CN105895284A - Thermal protection-type varistor - Google Patents
Thermal protection-type varistor Download PDFInfo
- Publication number
- CN105895284A CN105895284A CN201610409880.7A CN201610409880A CN105895284A CN 105895284 A CN105895284 A CN 105895284A CN 201610409880 A CN201610409880 A CN 201610409880A CN 105895284 A CN105895284 A CN 105895284A
- Authority
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- China
- Prior art keywords
- fuse
- wire pin
- thermo
- metal electrode
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
- H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to a thermal protection-type varistor, which comprises a pressure-sensitive chip, a thermal fuse, lead wire pins and an encapsulating coating, wherein the surface of the pressure-sensitive chip is coated with a metal electrode layer; one end of each lead wire pin is directly welded with the metal electrode layer or is welded with the metal electrode layer through the thermal fuse and an intermediate electrode; welding spots are formed; the other end of each lead wire pin extends out of the encapsulating coating and is connected with the outside; and the encapsulating coating coats the pressure-sensitive chip, the thermal fuse and one end of each lead wire pin. The thermal protection-type varistor is simple in structure; through the arranged intermediate electrode, the contact area with an electrode of the varistor is ensured; the high-current shock resistance of the product is effectively improved; through introduction of the intermediate electrode, heat conduction is facilitated; arcing when the fuse is blown out is avoided; the reaction speed of the blown fuse is increased; by overall paint encapsulation, an encapsulating paint simultaneously plays roles in isolation of the fuse and the varistor and overall encapsulation of the product; and the technology is simplified.
Description
Technical field
The present invention relates to a kind of varistor, especially a kind of Thermal protection type varistor.
Background technology
Piezoresistor depend on its superior VA characteristic curve, low production cost, electronic circuit overvoltage,
Surge protection aspect is widely used in, but circuit is abnormal because of overvoltage too much in electronic circuit, causes pressure-sensitive
Resistor takes place frequently action, occur performance reduce, lost efficacy, serious time occur that piezoresistor self punctures, fires
Burn phenomenon, cause other resistor assembly of periphery to burn, cause bigger loss；
The finished product electric fuse that on existing market, general employing is traditional and varistor, elastic piece structure and varistor
Structures in series, as being primarily present following several deficiency:
1, small product size is big, it is bigger to take installing space, it is impossible to meet module miniaturized design；
2, Thermal Cutoffs is because of shell, installation site impact, causes temperature transfer feedback speed slow, unfavorable
Disconnect in time in power supply；
3, product component assembles complexity, is unfavorable for automatization, large-scale production.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind of Thermal protection type piezoresistor, it is possible to pressure-sensitive
Before generation height is hot, on fire after resistance failure, more effectively, quickly cuts off the electricity supply, prevent catching fire.
The technical solution adopted in the present invention is: a kind of Thermal protection type piezoresistor, including chip varistor,
Thermo-fuse, wire pin and encapsulating coating；Described chip varistor surface-coated has metal electrode layer；Institute
The one end of the wire pin stated directly is welded with metal electrode layer or by thermo-fuse, target and metal electricity
Pole layer welding, and form solder joint；Make wire pin depart from target after thermo-fuse melts, form open circuit
Protection, described solder joint is alloy solder joint.The wire pin leads other end stretches out encapsulating coating and external connection；
When chip varistor temperature is increased to predetermined temperature, thermo-fuse fuses, and line disconnection connects avoids product high temperature
Abnormal；High-temperaure coating protection product avoids product high-temp combustion, cracking to affect periphery components and parts.Described
One end of chip varistor, thermo-fuse, wire pin is wrapped up by encapsulating coating；Described encapsulating coating is by weight
Percentage ratio be respectively the organic resin 15%～45% through graft modification, inorganic salt filler 15%～50%, hardening
Agent 0.1%～3%, solvent 3%～20% composition.
Further, thermo-fuse of the present invention is the thermo-fuse that internal filling or surface scribble Colophonium；
Or the PUR promoting that fuse disconnects after being heated, can be produced.
Further saying, the organic resin through graft modification of the present invention is by organic resin and containing amine
The silane of base or carry out graft reaction with dimethyldiethoxysilane and form；And this organic resin contain aluminum,
At least one in silicon, zirconium, magnesium, calcium, titanium, iron ion；The silane of amino-contained is diethylin methyl three
Ethoxysilane；Described organic resin is epoxy silicone resin, poly-ammonia organic siliconresin, organosilicon phenol
Urea formaldehyde and/or boron bakelite resin；Described inorganic salt filler be metal-oxide, Pulvis Talci, mica powder,
One or more mixture in carbon black, graphite, molybdenum bisuphide, zinc phosphate.
Further saying, the number of wire pin of the present invention is two；It is respectively the first wire to draw
Foot and the second wire pin；One end of the first described wire pin and the metal electrode layer of chip varistor side
It is connected；The other end of the first wire pin extends to outside encapsulated layer；The one of the second described wire pin
End be connected with thermo-fuse one end, the thermo-fuse other end is connected with target, target again with pressure-sensitive core
Slice surface metal electrode layer connects；The other end of the second wire pin extends to outside encapsulated layer.
Further saying, the number of wire pin of the present invention is three；It is respectively the first wire to draw
Foot, the second wire pin and privates pin；The first described wire pin and the one of the second wire pin
End metal electrode layer with chip varistor both sides respectively is connected；First wire pin and the second wire pin
The other end extends to outside encapsulated layer；One end of described privates pin is connected with thermo-fuse one end,
The thermo-fuse other end is connected with target, and target is connected with chip varistor surface metal electrode again, the
The other end of three wires pin extends to outside encapsulated layer.
Further saying, solder joint of the present invention is containing stannum, silver, the conjunction of one or more compositions of copper
Gold copper-base alloy.
According to product resistance to heavy current impact requirement, use target, can increase and chip varistor surface gold
Belong to electrode contact area, improve product through-current capability.
The invention has the beneficial effects as follows: product structure is simple, and in design, thermo-fuse is connected with target, in
Between electrode again with silver face is connected, target setting ensure that the contact area with piezoresistance electrode, effectively
Improve the resistance to high current impulse withstanding capability of product, target be imported with beneficially conduction of heat, avoid drawing during fuse failure
Arc, accelerates fuse response speed fast；New construction uses overall coating encapsulating, and encapsulating coating simultaneously works as melting
Silk and pressure sensitive electrodes isolation, the function of product entirety encapsulating, Simplified flowsheet；New construction is suitable to automatization, rule
Mould produces, and according to varistor needs, selects the combination of different size thermo-fuse, flexible design, applicable field
Close extensively.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of existing imitative SPD shell fragment technology；
Fig. 2 is the structural representation of existing Thermal Cutoffs technology；
Fig. 3 (a) is the structural representation of two wire pins of the present invention；
Fig. 3 (b) is the structural side view of Fig. 3 (a)；
Fig. 4 (a) is the structural representation of three wire pins of the present invention；
Fig. 4 (b) is the structural side view of Fig. 4 (a)；
In figure: 1, alloy solder joint；2, target；3, chip varistor；4, thermo-fuse；5, encapsulating is coated with
Layer；6, wire pin.
Detailed description of the invention
Presently in connection with accompanying drawing and preferred embodiment, the present invention is further detailed explanation.These accompanying drawings are
The schematic diagram simplified, illustrates the basic structure of the present invention the most in a schematic way, and therefore it only shows and the present invention
Relevant composition.
Fig. 1, shown in 2 it is the structure of varistor of prior art；Institute in its weak point such as background technology
State, narration is not repeated herein.
Fig. 3 and Fig. 4 is present configuration schematic diagram, including chip varistor, thermo-fuse, target, draws
Foot wire, encapsulating coating；Described chip varistor surface-coated has metal electrode layer；The one of described wire
End is welded with silver electrode layer or is welded with pressure sensitive electrodes layer by fuse, target, forms alloy solder joint；
Described thermo-fuse is the thermo-fuse that internal filling or surface scribble the flux material such as Colophonium；Encapsulating coating will pressure
Chip, thermo-fuse, target, wire one end parcel, the wire other end stretches out coating can be with external connection；
When chip varistor temperature is increased to predetermined temperature, thermo-fuse fuses, and causes wire to depart from chip varistor,
Line disconnection connects avoids product height temperature abnormality；Coating protection product avoids product high-temp combustion, cracking impact
Periphery components and parts.One end of chip varistor, thermo-fuse, wire pin is wrapped up by encapsulating coating；Described bag
Seal the organic resin 15%～45% through graft modification, inorganic salt filler that coating is respectively by percentage by weight
15%～50%, sclerosing agent 0.1%～3%, solvent 3%～20% composition.The described organic tree through graft modification
Fat is the silane by organic resin and amino-contained or carries out graft reaction with dimethyldiethoxysilane and form；
And this organic resin contains at least one in aluminum, silicon, zirconium, magnesium, calcium, titanium, iron ion.Described contains
The silane of amido is diethylin MTES.Described organic resin be epoxy silicone resin,
Poly-ammonia organic siliconresin, organosilicon phenolic resin and/or boron bakelite resin.Inorganic salt filler be metal-oxide,
One or more mixing in Pulvis Talci, mica powder, carbon black, graphite, molybdenum bisuphide, zinc phosphate
Thing.Grafting modification agent can be Poly (dimethyl siloxane) (PDMS), MPS
(3‐methacryloxy‐propyl‐trimethoxysilane)、GPS(3‐glycidoxypropyl‐trimethoxysilane)
Or be ring-type Si oxide and the silica with specific response functional group (vinyl, amino, epoxy group)
Alkane coupling agent etc..Sclerosing agent is any one of amine or anhydrides.Solvent is the mixed liquor of toluene and dimethylbenzene.
With resistant to elevated temperatures organic resin as base material, add containing aluminum, silicon, zirconium, magnesium, calcium, titanium, the connecing of ferrum plasma
The insulating heat-conduction material of branch modification forms organic material, utilizes associativity and the formability of organic material, shapes
In component external.Bearing pyroprocess when assembly moment, organic material can be lost by slow self sacrifice, and has
Machine graft, because sacrificing consume process containing aluminum, silicon, zirconium, magnesium, calcium, titanium, ferrum plasma, can height
Temperature oxidation forms the metal-oxide of nano-scale, and these nano-scale metal-oxides have insulation heat biography
Function and form the defencive function of resistance to instantaneous high-temperature, another characteristic of this conjugate is high temperature heat-resistant impact.
In Fig. 3 example, the number of product wire pin is two, and the respectively first wire pin and second is led
Wire pin；Described one end of the first wire pin is connected with the metal electrode layer of chip varistor side；The
The other end of one wire pin extends to outside encapsulated layer；One end of the second described wire pin and pressure-sensitive core
The metal electrode layer of sheet opposite side is connected, and is connected with thermo-fuse one end, and the thermo-fuse other end is with middle
Electrode connects, and target metal electrode with chip varistor surface again is connected；Another of second wire pin
End extends to outside encapsulated layer.
In Fig. 4 example, the number of product wire pin is three, the respectively first wire pin, second leads
Wire pin and privates pin；The first described wire pin and one end of the second wire pin respectively with pressure
The metal electrode layer of quick chip both sides is connected；The other end of the first wire pin and the second wire pin extends
To encapsulated layer；One end of described privates pin is connected with the metal electrode layer of chip varistor side
Connect；Described privates pin is connected with thermo-fuse one end, and the thermo-fuse other end is connected with target,
Target is connected with its chip varistor surface metal electrode again, and the other end of privates pin extends to bag
Outside sealing.
The surface structure of the present invention can be round, square etc. because of chip varistor, embedding shell shape, encapsulating
Mode is powder painting, liquid painting, embedding etc.；Present configuration is simple, voltage dependent resistor chip, thermo-fuse, electricity
Polar conductor can be worked continuously with automated production, it is not necessary to manually participates in assembling, and encapsulating, embedding can be used to make
Industry, employing heat conductivity, the coating that high temperature resistant superiority is good, add the thermo-fuse timely feedback to temperature,
Ensure the effectiveness of Thermal protection, simultaneously because of structure be simply easy to be greatly improved automatically, large-scale production operation；
The present invention can also be according to customer demand, and solder joint selects different temperatures alloy thermo-fuse, coordinates with varistor,
It is widely used in various temperature, overvoltage protection occasion.Compared with the varistor used in the market, this
Invention has overheated cutting off the electricity supply, and prevents catching fire function；With existing traditional general varistor addition
Product Temperature protection, copy SPD elastic piece structure assemble compare, the present invention has feedback speed faster, more
Fast cutting off the electricity supply prevents catching fire, and simple in construction, cost are extremely low, can be suitable for, replace existing tradition
Thermal protection type varistor, be suitable for various overvoltage circuits protection.
The detailed description of the invention of the simply present invention described in description above, various illustrations are not to this
Bright flesh and blood is construed as limiting, and person of an ordinary skill in the technical field is permissible after having read description
The most described detailed description of the invention is made an amendment or deformed, without departing from the spirit and scope of the invention.
Claims (6)
1. a Thermal protection type piezoresistor, it is characterised in that: include chip varistor, thermo-fuse, wire
Pin and encapsulating coating；Described chip varistor surface-coated has metal electrode layer；Described wire pin
One end directly weld with metal electrode layer or pass through thermo-fuse, target welds with metal electrode layer, and
Form solder joint；The wire pin leads other end stretches out encapsulating coating and external connection；Described encapsulating coating will
Chip varistor, thermo-fuse, one end parcel of wire pin；Described encapsulating coating is by percentage by weight respectively
For the organic resin 15%～45% through graft modification, inorganic salt filler 15%～50%, sclerosing agent 0.1%～3%,
Solvent 3%～20% forms.
2. Thermal protection type piezoresistor as claimed in claim 1, it is characterised in that: described thermo-fuse
It is internal fill or surface scribbles the thermo-fuse of Colophonium；Or the hot melt promoting that fuse disconnects after being heated, can be produced
Glue.
3. Thermal protection type piezoresistor as claimed in claim 1, it is characterised in that: described through grafting
Modified organic resin is by organic resin and the silane of amino-contained or to connect with dimethyldiethoxysilane
Branch reaction forms；And this organic resin contains at least in aluminum, silicon, zirconium, magnesium, calcium, titanium, iron ion
Kind；The silane of amino-contained is diethylin MTES；Described organic resin is that epoxy is organic
Silicones, poly-ammonia organic siliconresin, organosilicon phenolic resin and/or boron bakelite resin；Described inorganic salt is filled out
Material is the one in metal-oxide, Pulvis Talci, mica powder, carbon black, graphite, molybdenum bisuphide, zinc phosphate
Or two or more mixture.
4. Thermal protection type piezoresistor as claimed in claim 1, it is characterised in that: described wire draws
The number of foot is two；It is respectively the first wire pin and the second wire pin；The first described wire pin
One end be connected with the metal electrode layer of chip varistor side；The other end of the first wire pin extends to bag
Outside sealing；One end of the second described wire pin is connected with thermo-fuse one end, the thermo-fuse other end with
Target connects, and target is connected with chip varistor surface metal electrode layer again；Second wire pin
The other end extends to outside encapsulated layer.
5. Thermal protection type piezoresistor as claimed in claim 1, it is characterised in that: described wire draws
The number of foot is three；It is respectively the first wire pin, the second wire pin and privates pin；Described
The first wire pin and one end metal electrode layer with chip varistor both sides respectively of the second wire pin be connected
Connect；The other end of the first wire pin and the second wire pin extends to outside encapsulated layer；Described the 3rd leads
One end of wire pin is connected with thermo-fuse one end, and the thermo-fuse other end is connected with target, target
Being connected with chip varistor surface metal electrode, the other end of privates pin extends to outside encapsulated layer again.
6. Thermal protection type piezoresistor as claimed in claim 1, it is characterised in that: described solder joint is
Containing stannum, silver, the alloy material of one or more compositions of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610409880.7A CN105895284A (en) | 2016-06-12 | 2016-06-12 | Thermal protection-type varistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610409880.7A CN105895284A (en) | 2016-06-12 | 2016-06-12 | Thermal protection-type varistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895284A true CN105895284A (en) | 2016-08-24 |
Family
ID=56730332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610409880.7A Pending CN105895284A (en) | 2016-06-12 | 2016-06-12 | Thermal protection-type varistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105895284A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300638A (en) * | 2018-11-27 | 2019-02-01 | 深圳市辰驹电子科技有限公司 | Anti- power frequency arc extinguishing encapsulation piezoresistor and packaging method |
| CN111200098A (en) * | 2020-01-08 | 2020-05-26 | 深圳市力电电池有限公司 | Button battery pin and welding method thereof |
| WO2020107190A1 (en) * | 2018-11-27 | 2020-06-04 | 深圳市辰驹电子科技有限公司 | Power frequency voltage withstanding and arc-extinguishing packaged varistor and packaging method |
| CN114141459A (en) * | 2021-12-25 | 2022-03-04 | 贵州凯里经济开发区中昊电子有限公司 | Over-temperature protection method and structure of nano-alloy electrode piezoresistor |
| CN114843054A (en) * | 2022-04-01 | 2022-08-02 | 华南理工大学 | Packaging material and packaging method for piezoresistor |
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| CN200959260Y (en) * | 2006-10-13 | 2007-10-10 | 舜全电气器材(东莞)有限公司 | Combustion-proof pressure-sensitive resistor |
| CN101320605A (en) * | 2007-06-06 | 2008-12-10 | 兴勤电子工业股份有限公司 | Piezoresistor with heat protection function |
| CN102337002A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof |
| CN102337003A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Epoxy resin encapsulating material modified by organosilicon, its preparation method and its application |
| CN105390219A (en) * | 2015-12-14 | 2016-03-09 | 天津凯华绝缘材料股份有限公司 | Component with over-voltage over-current protective effect and manufacturing process of the same |
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2016
- 2016-06-12 CN CN201610409880.7A patent/CN105895284A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN200959260Y (en) * | 2006-10-13 | 2007-10-10 | 舜全电气器材(东莞)有限公司 | Combustion-proof pressure-sensitive resistor |
| CN101320605A (en) * | 2007-06-06 | 2008-12-10 | 兴勤电子工业股份有限公司 | Piezoresistor with heat protection function |
| CN102337002A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300638A (en) * | 2018-11-27 | 2019-02-01 | 深圳市辰驹电子科技有限公司 | Anti- power frequency arc extinguishing encapsulation piezoresistor and packaging method |
| WO2020107190A1 (en) * | 2018-11-27 | 2020-06-04 | 深圳市辰驹电子科技有限公司 | Power frequency voltage withstanding and arc-extinguishing packaged varistor and packaging method |
| CN111200098A (en) * | 2020-01-08 | 2020-05-26 | 深圳市力电电池有限公司 | Button battery pin and welding method thereof |
| CN111200098B (en) * | 2020-01-08 | 2022-08-19 | 深圳市力电电池有限公司 | Button battery pin and welding method thereof |
| CN114141459A (en) * | 2021-12-25 | 2022-03-04 | 贵州凯里经济开发区中昊电子有限公司 | Over-temperature protection method and structure of nano-alloy electrode piezoresistor |
| CN114843054A (en) * | 2022-04-01 | 2022-08-02 | 华南理工大学 | Packaging material and packaging method for piezoresistor |
| CN114843054B (en) * | 2022-04-01 | 2023-11-28 | 华南理工大学 | Encapsulating material and encapsulating method for piezoresistor |
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Application publication date: 20160824 |
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