meter The related entity of calculation machine, either hardware, the combination of hardware and software, execution software.As an example, component or module It can be but be not limited to the program run on a processor, processor or part of it, hard disk, (optics and/or magnetic storage Medium) device of multi-storage, object, thread, program and/or computer.By illustration, run on the server application and The server can be component or module.One or more components or module scans can be in programs and/or thread, and component or module It can locally on a computer or processor or be distributed between two or multiple computers or processor.

As used herein, " inference " (infer) or " inferential " (inference) is generally referred to via event, news Number and/or data, from one group the reasons why the program of the inference system and/or the state of environment.It is inferential to can be used to identify Text or movement in specific, or distribution a possibility that can produce state, for example.This is inferential can be it is random, also It is, based on the considerations of the calculating of the probability distribution of the states of interest of the data of state.It is inferential also to can refer to for from one group of thing The technology of part and/or data combination higher levels event.It is this inferential to lead to from one group event and/or storage event number According to, construction of new events or movement, no matter whether the events such as this are closely related, no matter and the event and data be from one or Multiple events and data source.

In addition, the words such as " example " or " demonstration " are to use example as using finger here, example or illustration.It is described herein Any aspect or design as " demonstration " is without having to being read as preferably or better than other aspects or design.It is that use " is shown instead This word of model " is merely intended to that concept is presented in entity mode.So application used in, "or" be intended to finger include "or", And nonexclusive "or".It is, being perfectly clear unless specifically stated otherwise or from context, otherwise, " X uses A or B " is intended to finger Automatically any one of arrangement is included.It is, if X uses A；X uses B；Or X uses A and B, then " X uses A or B " meets Any one previously described example.In addition, " one " and " one " article used in this application and claim should be read as " one Or multiple ", it can understand that it refers to single form unless specifically stated otherwise or from context.

Although these features can be with other implementations in addition, aspect can be disclosed by the only one of several embodiments One or more other features combination of example, as desired, is also advantageous that in any specific or special requisition.Furthermore "comprising", Similar text used in " comprising ", " having ", " containing ", its variant and detailed description or claim, is intended to It is used as open vicarious text as similar with "comprising", without excluding any additional or other components.

Claims

1. a kind of sensor, includes:

MEMS (MEMS) acoustic sensor organizes structure to handle sound pressure wave in case detecting mode；

Case detecting component includes application-specific integrated circuit (ASIC) to organize structure to detect sound relevant to the sound pressure wave Sound pressure events, and control signal is generated accordingly, it is received and the sound pressure with response from the MEMS acoustic sensor The relevant signal of wave；

Multiplexer, organize structure to generate the output signal through multitask, with response receive the control signal and with the sound pressure The relevant signal of wave；

Model selection component organizes structure so that from a mode is set between several modes of the sensor, which includes should At least one of case detecting mode, low electric energy audio mode, standard efficiency mode, Supersonic wave mode or sleep pattern；And

Package includes lid and package substrate, wherein the package, which has, to be adapted to receive the port part of the sound pressure wave The output of the output signal through multitask is transmitted with adapting to, and wherein, the pack package MEMS sound Sensor, the multiplexer and the case detecting component.

2. sensor as described in claim 1, wherein the output signal through multitask includes interruption and data, the interruption Comprising the control signal, and the data include the signal relevant to the sound pressure wave.

3. sensor as described in claim 1, wherein the case detecting component organizes structure also to generate the control signal, with from Low electric energy audio mode wakes up coder component relevant to the sensor, sensor center or system processor, with sound This from sensor output signal through multitask should be handled.

4. sensor as described in claim 1, wherein the case detecting component organizes structure also to detect sound, voice, ultrasonic At least one of signal, keyword, voice activity or preset sound form, using as the sound pressure event.

5. sensor as described in claim 1, wherein the case detecting component also organizes structure based on related to the sound pressure wave And include the signal of analog signal, detect the sound pressure event relevant to the sound pressure wave.

6. sensor as described in claim 1, wherein the case detecting component also organizes structure based on related to the sound pressure wave And include the signal of digital signal, detect the sound pressure event relevant to the sound pressure wave.

7. sensor as described in claim 1, wherein the model selection component organizes structure also to be based partially on and the case detecting At least one of the state of signal or frenquency signal relevant to the sensor on the relevant interface of component, sets the sensor A mode.

8. sensor as claimed in claim 7, wherein the frenquency signal relevant to the sensor include basic frequency signal or It is packaged at least one of the signal of the oscillator in the package, and wherein, which organizes structure also to be based on It determines to select the sleep pattern, based on the basic frequency news determined in logically high numerical value in the basic frequency signal of logic low numerical value It number selects the case detecting mode and starts the internal frequency generated by the oscillator, in the case detecting scheme control this more Business device issues the control signal in the output, selects the low electric energy comprising the basic frequency signal of low frequency signal based on decision Audio mode simultaneously stops that the internal frequency generated by the oscillator, in the low electric energy audio mode to control the multiplexer defeated at this It is upper out to issue the signal relevant to the sound pressure wave and based on the basic frequency signal choosing determined comprising high-frequency signal Select the standard efficiency mode.

9. a kind of sensor, includes:

MEMS (MEMS) sensor organizes structure in case detecting mode treatment ultrasonic pressure wave；

Case detecting component includes application-specific integrated circuit (ASIC) that group structure is relevant to the ultrasonic pressure wave to detect Ultrasonic pressure events, and control signal is generated accordingly, it is received and the Supersonic wave pressure with response from the MEMS sensor The relevant signal in Reeb；

Model selection component organizes structure so that from a mode is set between several modes of the sensor, which includes should At least one of case detecting mode, low electric energy audio mode, standard efficiency mode, Supersonic wave mode or sleep pattern；

Digital signal processor (DSP), organize structure with handle from the MEMS sensor with the ultrasonic pressure wave phase The signal closed in one of several modes set by the model selection component to operate；And

Package, include lid and package substrate, wherein the package have output, adapt to transmit the control signal and The signal relevant to the ultrasonic pressure wave, and wherein, the pack package MEMS sensor and the event Detection element.

10. sensor as claimed in claim 9, wherein the case detecting component organizes structure also to generate the control signal, with from Low electric energy audio mode wakes up coder component relevant to the sensor, sensor center or system processor, with sound The output signal through multitask from the sensor should be handled.

11. sensor as claimed in claim 9, wherein the case detecting component is also organized structure and is based on and the ultrasonic pressure wave The signal that is related and including analog signal, detects the ultrasonic pressure events relevant to the ultrasonic pressure wave.

12. sensor as claimed in claim 9, wherein the case detecting component is also organized structure and is based on and the ultrasonic pressure wave The signal that is related and including digital signal, detects the ultrasonic pressure events relevant to the ultrasonic pressure wave.

13. sensor as claimed in claim 10, further includes:

Multiplexer, organize structure to generate the output signal through multitask, with response receive the control signal and with the ultrasonic The relevant signal of pressure wave.

14. sensor as claimed in claim 13, wherein the output signal through multitask includes to interrupt and data, in this Disconnected includes the control signal, and the datagram contains the signal relevant to the ultrasonic pressure wave.

15. sensor as claimed in claim 13, wherein frenquency signal relevant to the sensor include basic frequency signal or It is packaged at least one of the signal of the oscillator in the package, and wherein, which organizes structure also to be based on It determines to select the sleep pattern, based on the basic frequency news determined in logically high numerical value in the basic frequency signal of logic low numerical value It number selects the case detecting mode and starts the internal frequency generated by the oscillator, in the case detecting scheme control this more Business device issues the control signal in the output, selects the low electric energy comprising the basic frequency signal of low frequency signal based on decision Audio mode simultaneously stops the internal frequency generated by the oscillator, controls the multiplexer at this in the low electric energy audio mode The signal relevant to the ultrasonic pressure wave is issued in output and based on the basic frequency news determined comprising high-frequency signal Number select the standard efficiency mode.

16. a kind of method relevant to sensor, includes:

With MEMS (MEMS) acoustic sensor in case detecting mode treatment sound pressure wave；

From a mode for setting the sensor between several modes of the sensor, which includes the case detecting mould At least one of formula, low electric energy audio mode, standard efficiency mode, Supersonic wave mode or sleep pattern；

Signal relevant to the sound pressure wave, the event are received from the MEMS acoustic sensor in case detecting component Detection element includes application-specific integrated circuit (ASIC)；

Sound pressure event relevant to the sound pressure wave is detected with the case detecting component；

Control signal is generated, to respond the detecting sound pressure event；

The output news through multitask are generated based on the control signal and the signal relevant to the sound pressure wave with multiplexer Number；And

The output signal through multitask is transmitted via the output of package, which includes lid, package substrate, this is micro- Mechatronic Systems acoustic sensor, the multiplexer and the case detecting component.

17. the method described in claim 16, wherein the generation output signal through multitask is interrupted comprising multi-tasking And data, which includes the control signal, and the signal includes the signal relevant to the sound pressure wave.

18. the method described in claim 16, wherein the generation control signal includes to generate the control signal, with from low Electric energy audio mode wakes up coder component relevant to the sensor, sensor center or system processor, with response Handle the output signal through multitask from the sensor.

19. the method described in claim 16, wherein the detecting sound pressure event includes detecting sound, voice, Supersonic At least one of wave signal, keyword, voice activity or preset sound form, using as the sound pressure event.

20. the method described in claim 16, wherein detecting sound pressure event package relevant to the sound pressure wave Containing based on the signal related and comprising analog signal to the sound pressure wave, the sound relevant to the sound pressure wave is detected Pressure events.

21. the method described in claim 16, wherein detecting sound pressure event package relevant to the sound pressure wave Containing based on the signal related and comprising digital signal to the sound pressure wave, the sound relevant to the sound pressure wave is detected Pressure events.

22. the method described in claim 16, wherein the setting one mode includes to be based partially on and the case detecting group At least one of the state of signal or the relevant frenquency signal of the sensor on the relevant interface of part sets being somebody's turn to do for the sensor One mode.

23. method as claimed in claim 22, wherein the frenquency signal relevant to the sensor include basic frequency signal and It is packaged at least one of the signal of the oscillator in the package, further includes:

The basic frequency signal based on decision in logic low numerical value selects the sleep pattern；

It selects the case detecting mode and starts to be generated by the oscillator in the basic frequency signal of logically high numerical value based on decision Internal frequency；

In the case detecting scheme control, the multiplexer issues the control signal in the output；

The low electric energy audio mode is selected comprising the basic frequency signal of low frequency signal based on decision and is stopped by the oscillator The internal frequency of generation；

The multiplexer is controlled in the low electric energy audio mode, and the signal relevant to the sound pressure wave is issued in the output； And

The standard efficiency mode is selected comprising the basic frequency signal of high-frequency signal based on decision.

24. a kind of method relevant to sensor, includes:

With MEMS (MEMS) sensor in case detecting mode treatment ultrasonic pressure wave；

From a mode for selecting the sensor between several modes of the sensor by model selection component, several modes At least one comprising the case detecting mode, low electric energy audio mode, standard efficiency mode, Supersonic wave mode or sleep pattern Person；

Signal relevant to the ultrasonic pressure wave is received from the MEMS sensor in case detecting component, which detects Surveying component includes application-specific integrated circuit (ASIC)；

Ultrasonic pressure events relevant to the ultrasonic pressure wave are detected with the case detecting component；

Control signal is generated, to respond the detecting ultrasonic pressure events；

It is handled by digital signal processor (DSP) relevant to the ultrasonic pressure wave from the MEMS sensor The signal in one of several modes set by the model selection component to operate；And

Via the output transmission of package based on the control signal and the signal relevant to the ultrasonic pressure wave through more The output signal of business, the package include lid, package substrate, the MEMS sensor and the case detecting group Part.

25. method as claimed in claim 24, wherein the generation control signal includes to generate control signal, with from low electricity Energy audio mode wakes up coder component relevant to the sensor, sensor center or system processor, to respond place Manage the output signal through multitask from the sensor.

26. method as claimed in claim 24, wherein detecting Supersonic wave pressure thing relevant to the ultrasonic pressure wave Part includes to be detected related to the ultrasonic pressure wave based on the signal related and comprising analog signal to the ultrasonic pressure wave The ultrasonic pressure events.

27. method as claimed in claim 24, wherein detecting Supersonic wave pressure thing relevant to the ultrasonic pressure wave Part includes to be detected related to the ultrasonic pressure wave based on the signal related and comprising digital signal to the ultrasonic pressure wave The ultrasonic pressure events.

28. method as claimed in claim 25, further includes:

Based on the control signal and the signal relevant to the ultrasonic pressure wave, with the multiplexer being packaged in the package Generate the output signal through multitask.

29. method as claimed in claim 28, wherein the generation output signal through multitask is interrupted comprising multi-tasking And data, which includes the control signal, and the data include the signal relevant to the ultrasonic pressure wave.

30. method as claimed in claim 28, further includes:

It monitors frenquency signal relevant to the sensor, includes monitoring basic frequency signal and the oscillator being packaged in the package Signal at least one:

Based on the basic frequency signal selection sleep pattern determined in logic low numerical value；

The multiplexer is controlled in the low electric energy audio mode, and the news relevant to the ultrasonic pressure wave are issued in the output Number；And

It include the basic frequency signal selection criteria efficiency mode of high-frequency signal based on decision.

31. a kind of system relevant to sensor, includes:

MEMS (MEMS) sensor package, organize structure with case detecting mode treatment sound pressure wave, and accordingly with The relevant output of the package uploads the output signal of warp let-off multitask, which includes data in Disconnected, the data are related to the sound pressure wave；

The model selection component of the MEMS sensor package organizes structure to set between several modes of the sensor One mode, several modes include the case detecting mode, low electric energy audio mode, standard efficiency mode, Supersonic wave mode, Or at least one of sleep pattern；

At least one of sensor center, coder digital signal processor or primary processor organize structure to receive this through more At least part of the output signal of business, and be at least partially based on the output signal through multitask and be sent to frenquency signal The MEMS sensor package；And

Demultiplexer, with the sensor center, the coder digital signal processor or the primary processor this at least one Person is related, organizes structure to receive the output signal through multitask, and by with the data of the sound pressure wave or stealpass in this Send to the sensor center, the coder digital signal processor or the primary processor this at least one.

32. system as claimed in claim 31, wherein the MEMS sensor package further includes oscillator, the vibration Swing at least part of device in case detecting mode supply electric energy to the MEMS sensor package.

33. system as claimed in claim 32, wherein the MEMS sensor package further includes model selection group Part organizes structure to select sleep pattern based on the basic frequency signal determined in logic low numerical value, based on decision in logically high numerical value The basic frequency signal selects the case detecting mode and starts the internal frequency generated by the oscillator, in the case detecting mode Multiplexer relevant to the MEMS sensor package is controlled to issue the interruption in the output, include based on decision The basic frequency signal of low frequency signal selects low electric energy audio mode and stops the internal frequency generated by the oscillator, In The low electric energy audio mode control the multiplexer issued in the output data relevant to the sound pressure wave and It include the frenquency signal selection criteria efficiency mode of high-frequency signal based on decision.

34. system as claimed in claim 31, wherein the sensor center, the coder digital signal processor are somebody's turn to do Primary processor this at least one be group structure to wake up from reducing power mode, which is received with response In the interruption and the data relevant to the sound pressure wave at least one.