CN105916084A - Intelligent sensor operated in normally open mode - Google Patents

Intelligent sensor operated in normally open mode Download PDF

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Publication number
CN105916084A
CN105916084A CN201610099750.8A CN201610099750A CN105916084A CN 105916084 A CN105916084 A CN 105916084A CN 201610099750 A CN201610099750 A CN 201610099750A CN 105916084 A CN105916084 A CN 105916084A
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Prior art keywords
signal
sensor
relevant
mems
package
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Granted
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CN201610099750.8A
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CN105916084B (en
Inventor
O·奥利阿埃伊
F·阿斯萨德拉格赫
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InvenSense Inc
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InvenSense Inc
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Priority claimed from US14/628,686 external-priority patent/US20150350772A1/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/03—Connection circuits to selectively connect loudspeakers or headphones to amplifiers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Toys (AREA)

Abstract

The present invention relates to an intelligent sensor operated in a normally open mode, wherein a micro-electromechanical system (MEMS) sensor and a digital signal processor (DSP) are arranged in a sensor package to form the intelligent sensor. According to the embodiments of the invention, the intelligent sensor comprises an MEMS acoustic sensor/microphone and a DSP, wherein the MEMS acoustic sensor is composed of a substrate cover and a package substrate. The package substrate is defined with a back hole for the MEMS acoustic sensor/microphone. According to the embodiments of the present invention, the intelligent sensor might comprise an MEMS action sensor accommodated in the package or a closed part. Based on the embodiments of the present invention, a triggering event or a wake-up event can be intelligently responded, and a normally open sensor is provided to continuously detect the triggering event or the wake-up event at the same time. Therefore, the single charging type power management and the battery life are improved. In addition, the invention describes various physical configurations for the intelligent sensor and the MEMS sensor or the microphone package.

Description

The intelligence sensor of always-on operation
The mutual reference of related application
Subject application is the continuous case of part of U.S. patent application case sequence number 14/293,502, application Day is on June 2nd, 2014, the intelligence sensor of entitled always-on operation, and this case is in full It is incorporated by reference herein.
Technical field
Main disclosure relevant MEMS (MEMS) sensor.
Background technology
Traditionally, running gear becomes more and more lighter and small and exquisite.Meanwhile, user is for more Complicated, it is provided that lasting connectivity, and/or more requirement rich in the application of feature is and provides light Just with the expectation contradiction of the device of compact devices, this device also provided for holding before needs charge Permitted the battery life of degree.Therefore, the expectation of the power consumption reducing these devices has produced many Device or system are placed in the various methods of various " sleep " pattern by the method for kind.Such as, these sides Method optionally stops assembly (such as, processor or its part, display, backlight, logical News assembly), optionally slow down the clock rate of associated component (such as, processor, internal memory), The combination of step maybe can be provided to reduce power consumption.
But, at that time device be these " sleep " pattern time, based on trigger event or wake events Signal (such as, button, default time at the expiration, device action) may be used to wake up up or again open Dynamic device.In the case of the wake events caused by the interaction with device, these phases Interaction can be by the sensor in device and/or interlock circuit (such as, button, switch, accelerometer) Detected.But, because these are in order to monitor the sensor of this sensor and/or circuit through energising And the interaction with device can be detected, such as, in order to enable often supervising device environment, even When device be these " sleep " pattern time, this sensor and its interlock circuit consume from battery continuously Electricity.
Additionally, generally use its purposes logic or specific general in order to monitor the circuit of this sensor Electric energy management assembly, it is bigger than power consumption needed for monitoring this sensor, and be provided with Trigger event or wake events.Such as, decide whether that Rouser can be based on receiving from including The interruption of the circuit of this sensor or control signal, and by the electric energy management group of the processor of device Part is measured.That is, can input based on from the total of the most indiscriminate sensor, and in inciting somebody to action The big microprocessor of relative power consumption and associated circuitry are delivered in stealpass.This can cause single filling The inefficiency electric energy management of electricity and the battery life of minimizing, because whole processor can be based on inaccurate True or can casual trigger event or wake events, and the most fully charged.
As a result, traditional sensors, such as, acoustic sensor and mike and/or relevant electric energy pipe Reason scheme is generally by such as utilizing continuously on mike to consume the electric power of excess.Other In traditional solution, traditional sensors and/or relevant electric energy management scheme possibility will not be with existing Product design compatible.
It is therefore desirable to provide improve the intelligence sensor of these and other disappearances.Above-mentioned disappearance is only anticipated It is intended to provide the general introduction of the some of them problem of tradition execution, but is not intended to exhaustive.Other are with traditional The corresponding benefit performing relevant problem and technology and multiple aspect described herein can be below looking back Can become apparent during narration.
Summary of the invention
Following person presents the simplification of description and concludes, to provide the basic of some aspects of description Understand.This concludes the extensibility general introduction of not description.It is not intended to be wanting of identification description Point or key element or describe particularly any specific embodiment of description any category or Any category of claim.Its sole purpose is that to present some of description in simplified form general Read, as the foreword of the more detailed narration presented afterwards.
According to the aspect of main disclosure, in limiting examples, it is provided that include micro electronmechanical The sensor of system (MEMS) acoustic sensor.Therefore, exemplary sensor can include micro electronmechanical System (MEMS) acoustic sensor.Additionally, exemplary sensor comprises digital signal processor (DSP), this bank of digital signal processors constitutes generation control signal to coupling this sensing communicatively The system processor of device.It addition, exemplary sensor can comprise package, this package includes Lid and packaging structure.Such as, this package can have and is adjusted to the port that sound wave or acoustic pressure receive Part.Additionally, this package can accommodate this MEMS acoustic sensor, and this MEMS sound The dorsal pore hole ringing sensor can accommodate DSP.Other exemplary sensor can comprise MEMS action Sensor.
Additionally, describe exemplary mike packaging.Such as, exemplary mike package can wrap The DSP controlling the device outside mike package is constituted containing MEMS microphone and group.Non-limit In condition sample processed, exemplary mike package can have lid and package substrate.Such as, Mike package can have the port part that can receive acoustic pressure or sound wave.In other aspects, mike Package can accommodate MEMS microphone and the DSP in the dorsal pore hole of MEMS microphone. In further non-limiting aspect, it is provided that the exemplary method relevant to intelligence sensor.Its He can comprise MEMS action sensor by exemplary mike package.
In other exemplary embodiments, it is provided that include that organizing composition processes case detecting pattern In the exemplary intelligence sensor of MEMS acoustic sensor of sound/ultrasound pressure wave.Show Plasticity intelligence sensor can farther include case detecting assembly, and this assembly includes that group constitutes detecting Wave sound sound/ultrasound the pressure events relevant to sound/ultrasound pressure wave, and produce control news Number ASIC, with response receive with from this MEMS sensor sound/ The signal that ultrasound pressure wave is relevant.Additionally, exemplary square shaped sensor device can include multitask Device and package, this multiplexer produces the output signal through multitask through group structure, with response Receive this control signal and to the signal that sound/ultrasound pressure wave is relevant, and this package bag Include lid, package substrate, the port being adjusted to reception sound/ultrasound pressure wave and tune Whole for transmitting this output through the output signal of multitask, wherein this package accommodates this MEMS Acoustic sensor should, multiplexer and this case detecting assembly.
Further in exemplary embodiments, it is provided that exemplary system include organizing at composition Sound in director's part sense mode/ultrasound pressure wave, and include and sound/ultrasound pressure wave The transmission of the interruption in relevant data and the output relevant to this package is through the output of multitask The MEMS sensor package of signal.Exemplary system can farther include one or more sensing Device maincenter ,/decoder (coder) and/or group composition are based partially on this and interrogate through the output of multitask Number, receive this of a part through the output signal of multitask and transmission frequency signal to this MEMS Sensor package primary processor.Exemplary embodiments system further, according to mainly taking off Show that content can include relevant to this one or more sensor maincenter, coder or primary processor Demultiplexer, wherein this demultiplexer group constitute receive this through multitask output signal and Transmit one or more data relevant to sound/ultrasound pressure wave or interrupt this biography of one or more of Sensor maincenter, coder or primary processor.
Further non-limiting specific embodiment provides and can include in case detecting pattern with MEMS Sensor processes the exemplary method of sound/ultrasound pressure wave.Exemplary method described herein can Further include at and include that the case detecting assembly of ASIC receives and from this The relevant signal of the sound of MEMS sensor/ultrasound pressure wave with；Signal is controlled to produce Sound/ultrasound pressure thing that the detecting of this case detecting assembly is relevant to sound/ultrasound pressure wave Part, with response detecting sound/ultrasound pressure events；And/or include lid, packaging via output Part substrate, this MEMS sensing and the package of this case detecting assembly, transmit this control news Number and to the signal that sound/ultrasound pressure wave is relevant.
These and other specific embodiments are in described below.
Accompanying drawing explanation
Multiple non-limiting specific embodiment further regards to accompanying drawing narration, wherein:
Fig. 1 describes the function block diagram of MEMS (MEMS) intelligence sensor, wherein MEMS acoustic sensor promotes to produce the control signal relevant to digital signal processor (DSP) Relevant；
Fig. 2 describes other function block diagrams of MEMS intelligence sensor, and wherein MEMS moves Make sensor to promote to produce the control signal relevant with DSP together with MEMS acoustic sensor；
Fig. 3 describes non-limiting sensor or mike package (such as, including MEMS sound Ring sensor or mike), wherein DSP can and with this MEMS acoustic sensor or mike Relevant ASIC is integrated；
Fig. 4 describes other sensors or mike package (such as, passes including the MEMS sound Sensor or mike), wherein MEMS acoustic sensor or mike can be through electrical couplings and machineries Being fixed on ASIC, wherein DSP can be through integrating；
Fig. 5 describes further sensor or mike package (such as, including MEMS sound Ring sensor or mike), wherein MEMS acoustic sensor or Mike are through wind electrical couplings and machine Tool is fixed on ASIC, and wherein this sensor or mike package The independent DSP of middle receiving；
Fig. 6 describes non-limiting sensor or mike package (such as, including the MEMS sound Sensor or mike and MEMS action sensor), wherein MEMS acoustic sensor or wheat Gram bellows chamber piece installing provides independent DSP；
Fig. 7 describes other sensors or mike package (such as, passes including the MEMS sound Sensor or mike and MEMS action sensor), wherein MEMS acoustic sensor or Mike Wind is through electrical couplings and is mechanically anchored on ASIC, and wherein DSP is through integrating；
Fig. 8 explains the cross sectional representation of demonstration intelligence sensor, wherein MEMS sound sensing Device or mike promote to produce the control signal relevant to DSP；
The cross sectional representation explaining further exemplary intelligence sensor of Fig. 9, wherein, MEMS action sensor promotes generation relevant with DSP together with MEMS acoustic sensor Control signal；
Figure 10 explaination represents the block diagram of the example use of intelligence sensor；
Figure 11 describes to be suitable for the exemplary behaviour of the exemplary embodiments being incorporated to main disclosure Make environment；
What Figure 12 described the non-limiting aspect according to main disclosure includes intelligence sensor Exemplary embodiments, this intelligence sensor promote produce control signal；
Figure 13 describes the further exemplary concrete reality of the intelligence sensor according to main disclosure Executing example, this intelligence sensor promotes to produce control signal；
What Figure 14 described the further aspect according to main disclosure includes showing of intelligence sensor Exemplary system, this system promotes to produce control signal；
Figure 15 describes the case detecting of the non-limiting aspect according to main disclosure, controls news Number generation and/or the exemplary scenario of model selection；
Figure 16 describes the exemplary flow chart of the non-limiting method relevant to intelligence sensor；
Figure 17 describes another exemplary flow of the non-limiting method relevant to intelligence sensor Figure；And
Figure 18 describes the further exemplary flow of the non-limiting method relevant to intelligence sensor Cheng Tu.
Detailed description of the invention
Simplified summary is provided to describe some aspects of the application for the purpose of description and not of limitation. Therefore, device, system and method advise the modification of embodiment in being intended to scope of the present application.
As it has been described above, the conventional power source management of mobile device can rely on based on from being relatively not added with The intensive microprocessor of relative power of total input of the sensor selected or its power management component and The circuit being associated, may result in the inefficient power management of single charge and reduces battery life.
Therefore, traditional sensor, such as acoustic sensor and mike and/or the merit being associated Rate Managed Solution generally consumes the power of excess, such as, by utilizing the mike of energising continuously. In other traditional solution, existing sensor and/or the power management scheme being associated May be compatible with existing product design.Such as, as further described herein, this Shen Please provide sensor, intelligence sensor, mike, sensor or microphone package and/or The exemplary realization of the power management scheme being associated, pin specific with existing needs or input/defeated Go out the product design compatibility that number, configuration etc. are associated with existing product design.
Therefore each aspect of intelligence sensor is described.Such as, retouch with the background of intelligence sensor State each embodiment of the device of the application, technology and method.The exemplary embodiment of the application Offer has self-contained (self-contained) and processes, determines and/or the leading to all the time of estimating ability The sensor of electricity.
Such as, according to an aspect, intelligence sensor is communicably coupled to number in can including encapsulation One or more MEMSs (MEMS) sensor (example of word signal processor (DSP) As, internal DSP), encapsulation includes one or more MEMS sensor and DSP.Entering one In the example of step, one or more MEMS sensor can include MEMS acoustic sensor Or mike.In another example, one or more MEMS sensor can include MEMS Accelerometer.
In various embodiments, DSP can process the letter from one or more MEMS sensor Number perform calling out of various function, such as, key word identification, external device (ED) or system processor Wake up, the control of one or more MEMS sensor etc..At further aspect, intelligent sensing The DSP of device can promote the Properties Control of one or more MEMS sensor.Such as, except producing Outside raw control signal, based on one or more signal from one or more MEMS sensor, Intelligence sensor including DSP can be by the letter from one or more MEMS sensor Number self-sustaining analysis guide or otherwise perform self-contained function (such as, calibration, property Can adjust, change operator scheme) (such as, about sound, the signal of action, carry out auto correlation DSP Other signal of sensor and/or any combination).
According to an aspect, intelligence sensor can promote to be energized all the time, the low merit of intelligence sensor Consumption operation, can promote the more complete low-power of external device (ED) or the system processor being associated. Such as, described intelligence sensor can include that clock is (such as, time 32 kilo hertzs (kHz) Clock).In further aspect, intelligence sensor as described herein can be less than 1.5 volts (V) Work under the supply voltage of (such as, 1.2 volts).According to various embodiments, as described herein DSP be compatible to the CMOS technology node of 90 nanometers or lower, and other technologies.Make For non-limiting example, internal DSP can use 90 nanometers or following CMOS technology with And the independent mould of other technologies realizes, and can encapsulate (such as, with MEMS sensor In MEMS acoustic sensor or the closure member of mike or dorsal pore hole), such as institute the most further State.
In the another aspect of the application, it is outside and can that intelligence sensor can control intelligence sensor The device of communicative couplings or system processor, such as, as by send control signal to device or System processor, controls signal and is used as device or the trigger event of system processor or wakes up up Event.As a further example, can be used by the system or device that include intelligence sensor From the control signal of intelligence sensor as trigger event or wake events, relevant to control Operation of system or device etc..Control signal can be based upon including one or more microcomputer The intelligence of electricity system sensor (such as, acoustic sensor, action sensor, other sensors) Can the trigger event that determines of sensor or wake events, can be identified by DSP.Therefore, intelligence The various embodiments of energy sensor can provide and independently wake up decision up to wake up up at association intelligent sensing The system of device or other assembly of external device (ED).Such as, DSP can include (I2C) between integrated circuit Send control signals to outside system processor is associated with intelligence sensor with interrupt function Part device and/or the application processor of device, as functional mobile phone, smart phone, intelligent watch, Flat board, E-book reader, net book, on-vehicle navigation apparatus, game pad or device, Wearable calculating device etc..
Include that acoustical signal carries out the audio sensor operated, the application accordingly, due to mike Exemplary embodiment can promote produce control signal (such as, interrupt signal, interrupt control letter Number, I2C signal).Additionally, the exemplary embodiment of the application can promote leading to all the time of mike Electrically operated application, such as sound detection, voice activity detection, key word positions, ambient sound Analyze, such as, produce control signal by using sonic transducer to promote and (such as, interrupt Signal, interruption control signal, I2C signal) to be sent to exemplary process based on sound events detection Device (such as, system processor, sensor hub, primary processor, application processor etc.).
The various illustrative embodiments being detailed further below can be without departing from the application Premise be applied to MEMS sensor design and encapsulation field.
Specific embodiment
Each aspect of the application or feature describe with reference to the accompanying drawings, and wherein same reference numerals is used To refer to same components.Illustrate many concrete details in this manual, in order to provide this Shen Thorough understanding please.It will be appreciated, however, that some aspect of the application can not have these Specific detail or realize in the case of utilizing other method, assembly, parameter etc..In other examples In, known construction and device describes in the form of a block diagram, in order to the description of various embodiments And explanation.
Fig. 1 illustrates the functional block diagram of MEMS (MEMS) intelligence sensor 100, Wherein, according to the various non-limiting aspect of the application, MEMS acoustic sensor or mike 102 can promote to produce with the digital signal processor (DSP) 106 of association to control signal 104 (such as, interrupting controlling signal, I2C signal).As mentioned, DSP 106 can process From MEMS acoustic sensor or the signal of mike 102, to perform various function, such as, Key word identification, external device (ED) or system processor wake up up, one or more MEMS sensor Control.Such as, DSP 106 can include I2C and interrupt function, controls signal 104 to send To system processor (not shown), the external device (ED) (not shown) of association intelligence sensor and/ Or such as function formula phone, smart phone, intelligent watch, tablet PC, electronic reader, Upper net type pen electricity, autopilot, game pad or device, the formula that screws on calculates device Etc. the application processor (not shown) of device.
Control the device that signal 104 can be used to control to be communicatively coupled intelligence sensor 100 Or system processor (not shown).Such as, intelligence sensor 100 can control intelligence sensor 100 outside and can the device of communicative couplings or system processor (not shown), such as, as passed through Send and control signal 104 to device or system processor, be used as device or system processor Trigger event or wake events.As a further example, can be by including the intelligence of example The system of sensor or device use the control signal 104 from intelligence sensor 100 as touching Send out event or wake events, to control operation of relevant system or device etc..Control signal 104 can be based upon including one or more MEMS sensor (such as, micro-electro-mechanical systems System acoustic sensor or mike 102, action sensor, other sensors) intelligence sensor 100 trigger event determined or wake events, can be identified by DSP 106.Therefore, intelligence The various embodiments of sensor 100 can provide and independently wake up decision up to wake up up in association intelligence biography The system of sensor 100 or other assembly of external device (ED).
Intelligence sensor 100 can farther include buffer-amplifier 108, analog-digital converter (ADC) 110, and frequency demultiplier (decimator) 112, pass from the MEMS sound to process Sensor or the signal of mike 102.Including MEMS acoustic sensor or mike 102 The non-limiting example of intelligence sensor 100, MEMS acoustic sensor or mike 102 can Being communicatively coupled outside coder or processor 114, it can use as known in the art Simulation and/or DAB signal (such as, pulse density modulated (PDM) signal, integration slice Between sound (I2S) signal, information and/or data).It should be understood, however, that outside The scope of coder or processor 114 various embodiments described here is dispensable.
In further aspect, the DSP 106 of intelligence sensor 100 can promote one or many The Properties Control 116 of individual MEMS sensor.Such as, in an aspect, except producing control Outside signal 104, based on one or more signal from one or more MEMS sensor, bag The intelligence sensor 100 including DSP 106 can be by sensing from one or more MEMS The self-sustaining analysis of the signal of device guides or otherwise performs self-contained function (such as, school Standard, adjusting performance, change operator scheme) (such as, from MEMS acoustic sensor or wheat The signal of gram wind 102, the signal of relevant action, the always sensor of auto correlation DSP 106 Other signal, from other signals of external device (ED) or system processor (not shown), and/or Any combination).
Such as, by sensor or mike package combine DSP 106 and MEMS sensing Device or mike 102 and DSP 106 are exclusively used in MEMS sensor or mike 102, DSP 106 can provide sensor or the extra control of mike 102 performance.Such as, non-limiting Aspect in, the changeable MEMS sensor of DSP 106 or mike 102 are different patterns. Such as, as it has been described above, as low-power intelligence sensor 100, embodiments herein can produce Trigger event or wake events.But, DSP 106 can also promote to configure this MEMS sensing Device or mike 102 as high-performance mike (such as, for voice application) relative to low Performance mike (such as, is used for producing trigger event or wake events).
Therefore, intelligence sensor 100 can also include internal memory or core buffer (not shown) Preserve data or information (such as, sound or the voice letter associating one or more MEMS sensor Breath, pattern) in further indefiniteness aspect, based on associating one or more MEMS sensing The a series of abundant environmental factors of device promotes to produce control signal.
As it has been described above, intelligence sensor 100 can promote the energising all the time of intelligence sensor 100 Low-power operation, its can promote association external device (ED) (not shown) or system processor (not Illustrate) more complete downward power.Such as, described intelligence sensor 100 can include Clock (such as, 32 kilo hertzs of (kHz) clocks).At further aspect, intelligence sensor 100 can work under 1.5 volts (such as, 1.2 volts) supply voltage below.As non-limit The example of property processed, by using DSP 106 and MEMS acoustic sensor or mike 102 to carry For the low-power operation being energized all the time of intelligence sensor 100, system processor or external device (ED) (not shown) can power-off more fully, the simultaneously cognitive association one of holding intelligence sensor 100 Or a series of abundant environmental factors (such as, one or more MEMS of multiple MEMS sensor Acoustic sensor or mike 102, action sensor).
In further nonrestrictive aspect, it is provided that MEMS acoustic sensor or mike 102 With DSP 106 at common sensor or mike package or closure member (such as, including lid With sensor or mike package substrate), such as definition MEMS acoustic sensor or Mike The mike package of wind 102, such as, further describe below in relation to Fig. 3-9.According to various Embodiment, DSP 106 can be compatible with the CMOS technology node of 90 nanometers or lower, and Other technologies.As non-limiting example, DSP 106 can use 90 nanometers or following The independent mould of CMOS technology and other technologies realizes, and can be with one or more MEMS sensor packaging (such as, MEMS acoustic sensor or the closure member of mike 102 Or in dorsal pore hole), as further described herein.In another aspect, DSP 106 can be integrated Close connected MEMS acoustic sensor or one or more buffer-amplifier 108 of mike 102, ADC 110, and/or frequency demultiplier 112 is to common ASIC, such as, as This is about Fig. 3-9 further description.
Fig. 2 illustrates another functional block diagram of MEMS intelligence sensor 200, wherein one or Multiple MEMS sensor include MEMS action sensor 202, pass in conjunction with the MEMS sound Sensor or mike 102, and can promote to produce control signal 204.Except above with respect to figure Function described by 1 and performance, Fig. 2 provides the MEMS intelligence sensor 200 of combination, its Can further include one or more of MEMS action sensor 202 (such as, MEMS Accelerometer), buffer-amplifier 206, ADC 208 and frequency demultiplier 210 process from MEMS The signal of action sensor 202 and DSP 212.
In nonrestrictive aspect, MEMS action sensor 202 can include that MEMS accelerates Meter.In another aspect, MEMS accelerometer can include low-G accelerometer, it is characterised in that low-G Accelerometer can be used for monitoring relatively low acceleration level in the application, such as, exist when device In the hands of user, user waves his or her arm, and is experienced by hand-held device.Low-G Accelerometer is further characterized by by the accelerometer with reference to height-G, and it can be used in the application Monitor the most high-caliber acceleration, for instance it can be possible that be useful in car crass detection application 's.It is understood, however, that the various embodiments of the application are not limited to use MEMS Action sensor 202 (such as, MEMS accelerometer, low-G MEMS accelerometer).
Combination sensor 200 may be coupled to outside coder or processor 114, and it can be adopted By known simulation and/or DAB signal (such as, PDM signal, I2S signal, information And/or data).Additionally, outside coder process 114 can use and move with MEMS Make simulation and/or digital signal, information and/or data that sensor 202 is associated.But, should It should be appreciated that outside coder or the scope of processor 114 various embodiments described here Dispensable.
Such as the description above with respect to Fig. 1, DSP212 can process from one or more MEMS The signal of sensor (such as, one or more MEMS acoustic sensor or mike 102, micro- Mechatronic Systems action sensor 202), to perform various function, such as, key word identification, outer Part device or system processor wake up up, the control of one or more MEMS sensor.Such as, DSP212 can include I2C and interrupt function, with send control signal 204 to association such as function Formula phone, smart phone, intelligent watch, tablet PC, electronic reader, upper net type phase Association pen electricity, autopilot, game pad or device, the formula that screws on calculates device etc. (do not show Deng the intelligence sensor of device and/or the system processor of application processor (not shown) Go out), external device (ED) (not shown).
Control signal 204 can be used to control one and is communicatively coupled intelligence sensor 200 Device or system processor (not shown).Such as, intelligence sensor 200 can control intelligence biography Sensor 200 is outside and can a device of communicative couplings or system processor (not shown), example As, as controlled signal 204 to device or system processor by sending, be used as device or The trigger event of system processor or wake events.As a further example, can be by including The system of the intelligence sensor of example or device use the control signal from intelligence sensor 200 204 as trigger event or wake events, to control relevant system or the operation of device.Such as, Control signal 204 can be based upon including one or more MEMS sensor (such as, MEMS acoustic sensor or mike 102, MEMS action sensor 202, other pass Sensor) the trigger event that determines of intelligence sensor 200 or wake events, DSP can be passed through 212 identify.Therefore, the various embodiments of intelligence sensor 200 can provide and independently wake up decision up System or other assembly of external device (ED) of intelligence sensor 200 is being associated to wake up up.
The trigger event of embodiments herein or the non-limiting example (example of wake events input As, including one or more MEMS acoustic sensor or mike 102, MEMS action Sensor 202, such as MEMS accelerometer, other sensors) can be to remove shifting from pocket The action of mobile phone.In this case, intelligence sensor 200 can identify the shifting being grasped Mobile phone, mobile phone are to alternative sounds of cloth of pocket etc..Intelligence sensor 200 is permissible Identify that the mobile phone that experienced is grasped, promotes, rotates and/or the different action of rotation etc., At certain angle display mobile phone to user.Although individually any one input is (such as, From adding of MEMS acoustic sensor or mike 102 or MEMS action sensor 202 One of audio frequency input of speed meter input) it is not necessarily indicative to effective wake events, intelligence sensor 200 Can identify two input be combined as effective wake events.On the contrary, use indiscriminate May need in the case of sensor to abandon much to input (such as, mobile phone is grasped, Rustle to the mobile phone of sack cloth, the mobile phone experienced is grasped, promotes, revolves Turn and/or the different action of rotation etc.), it is used as effective trigger event or wakes up thing up Part.Otherwise, in the case of using indiscriminate sensor, may result in too many wrong report, The effectiveness of the indiscriminate sensor of minimizing electric energy management, such as, because whole system processor Or external device (ED) is potentially based on inaccurate or inadvertent free event or wake events is the most complete Energising.
In other example embodiment, the DSP 212 of intelligence sensor 200 can help this one or Such as, multiple MEMS sensor (MEMS acoustic sensor or mike 102, MEMS Action sensor 202 and other sensors one or more) Properties Control 116.Such as In an aspect, including the intelligence sensor 200 of DSP 212 except based on from this Or one or more signals of multiple MEMS sensor or otherwise produce control signal Outside 204, it is also possible to carry out self-contained function (such as, correction, adjusting performance, change behaviour Operation mode), this self-contained function is by the signal from this one or more MEMS sensor (such as, from this MEMS acoustic sensor or mike 102, MEMS action sensor One or more signal of 202 and other sensors etc., from the biography associated with DSP212 Other signals of sensor, from external device (ED) or other signals of system processor (non-icon), And/or aforesaid combination in any) self-supporting analysis.
Therefore, intelligence sensor 200 also can comprise internal memory or core buffer (non-icon) with Preserve the data or information (such as, audio frequency or sound associated with this one or more MEMS sensor Message breath, action message, pattern), thereby help to produce based on one group quite a lot of and this Or multiple MEMS sensor (such as, MEMS acoustic sensor or mike 102, MEMS Action sensor 202 and other sensors one or more) control of environmental factors that associates Signal processed.
As it was previously stated, intelligence sensor 200 can help this this intelligence sensor 200 normally opened, Low-power operation, so can help associated external device (non-icon) or system processor be (not Icon) more complete power drop.Such as, aforesaid intelligence sensor 200 can comprise clock (such as, the clock of 32 kilo hertzs (kHz)).In other aspects, intelligence sensor 200 can be grasped Make in the power supply supply less than 1.5 volts (such as 1.2 volts).As unrestriced example, by Employing has MEMS acoustic sensor or mike 202 and MEMS action sensor The DSP of 202 provides intelligence sensor 200, system processor or external device (ED) (non-icon) Normally opened, low-power operation can more fully decline, simultaneously maintain intelligence sensor 200 1 Such as, group is for quite a lot of and this one or more MEMS sensor (MEMS acoustic sensor Or one of mike 102, MEMS action sensor 202 and other sensors or many Individual) warning of environmental factors that associates.
In other unrestricted aspects, MEMS acoustic sensor or mike 102 and DSP 212 are arranged on common sensor or mike package or closure member (such as includes lid and sensing Device or mike package substrate), such as, figure 3 below to 9 further described can Definition MEMS acoustic sensor or the mike package in mike 102 dorsal pore hole.According to each Kind implement profit, DSP212 can with 90 nanometers or following CMOS process nodes and other Technical compatibility.As nonrestrictive example, DSP may utilize 90 nanometers or following CMOS Processing procedure and other technologies realize on individual other crystal grain, and can be by as described herein One or more MEMS sensor are packaging (such as, in MEMS acoustic sensor or wheat Gram wind 102, MEMS action sensor 202 and the closure member of other sensors or dorsal pore hole Among).In other aspects, such as, further described with reference to Fig. 3 to 9 at this, DSP 212 can with buffer-amplifier 108, ADC 110 and/or with MEMS acoustic sensor Or mike 102 association frequency demultiplier 112 and/or and buffer-amplifier 206, ADC 208 and/or the frequency demultiplier 210 that associates with MEMS action sensor 202 be integrated into specific should Use integrated circuit.
The various unrestriced aspect disclosed according to this, Fig. 3 to 7 illustrates MEMS intelligent sensing The example set composition of device 100/200 assembly.For example, Fig. 3 describes unrestricted sensor Or mike package 300 (such as, including MEMS acoustic sensor or mike 102). In an aspect, sensor or mike package 300 can include closure member, this closure member Including sensor or mike package substrate 302 and can house and define the MEMS sound pass The lid 304 in the dorsal pore hole 306 of sensor or mike 102.Including sensor or Mike's bellows chamber This closure member of piece installing substrate 302 and lid word 304 can have and is applicable to receive sound wave or acoustic pressure Port part 308.For other group structures of MEMS acoustic sensor or mike 102, port part 308 also can position in lid 304, or for need not to receive sound wave or one of acoustic pressure or Other group structures of multiple MEMS sensor, port part 308 can be omitted.The MEMS sound passes Sensor or mike 102 can mechanical grip in sensor or mike package substrate 302 also This sensor or mike package substrate 302 can be communicatively coupled to.Such as about Fig. 1 with Described by upper, sensor or mike package 300 may also comprise ASIC 310 and DSP 312 (such as DSP106), it can be placed in closure member, this closure member Including sensor or mike package substrate 302 and lid 304.In the biography that Fig. 3 is described In sensor or mike package 300, DSP 312 can be with ASIC 310 Integrated.ASIC 310 can mechanical grip in sensor or mike package base Plate 302, and MEMS can be communicatively coupled to via sensor or mike package substrate 302 Acoustic sensor or mike 102.
With reference to Fig. 4, for sensor or mike package 400, DSP 312 is permissible Integrated with ASIC 310.This ASIC 310 can mechanical grip In sensor or mike package substrate 302 and this sensor or mike can be communicatively coupled to Package substrate 302.MEMS acoustic sensor or mike 102 can mechanical grip in specific Application integrated circuit 310 also can be communicatively coupled to this ASIC 310.Fig. 5 describes Other sensors or mike package 500 are (such as, including MEMS acoustic sensor or wheat Gram wind 102, wherein MEMS acoustic sensor or mike 102 can communicative couplings machinery patches It is attached on the top of ASIC 310, and the most independent DSP 312 is (such as, DSP 106) can be placed in this sensor or mike package 500.DSP 312 can machine Tool is pasted to sensor or mike package substrate 302 can be via sensor or Mike's bellows chamber Piece installing substrate 302 is communicatively coupled to MEMS acoustic sensor or mike 102.
Fig. 6 describe unrestricted sensor or mike package 600 (such as, including MEMS acoustic sensor or mike 102 and MEMS action sensor 202), its Middle independent DSP 602 (such as, DSP212) may be disposed at this MEMS acoustic sensor or wheat In gram bellows chamber piece installing 600.DSP 602 and MEMS action sensor 202 can mechanical grip extremely Sensor or mike package substrate 302 are also communicatively coupled to this sensor or mike packaging Part substrate 302.Such as about described by figure 2 above, sensor or mike package 600 May also comprise ASIC 604.Such as about described by figure 4 above, MEMS Acoustic sensor or mike 102 can mechanical grip to ASIC 604 and communicate It coupled to this ASIC 604.Fig. 7 describes other sensors or mike package 700 (such as, pass including MEMS acoustic sensor or mike 102 and MEMS action Sensor 202), wherein MEMS acoustic sensor or mike 102 can communicative couplings can machine Tool is pasted on the top of ASIC 604, and wherein DSP 602 can be integrated.
Fig. 8 illustrates the diagrammatic, cross-sectional figure of demonstration intelligence sensor 800, according to this exposure Each aspect, in intelligence sensor 800, MEMS acoustic sensor or mike 102 Promote to utilize the DSP 312 (such as DSP 106) being associated to produce control signal 104.Intelligence Sensor 800 can comprise MEMS acoustic sensor or mike 102 in closure member, this envelope Closing member includes that sensor or mike package substrate 302 and lid 304 are to cover and to define The dorsal pore hole 306 of MEMS acoustic sensor or mike 102.Intelligence sensor 800 more may be used Including DSP 312 (such as DSP 106), it can be capped on this and include sensor or mike Package substrate 302 and the closure member of lid 304.As it has been described above, this includes package substrate 302 and the closure member of lid 304 can have port part 308 or other are suitable to receive sound wave or acoustic pressure Component.ASIC 310 is mechanically fixed to sensor or mike package Substrate 302 is also communicated with sensor or mike package substrate 302 coupling by closing line 802 Connect.MEMS acoustic sensor or mike 102 are mechanically fixed to the integrated electricity of application-specific Road 310 communicating with couples.DSP 312 is mechanically fixed to sensor or Mike's bellows chamber Piece installing substrate 302 is also led to sensor or mike package substrate 302 by closing line 804 Letter couples.Solder 806 on sensor or mike package substrate 302 can be easy to intelligence The externally connected substrate of sensor 800, such as printed circuit board (PCB) (PCB) (not shown).
Fig. 9 illustrates the diagrammatic, cross-sectional figure of further unrestriced intelligence sensor 900, Other the unrestricted aspects disclosed according to this, in intelligence sensor 900, MEMS action passes Sensor 202, it is together with MEMS acoustic sensor or mike 102, promotes to utilize and is correlated with The DSP 602 (such as DSP 212) of connection produces control signal 204.Intelligence sensor 900 can Comprise one or more MEMS acoustic sensor or mike 102, MEMS action sensor 202 Deng equal in a closure member, this closure member include sensor or mike package substrate 302 and Lid 304 is to cover MEMS acoustic sensor or mike 102 and MEMS action sensing Device 202 also defines the dorsal pore hole 306 of MEMS acoustic sensor or mike 102.Intelligence Sensor 900 more can include DSP 602 (such as DSP 212), and it is capped on this and includes sensing In device or mike package substrate 302 and lid 304 closure member.As it has been described above, this includes The closure member of package substrate 302 and lid 304 can have port part 308 or other are suitable to receive Sound wave or the component of acoustic pressure.ASIC 604 be mechanically fixed to sensor or Mike package substrate 302 also passes through closing line 902 and sensor or mike package base Plate 302 coupled in communication.MEMS acoustic sensor or mike 102 are mechanically fixed to spy Determine application integrated circuit 604 communicating with to couple.DSP 602 is mechanically fixed to sensing Device or mike package substrate 302 are also packed with sensor or mike by closing line 904 Part substrate 302 coupled in communication.MEMS action sensor 202 is mechanically fixed to sensor Or mike package substrate 302 by closing line 906 and sensor or mike package Substrate 302 coupled in communication.Solder on sensor or mike package substrate 302 can be just In the externally connected substrate of intelligence sensor 900, such as printed circuit board (PCB) (PCB) (not shown).
Figure 10 illustrates according to this further aspect disclosed in order to represent showing of intelligence sensor The block chart of model application.Describing in detail, block chart display main system 1000, it comprises and is fixed to Sound port part 1002 and the intelligence sensor 1004 of PCB 1006 (such as include one or more MEMS acoustic sensor or mike 102, MEMS action sensor 202 or other biographies Sensor), PCB 1006 has a hole (orifice) 1008 or other allows sound wave or acoustic pressure by arriving The means of intelligence sensor 1004.Additionally, main system 1000 can include device 1010, such as System processor, the external device (ED) being associated with intelligence sensor 1004 and/or application processor, These be mechanically fixed to PCB 1006 and with intelligence sensor 1004 coupled in communication so that Receive from intelligence sensor 1004 and control signal 104/204 and/or other information and/or data. Such as, this intelligence sensor 1004 can include that intelligence sensor (such as includes one or more MEMS Acoustic sensor or mike 102, MEMS action sensor 202 or other sensors), Such as the description herein in regard to Fig. 1-9.Main system 1000 can be any need intelligence sensor be System, such as function formula phone, smart phone, intelligent watch, tablet PC, electronic reading Device, upper net type pen electricity, autopilot, game pad or device, the formula that screws on calculate Device, etc..
But, (such as include one or more according to the intelligence sensor of this each aspect disclosed MEMS acoustic sensor or mike 102, MEMS action sensor 202 and sensor) Embodiment illustrate that and be described in herein, and be not used to limit, it will be understood that originally take off Dew is not limited to this.Various realizations can be applicable to other necks of MEMS sensor design and packaging Territory, without deviating from disclosure as herein described.Illustrate, it will be understood that, institute herein Other stated needs the application of intelligence sensor can comprise remotely supervision and/or sensing device no matter Automatically or semi-automatically, and the most such long-range supervision/or sensing device whether contain use the sound Sensor or the application of mike.Such as, use DSP at sensor packaging as described herein Various technology in part can promote to improve the electric energy management of single charge and battery life, such as, Trigger event or the more intelligent and/or Division identification of wake events.Therefore, its of intelligence sensor His embodiment or application can comprise but be not limited to some application, containing be associated with measurement temperature, Pressure, humidity, light and/or the sensor of other electromagnetic radiation (such as communications and liaison signal) and/or Other are associated with measurement physics or learn or the sensor of electrical phenomena.
Therefore, in each aspect, this exposure provides a kind of sensor, and it includes having or be associated with The MEMS acoustic sensor in dorsal pore hole (such as dorsal pore hole 306) (such as MEMS acoustic sensor or Mike 102), such as about Fig. 1-10.In another example embodiment, such as above-mentioned Fig. 1 and Shown in 2, such as, this sensor can organize structure with operation less than 1.5 volts.In other aspects, This sensor can be organized structure and open in (always-on) pattern with operation permanent, as described herein.Example As, this sensor may be included with such as main system 1000 (such as function formula phone, smart phone, Intelligent watch, tablet PC, electronic reader, upper net type pen electricity, autopilot, Game pad or device, the formula that screws on calculate device) device in, this main system includes system Processor (such as device 1010), wherein system processor (such as device 1010) is in this package Outside.Such as, system processor (such as device 1010) can comprise for controlling mobile phone (such as master System 1000) the integrated circuit of function.
DSP that this sensor can farther include to be positioned in dorsal pore hole (such as dorsal pore hole 306) (as DSP 106/212), this DSP can organize structure with in response to from this MEMS acoustic sensor (as MEMS acoustic sensor or mike 102) receive signal, and to system processor (such as communication coupling Connect the device 1010 of this sensor) produce control signal (as controlled signal 104/204).Additionally, example As hereinbefore about the description of Fig. 3-9, this sensor can include package, and it can comprise lid (such as lid 304) and package substrate (such as sensor or mike package substrate 302).In a state In sample, this package can have port part (such as port part 308), and this port part may be adapted to receive sound wave or sound Pressure.In further aspect, this package can cover this MEMS acoustic sensor (such as sensor Or mike package substrate 302) and define this MEMS acoustic sensor (such as sensor or Mike package substrate 302) dorsal pore hole (such as dorsal pore hole 306).In other unrestriced aspects In, this sensor can farther include MEMS action sensor (such as MEMS action sensor 202)。
DSP (such as DSP 106/212) can include such as, ASIC as above. In further aspect, DSP (such as DSP 106/212) can organize structure with in response to process from MEMS acoustic sensor is (such as MEMS acoustic sensor or mike 102, MEMS action Sensor 202) signal, and produce wake up signal up.Therefore, DSP (such as DSP 106/212) can Including wake module, its group structure is with according to by DSP (such as DSP 106/212) institute's identification and/or deduction The trigger event gone out or wake events are to wake up this system processor (such as device 1010) up.Yu Jinyi In the unrestricted aspect of step, this DSP (such as DSP 106/212) can organize structure with in response to from one or Multiple MEMS action sensors (such as MEMS action sensor 202) receive signal or from being somebody's turn to do MEMS acoustic sensor (such as MEMS acoustic sensor or mike 102) receive signal, from Other sensors receive signal, from other devices, (processor, such as system processor is (such as device 1010)) receive signal, and produce control signal 104/204.
Additionally, the most above-mentioned description about Fig. 1-2, this DSP (such as DSP 106/212) more may be used Group structure with, maybe can include sensor control block and organize structure with, control one or more this MEMS Action sensor (such as MEMS action sensor 202), this MEMS acoustic sensor (as MEMS acoustic sensor or mike 102) etc..Illustrate, sensor control as herein described Molding block can organize structure with perform self-contained function (such as: calibration, adjusting performance, change operator scheme), It is guided by self-supporting analysis of the signal from this one or more MEMS sensor, wherein, From this one or more MEMS sensor signal such as: from one or more this MEMS Acoustic sensor or mike 102, MEMS action sensor 202, other sensors etc. Signal, from other signals of the sensor being associated with DSP (such as DSP 106/212), from outward Part device or other signals of system processor (such as device 1010) and/or aforementioned combination in any. Therefore, in further other unrestricted aspects, including this sensor control block DSP (as DSP 106/212), such as, can organize structure with perform such sensor control function, such as, for Response receives signal from one or more MEMS action sensor or passes from this MEMS sound Sensor (such as MEMS acoustic sensor or mike 102) receives signal, autobiography sensor receives news Number, receive signal etc. from other devices (processor, such as system processor (such as device 1010)) Deng.Therefore, DSP (such as DSP 106/212) or be associated in the biography of DSP (such as DSP 106/212) Sensor control module can organize structure with, among other things, calibrate, adjust one or more this MEMS Acoustic sensor (such as MEMS acoustic sensor or mike 102), this MEMS action sensing Device (such as MEMS action sensor 202), the performance of other sensors or change one or more This MEMS acoustic sensor (such as MEMS acoustic sensor or mike 102), this MEMS The operator scheme of action sensor (such as MEMS action sensor 202), other sensors etc. Deng.
But, the demonstration of sensor as herein described is implemented can additionally or alternatively comprise sensing Other features of device, intelligence sensor, mike, sensor or mike package etc. or Function, as above-mentioned about the description of Fig. 1-10.
In further exemplary embodiment, this exposure provides a kind of mike package (such as to include MEMS acoustic sensor or the sensor of mike 102 or mike package), such as, as The above-mentioned description about Fig. 1-10.In further example embodiment, as above-mentioned about Fig. 1 and The description of 2, such as, this mike package can organize structure with operation less than 1.5 volts.Yu Jin In the aspect of one step, this mike package can be organized structure and open (always-on) with operation permanent In pattern, as described herein.Such as, this mike package may be included with such as main system 1000 (such as function formula phone, smart phone, intelligent watch, tablet PC, electronic readings Device, upper net type pen electricity, autopilot, game pad or device, the formula that screws on calculate Device) device or system in, this main system includes system processor (such as device 1010), wherein System processor (such as device 1010) is in the outside of this package.Such as, system processor (as Device 1010) the integrated electricity of function for controlling mobile phone (such as main system 1000) can be comprised Road.
Therefore, mike package is (as included MEMS acoustic sensor or mike 102 Sensor or mike package) can include that there is or be associated with dorsal pore hole (such as dorsal pore hole 306) MEMS microphone (such as MEMS acoustic sensor or mike 102).This mike package The DSP (such as DSP 106/212) being positioned in dorsal pore hole (such as dorsal pore hole 306) can be farther included, should DSP can organize structure to control to pack at mike by control signal (as controlled signal 104/204) Device (such as device 1010) outside part.Illustrating, this mike package can include such as Lid (such as lid 304) and package substrate (such as sensor or mike package substrate 302), as The above-mentioned description about Fig. 3-9.In an aspect, this mike package can have port (as Port part 308), this port part may be adapted to receive sound wave or acoustic pressure.In further aspect, this Mike Bellows chamber piece installing defines dorsal pore hole (such as dorsal pore hole 306).In other aspects, this mike is packed Part can cover this MEMS microphone (such as sensor or mike package substrate 302) and be somebody's turn to do DSP (such as DSP 106/212).In other unrestriced aspects, this mike package can enter One step includes MEMS action sensor (such as MEMS action sensor 202).
DSP (such as DSP 106/212) can include such as, ASIC as above. In further aspect, DSP (such as DSP 106/212) can organize structure with in response to process from MEMS microphone is (such as MEMS acoustic sensor or mike 102, MEMS action sensing Device 202) signal, and produce wake up signal up.Therefore, DSP (such as DSP 106/212) can include Waking up assembly up, its group structure and/or is inferred by DSP (such as DSP 106/212) institute's identification with basis Trigger event or wake events wake up this device (such as device 1010) up.In further non-limit In aspect processed, this DSP (such as DSP 106/212) can organize structure to pass from one or more MEMS action Sensor (such as MEMS action sensor 202) receives signal or from this MEMS acoustic sensor (such as MEMS acoustic sensor or mike 102) receives signal, receives letter from other sensors Number, from other devices (processor, such as system processor (such as device 1010)) receive signal, and Produce and control signal 104/204.
Additionally, the most above-mentioned description about Fig. 1-2, this DSP (such as DSP 106/212) more may be used Including sensor control assembly, its group structure with control one or more this MEMS action sensor (as MEMS action sensor 202), this MEMS acoustic sensor is (such as MEMS acoustic sensor Or mike 102) etc..Sensor as herein described controls assembly can organize structure to perform self-contained merit Can (such as: calibration, adjusting performance, change operator scheme), it is by from this one or more MEMS The self-supporting analysis of the signal of sensor is guided, and wherein, senses from this one or more MEMS The signal of device is such as: from one or more this MEMS acoustic sensor or mike 102, The signal of MEMS action sensor 202, other sensors etc., from be associated with DSP (as DSP 106/212) sensor other signals, from external device (ED) or system processor (such as dress Put 1010) other signals and/or aforementioned combination in any.Therefore, in further other are unrestricted In aspect, control assembly DSP (such as DSP 106/212) including this sensor, such as, structure can be organized To perform such sensor control function, such as, in response to move from one or more MEMS Make sensor receive signal or from this MEMS acoustic sensor (such as MEMS acoustic sensor or Mike 102) receive signal, autobiography sensor receive signal, from other devices (processor, example Such as system processor (such as device 1010)) receive signal etc..Therefore, DSP (such as DSP 106/212) Or the sensor control block being associated in DSP (such as DSP 106/212) can organize structure with, except it Outside him, calibrate, adjust one or more this MEMS acoustic sensor (as the MEMS sound passes Sensor or mike 102), this MEMS action sensor (such as MEMS action sensor 202), The performance of other sensors or change one or more this MEMS acoustic sensor (such as MEMS Acoustic sensor or mike 102), this MEMS action sensor (as MEMS action sense Device 202), the operator scheme etc. of other sensors etc..Therefore, DSP it is associated in (such as DSP 106/212) sensor controls assembly can organize structure with among other things, calibrates, adjusts one or many This MEMS acoustic sensor individual (such as MEMS acoustic sensor or mike 102), this MEMS Action sensor (such as MEMS action sensor 202), the performance of other sensors or change One or more this MEMS acoustic sensor (such as MEMS acoustic sensor or mike 102), This MEMS action sensor (such as MEMS action sensor 202), other sensors etc. Operator scheme etc..
But, the demonstration of sensor as herein described is implemented can additionally or alternatively comprise sensing Other features of device, intelligence sensor, mike, sensor or mike package etc. or Function, as above-mentioned about the description of Fig. 1-10.
Such as unrestricted example, Figure 12-15 illustrates further sensor as herein described, intelligent sensing The unrestricted aspect that the demonstration of device, mike, sensor or mike package etc. is implemented.
Figure 11 illustrates the exemplary operational environment 1100 being suitable for merging with the example embodiment of this exposure. Such as, it may be appreciated that, tradition application in sensor 1102 can comprise promote produce control news The digital circuit (not shown) of numbers 1104 (as interrupted signal, interrupting controlling signal, I2C signals), At the signal that some events occurs.This control signal 1104 (as interrupt signal, interrupt controlling signal, I2C signal) can be sent to processor (such as processor 1106, sensor maincenter 1108, main Processor 1110, application processor 1112 etc.) with notifier processes device, effective information is present in In this sensor 1102 and at sensor 1102 with processor (such as processor 1106, sensor Maincenter 1108, Main Processor Unit 1110, application processor 1112 etc.) between communication requirement. As shown in figure 11, processor except include processor 1106, sensor maincenter 1108 and/or Main Processor Unit 1110, can include application processor according to the processor of unrestricted aspect 1112 (AP), such as, in action in device or platform, such as portable electric or or flat board individual meter Calculation machine (PC), limited.
The most as shown in figure 11, exemplary operational environment 1100 can include using layer architecture The system of (layered architecture), wherein sensor 1102 will control signal 1104 (as interrupted Signal, interruption control signal, I2 signal) send to sensor maincenter (such as sensor maincenter 1108), its can include one less compared to Main Processor Unit (such as Main Processor Unit 1110) and more The processor of not power consumption (power-intensive) is in system (such as AP etc.).Exemplary sensor maincenter (such as sensor maincenter 1108) can be easy to perform data certain to being received from this sensor 1102 The signal processing of degree, and Main Processor Unit of demonstrating (such as Main Processor Unit 1110) can maintain fall Low power mode (such as sleep pattern etc.) is to reduce the power consumption of system.
Then, exemplary sensor maincenter (such as sensor maincenter 1108) can determine (as according to including pass Be coupled to the data etc. of the information of this sensor 1102) will control signal 1116 (as interrupt signal, Interrupt controlling signal, I2C signal) send to demonstration Main Processor Unit (such as Main Processor Unit 1110). According at least to this control signal 1116 (as interrupted signal, interrupting controlling signal, I2C signal), This Main Processor Unit (such as Main Processor Unit 1110) can be easy to decide whether to power on (power up) (as Wake up up from reducing in electric energy sleep pattern) assembly of demonstration system, can be conducive in exemplary sensor Between pivot (such as sensor maincenter 1108) and demonstration Main Processor Unit (such as Main Processor Unit 1110) Communication.
The most as shown in figure 11, exemplary operational environment 1100 can include system, the most portable Formula phone, flat board PC etc., it includes one or more mike 1118.Apprehensible, In exemplary operational environment 1100, coder 1120 can be used for controlling one or more mike 1118, receive video signal data 1122 from mike 1118 and/or send treated video signal number According to 1124 to demonstration Main Processor Unit (such as application processor 1112).In such a system, show Model Main Processor Unit (such as application processor 1112) can decide whether to power on (as slept from reduction electric energy Sleep mode wakes up up) assembly of demonstration system, such as coder 1120 and/or indicate this coding and decoding Mike opened by device 1120.
Once mike 1118 is opened, and mike 1118 is sustainable sends video signal data 1122 To coder 1120.Apprehensible, when mike 1118 is persistently energized, such Tradition joins this may consume too much electric power.Illustrate, be further appreciated that, in order to tie up Holding MIN function, mike 1118, coder 1120 and Main Processor Unit are (as answered With processor 1112) it is persistently to be powered.Based on interruption compared to other demonstrations for sensor The operating environment of 1102, the obviously not power saving of the audio system of conventionally employed mike 1118 (power-efficient).But, because mike 1118 includes operation sound on sound signal Video sensor, the example embodiment of this exposure can beneficially produce control signal (as interrupt signal, Interrupt controlling signal, I2 signal).Furthermore, the example embodiment of this exposure can be easy to mike Permanent unlatching operates for such as sound detection, voice activity detection, key word identification (spotting), the application such as ambient sound analysis, for example, according to the detection of sound event, Signal (as interrupted signal, interrupting controlling signal, I2C signal) is controlled by using can promote to produce Acoustic sensor with transmission to exemplary storage medium (as processor 1106, sensor maincenter 1108, Main Processor Unit 1110, application processor 1112 etc.).
Figure 12 illustrates the intelligence biography including producing control signal according to this unrestricted aspect disclosed The example embodiment 1200 of sensor 1202.For example, Figure 12 illustrates use acoustic sensor The model embodiment 1200 of 1202, wherein acoustic sensor 1202 is according to the detection of sound event, Promote to produce and control signal (as interrupted signal, interrupting controlling signal, I2C signal) for transmission To exemplary storage medium (as processor 1204, sensor maincenter 1206, Main Processor Unit 1208, Demonstration Application processor etc.).In example embodiment, can be by including one or more demonstration control The output signal through multitask of signal processed (as interrupted signal, interrupting controlling signal, I2C signal) 1210 and include being associated with the sound pressure ripple changed by demonstration acoustic sensor 1202 The data of signal, transmit produced control signal.
Such as unrestricted example, about acoustic sensor 1202 and exemplary storage medium (such as processor 1204), when detecting sound event and/or determining that this sound event indicates whether effective sound event Time, acoustic sensor 1202 can produce control signal (as interrupted signal, interrupting controlling signal, I2C Signal) and transmit it to exemplary storage medium (such as processor 1204).Interrupt according to processor, show Model processor (such as processor 1204) can decide whether power on (as from reducing electric energy sleep mode wakeup) Acoustic sensor and/or whether start to communicate with acoustic sensor 1202.Coding and decoding is included in some In the example embodiment 1200 of device 1212, acoustic sensor 1202 can be easy to transmit video signal simultaneously Data 1214 to coder 1212.
In further unrestricted example, about acoustic sensor 1202 and exemplary storage medium (as Main Processor Unit 1208), when detecting sound event and/or determining that this sound event has indicated whether During effect sound event, acoustic sensor 1202 can produce control signal (as interrupted signal, interrupting control Signal processed, I2 signal) and passed hub setting exemplary sensor maincenter (such as sensor maincenter 1206). According to the interruption of transmission to exemplary sensor maincenter (such as sensor maincenter 1206), exemplary sensor Maincenter (such as sensor maincenter 1206) can be easy to decide whether to power on (as from reducing electric energy sleep mould Formula wakes up up) acoustic sensor 1202 and/or whether start to communicate with acoustic sensor 1202, example As by requiring to acoustic sensor 1202 and/or receiving video signal data from acoustic sensor 1202 1214.In some demonstrations include the embodiment 1200 of coder 1212, acoustic sensor 1202 can be easy to transmit video signal data 1214 to coder 1212 simultaneously.In implementing further In example, exemplary sensor maincenter (such as sensor maincenter 1206), when receiving, video signal data 1214 is (logical Cross and include that one or more demonstration controls signal (as interrupted signal, interrupting controlling signal, I2C news Number) the output signal 1210 through multitask and including be associated with by demonstration acoustic sensor The data of the signal of the sound pressure ripple that 1202 are changed) and/or determine that this video signal data 1214 is During the effective video signal data of no expression, exemplary sensor maincenter (such as sensor maincenter 1206) can determine Whether the assembly of (as from reduce in electric energy sleep pattern waken up) demonstration system, such as at demonstration if powering on Reason device (such as Main Processor Unit 1208), such as or whether power-off (is slept as gone back to assembly to reduce electric energy Sleep mode, case detecting pattern etc.).
Another example embodiment 1300 of the intelligent inductor 1302,1304 that Figure 13 is described, its It is easy to control signal according to title is open to produce.As used herein, institute's intention induction apparatus, Intelligent inductor and analog, and include induction apparatus, the package of intelligent inductor etc., Except as otherwise noted, MEMS induction apparatus, MEMS intelligent inductor etc. are referred to.Such as, show The MEMS sound induction apparatus of model or mike 1306 can include sound film (not shown) and, example As, as further described herein, about Fig. 3-9, through the sound that group structure is received with place's reason film The ASIC of the signal that pressure wave is associated.The ASIC of demonstration Can include through group structure to produce and by the MEMS sound induction apparatus demonstrated or mike 1306 institute The pre-amplifier 1308 of analog signal 1316 that the sound pressure ripple received is associated and/or can The sound received including MEMS sound induction apparatus or the mike 1306 to produce with demonstration The ADC 1310 of the digital signals 1318 that pressure wave is associated is (such as: numerical digit audible signals, PDM Signal, I2S signal, message and/or the data of other digital format) etc..
Non-limiting example disclosed in title can include extra circuit, such as case detecting device 1312,1314, case detecting assembly etc., it is based on the analog signal relevant to sound pressure ripple 1316, based on digital signals 1318 being associated with sound pressure ripple etc., and can be composed Judge whether that producing one or more demonstration controls signal 1320 (such as, interruption signal, interruption control Signal, I2C signal).Such as, the case detecting device 1312,1314 of demonstration, case detecting group Parts etc., can be composed as detecting based on signal (such as, the analog signal being associated with sound pressure ripple 1316, digital signals 1318) and/or in response to from MEMS sound induction apparatus or mike 1306 Signal (such as, analog signal 1316, the digital signals being associated with sound pressure ripple received 1318) produce one or more demonstration and control signal 1320 (such as, interruption signal, interruption control Signal, I2C signal).In non-limiting aspect, the case detecting device 1312,1314 of demonstration, thing Part detection element etc., can be constituted to detect any various sound pressure event, including or close Connection, but be not limited to, sound, voice, ultrasound wave signal, keyword, voice activity or work Preset sound kenel etc. for sound pressure event.
It addition, example embodiment disclosed in title can include extra circuit, it is conducive to knot The control signal 1320 closing and/or transmitting one or more demonstration (such as, interrupts signal, interrupts controlling Signal, I2C signal) and include, such as, the most described further below, about Fig. 3-9, Single output (the example of package (such as, package includes intelligence intelligent inductor 1302,1304 etc.) As, it is associated with the solder pads of signal/interrupt output 1322,1324, pin, contact etc.) on The sound pressure ripple that demonstration MEMS sound induction apparatus or mike 1306 are changed is associated The data of signal (such as, analog signal 1316, digital signals 1318).As nonrestrictive Example, Fig. 1 describes multiplexer (MUX) 1326 through group structure to combine and/or to transmit one or more The control signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal) of demonstration and Including, such as, the most described further below, about Fig. 3-9, in package (such as, packaging Part include intelligence intelligent inductor 1302,1304 etc.) single output (such as, be associated with signal/ The solder pads of interrupt output 1322,1324, pin, contact etc.) on the demonstration MEMS sound Signal (such as, the analogy news that the sound pressure ripple that induction apparatus or mike 1306 are changed is associated Numbers 1316, digital signals 1318) data.
In other example embodiment disclosed in title, intelligent inductor (such as, intelligent inductor 1304 etc.) embodiment farther include extra circuit, its be conducive to operation include except Showing of MEMS sound induction apparatus in the various patterns of standard performance pattern or mike 1306 Model intelligent inductor 1300.As nonrestrictive example, intelligent inductor (such as, intelligence sense Answer device 1304 etc.) example embodiment 1300 can beneficially operate, such as, but not limited to, about Figure 14-15 and model selection assembly, in case detecting pattern, low electric energy message pattern, standard effect Intelligent inductor (such as, intelligent inductor in energy pattern, ultrasound pattern and/or sleep pattern 1304 etc.).In example embodiment other disclosed in title, intelligent inductor is (such as, Intelligent inductor 1304 etc.) embodiment 1300 can also include, for example, but not limited to, close In Figure 14-15 and model selection assembly, it is beneficial to provide by processor 1330 (such as, process Device, processor maincenter, Main Processor Unit, application processor etc.) can be beneficial to from including MEMS The intelligent inductor (such as, intelligent inductor 1304 etc.) of sound induction apparatus or mike 1306 Example embodiment 1300 operation multiple patterns between mode selection interface extra that change Circuit.
At non-limiting aspect, various embodiments disclosed in title can provide according to such as I2C, serial circumference interface (SPI), action Industry Processor(MIPI) voice-wires SM(Mobile Industry Processor(MIPI) Sound WireSM) and/or its The mode selection interface 1328 of the organized structure of its self defined interface.Additionally, such as, as entered one herein Step describes, about model selection assembly and Figure 14-15, when Figure 13 drawing processing device 1330 (example As, processor, induction apparatus maincenter, Main Processor Unit, application processor etc.) through package (example As, package includes intelligent inductor 1302,1304 etc.) model selection input 1332 (such as, Solder pads, pin, contact etc.) it is coupled in mode selection interface 1328, processor 1330 is (such as, Processor, induction apparatus maincenter, Main Processor Unit, application processor etc.) when also may couple to such as Arteries and veins (ck) inputs another input of 1334 (such as, solder pads, pin, contacts etc.).
Such as, the demonstration system 1400 that Figure 14 describes include beneficially producing according to title open enter Control signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal) in terms of one step Intelligent inductor (such as, intelligent inductor 1402 etc.).Except about demonstration intelligent-induction Outside the exemplary components described in Figure 13 of device (such as, intelligent inductor 1304 etc.), intelligence of demonstrating Can be additionally may included in except the various patterns of standard performance pattern are beneficial to operation by induction apparatus 1402 Additional circuit including the demonstration intelligent inductor of MEMS sound induction apparatus or mike 1306. As non-limitative example, various embodiments disclosed in title can provide and include through group structure to set Fixed from including foregoing one or more case detecting pattern, low electric energy message pattern, standard The several modes of the demonstration intelligent inductor 1402 of efficiency mode, ultrasound pattern or sleep pattern Between the mode selection interface of model selection assembly 1404 of a kind of pattern.
In further non-limitative example, the example embodiment of model selection assembly 1404 can Farther include through group structure with monitor be beneficial to provide mode selection interface 1328 seasonal pulse (ck) defeated Go out the seasonal pulse monitoring component (not shown) of the state of 1334 (such as, solder pads, pin, contacts etc.). Such as, as further described herein, it is possible to provide for the demonstration of intelligent inductor 1402 of demonstrating Control interface, such as, utilize seasonal pulse (ck) to export 1334 (such as, solder pads, pin, contacts Deng) state as indicator and/or be used for including MEMS sound induction apparatus or mike 1306 The control of selected pattern of operation of demonstration intelligent inductor 1402.In the exemplary embodiments, Demonstration intelligent inductor 1402 can farther include to be beneficial to be used in the case detecting pattern of operation and wrap Include the operation of the demonstration intelligent inductor 1402 of MEMS sound induction apparatus or mike 1306 The internal oscillator (OSC) 1406 of the generation of time pulse signal.As described in fig. 14, demonstration Embodiment can farther include, when maintaining the stability of time pulse signal 1412 and being associated with control news Numbers 1320 (such as, interrupting signal, interrupt controlling signal, I2C signal etc.) and include being associated with News by the sound pressure ripple that demonstration MEMS sound induction apparatus or mike 1306 are changed During the data of number (such as, analog signal (not shown), digital signals 1318), through group structure to combine Borrowed by internal oscillator (OSC) 1406 and the time pulse signal of outside time pulse signal 1410 and/or utilization By including the MEMS sound induction apparatus or the mike that beneficially provide mode selection interface 1328 The multiplexer of the assembly management time pulse signal 1412 of the demonstration intelligent inductor 1402 of 1306 1408。
In further non-limitative example, the example embodiment of model selection assembly 1404 can Farther include through group structure with monitor be beneficial to provide mode selection interface 1328 seasonal pulse (ck) defeated Go out the seasonal pulse monitoring component (not shown) of the state of 1334 (such as, solder pads, pin, contacts etc.). Such as, as further described herein, it is possible to provide for the demonstration of intelligent inductor 1402 of demonstrating Control interface, such as, utilize seasonal pulse (ck) to export 1334 (such as, solder pads, pin, contacts Deng) state as indicator and/or be used for including MEMS sound induction apparatus or mike 1306 The control of selected pattern of operation of demonstration intelligent inductor 1402.In the exemplary embodiments, Demonstration intelligent inductor 1402 can farther include to be beneficial to be used in the case detecting pattern of operation and wrap Include the operation of the demonstration intelligent inductor 1402 of MEMS sound induction apparatus or mike 1306 The internal oscillator (OSC) 1406 of the generation of time pulse signal.As described in fig. 14, demonstration Embodiment can farther include, when maintaining the stability of time pulse signal 1412 and being associated with control news Numbers 1320 (such as, interrupting signal, interrupt controlling signal, I2C signal etc.) and include being associated with News by the sound pressure ripple that demonstration MEMS sound induction apparatus or mike 1306 are changed During the data of number (such as, analog signal (not shown), digital signals 1318), through group structure to combine Borrowed by internal oscillator (OSC) 1406 and the time pulse signal of outside time pulse signal 1410 and/or utilization By including the MEMS sound induction apparatus or the mike that beneficially provide mode selection interface 1328 The multiplexer of the assembly management time pulse signal 1412 of the demonstration intelligent inductor 1402 of 1306 1408。
Therefore, demonstration system 1400 includes intelligent inductor (such as, intelligent inductor 1402 etc.), Detecting based on sound event and/or judge that described sound event represents effective sound event, its profit Signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal), bag is controlled in producing The demonstration intelligent inductor 1402 including MEMS sound induction apparatus or mike 1306 can produce Control signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal) and transmit control Signal processed is to demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414).Based on being sent to demonstration The interruption of induction apparatus maincenter (such as, induction apparatus maincenter 1414), demonstration induction apparatus maincenter is (such as, Induction apparatus maincenter 1414) can be beneficial to judge whether that power supply is (such as, from reducing electric energy sleep pattern In wake up up) and/or start with include MEMS sound induction apparatus or mike 1306 demonstration intelligence Induction apparatus 1402 connects, such as, include by including MEMS sound sense by request and/or reception (such as, analog signal is (not to answer the signal of demonstration intelligent inductor 1402 of device or mike 1306 Illustrate), digital signals 1318) data.
In some example embodiment 1400 including codec 1416, including MEMS sound The demonstration intelligent inductor 1402 ringing induction apparatus or mike 1306 can be beneficial to transmit include simultaneously The data of signal (such as, analog signal (not shown), digital signals 1318) are to codec 1416. In a further embodiment, demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414), base In accepting to include the data of signal (such as, analog signal (not shown), digital signals 1318), example As, through including that one or more demonstration controls signal 1320 and (such as, interrupts signal, interrupt controlling Signal, I2C signal) multitask output (such as, be associated with the weldering of signal/interrupt output 1324 Backing strap, pin, contact etc.) and (such as, analog signal (not shown), numerical digit is interrogated to include signal Numbers 1318) data and/or judgement include signal (such as, analog signal (not shown), digital signals 1318) whether data represent effective audible signals, and demonstration induction apparatus maincenter is (such as, in induction apparatus Pivot 1414) can be beneficial to judge whether power supply (such as, wake up up) from reducing electrosleep pattern, or Whether power-off (such as, return assembly enter reduce electric energy sleep pattern, case detecting pattern etc.) In the assembly of demonstration system 1400, such as, such as exemplary storage medium (such as, application processor 1418).
Figure 15 describes to control signal 1320 (in such as, for case detecting, one or more demonstration Disconnected signal, interrupt controlling signal, I2C signal) generation and/or according to limit non-disclosed in title The exemplary architecture 1500 of the model selection in terms of property processed.As it has been described above, model selection assembly 1404 Example embodiment may further include through be configured as monitor seasonal pulse (ck) input 1334 state Seasonal pulse monitoring component (not shown).Therefore, in step 1502, monitor that seasonal pulse (ck) inputs 1334 The demonstration seasonal pulse monitoring component (not shown) of state may determine that and input on 1334 at seasonal pulse (ck) One or more frequency (Fck) of any signal and/or voltage (Vck).Such as, in exemplary architecture In 1500, if it is determined that this seasonal pulse (ck) inputs 1334 and maintained low value (such as, in step continuously The Fck=0 of rapid 1504 and 1506 Vck be not equal to logic-high value), including MEMS sound The demonstration intelligent inductor 1402 ringing induction apparatus or mike 1306 can be placed into sleep pattern (such as, by model selection assembly 1404 etc.), its seasonal pulse monitors and can continue 1502.
If it is determined that, in step 1506, it is to maintain constantly to patrol that this seasonal pulse (ck) inputs 1334 Collect high level (such as, be equal to logic-high value in the Vck of step 1506), should including MEMS phonoreception The demonstration intelligent inductor 1402 of device or mike 1306 can be placed into case detecting pattern (example As, by model selection assembly 1404 etc.).In exemplary events sense mode, ppu (such as, application processor 1418 and/or induction apparatus maincenter 1414) and codec 1414 can To be placed into demonstration sleep pattern, keep seasonal pulse (ck) to input 1334 (such as, Vck) simultaneously and patrolling Collect high level.It should be noted that in the exemplary embodiments, at the outside seasonal pulse of shortcoming (such as, outward Portion's time pulse signal 1410) under, including MEMS sound induction apparatus or the demonstration intelligence of mike 1306 Can switch to internal oscillator (OSC) 1406 by induction apparatus 1420, in step 1508, with behaviour Make ADC 1310 and/or other such as model selection interface 1328, case detecting device 1314 etc. Assembly.
In sound event (in such as, in step 1510, through including MEMS sound induction apparatus Or the demonstration intelligent inductor 1402 of mike 1306) detecting can produce control signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal), and can be in step 1512 Transmit and control signal to demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414).As entered herein One step describes, and controls signal 1320 and (such as, interrupts signal, interrupts controlling signal, I2C news Number) can be by including that one or more demonstration controls signal 1320 and (such as, interrupts signal, interruption Control signal, I2C signal) and include signal (such as, analog signal (not shown), digital signals 1318) exporting through multitask of data (such as, is associated with the solder of signal/interrupt output 1324 Pad, pin, contact etc.) it is routed to induction apparatus maincenter (such as, induction apparatus maincenter 1414) of demonstrating. In the exemplary embodiments, including one or more demonstration control signal 1320 (such as, interrupt signal, Interrupt controlling signal, I2C signal) and include signal (such as, analog signal (not shown), numerical digit Signal 1318) data through multitask output (such as, be associated with signal/interrupt output 1324 Solder pads, pin, contact etc.) assembly (such as, model selection assembly can be selected by pattern model 1404) controlled.Described model selection assembly is through organizing structure to control one or more multiplexer (MUX) 1326, exemplary internal agitator (OSC) 1406 and/or demonstration multiplexer 1408, It is beneficial to perform exemplary architecture 1500 and controls signal for case detecting, one or more demonstration 1320 (such as, interrupt signal, interrupt control signal, I2C signals) generation and/or according to topic State the model selection of disclosed non-limiting aspect.
If not having event to be detected in step 1510, including MEMS sound induction apparatus or wheat The demonstration intelligent inductor 1402 of gram wind 1306 can be maintained at exemplary events in step 1508 and detect In survey pattern (such as, by model selection assembly 1404 etc.).Such as, detect in exemplary events In pattern, demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) and demonstration codec (example As, codec 1416) it is positively retained in demonstration sleep pattern, for this demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) and demonstration codec (such as codec 1416) can maintain It is not responding to any signal in its data input (such as, PDM input 1420).But, if Step 1510 detects event, including MEMS sound induction apparatus or the demonstration of mike 1306 Intelligent inductor 1402 can beneficially produce control signal 1320 (such as, to interrupt signal, interrupts control Signal processed, I2C signal) and/or by this demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) Interrupt pin 1422, they are sent to demonstrate induction apparatus maincenter (such as, induction apparatus maincenter 1414), because including the demonstration intelligent inductor of MEMS sound induction apparatus or mike 1306 1402, by including that one or more demonstration controls signal 1320 and (such as, interrupts signal, interrupts control Signal processed, I2C signal) and include signal (such as, analog signal (not shown), digital signals 1318) Data through multitask output (such as, be associated with signal/interrupt output 1324 solder pads, Pin, contact etc.), it is connected to induction apparatus maincenter (such as, induction apparatus maincenter 1414) of demonstrating. Therefore, the control signal received in demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal), in step 1512, permissible Be used as be beneficial to instruction demonstration induction apparatus maincenter (such as, induction apparatus hinge 1414) power supply (such as, from Low electric energy sleep pattern wakes up up) signal.
Once receive at exemplary induction apparatus maincenter (such as, induction apparatus maincenter 1414) and control signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal), in step 1512, demonstration Property induction apparatus maincenter (such as, induction apparatus maincenter 1414) can be beneficial to transmit low frequency seasonal pulse (such as, Fck=768 KHz (kHz)) to comprising MEMS system 1516 sound equipment induction apparatus or Mikes The demonstration intelligent inductor 1402 of wind 1306.Input with supervision seasonal pulse (ck) upon through group structure The seasonal pulse monitoring component (not shown) of the state of 1334 inputs 1334 (such as, solders at seasonal pulse (ck) Pad, pin, contact etc.) on detect low frequency seasonal pulse (such as, Fck=768 KHz (kHz)), Pattern model selects assembly 1404 can switch and include MEMS sound induction apparatus or mike The inside that the demonstration intelligent inductor 1402 of 1306 produces by internal oscillator (OSC) from use The outside time pulse signal 1410 of time pulse signal is (such as, including low frequency seasonal pulse, e.g., Fck=768 KHz (kHz)).As result, pattern model selects assembly 1404 can cut in step 1504 Change and show the model intelligent inductor 1402 including MEMS sound induction apparatus or mike 1306, from Exemplary events sense mode is to low electric energy message pattern of demonstrating.Because sensing including the MEMS sound The demonstration intelligent inductor 1402 of device or mike 1306, by including that one or more demonstration controls Signal 1320 (such as, interrupt signal, interrupt controlling signal, I2C signal) and include signal (example As, analog signal (not shown), digital signals 1318) data through multitask export (such as, It is associated with the solder pads of signal/interrupt output 1324, pin, contact etc.), it is connected to demonstration Induction apparatus maincenter (such as, induction apparatus maincenter 1414) (and demonstration codec (such as, encoding and decoding Device 1416)), including MEMS sound induction apparatus or the demonstration intelligent inductor of mike 1306 1402 can transmit by demonstration MEMS sound induction apparatus or mike 1306 institute in step 1518 What the sound pressure ripple of conversion was associated includes signal (such as, analog signal (not shown), numerical digit Signal 1318) data to demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) (and demonstration Codec (such as, codec 1416)).
In the exemplary embodiments, in step 1512, it is associated at demonstration induction apparatus according to including Maincenter is received signal (such as, the analogy of the sound pressure ripple of (such as, induction apparatus maincenter 1414) Signal (not shown), digital signals 1318) data, 1514, as described further herein , demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) can be beneficial to judge sound event Whether represent effective sound event.Based on judging whether the sound event in step 1514 represents Effective sound event, demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414), in step 1520, can be beneficial to judge whether to power (such as, waking up up from the sleep pattern of low electric energy) in showing Model processor (such as application processor 1418).In turn, processor (such as, the application of demonstration Processor 1418), in step 1522, can be beneficial to one or more of determine whether power supply (such as, Wake up up from the sleep pattern of low electric energy) in demonstration codec (such as, codec 1416), Such as, in step 1522, group structure demonstration codec (such as, codec 1416) is to perform Replacement or the audible signals outside demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) Process task.If in step 1522 group structure demonstration codec (such as, codec 1416) To perform replacement or the sound outside demonstration induction apparatus maincenter (such as, induction apparatus maincenter 1414) News signal processes task, in step 1524, demonstration codec (such as, codec 1416) Can be beneficial to input at seasonal pulse (ck) transmit high frequency time pulse (example on 1334 (solder pads, pin, contacts) As, Fck=2.4 megahertz (MHz)) to including MEMS sound induction apparatus or mike 1306 Demonstration intelligent inductor 1402, (such as, compiles solution in step 1522 at demonstration codec simultaneously Code device 1416) receive and include being changed by demonstration MEMS sound induction apparatus or mike 1306 The signal (such as, analog signal (not shown), digital signals 1318) that sound pressure ripple is associated Data.The once high frequency on seasonal pulse (ck) 1334 (such as, solder pads, pin, contact etc.) Seasonal pulse (such as, Fck=2.4 megahertz) is provided, and demonstration induction apparatus maincenter is (such as, in induction apparatus Pivot 1414) can stop transmitting low frequency seasonal pulse (such as, Fck=768 KHz (kHz)).If Judge that this sound event will not represent effective sound event, in demonstration induction apparatus in step 1514 Pivot (such as, induction apparatus maincenter 1414) can be beneficial to judge whether to include MEMS sound induction apparatus or The demonstration intelligent inductor 1402 of mike 1306 may remain in exemplary events sense mode (such as, by model selection assembly 1404 etc.), such as, in step 1526, by pattern model Select assembly 1404 switching include MEMS sound induction apparatus or mike 1306 demonstrate intelligence sense Answer device 1402 by using outside time pulse signal 1410 (such as, including low frequency seasonal pulse, e.g., Fck= 768 KHz (kHz)) to the internal clock news generated by internal oscillator (OSC) 1406 Number.
Therefore, in various embodiments, open can the offer of title includes case detecting circuit Demonstration MEMS sound induction apparatus or mike 1306 are beneficial to produce interruption.Such as, demonstration is real Execute example and can include the demonstration intelligent-induction of MEMS sound induction apparatus or mike 1306 Device 1402, case detecting device 1312,1314, case detecting assembly, etc., it is by including One or more demonstration controls signal 1320 and (such as, interrupts signal, interrupts controlling signal, I2C news Number) and include being associated in and changed by demonstration MEMS sound induction apparatus or mike 1306 The data of the signal (such as, analog signal (not shown), digital signals 1318) of sound pressure ripple (such as, it is associated with the solder pads of signal/interrupt output 1324, pin through multitask output, connects Point etc.) and be beneficial to produce.Other example embodiment described herein can provide and include the MEMS sound The demonstration intelligent inductor 1402 of induction apparatus or mike 1306, and farther include seasonal pulse prison Visual organ and model selection.In further example, including MEMS sound induction apparatus or Mike The demonstration intelligent inductor 1402 of wind 1306 may further include, as further described herein, 1334 (such as, solder pads, pin, contacts etc.) are inputted with supervision seasonal pulse (ck) including through group structure The pattern model of the seasonal pulse monitoring component (not shown) of state selects assembly 1404.
Without limitation, demonstration intelligence sensor 1402 includes MEMS acoustic sensor or Mike Wind 1306 includes a demonstration intelligence sensor 1402 with MEMS acoustic sensor, or wheat Gram wind 1306 is used for promoting one or more case detecting and/or interrupts producing and use general numeral PDM mike form factors (intelligence sensor of such as example embodiment be can pass through pin with Typically have five input/outputs or pin (such as frequency, data, for defeated, ground connection input/output or draw Foot) digital microphone share).In other embodiments, the main offer system that discloses includes at demonstration Reason device (such as processor, Main Processor Unit, application processor such as application processor 1418), shows Model sensor maincenter (such as sensor maincenter 1414), exemplary compilation code device is (such as coder 1416) and demonstration intelligence sensor 1402 include MEMS acoustic sensor or one can be promoted Individual or multiple case detecting and/or interrupt producing.
In example embodiment, main exposure provides an exemplary sensor, and it includes the MEMS sound Sensor (such as MEMS acoustic sensor or mike 1306) is applicable under a case detecting pattern Processing sound pressure ripple. exemplary sensor further includes a case detecting assembly (such as case detecting device 1312,1314, case detecting assembly etc.), case detecting assembly includes an application integrated circuit (ASIC) be applicable to detect a sound pressure event relevant to sound pressure wave sound, and in response to product A raw control signal (as one or more demonstration controls signal 1320, interrupts signal, interrupts controlling Signal, I2C signal etc.) to receive from MEMS acoustic sensor (such as MEMS acoustic sensor Or mike 1306) and the signal relevant to this sound pressure ripple (such as analog signal 1316, Digital signal 1318).
In another example embodiment, an exemplary events detection element (such as case detecting device 1312, 1314, case detecting assembly etc.) more it is applicable to produce this control signal (as one or more is demonstrated Control signal 1320, interrupt signal, interrupt controlling signal, I2C signal etc.) with low from a demonstration Power mode goes to wake up (as reduced electric energy sleep mode wakeup from one) coder assembly up (as compiled Decoder 1416), a sensor maincenter (such as sensor maincenter 1414), or with this sensor The system processor that (such as including MEMS acoustic sensor or mike 1306) is correlated with is (such as place Reason device a, Main Processor Unit), with in response to the output signal processed once multitask (such as one or more Demonstration control signal (as control signal 1320, interrupt signal, interrupt control signal, I2C signal, With datagram include by one demonstration MEMS acoustic sensor or mike 1306 from sensor (as bag Include MEMS acoustic sensor or mike 1306) transduce and relevant to sound pressure ripple One signal (such as analog signal 1316, digital signal 1318).Being described in further detail, event is detectd Survey assembly (such as case detecting device 1312,1314, case detecting assembly etc.) and be more applicable to detecting One or more sound, voice, ultrasound signal, key word, voice activity, or the sound form preset Such as sound pressure event. without limitation, case detecting assembly (such as case detecting device 1312,1314, Case detecting assembly etc.) more it is applicable to detecting demonstration MEMS acoustic sensor or mike 1306 transductions and the sound pressure event relevant to this sound pressure ripple.
In an example embodiment, exemplary sensor further includes multiplexer (such as multiplexer 1326) In order to produce output signal (as through signal/interrupt output 1322,1324) once multitask with Response receive this control signal (as one or more demonstration control signal 1320, interrupt signal, Interrupt controlling signal, I2C signal etc.) and the signal relevant to sound pressure ripple (such as analog signal 1316, digital signal 1318).For example, it is further described in this, multiplexer 1326 Be applicable to combination and/or transmit one or more demonstration control signal 1320 (as interrupted signal, in Disconnected control signal, I2C signal etc.) and datagram to include one relevant to sound pressure ripple and by demonstrating MEMS acoustic sensor or mike 1306 signal are (such as analog signal 1316, digital signal 1318) transduction and come, as the output signal once multitask a package (such as package, bag Include intelligence sensor 1302,1304,1402 etc.) signal output (as with signal/interrupt output 1322,1324 relevant solder pads, pin, contact etc.), for example, it is further described, With reference to Fig. 3 to 9.Therefore, a demonstration can include an interruption, in this through the output signal of multitask Break and include that this control signal (as one or more demonstration controls signal 1320, interrupts signal, interrupts Control signal, I2C signal etc.) include the signal relevant with sound pressure ripple to datagram (such as simulation news Numbers 1316, digital signal 1318).
In another example embodiment, an exemplary sensor can include that one has a lid and a package The package of substrate, its package have a port part in order to receive sound pressure ripple and one in order to Transmit the output of the output signal of this multitask (as relevant to signal/interrupt output 1322,1324 Solder pads, pin, contact etc.), and wherein this package houses this MEMS acoustic sensor (such as demonstration MEMS acoustic sensor or mike 1306), this multiplexer is (such as multiplexer 1326), with this case detecting assembly (such as case detecting device 1312,1314, case detecting assembly Deng), for example, it is further described in this, with reference to Fig. 3-9.
In other embodiments, an exemplary sensor more can include that a model selection assembly is (such as mould Formula selects interface 1328, model selection assembly 1404 etc.) in order to (to include demonstration from this sensor MEMS acoustic sensor or mike 1306) several model selections set a pattern, should A little patterns include one or more exemplary events sense mode, low electric energy audio mode of demonstrating, demonstration Standard efficiency mode, ultrasound pattern of demonstrating, or demonstration sleep pattern, be further described in this. Infinite, pattern model selects assembly (such as mode selection interface 1328, model selection assembly 1404 etc.) be more applicable to according to part or one or more with this case detecting assembly (such as event Detector 1312,1314, case detecting assembly etc.) a relevant interface is (as inputted in frequency 1334, input 1332 in model selection, be relevant to mode selection interface 1328, be relevant to pattern Select assembly 1404 etc.) signal go setting sensor (such as to include MEMS sound sensing of demonstrating Device or mike 1306) a pattern, or one with this sensor (such as include demonstrate MEMS sound Ringing sensor or mike 1306) relevant frenquency signal is (such as internal oscillator 1406, outside Frenquency signal 1410 etc.) state.
In another unrestricted, with this sensor (such as include demonstrate MEMS acoustic sensor or Mike 1306) relevant (such as internal oscillator 1406, foreign frequency signal 1410 etc.) can Including one or more basic frequency signal (such as foreign frequency signal 1410) or at package (as interior Portion's agitator 1406) in the signal of accommodating agitator. in the most unrestricted, model selection group Part (such as mode selection interface 1328, model selection assembly 1404 etc.) can more be used for based on decision Logic low numerical value (as Fck 1504 equal to 0 and 1506, Vck is not equal to a logic high Numerical value) this basic frequency signal (such as foreign frequency signal 1410) select one demonstration sleep pattern；Base In determining this basic frequency signal at logic high numerical value (such as Vck in 1506 equal to logic high numerical value) (such as foreign frequency signal 1410) selects an exemplary events sense mode and starts by this agitator The internal frequency (such as foreign frequency signal 1410) that (such as internal oscillator 1406) produces；Show one Model this multiplexer of case detecting Schema control (such as multiplexer 1326) this output (as once The output signal of multitask in single output, e.g., solder pads, pin, contact, etc., with packaging Message/the interrupt output 1322,1324 of part is correlated with, and such as, package includes intelligence sensor 1302,1304,1402 etc.) send on this control signal (as one or more demonstration control signal 1320, Interrupt signal, interrupt controlling signal, I2C signal etc.), for example and be further described, reference Fig. 3 to 9；Based on determining that this basic frequency comprising low frequency signal (such as Fck=768kHz) is interrogated Number (such as foreign frequency signal 1410) selects a low electric energy audio mode of demonstration, and stops to be shaken by this Swing the internal frequency that device (such as internal oscillator 1406) produces；At a low electric energy audio mode of demonstration Control this multiplexer (such as multiplexer 1326) in this output (as the output once multitask is interrogated Number in single output, such as the solder pads relevant to the message/interrupt output 1322,1324 of package, Pin, contact, etc.) on send this signal relevant to this sound pressure ripple (such as analog signal 1316, digital signal 1318), and based on determining to comprise altofrequency signal (such as Fck=2.4 MHz) this basic frequency signal selects an exemplary criteria efficiency mode.
In other embodiments, main offer one exemplary sensor that uncovers, it includes a MEMS sensing Device (such as MEMS acoustic sensor or mike 1306) for a case detecting assembly (as Case detecting device 1312,1314, case detecting assembly etc.) process ultrasound pressure wave. this demonstration Sensor more can include that a case detecting assembly (such as case detecting device 1312,1314, detect by event Survey assembly etc.) to have an application integrated circuit (ASIC) relevant to ultrasound pressure wave in order to detect Ultrasound pressure events, and produce a control signal (as one or more demonstration control signal 1320, Interrupt signal, interrupt control signal, I2C signal etc.) with response from MEMS sensor (as MEMS acoustic sensor or mike 1306) receive and relevant to ultrasound pressure wave One signal (such as analog signal 1316, digital signal 1318).
In another example embodiment, an exemplary events detection element (such as case detecting device 1312, 1314, case detecting assembly etc.) most probably in producing a control signal (as one or more demonstration controls Signal 1320, interrupts signal, interrupts controlling signal, I2C signal etc.) with from a low electric energy of demonstration Pattern is gone to wake up (as reduced electric energy sleep mode wakeup from one) up and (is such as included with this sensor MEMS acoustic sensor or mike 1306) relevant coder parts are (such as coder 1416), a sensor maincenter (such as sensor maincenter 1414), or a system processor is (as processed Device, a Main Processor Unit, an application processor such as application processor 1418 etc.) process with response From sensor (such as including MEMS acoustic sensor or mike 1306) and by a demonstration MEMS acoustic sensor or mike 1306 transduce and relevant to ultrasound pressure wave once The output signal of multitask (as one or more demonstration controls signal such as control signal 1320, interrupts Signal, interrupts controlling signal, I2C signal, and datagram and includes signal such as analog signal 1316, Digital signal 1318).It is further described, case detecting assembly (such as case detecting device 1312, 1314, case detecting assembly etc.) most probably in detecting one or more ultrasound signal, or with acquiescence Ultrasound pattern is a ultrasound pressure events.In one unrestricted, case detecting assembly is (such as thing Part detector 1312,1314, case detecting assembly etc.) more can based on this ultrasound pressure wave phase The signal closed and transduceed by a demonstration MEMS acoustic sensor or mike 1306 is (such as simulation news Numbers 1316, digital signal 1318) go to detect this this ultrasound pressure events.
In other example embodiment, an exemplary sensor also includes that one comprises lid and package substrate Package, wherein this package has Single port part in order to receive ultrasound pressure wave, Yi Jiyi Output (such as solder pads, pin, contact etc. is relevant to signal/interrupt output 1322,1324) in order to pass Defeated this through the output signal of multitask, and its package houses this MEMS sensor and (such as shows Model MEMS acoustic sensor or mike 1306) with this case detecting assembly (such as case detecting Device 1312,1314, case detecting assembly etc.), for example and further describe, with reference to Fig. 3 extremely 9.In a unrestricted aspect, the demonstration package including lid with package substrate also can house one Multiplexer (such as multiplexer 1326), is been described by this.
In an example embodiment, an exemplary sensor more can include that a multiplexer is (such as multitask Device 1326) in order to produce the output signal once multitask (as through signal/interrupt output 1322,1324) with response receive control signal (as one or more demonstration control signal 1320, Interrupt signal, interrupt controlling signal, I2C signal etc.) and relevant to this ultrasound pressure wave Signal (such as analog signal 1316, digital signal 1318).For example, be further described in This, multiplexer 1326 can be used for combining or transmit one or more demonstration control signal 1320 (as Interrupt signal, interrupt control signal, I2C signal etc.) and datagram include one with sound pressure ripple Signal that is relevant and that transduceed by demonstration MEMS acoustic sensor or mike 1306 is (such as mould Intend signal 1316, digital signal 1318) transduction and come, such as the output signal once multitask Defeated in the signal of a package (such as package, including intelligence sensor 1302,1304,1402 etc.) Go out (such as the solder pads relevant to signal/interrupt output 1322,1324, pin, contact etc.), citing For, it is further described, with reference to Fig. 3 to 9.Therefore, a demonstration is interrogated through the output of multitask Number can include an interruption, this interruption includes that this control signal is (as one or more demonstration controls signal 1320, interrupt signal, interrupt controlling signal, I2C signal etc.) include and sound pressure ripple with datagram Relevant signal (such as analog signal 1316, digital signal 1318).
In other example embodiment, an exemplary sensor further includes a model selection assembly (such as pattern Select interface 1328, model selection assembly 1404 etc.) in order to (to include demonstration from this sensor MEMS acoustic sensor or mike 1306) several model selections set a pattern, those Pattern includes one or more exemplary events sense mode, low electric energy audio mode of demonstrating, demonstration mark Quasi-efficiency mode, ultrasound pattern of demonstrating, or demonstration sleep pattern, be further described in this.Non- Limiting, pattern model selects assembly (such as mode selection interface 1328, model selection assembly 1404 etc.) be more applicable to according to part or one or more with this case detecting assembly (such as event Detector 1312,1314, case detecting assembly etc.) a relevant interface is (as inputted in frequency 1334, input 1332 in model selection, be relevant to mode selection interface 1328, be relevant to pattern Select assembly 1404 etc.) signal go setting sensor (such as to include MEMS sound sensing of demonstrating Device or mike 1306) a pattern, or one with this sensor (such as include demonstrate MEMS sound Ringing sensor or mike 1306) relevant frenquency signal is (such as internal oscillator 1406, outside Frenquency signal 1410 etc.) state.
In another unrestricted, with this sensor (such as include demonstrate MEMS acoustic sensor or Mike 1306) relevant (such as internal oscillator 1406, foreign frequency signal 1410 etc.) can Including one or more basic frequency signal (such as foreign frequency signal 1410) or at package (as interior Portion's agitator 1406) in the signal of accommodating agitator. in the most unrestricted, model selection group Part (such as mode selection interface 1328, model selection assembly 1404 etc.) most probably in: based on decision At logic low numerical value, (such as Fck 1504 equal to 0, and 1506, Vck is not equal to a logic high Numerical value) this basic frequency signal (such as foreign frequency signal 1410) go to select a demonstration sleep pattern； Based on this basic frequency news determined at logic high numerical value (such as Vck in 1506 equal to logic high numerical value) Number (such as foreign frequency signal 1410) goes select an exemplary events sense mode and start by this vibration The internal frequency (such as foreign frequency signal 1410) that device (such as internal oscillator 1406) produces；Control This multiplexer (such as multiplexer 1326) this output (as once multitask output signal in Single output, such as the solder pads relevant to the message/interrupt output 1322,1324 of package, connects Foot, contact, etc., such as, package includes intelligence sensor 1302,1304,1402 etc.) upper Go out this control signal (as one or more demonstration controls signal 1320, to interrupt signal, interrupt controlling news Number, I2C signal etc.), for example, and it is further described, with reference to Fig. 3 to 9；Based on determining bag This basic frequency signal containing low frequency signal (such as Fck=768kHz) is (such as foreign frequency signal 1410) select a low power mode of demonstration, and/or stop by this agitator (such as internal oscillator 1406) internal frequency produced；One demonstrate low electric energy audio mode control this multiplexer (as Multiplexer 1326) this output (if the output signal once multitask is in single output, as with The relevant solder pads of message/interrupt output 1322,1324 of package, pin, contact, etc.) on Send this signal relevant to this ultrasound pressure wave (such as analog signal 1316, digital signal 1318) this basic frequency news of altofrequency signal (such as Fck=2.4MHz), and/or are comprised based on decision Number (such as foreign frequency signal 1410) selects an exemplary criteria efficiency mode.
In other example embodiment, the main offer demonstration system that uncovers (such as demonstration system 1400 and/or Part, assembly, and sub-component and combination in any etc.) include a demonstration MEMS sensor bag (as one includes one or more intelligence sensor 1302, intelligence sensor 1304, intelligence passes in piece installing The package of sensor 1402 grade), for example, further describe in this, with reference to Fig. 3-9, 13-15 etc..Demonstration MEMS sensor package can be used for processing in a case detecting pattern Sound pressure ripple (and/or ultrasound pressure wave), or transmit the output signal once multitask (as one or more demonstration controls signal, as controlled signal 1320, interrupt signal, interrupt controlling news Number, I2C signal etc.) and datagram include by demonstration MEMS acoustic sensor or mike 1306 transductions the signal relevant to sound pressure ripple (and/or ultrasound pressure wave) are (such as simulation news Numbers 1316, digital signal 1318), this signal includes and this sound pressure ripple (and/or ultrasound Pressure wave) and (such as including one or more intelligence sensor 1302, intelligent sensing with package Device 1304, intelligence sensor 1402, the package waited) relevant output (as with signal/interruption The relevant solder pads of output 1322,1324, pin, contact etc.) interrupt, for example, and in this Further describe, with reference to Fig. 3-9.
In addition, the demonstration system mainly uncovered more can include one or more exemplary sensor maincenter (such as sensor maincenter 1414), demonstration coding/decoding digital signal processor (coder) (such as coder 1416), or one with this sensor (such as include MEMS acoustic sensor or wheat Gram wind 1306) (such as processor, a Main Processor Unit, an application processes relevant Main Processor Unit Device such as application processor 1418 etc.). for example, in multiple example embodiment, this is one or many years old Individual exemplary sensor maincenter (such as sensor maincenter 1414), this demonstration coding/decoding digital signal Processor (coder) (such as coder 1416), or (such as include MEMS with this sensor Acoustic sensor or mike 1306) (such as processor, one mainly locates relevant Main Processor Unit Reason device, an application processor such as application processor 1418 etc.) may be used to receive at least part of being somebody's turn to do Through multitask output signal (as one or more demonstration control signal as control signal 1320, in Disconnected signal, interrupts controlling signal, I2C signal), include with datagram and passed by the demonstration MEMS sound Sensor or mike 1306 are transduceed and relevant to sound pressure ripple (and/or ultrasound pressure wave) Signal (such as analog signal 1316, digital signal 1318), this signal includes and this sound pressure Ripple (and/or ultrasound pressure wave)；Also may be used to based at least part of this through the output of multitask Signal (as one or more demonstration controls signal such as control signal 1320, interrupts signal, interrupts control Signal processed, I2C signal) and include by demonstration MEMS acoustic sensor or mike 1306) Transduction and the signal relevant to sound pressure ripple (and/or ultrasound pressure wave) are (such as analog signal 1316, digital signal 1318) go to transmit a frenquency signal (such as foreign frequency signal 1410 etc.) extremely This MEMS sensor package (such as includes one or more intelligence sensor 1302, intelligent sensing Device 1304, a package of intelligence sensor 1402 grade).
In other embodiments, the demonstration system mainly uncovered more can include that a demultiplexer (is not painted It is shown in figure), this demultiplexer system is relevant to this one or more exemplary sensor maincenter (as passed Sensor maincenter 1414), this demonstration coding/decoding digital signal processor (coder) is (as compiled Decoder 1416), or Main Processor Unit is (such as processor, a Main Processor Unit, an application process Device such as application processor 1418 etc.). for example, in an example embodiment, a demonstration solution is many Task device can be used for receiving this output signal through multitask (as one or more demonstration controls signal As controlled signal 1320, interrupt signal, interrupt control signal, I2C signal), with datagram include by Demonstration MEMS acoustic sensor or mike 1306 is transduceed and (and/or super with sound pressure ripple Sound wave pressure wave) relevant signal (such as analog signal 1316, digital signal 1318)；Also can use With the one or more signal relevant to sound pressure ripple (and/or ultrasound pressure wave) of transmission (as Analog signal 1316, digital signal 1318) or interrupt to this one or more exemplary sensor Pivot (such as sensor maincenter 1414), demonstration coding/decoding digital signal processor is (such as coding and decoding Device 1416), or Main Processor Unit (such as processor, a Main Processor Unit, an application processor is such as Application processor 1418 etc.).In addition, demonstration MEMS sensor package is included (such as bag Containing one or more intelligence sensor 1302, intelligence sensor 1304, intelligence sensor 1402 Deng package) demonstration system more can include that an agitator (such as internal oscillator 1406 etc.) is used To drive at least a part of MEMS sensor package in an exemplary events sense mode (such as include one or more intelligence sensor 1302, intelligence sensor 1304, intelligence sensor The package of 1402 grades).Without limitation, demonstration system more can include a MEMS sensor packaging Part (such as includes one or more intelligence sensor 1302, intelligence sensor 1304, intelligent sensing The package of device 1402 grade) in order to wake up (as reduced electric energy sleep mode wakeup from) one or many up Individual exemplary sensor maincenter (such as sensor maincenter 1414), this demonstration coding/decoding digital signal Processor (coder) (such as coder 1416), or Main Processor Unit (such as processor, one Main Processor Unit, an application processor such as application processor 1418 etc.), for example, to respond At least one interruption received or number relevant to sound pressure ripple in the output signal of multitask According to.
The most unrestricted application, includes demonstration MEMS sensor package and (such as comprises There are one or more intelligence sensor 1302, intelligence sensor 1304, intelligence sensor 1402 etc. Package) demonstration system more demonstration system further include a model selection assembly (such as model selection Interface 1328, model selection assembly 1404 etc.) for based on determining at logic low numerical value (such as Fck 1504 equal to 0 and 1506, Vck is not equal to a logic high numerical value) frenquency signal (as frequency Rate input 1334 includes solder pads, pin, contact etc.) select a demonstration sleep pattern；Based on certainly It is scheduled on this frenquency signal of logic high numerical value (such as Vck in 1506 equal to logic high numerical value) (such as frequency Input 1334 includes solder pads, pin, contact etc.) select an exemplary events sense mode and open The dynamic internal frequency produced by this agitator (such as internal oscillator 1406)；In order in a demonstration thing Part sense mode controls this multiplexer (such as multiplexer 1326) in this output (as once many The output signal of business in single output, e.g., solder pads, pin, contact, etc., with package Message/interrupt output 1322,1324 is correlated with, and package such as includes intelligence sensor 1302, 1304,1402 etc.) send this control signal on (as one or more demonstration controls signal 1320, to interrupt Signal, interrupts controlling signal, I2C signal etc.), for example and be further described, with reference to Fig. 3 To 9；Based on determine comprise low frequency signal (such as Fck=768kHz) this frenquency signal (as Frequency input 1334 includes solder pads, pin, contact etc.) go to select a low power mode of demonstration, And/or stop the internal frequency produced by this agitator (such as internal oscillator 1406)；In a demonstration Low power mode controls this multiplexer (such as multiplexer 1326) in this output (as once many The output signal of business is in single output, such as message/interrupt output 1322,1324 phase with package The solder pads closed, pin, contact, etc.) on send and this sound pressure ripple (and/or ultrasound pressure Ripple) relevant this signal (such as analog signal 1316, digital signal 1318)；And/or based on decision Comprise this frenquency signal of altofrequency signal (such as Fck=2.4MHz) (such as frequency input 1334 bag Include solder pads, pin, contact etc.) select an exemplary criteria efficiency mode.
Based on object content described above, preferably may be used with the method being embodied as according to aforementioned exposure Reference flowchart Figure 16 is to 18.For the purpose simply illustrated, it is with a series of square description side Method, do understand embodiment and corresponding description content is not limited to these squares Order, some square can occur with different order, and/or occur with other squares simultaneously.Any The flow process that is non-sequential or that separate from collateral branch of flowchart representation should be understood that, is to imply other not Same branch, flow path, and square order, all can be used to implement to reach same or analogous Result., and the square that illustrates of not all must be applied in following method in addition.
Demonstration methods
Figure 16 illustrates the relevant to intelligence sensor non-of the various non-limiting aspect according to the present invention The example flow chart of restriction method.As infinite example, demonstration methods 1600 can be included in 1602 receive sound pressure or sound ripple.For example, sound pressure or sound ripple can be via examples As adapted to (such as, comprise MEMS with this sensor package receiving sound pressure or sound ripple Acoustic sensor or the sensor of mike 102 or mike package) in port part (such as, port Part 308), and (such as, comprised MEMS acoustic sensor or wheat by being packaged in sensor package The sensor of gram wind 102 or mike package) in MEMS acoustic sensor (such as, MEMS acoustic sensor or mike 102) receive, (such as, this sensor package comprises lid Lid 304) and package substrate (such as, sensor or mike package substrate 302), as above State about described by Fig. 3-9.
In an aspect, as above with respect to described by Fig. 1 and 2, for example, this MEMS Acoustic sensor (such as, MEMS acoustic sensor or mike 102) can organize structure with less than 1.5 Volt voltage-operated.In another aspect, this MEMS acoustic sensor (such as, MEMS Acoustic sensor or mike 102) structure can be organized with in always on pattern (always-on mode) Operation.For example, this MEMS acoustic sensor (such as, MEMS acoustic sensor or Mike 102) can be included in a device, this device for example, main system 1000 (such as, function Formula phone, smart phone, intelligent watch, tablet PC, electronic reader, upper net type pen Electricity, autopilot, game pad or device, the formula that screws on calculate device), it comprises System processor (such as, device 1010) and this MEMS acoustic sensor (such as, MEMS Acoustic sensor or mike 102), wherein, this system processor (such as, device 1010) is Position is outside this sensor package.For example, system processor (such as, device 1010) can Comprise integrated circuit (IC), in order to control the function of mobile phone (such as, main system 1000).
Demonstration methods 1600 can be additionally included in 1604 by signal from this MEMS acoustic sensor (example As, MEMS acoustic sensor or mike 102) it is sent to be packaged in this MEMS sound sensing The dorsal pore hole (such as, dorsal pore hole 306) of device (such as, MEMS acoustic sensor or mike 102) Interior DSP (such as, DSP 106/212).1606, demonstration methods 1600 by signal from packaging MEMS action sensor (such as, MEMS action sensor in this sensor package 202) this DSP (such as, DSP 106/212) it is sent to.
In another non-limiting aspect, demonstration methods 1600 can comprise 1608 should by use DSP (such as, DSP 106/212) produces and controls signal (such as, control signal 104/204), its In, this control signal (such as, DSP 106/212) is suitable for promoting to control device, such as, System processor (such as, device 1010) outside this sensor package, such place is additionally Describe.As a Non-limiting examples, by using this DSP (such as, DSP 106/212) Produce this control signal (such as, controlling signal 104/204) and can comprise based on coming from MEMS dynamic Make the signal of sensor (such as, MEMS action sensor 202), come from such as MEMS Acoustic sensor or the signal of mike 102 and/or a combination thereof one or more, producing should Control signal (such as, controlling signal 104/204).
For example, this control signal is produced (such as, with this DSP (such as, DSP 106/212) Control signal 104/204) generation can be comprised wake up signal up, to adapt to promote to supply from low energy state This device, such as, system processor (such as, device 1010) is given to electric energy.Like this, exist 1610, demonstration methods 1600 can also include this control signal (such as, controlling signal 104/204) Being sent to this device from this DSP (such as, DSP 106/212), such as, system processor is (such as, Device 1010), to promote this device of starting shooting.Additionally, 1612, demonstration methods 1600 also may be used Comprise by use this DSP (such as, DSP 106/212), and adjustment, adjust this MEMS move Make sensor (such as, MEMS action sensor 202) or this such as MEMS acoustic sensor Or mike 102) one or more performances or change operator scheme.
Figure 17 illustrates and intelligence sensor of demonstrating (such as, demonstration intelligence sensor 1302,1304, 1402 etc.) another example flow chart of relevant non-limiting method 1700.For example, show Model method 1700 can be included in case detecting pattern with acoustic sensor (such as, MEMS such as 1702 Acoustic sensor or mike 1306) process sound pressure ripple.1704, demonstration methods 1700 Can comprise ASIC case detecting assembly (such as, case detecting device 1312, 1314, case detecting assembly etc.) place, from this MEMS acoustic sensor (such as, MEMS sound Ring sensor or mike 1306) receive signal (such as, the simulation relevant to this sound pressure ripple Signal 1316, digital signal 1318).
Additionally, 1706, with this case detecting assembly (such as, demonstration methods 1700 can comprise Case detecting device 1312,1314, case detecting assembly etc.) detecting is relevant to this sound pressure ripple Sound pressure event.As non-limiting examples, 1706, demonstration methods 1700 can comprise detecting Sound, voice, ultrasound signal, key word, voice activity or default sound form One or more, using as this sound pressure event, for example, as described herein.? In another Non-limiting examples, 1706, demonstration methods 1700 also can comprise based on this sound pressure This signal (such as, analog signal 1316, digital signal 1318) that Reeb is relevant, detects and is somebody's turn to do This sound pressure event that sound pressure ripple is relevant.
Demonstration methods 1700 can also include producing control signal 1708, and (such as, one or more shows Model controls signal 1320, interrupts signal, interruption control signal, I2C signal etc.), should with response Detect this sound pressure event.As Non-limiting examples, demonstration methods 1700 can comprise generation should (such as, one or more demonstration controls signal 1320, interruption signal, interrupts controlling news to control signal Number, I2C signal etc.), to wake up up from low power mode of demonstrating (such as, from reducing electric energy sleep mould Formula wakes up up) and this intelligence sensor (such as, demonstration intelligence sensor 1302,1304,1402 etc.) Relevant coder (such as, coder 1416) assembly, sensor maincenter (such as, sense Device maincenter 1414) or system processor (such as, processor, Main Processor Unit, application process Device (such as, application processor 1418) etc.), with response process relevant to sound pressure ripple through many The output signal of task (such as, one or more demonstration control signal (such as, control signal 1320, Interrupt signal, interrupt controlling signal, I2C signal and comprising signal (such as, analog signal 1316, digital signal 1318) data, this sound pressure ripple be by demonstration the MEMS sound pass Sensor or mike 1306 and from this intelligence sensor (such as, demonstration intelligence sensor 1302, 1304,1402 etc.) institute's transducing.
1710, demonstration methods 1700 also can comprise based on this control signal (such as, one or many Individual demonstration control signal 1320, interrupt signal, interrupt control signal, I2C signal etc.) and with this This signal (such as, analog signal 1316, digital signal 1318) that sound pressure ripple is relevant, with Multiplexer (such as, multiplexer 1326) produce through multitask output signal (such as, via Signal/interrupt output 1322,1324).For example, as described herein, multiplexer 1326 can organize structure with combination and/or transmits one or more demonstration control signal 1320 (such as, interruption Signal, interrupt controlling signal, I2C signal) and signal (such as, the mould relevant to sound pressure ripple Intend signal 1316, digital signal 1318), this sound pressure ripple is to be passed by the demonstration MEMS sound Sensor or 1306 transducings of mike, (such as, to comprise intelligence sensor as at package 1302, the package of 1304,1402) single output (such as, solder pads, pin, contact Deng, relevant to signal/interrupt output 1322,1324) on the output signal through multitask, lift For example, as described herein about Fig. 3-9.As another Non-limiting examples, demonstration Method 1700 also can comprise multi-tasking 1710 and interrupt and signal, and this interruption comprises this control Signal (such as, one or more demonstration control signal 1320, interrupt signal, interrupt control signal, I2C signal etc.), and this datagram is containing this signal (such as, the simulation relevant to this sound pressure ripple Signal 1316, digital signal 1318).
Demonstration methods 1700 also can include (such as, comprising intelligent sensing via package 1712 The package of device 1302,1304,1402 etc.) output (such as, via signal/interrupt output 1322, 1324) transmit this output signal through multitask, this package comprise lid, package substrate, This MEMS acoustic sensor (such as, MEMS acoustic sensor or mike 1306), these are many Task device (such as, multiplexer 1326) and this case detecting assembly (such as, case detecting Device 1312,1314, case detecting assembly etc.), for example, as described herein in Fig. 3-9 's.
Additionally, demonstration methods 1700 can also include (such as, showing from this intelligence sensor 1714 Model intelligence sensor 1302,1304,1402 etc.) several patterns between, set this intelligent sensing One or more pattern of device (such as, demonstration intelligence sensor 1302,1304,1402 etc.) is (such as, Via model selection assembly, mode selection interface 1328, model selection assembly 1404 etc., this number Individual pattern comprises exemplary events sense mode, demonstrate low electric energy audio mode, exemplary criteria usefulness Pattern, demonstration ultrasound pattern and/or demonstration sleep pattern, for example, so place is retouched State.As Non-limiting examples, demonstration methods 1700 1714 can comprise be based partially on should Case detecting assembly (such as, case detecting device 1312,1314, case detecting assembly etc.) relevant Interface (such as, in and model selection assembly 1404 phase relevant to mode selection interface 1328 Close frequency input 1334, model selection input 1332 on) on signal and with this intelligent sensing The frenquency signal that device (such as, demonstration intelligence sensor 1302,1304,1402 etc.) is correlated with is (such as, Internal oscillator 1406, foreign frequency signal 1410 etc.) state, set this intelligence sensor (example Such as, demonstration intelligence sensor 1302,1304,1402 etc.) this pattern.As another Non-limiting examples, with this intelligence sensor (such as, demonstration intelligence sensor 1302,1304,1402 Deng) relevant frenquency signal (such as, internal oscillator 1406, foreign frequency signal 1410 etc.) Basic frequency signal (such as, foreign frequency signal 1410 etc.) can be comprised and be packaged in this package One or more of signal of agitator (such as, internal oscillator 1406 etc.).
Therefore, in another non-limiting examples, demonstration methods 1700 can also wrap 1714 Include according to determining at logic low numerical value (such as, 1504, Fck=0, and 1506, Vck Be not equal to logic high numerical value) this basic frequency signal (such as, foreign frequency signal of logic low numerical value 1410 etc.) demonstration sleep pattern is selected；According to determine logic high numerical value (such as, 1506, Vck be equal to logic high numerical value) this basic frequency signal (such as, foreign frequency signal 1410 etc.) choosing Select exemplary events sense mode, and start by this agitator (such as, internal oscillator 1406 etc.) Produced internal frequency；This multiplexer (such as, many is controlled at exemplary events sense mode Business device 1326) this output (such as, the output signal through multitask in single output, such as, Solder pads, pin, contact etc., relevant to the signal/interrupt output 1322,1324 of package, Such as, comprise the package of intelligence sensor 1302,1304,1402 etc.) on send this control news Number (such as, one or more demonstration control signal 1320, interrupt signal, interrupt control signal, I2C Signal etc.)；This basic frequency of low frequency signal (such as, Fck=768kHz) is comprised according to decision Signal selects low electric energy audio mode of demonstrating, and stops by this agitator (such as, internal oscillator Device 1406 etc.) produced by internal frequency；This multitask is controlled at this demonstration low electric energy audio mode Device (such as, multiplexer 1326) is at this output (such as, defeated through multitask in single output Go out signal, such as, solder pads, pin, contact etc., with the signal/interrupt output 1322 of package, 1324 are correlated with, and such as, comprise the package of intelligence sensor 1302,1304,1402 etc.) on Send signal (such as, analog signal 1316, the digital signal relevant to this sound pressure ripple 1318)；And/or this dominant frequency of altofrequency signal (such as, Fck=2.4MHz) is comprised based on decision Rate signal (such as, foreign frequency signal 1410 etc.) selects exemplary criteria efficiency mode.
Figure 18 illustrates and intelligence sensor of demonstrating (such as, demonstration intelligence sensor 1302,1304, 1402 etc.) another non-limiting flow chart of relevant demonstration methods 1800.For example, such as 1802, Demonstration methods 1800 can be included in case detecting pattern with MEMS sensor (such as, MEMS Acoustic sensor or mike 1306) process ultrasound pressure wave.1804, demonstration methods 1800 Case detecting assembly (such as, the case detecting device comprising ASIC can be additionally included in 1312,1314, case detecting assembly etc.) place is from this MEMS sensor (such as, MEMS sound Ring sensor or mike 1306) receive signal (such as, the mould relevant to this ultrasound pressure wave Intend signal 1316 or digital signal 1318)
Additionally, 1806, with this case detecting assembly (such as, demonstration methods 1800 can comprise Case detecting device 1312,1314, case detecting assembly etc.) detecting is relevant to this ultrasound pressure wave Ultrasound pressure events.As Non-limiting examples, 1806, demonstration methods 1800 can comprise Detecting ultrasound signal or one or more of predetermined ultrasound form, using as this Supersonic wave pressure Power event, for example, as described herein.In another Non-limiting examples, 1806, Demonstration methods 1800 also can comprise based on this signal (such as, the mould relevant to this ultrasound pressure wave Intend signal 1316 or digital signal 1318) detect this ultrasound relevant to this ultrasound pressure wave Pressure events.
Demonstration methods 1800 can also include producing control signal 1808, and (such as, one or more shows Model controls signal 1320, interrupts signal, interruption control signal, I2C signal etc.), should with response Detect this ultrasound pressure events.As Non-limiting examples, demonstration methods 1800 also can produce this (such as, one or more demonstration controls signal 1320, interruption signal, interrupts controlling news to control signal Number, I2C signal etc.), with from low power mode of demonstrating, wake up up (such as, from reducing electric energy sleep Mode wakeup) and this intelligence sensor (such as, demonstration intelligence sensor 1302,1304,1402 Deng) relevant coder (such as, coder 1416) assembly, sensor maincenter (such as, pass Sensor maincenter 1414) or system processor (such as, processor, Main Processor Unit, answer use Reason device (such as, application processor 1418) etc.), process the output signal (example through multitask with response As, one or more demonstration controls signal and (such as, controls signal 1320, interrupts signal, interruption control Signal processed, I2C signal and comprise the signal relevant to ultrasound pressure wave (such as, simulation Signal 1316 or digital signal 1318) data, this ultrasound pressure wave be by demonstration MEMS Acoustic sensor or mike 1306) from this intelligence sensor (such as, demonstration intelligence sensor 1302,1304,1402 etc.) institute's transducing.
1810, demonstration methods 1800 also can comprise with multiplexer (such as, multiplexer 1326) According to this control signal, (such as, one or more demonstration controls signal 1320, interrupts signal, interruption Control signal, I2C signal etc.) and this signal relevant to this ultrasound pressure wave (such as, simulate Signal 1316 or digital signal 1318) produce through the output signal of multitask (such as, via news Number/interrupt output 1322,1324), this multiplexer is included in package and (such as, comprises intelligence The package of sensor 1302,1304,1402 etc.) in, this package comprises lid, package Substrate, this MEMS sensor (such as, MEMS acoustic sensor or mike 1306), should (such as, event is detectd for multiplexer (such as, multiplexer 1326) and this case detecting assembly Survey device 1312,1314, case detecting assembly etc.), for example, as described by Fig. 3-9. For example, as described herein, it is included in package and (such as, comprises intelligence sensor 1302, the package of 1304,1402 etc.) in multiplexer 1326 can organize structure with combination and/or Transmit one or more demonstration and control signal 1320 (such as, interruption signal, interruption control signal, I2C Signal) and comprise signal (such as, analog signal 1316 or the number relevant to ultrasound pressure wave Word signal 1318) data, this ultrasound pressure wave be by demonstration MEMS acoustic sensor or 1306 transducings of mike, using as package (such as, comprise intelligence sensor 1302, 1304, the package of 1402 etc.) single output (such as, solder pads, pin, contact etc., Relevant to signal/interrupt output 1322,1324) on the output signal through multitask, citing come Say, as about described by Fig. 3-9.As another Non-limiting examples, demonstration methods 1800 exists 1810 also can comprise multi-tasking interrupts and data, and this interruption comprises this control signal (such as, one Or multiple demonstration controls signal 1320, interruption signal, interruption control signal, I2C signal etc.), And this datagram containing this signal relevant to this ultrasound pressure wave (such as, analog signal 1316, Or digital signal 1318).
1812, demonstration methods 1800 can also include (such as, comprising intelligence biography via package The package of sensor 1302,1304,1402 etc.) output (such as, via signal/interrupt output 1322,1324) transmit this control signal (such as, one or more demonstration control signal 1320, in Disconnected signal, interrupt controlling signal, I2C signal etc.) and this news relevant to this ultrasound pressure wave Number (such as, analog signal 1316 or digital signal 1318), this package comprises lid, bag Piece installing substrate, this MEMS sensor (such as, MEMS acoustic sensor or mike 1306), This multiplexer (such as, multiplexer 1326) and this case detecting assembly (such as, event Detector 1312,1314, case detecting assembly etc.), for example, as retouched about Fig. 3-9 State.
Additionally, demonstration methods 1800 can also include that (such as, demonstration intelligence passes from this intelligence sensor Sensor 1302,1304,1402 etc.) several patterns between set this intelligence sensor (such as, Demonstration intelligence sensor 1302,1304,1402 etc.) one or more pattern (such as, by mould Formula selects assembly, mode selection interface 1328, model selection assembly 1404 etc.), these several moulds Formula comprises exemplary events sense mode, low power mode of demonstrating, exemplary criteria efficiency mode, shows Model ultrasound pattern and/or demonstration sleep pattern, for example, as described herein.
As Non-limiting examples, demonstration methods 1800 can also include monitoring and this intelligence sensor (example Such as, demonstration intelligence sensor 1302,1304,1402 etc.) relevant frenquency signal is (such as, interior Portion's agitator 1406, foreign frequency signal 1410 etc.), (such as, it comprise supervision basic frequency signal Foreign frequency signal 1410 etc.) or be packaged in this package (such as, comprise intelligence sensor 1302, 1304, the package of 1402 etc.) in the signal of agitator (such as, internal oscillator 1406 etc.) One or more, (such as, this package comprises lid, package substrate, this MEMS sensor MEMS acoustic sensor or mike 1306), multiplexer (such as, multiplexer 1326), And this case detecting assembly (such as, case detecting device 1312,1314, case detecting assembly etc.), For example, as about described by Fig. 3-9.Therefore, demonstration methods 1800 can also include portion Point according to this case detecting assembly (such as, case detecting device 1312,1314, case detecting group Part etc.) relevant interface is (such as, in and model selection group relevant to mode selection interface 1328 Frequency input 1334 that part 1404 grade is relevant, model selection input 1332) on signal or with this The frequency that intelligence sensor (such as, demonstration intelligence sensor 1302,1304,1402 etc.) is relevant The one or many of the state of signal (such as, internal oscillator 1406, foreign frequency signal 1410 etc.) This intelligence sensor of individual setting (such as, demonstration intelligence sensor 1302,1304,1402 etc.) This pattern.
Therefore, in another non-limiting examples, demonstration methods 1800 can also include following one or Multiple: according to determine logic low numerical value (such as, 1504, Fck=0, and 1506, Vck is not equal to logic high numerical value) this basic frequency signal (such as, foreign frequency signal 1410 etc.) Select demonstration sleep pattern；According to certainly at logic high numerical value, (such as, 1506, Vck is equal to patrolling Volume high numerical value) this basic frequency signal (such as, foreign frequency signal 1410 etc.), select demonstration thing Part sense mode, and start and produced by this agitator (such as, internal oscillator 1406 etc.) Internal frequency；At exemplary events sense mode, control this multiplexer (such as, multiplexer 1326) this output (such as, the output signal through multitask in single output, such as, weldering Backing strap, pin, contact etc., relevant to the signal/interrupt output 1322,1324 of package, example Such as, the package comprising intelligence sensor 1302,1304,1402 etc.) on send this control signal (such as, one or more demonstration controls signal 1320, interrupts signal, interruption control signal, I2C Signal etc.)；This basic frequency of low frequency signal (such as, Fck=768kHz) is comprised according to decision Signal selects low power mode of demonstrating, and stops by this agitator (such as, internal oscillator 1406 etc.) internal frequency produced by；In the low power mode of this demonstration, control this multiplexer (example As, multiplexer 1326) in this output (such as, output through multitask in single output Signal, such as, solder pads, pin, contact etc., with the signal/interrupt output 1322 of package, 1324 are correlated with, and such as, comprise the package of intelligence sensor 1302,1304,1402 etc.) on, Send this signal (such as, analog signal 1316 or the digital signal relevant to this sound pressure ripple 1318)；And/or this dominant frequency of altofrequency signal (such as, Fck=2.4MHz) is comprised according to decision Rate signal (such as, foreign frequency signal 1410 etc.), selects exemplary criteria efficiency mode.
But, the various demonstrations of demonstration methods 1600,1700 and/or 1800 as described Implementation can comprise and sensor, intelligence sensor, mike, sensing extraly or alternately Other fabrication steps that the feature or function of device or mike package etc. is relevant, as about figure Described in detail by 1-15.
The above-mentioned described example comprising embodiments of the invention.It is, of course, not possible to describe every One conceivable group structure, assembly and/or combination of method in order to describe the present invention, but should It is appreciated that to have such the additionally combination planting embodiment and arrangement.Therefore, asked Invention be intended to contain and fall within all this change in the range of appended claims, repair Just and variant.Although specific embodiment and example describe in being illustrative for property of the present invention, But the skilled person of this area, it should be recognized that fall within the range of this embodiment and example Various corrections are also possible.
As used in this application, " assembly ", " module ", " device " and " system " these arts Language is intended to refer to the entity relevant with computer, be no matter hardware, the combination of hardware and software, The software performed.As an example, assembly or module can be but be not limited at processor The program of upper operation, processor or one part, hard disk, (optics and/or magnetic storage medium) Device of multi-storage, object, thread, program and/or computer.By illustration, in service The application and this server that run on device can be assembly or module.One or more assembly or module are swept Retouch can in program and/or thread, and assembly or module can local at a computer or processor Go up or be distributed between two or multiple computers or processor.
As used herein, " inference " (infer) or " inferential " (inference) generally refer to via Event, signal and/or data, observe the journey of the state of this system of inference and/or environment from one group The reason of sequence.Inferential can be used to identify specific in literary composition or action, maybe can produce state can Can property be distributed, for example.This is inferential can be random, it is, based on state The calculating of the probability distribution of the states of interest of the consideration of data.Inferential also can refer to for from one Group event and/or the technology of data combination higher levels event.This inferential cause from one group of sight Examining event and/or store event data, construction of new events or action, no matter such event is the tightest Close relevant, no matter and this event and data be from one or more events and data source.
Additionally, the word such as " example " or " demonstration " is to use to refer to use as example, example or example herein Show.Any aspect as " demonstration " described herein or design need not be read as preferable or excellent In other aspect or design.On the contrary, " demonstration " this word is used to be only intended in entity mode Present concept.So used in application, "or" is intended to finger and includes "or" and nonexclusive "or".It is, unless specifically stated otherwise or be perfectly clear from context, otherwise, " X uses A or B " it is intended to refer to automatically to include any one of arrangement.If it is, X uses A； X uses B；Or X uses A and B, then " X uses A or B " meets previously described any one Individual example.Additionally, this applies for and attaches " one " and " one " article used in claim solving Read to be " one or more ", can understand that it refers to single form unless specifically stated otherwise or from context.
Although additionally, aspect can be disclosed by the only one of several embodiments, but these are special Levy and can combine with one or more further feature of other embodiments, as desired, be also advantageous that In any specific or special requisition.Furthermore, " comprising ", " including ", " having ", " contain Have ", its variant and describe in detail or claim used in similar word, be all Be intended as similar with " comprising " as open vicarious word, and do not get rid of any additionally Or other assembly.

Claims (37)

1. a sensor, comprises:
MEMS (MEMS) acoustic sensor, group structure is with process sound in case detecting pattern Sound press Reeb；
Case detecting assembly, comprises ASIC (ASIC), and group structure is with detecting and is somebody's turn to do The sound pressure event that sound pressure ripple is relevant, and produce control signal according to this, with response from this MEMS acoustic sensor receives the signal relevant to this sound pressure ripple；
Multiplexer, group structure, to produce the output signal through multitask, receives this control with response Signal and this signal relevant to this sound pressure ripple；And
Package, comprises lid and package substrate, and wherein, this package has adaptation to connect Receive the port part of this sound pressure ripple and adapt to transmit this output through the output signal of multitask, And wherein, this MEMS acoustic sensor of this pack package, this multiplexer and should Case detecting assembly.
2. sensor as claimed in claim 1, wherein, this is through the output signal bag of multitask Containing interrupting and data, this interruption comprises this control signal, and this datagram contains and this sound pressure This signal that ripple is relevant.
3. sensor as claimed in claim 1, wherein, this case detecting assembly organize again structure with Produce this control signal, to wake up the coder (volume relevant to this sensor up from low power mode Decoder) assembly, sensor maincenter or system processor, process from this sensor with response This through the output signal of multitask.
4. sensor as claimed in claim 1, wherein, this case detecting assembly organize again structure with Detecting sound, voice, ultrasound signal, key word, voice activity or the sound shape preset At least one of state, using as this sound pressure event.
5. sensor as claimed in claim 1, wherein, structure base organized again by this case detecting assembly In relevant to this sound pressure ripple and comprise this signal of analog signal, detecting and this sound pressure This sound pressure event that ripple is relevant.
6. sensor as claimed in claim 1, wherein, structure base organized again by this case detecting assembly In relevant to this sound pressure ripple and comprise this signal of digital signal, detecting and this sound pressure This sound pressure event that ripple is relevant.
7. sensor as claimed in claim 1, also includes:
Model selection assembly, group structure with between several patterns of this sensor set a pattern, These several patterns comprise this case detecting pattern, low electric energy audio mode, standard efficiency mode, Ultrasound pattern or at least one of sleep pattern.
8. sensor as claimed in claim 7, wherein, this model selection assembly organize again structure with It is based partially on the signal on the interface relevant to this case detecting assembly or relevant with this sensor At least one of the state of frenquency signal, sets a pattern of this sensor.
9. sensor as claimed in claim 7, wherein, this frequency relevant to this sensor Signal comprises basic frequency signal or be packaged in this package at least the one of the signal of agitator Person, and wherein, this model selection assembly organizes structure again with based on determining being somebody's turn to do at logic low numerical value Basic frequency signal selects this sleep pattern, based on determining this basic frequency signal at logic high numerical value Select internal frequency that this case detecting pattern starting produces by this agitator, detect in this event Survey this multiplexer of Schema control in this output, to send this control signal, comprise low based on decision This basic frequency signal of frenquency signal selects this low electric energy audio mode and stops to be produced by this agitator Raw internal frequency, control this multiplexer at this low electric energy audio mode and send in this output This signal relevant to this sound pressure ripple and based on determining to comprise this master of altofrequency signal Frenquency signal selects this standard efficiency mode.
10. a sensor, comprises:
MEMS (MEMS) sensor, group structure is with in case detecting mode treatment Supersonic wave pressure Reeb；
Case detecting assembly, comprises ASIC (ASIC), and group structure is with detecting and is somebody's turn to do The ultrasound pressure events that ultrasound pressure wave is relevant, and produce control signal according to this, with response The signal relevant to this ultrasound pressure wave is received from this MEMS sensor.
Package, comprises lid and package substrate, and wherein, this package has output, suitable Should be to transmit this control signal and this signal relevant to this ultrasound pressure wave, and wherein, This MEMS sensor of this pack package and this case detecting assembly.
11. sensor as claimed in claim 10, wherein, structure organized again by this case detecting assembly To produce this control signal, to wake up the coder relevant to this sensor up from low power mode (coder) assembly, sensor maincenter or system processor, process from this sensing with response This of device is through the output signal of multitask.
12. sensors as claimed in claim 10, wherein, structure organized again by this case detecting assembly Based on relevant to this ultrasound pressure wave and comprise this signal of analog signal, detecting and this Supersonic This ultrasound pressure events that wave pressure Reeb is relevant.
13. sensors as claimed in claim 10, wherein, structure organized again by this case detecting assembly Based on relevant to this ultrasound pressure wave and comprise this signal of digital signal, detecting and this Supersonic This ultrasound pressure events that wave pressure Reeb is relevant.
14. sensors as claimed in claim 10, also include:
Multiplexer, group structure, to produce the output signal through multitask, receives this control with response Signal and this signal relevant to this sound pressure ripple.
15. sensors as claimed in claim 14, wherein, this is through the output signal of multitask Comprising interruption and data, this interruption comprises this control signal, and this datagram contains and this ultrasound This signal that pressure wave is relevant.
16. sensors as claimed in claim 14, also include:
Model selection assembly, group structure is to set a mould between several patterns of this sensor Formula, these several patterns comprise this case detecting pattern, low power mode, standard efficiency mode, Ultrasound pattern or at least one of sleep pattern.
17. sensors as claimed in claim 16, wherein, the frequency relevant to this sensor Signal comprises basic frequency signal or be packaged in this package at least the one of the signal of agitator Person, and wherein, this model selection assembly organizes structure again with based on determining being somebody's turn to do at logic low numerical value Basic frequency signal selects this sleep pattern, based on determining this basic frequency signal at logic high numerical value Select internal frequency that this case detecting pattern starting produces by this agitator, detect in this event Survey this multiplexer of Schema control in this output, to send this control signal, comprise low based on decision This basic frequency signal of frenquency signal selects this low power mode stopping to be produced by this agitator Internal frequency, control this multiplexer in this low power mode and send and this Supersonic in this output This signal that wave pressure Reeb is relevant and based on determining this basic frequency news of comprising altofrequency signal Number select this standard efficiency mode.
18. 1 kinds of methods, comprise:
With MEMS (MEMS) acoustic sensor in case detecting mode treatment sound pressure Ripple；
Receive relevant to this sound pressure ripple at case detecting assembly from this MEMS acoustic sensor Signal, this case detecting assembly comprises ASIC (ASIC)；
With the sound pressure event that the detecting of this case detecting assembly is relevant to this sound pressure ripple；
Produce and control signal, to respond this sound pressure event of this detecting；
Produce based on this control signal and this signal relevant to this sound pressure ripple with multiplexer Output signal through multitask；And
Transmitting this output signal through multitask via package, this package comprises lid, bag Piece installing substrate, this MEMS acoustic sensor, this multiplexer and this case detecting assembly.
19. methods as claimed in claim 18, wherein, this generation this through the output of multitask Signal comprises multi-tasking to interrupt and data, and this interruption comprises this control signal, and this signal bag Containing this signal relevant to this sound pressure ripple.
20. methods as claimed in claim 18, wherein, this control signal of this generation comprises product This control signal raw, to wake up the coder (compiling relevant to this sensor up from low power mode Code device) assembly, sensor maincenter or system processor, process from this sensor with response This is through the output signal of multitask.
21. methods as claimed in claim 18, wherein, this sound pressure event bag of this detecting Containing detecting sound, voice, ultrasound signal, key word, voice activity or the sound preset At least one of form, using as this sound pressure event.
22. method as claimed in claim 18, wherein, this detecting and this sound pressure ripple phase This sound pressure event closed comprises based on relevant to this sound pressure ripple and comprise analog signal This signal, detects this sound pressure event relevant to this sound pressure ripple.
23. methods as claimed in claim 18, wherein, this detecting and this sound pressure ripple phase This sound pressure event closed comprises based on relevant to this sound pressure ripple and comprise digital signal This signal, detects this sound pressure event relevant to this sound pressure ripple.
24. methods as claimed in claim 18, also include:
A pattern of this sensor, these several moulds are set between multiple patterns of this sensor Formula comprises this case detecting pattern, low electric energy audio mode, standard efficiency mode, Supersonic mode Formula or at least one of sleep pattern.
25. methods as claimed in claim 24, wherein, this pattern of this setting comprises portion Divide the frequency relevant based on the signal on the interface relevant to this case detecting assembly or this sensor At least one of the state of signal, sets this pattern of this sensor.
26. methods as claimed in claim 25, wherein, this frequency relevant to this sensor Signal comprises basic frequency signal and at least the one of the signal of the agitator being packaged in this package Person, also includes:
Based on determining that this basic frequency signal at logic low numerical value selects this sleep pattern；
Based on determining that this basic frequency signal at logic high numerical value selects this case detecting pattern and opens The dynamic internal frequency produced by this agitator；
In this output, this control signal is sent at this this multiplexer of case detecting Schema control；
Based on determining that this basic frequency signal comprising low frequency signal selects this low electric energy audio mode And stop the internal frequency produced by this agitator；
Control this multiplexer in this low power mode to send in this output and this sound pressure ripple This relevant signal；And
Based on determining that this basic frequency signal comprising altofrequency signal selects this standard efficiency mode.
27. 1 kinds of methods, comprise:
With MEMS (MEMS) sensor at case detecting mode treatment ultrasound pressure wave；
Receive relevant to this ultrasound pressure wave at case detecting assembly from this MEMS sensor Signal, this case detecting assembly comprises ASIC (ASIC)；
With the ultrasound pressure thing that the detecting of this case detecting assembly is relevant to this ultrasound pressure wave Part；
Produce and control signal, to respond this ultrasound pressure events of this detecting；And
This is transmitted through controlling signal and relevant to this ultrasound pressure wave via the output of package This signal, this package comprises lid, package substrate, this MEMS sensor and is somebody's turn to do Case detecting assembly.
28. methods as claimed in claim 27, wherein, this control signal of this generation comprises product Raw control signal, to wake up the coder (coding and decoding relevant to this sensor up from low power mode Device) assembly, sensor maincenter or system processor, with response process from this sensor should Output signal through multitask.
29. methods as claimed in claim 27, wherein, this detecting and this ultrasound pressure wave This relevant ultrasound pressure events comprises based on relevant to this ultrasound pressure wave and comprise simulation This signal of signal, detects this ultrasound pressure events relevant to this ultrasound pressure wave.
30. methods as claimed in claim 27, wherein, this detecting and this ultrasound pressure wave This relevant ultrasound pressure events comprises based on relevant to this ultrasound pressure wave and comprise numeral This signal of signal, detects this ultrasound pressure events relevant to this ultrasound pressure wave.
31. methods as claimed in claim 27, also include:
Based on this control signal and this signal relevant to this ultrasound pressure wave, to be packaged in this Multiplexer in package produces the output signal through multitask.
32. methods as claimed in claim 31, wherein, this generation this through the output of multitask Signal comprises multi-tasking to interrupt and data, and this interruption comprises this control signal, and this datagram Containing this signal relevant to this ultrasound pressure wave.
33. methods as claimed in claim 31, also include:
Monitor the frenquency signal relevant to this sensor, comprise supervision basic frequency signal and be packaged in At least one of the signal of the agitator in this package:
Based on determining that this basic frequency signal at logic low numerical value selects this sleep pattern；
Based on determining that this basic frequency signal at logic high numerical value selects this case detecting pattern and opens The dynamic internal frequency produced by this agitator；
In this output, this control signal is sent at this this multiplexer of case detecting Schema control；
In determining that this basic frequency signal comprising low frequency signal selects this low power mode also The internal frequency only produced by this agitator；
Control this multiplexer in this low power mode to send in this output and this sound pressure ripple This relevant signal；And
Based on determining that this basic frequency signal comprising altofrequency signal selects standard efficiency mode.
34. 1 kinds of systems, comprise:
MEMS (MEMS) sensor package, group structure is with case detecting mode treatment sound Pressure wave, and the output signal of warp let-off multitask is uploaded according to this in the output relevant to this package, This comprises data and interruption through the output signal of multitask, and these data are relevant to this sound pressure ripple；
Sensor maincenter, coder digital signal processor or at least one of primary processor, Group structure is to receive this output signal at least some of through multitask, and is at least partially based on Frenquency signal is sent to this MEMS sensor package through the output signal of multitask by this；With And
Demultiplexer, with this sensor maincenter, this coder digital signal processor or This at least one of this primary processor be correlated with, group structure to receive this output signal through multitask, And maybe this interruption of these data with this sound pressure ripple is sent to this sensor maincenter, should This at least one of coder digital signal processor or this primary processor.
35. systems as claimed in claim 34, wherein, this MEMS sensor package is also Including agitator, this agitator gives this MEMS sensor at this case detecting pattern supply electric energy Package at least some of.
36. systems as claimed in claim 35, wherein, this MEMS sensor package Also including model selection assembly, group structure is with based on determining this basic frequency signal at logic low numerical value Select this sleep pattern, based on determining that this basic frequency signal at logic high numerical value selects this event Internal frequency that sense mode starting is produced by this agitator, at this case detecting Schema control The multiplexer relevant to this MEMS sensor package sends this interruption, base in this output In determining that this basic frequency signal comprising low frequency signal selects low power mode and stops to be shaken by this Swing device produce internal frequency, this low power mode control this multiplexer in this output send out Go out this data relevant to this sound pressure ripple and based on determining to comprise being somebody's turn to do of altofrequency signal Frenquency signal selects standard efficiency mode.
37. systems as claimed in claim 34, wherein, this sensor maincenter, this coding and decoding This at least one of device digital signal processor or this primary processor is that group structure is with from reducing electric energy Mode wakeup, with response receive this this interruption in the output signal of multitask and with this sound At least one of these data that pressure wave is relevant.
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