CN105892163A - Mother board and frame sealing glue coating manner for mother board - Google Patents
Mother board and frame sealing glue coating manner for mother board Download PDFInfo
- Publication number
- CN105892163A CN105892163A CN201610416625.5A CN201610416625A CN105892163A CN 105892163 A CN105892163 A CN 105892163A CN 201610416625 A CN201610416625 A CN 201610416625A CN 105892163 A CN105892163 A CN 105892163A
- Authority
- CN
- China
- Prior art keywords
- motherboard
- unit
- liquid crystal
- arranged side
- plastic box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
The invention relates to a mother board and a frame sealing glue coating manner for the mother board. The mother board comprises a plurality of liquid crystal panels which are arranged in a rectangular array side by side; two liquid crystal panels are called as a unit when the two liquid crystal panels which are arranged side by side meet the position relations that corresponding source ends are relatively close to each other and corresponding OLB areas are relatively away from each other; the mother board comprises at least two units which are arranged side by side in the same direction; frame sealing glue is coated along the periphery of the units which are arranged side by side in the same direction; the frame sealing glue is also straight coated along the joints of the liquid crystal panels which form the units that are arranged side by side in the same direction. The invention further provides the frame sealing glue coating manner for the mother board. According to the mother board and the frame sealing glue coating manner for the mother board provided by the invention, poor cutting caused by the condition that the frame sealing glue cannot be coated can be avoided; meanwhile, the requirements on a COS design of three sides can also be met.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly relate to the sealed plastic box coating of a kind of motherboard and motherboard
Mode.
Background technology
TFT-LCD i.e. thin film transistor (TFT) LCD, is in active matrix type liquid crystal display (AM-LCD)
One.Liquid crystal flat panel display, special TFT-LCD, is currently the only in brightness, contrast, merit
Catch up with in the combination properties such as consumption, life-span, volume and weight and display device more than CRT comprehensively, it
Function admirable, large-scale production characteristic are good, and automaticity is high, and the cost of raw material is cheap, development space
Wide, the main product of new century will be rapidly become, be a bright spot of 21 century global economy growth.
A new generation TFT-LCD is low temperature polycrystalline silicon (LTPS) product at present.
Development trend current for LCD is more and more narrower frame design.And LCD face
By all sealed plastic boxs (Seal) made a circle by thin film transistor (TFT) glass (TFT Glass) base during plate laminating
Plate gets up with color filter glass (CF Glass) base plate bonding.Small size panel when design is all
Design by (Side By Side) side by side increases the utilization rate of glass.Frame when LCD
(Border) when constantly reducing, especially source side (Source End), source side and neighbouring panel
(Panel) outer pin laminating (OLB) region tends to being close together tightly, the sealed plastic box that source side is corresponding
Spreading area reduces, and when Seal coating occurs skew, will be applied to neighbouring panel (Panel) corresponding
OLB region, cause this region glass offal timber to peel off.Specifically can be found in Fig. 1 and Fig. 2, Fig. 1
For the schematic diagram of existing sealed plastic box coating method (single panel), Fig. 2 is existing sealed plastic box coating method
The schematic diagram of (multiple panel).The panel 10 that Fig. 1 shows, by TFT glass substrate 1 and CF glass
Substrate 2 is bonded by sealed plastic box 4, and panel 10 is arranged above source side, and lower section is OLB region
3, the region filled with oblique line in accompanying drawing represents the distribution of sealed plastic box 4, and sealed plastic box 4 mainly includes ring
Around the part of the distribution that makes a circle in effective viewing area (AA) week, and close on effectively along OLB region 3
The part of the marginal distribution of viewing area.The liquid crystal panel of the corresponding final size of the panel 10 shown in Fig. 1,
Actual production is get from motherboard cutting processing.Seeing Fig. 2, whole motherboard correspondence has 4 side by side
Panel 10.When pursuing the narrow frame design of panel 10 source side, the envelope that panel 10 source side is corresponding
Frame glue spreading area reduces, and when sealed plastic box coating occurs skew, will be applied to neighbouring panel (Fig. 2
In be the panel of top) corresponding OLB region, cause this region glass offal timber to peel off.
In order to solve the problems referred to above, prior art exists another kind and is applied in sealed plastic box cutting
The sealed plastic box coating method that (COS, cut on seal) designs, namely along the coating side of sealed plastic box cutting
Formula.Seeing Fig. 3, it is the showing of sealed plastic box coating method (multiple panel) of existing 3 limit COS designs
It is intended to.Panel 10 is bonded by sealed plastic box 4 by TFT glass substrate 1 and CF glass substrate 2,
There is OLB region 3.Use source side relative with source side when panel 10 is arranged on motherboard, OLB
The mode that region is relative with OLB region, this mode all can use COS to set except OLB side
Count, and sealed plastic box will not be applied to adjacent OLB region, causes this region glass offal timber to peel off.
This sealed plastic box coating method also can face a problem, that is, in Fig. 3, dotted line frame region has one
Segment glass substrate is applied to entirely without by sealed plastic box, because here sealed plastic box cannot overlap.In reality
During the cutting of border, glass here does not has the support of sealed plastic box to be susceptible to fragmentation, causes cutting bad.
Summary of the invention
Therefore, it is an object of the invention to provide a kind of motherboard, solving sealed plastic box cannot be applied to and cause
The bad problem of cutting.
Another object of the present invention is to provide the sealed plastic box coating method of a kind of motherboard, solve sealed plastic box without
What method was applied to and caused cuts bad problem.
For achieving the above object, the invention provides a kind of motherboard, including: rectangular array is arranged side by side
Multiple liquid crystal panels, when two liquid crystal panels being arranged side by side meet corresponding source side relatively against and corresponding
During the position relationship that OLB region is relatively distant from, this two liquid crystal panel is referred to as unit, described motherboard bag
Include the unit that at least two is arranged side by side in the same direction；Peripheral coating around the described unit being arranged side by side in the same direction
Having sealed plastic box, the also junction along the liquid crystal panel of the unit being arranged side by side in the same direction described in composition is linearly coated with
It is furnished with sealed plastic box.
Wherein, described motherboard includes three unit being arranged side by side in the same direction.
Wherein, described motherboard includes four unit being arranged side by side in the same direction.
Wherein, the periphery of the described unit being arranged side by side in the same direction include described in the unit that is arranged side by side in the same direction
The outermost in territory, effective display area.
Wherein, the periphery of the described unit being arranged side by side in the same direction also include described in the unit that is arranged side by side in the same direction
The edge in corresponding OLB region.
Wherein, described sealed plastic box is ultraviolet curing sealed plastic box.
Wherein, described sealed plastic box is heat cure sealed plastic box.
Wherein, described liquid crystal panel at least includes TFT glass substrate and CF glass substrate.
Wherein, described liquid crystal panel is LTPS panel.
For achieving the above object, present invention also offers the sealed plastic box coating method of a kind of motherboard, including:
This motherboard includes multiple liquid crystal panels that rectangular array is arranged side by side, when two liquid crystal panels being arranged side by side
Meet corresponding source side relatively against and during position relationship that corresponding OLB region is relatively distant from, by this two liquid
Crystal panel is referred to as unit, and described motherboard includes the unit that at least two is arranged side by side in the same direction；By sealed plastic box
Around the peripheral coating of the described unit being arranged side by side in the same direction, described in described sealed plastic box also edge composition the most also
The junction of the liquid crystal panel of the unit of row's arrangement is linearly coated with.
In sum, the sealed plastic box coating method of motherboard of the present invention and motherboard can avoid sealed plastic box to be coated with
Cloth to and the cutting that causes is bad, the demand of 3 limit COS designs can also be met simultaneously.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings, by the detailed description of the invention of the present invention is described in detail, will make the present invention's
Technical scheme and other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is the schematic diagram of existing sealed plastic box coating method (single panel)；
Fig. 2 is the schematic diagram of existing sealed plastic box coating method (multiple panel)；
Fig. 3 is the schematic diagram of the sealed plastic box coating method (multiple panel) of existing 3 limit COS designs；
Fig. 4 is the structural representation of motherboard one of the present invention preferred embodiment.
Detailed description of the invention
Seeing Fig. 4, it is the structural representation of motherboard one of the present invention preferred embodiment.This motherboard mainly wraps
Include: multiple liquid crystal panels 20 that rectangular array is arranged side by side, when two liquid crystal panels 20 being arranged side by side
Meet corresponding source side relatively against and during position relationship that corresponding OLB region 23 is relatively distant from, should
Two liquid crystal panel 20 referred to as unit 30, the motherboard of preferred embodiment shown in Fig. 4 includes two the most also
The unit 30 of row's arrangement；Periphery around the unit being arranged side by side in the same direction is coated with sealed plastic box 24, also along group
The junction becoming the liquid crystal panel 20 of the unit 30 being arranged side by side in the same direction is linearly coated with sealed plastic box 25.
Sealed plastic box 24 or 25 can be ultraviolet curing sealed plastic box or heat cure sealed plastic box.The knot of liquid crystal panel 20
Structure at least includes TFT glass substrate 21 and CF glass substrate 22.Liquid crystal panel 20 can be LTPS
Panel, or other types two-d display panel.
Fig. 4 illustrate only simplest motherboard structure, actually motherboard and can include more arranging the most side by side
The unit 30 of row, such as three, four etc., it is also possible to include that other do not meet the knot of unit 30
Structure.As seen from Figure 4, the unit 30 being arranged side by side in the same direction includes what rectangular array was arranged side by side
Multiple liquid crystal panels 20, the periphery of the unit 30 being arranged side by side in the same direction actually includes being arranged side by side in the same direction
The outermost in territory, effective display area of unit 30, the unit 30 also including being arranged side by side in the same direction corresponding
The edge in OLB region 23.
For the motherboard structure of Fig. 4, present invention also offers corresponding sealed plastic box coating method, specifically side
Formula can draw according to the description of above-mentioned motherboard structure, does not repeats them here.
The motherboard of the present invention and the sealed plastic box coating method of motherboard, for prior art Fig. 3 dotted line frame region
What sealed plastic box cannot be applied to and cause cuts bad problem, it is proposed that a kind of 3 new limit COS envelopes
Frame glue coating method, can effectively solve the problems referred to above.The scheme that the present invention proposes designs at COS
Time, for using source side relative with source side, the OLB region mode relative with OLB region is carried out
During sealed plastic box coating, first in periphery coating one circle sealed plastic box, the most in the panel between the local employing of handing-over
The coating method of straight line, the sealed plastic box coating method of similar " field " type, see Fig. 4, can be with efficient solution
The cutting that Fig. 3 dotted line frame region sealed plastic box of determining cannot be applied to and cause is bad, can also meet 3 simultaneously
The demand of limit COS design, is COS design, it is simple to cutting processing in addition to OLB region.
Present invention can apply to:
1, liquid crystal display row scanning (Gate) drive circuit being integrated on Array substrate；
2, this circuit can be applicable to mobile phone, display, the raster data model field of TV；
3, the present invention can contain the industry advanced technology of LCD and OLED；
4, the stability of this circuit is applicable in the middle of the panel design of high-res.
In sum, the motherboard of the present invention and the sealed plastic box coating method of motherboard can effectively solve mesozone
The cutting that territory cannot be caused by sealed plastic box coating is bad, can also meet 3 limit COS design requirements simultaneously.
The above, for the person of ordinary skill of the art, can be according to the technical side of the present invention
Other various corresponding changes and deformation are made in case and technology design, and all these change and deformation are all answered
Belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a motherboard, it is characterised in that including: multiple liquid crystal surface that rectangular array is arranged side by side
Plate, when two liquid crystal panels being arranged side by side meet corresponding source side relatively against and corresponding OLB region is relative
Away from position relationship time, this two liquid crystal panel is referred to as unit, described motherboard include at least two with
To the unit being arranged side by side；Periphery around the described unit being arranged side by side in the same direction is coated with sealed plastic box, also
Junction along the liquid crystal panel of the unit being arranged side by side in the same direction described in composition is linearly coated with sealed plastic box.
2. motherboard as claimed in claim 1, it is characterised in that described motherboard includes three the most side by side
The unit of arrangement.
3. motherboard as claimed in claim 1, it is characterised in that described motherboard includes four the most side by side
The unit of arrangement.
4. motherboard as claimed in claim 1, it is characterised in that the described unit being arranged side by side in the same direction
Periphery include described in the outermost in the territory, effective display area of unit that is arranged side by side in the same direction.
5. motherboard as claimed in claim 1, it is characterised in that the described unit being arranged side by side in the same direction
Peripheral also include described in the edge in the corresponding OLB region of unit that is arranged side by side in the same direction.
6. motherboard as claimed in claim 1, it is characterised in that described sealed plastic box is ultraviolet curing envelope
Frame glue.
7. motherboard as claimed in claim 1, it is characterised in that described sealed plastic box is that frame is sealed in heat cure
Glue.
8. motherboard as claimed in claim 1, it is characterised in that described liquid crystal panel at least includes TFT
Glass substrate and CF glass substrate.
9. motherboard as claimed in claim 1, it is characterised in that described liquid crystal panel is LTPS face
Plate.
10. the sealed plastic box coating method of a motherboard, it is characterised in that including: this motherboard includes in square
Multiple liquid crystal panels that shape array is arranged side by side, when two liquid crystal panels being arranged side by side meet corresponding source side
Relatively against and during position relationship that corresponding OLB region is relatively distant from, this two liquid crystal panel is the most single
Unit, described motherboard includes the unit that at least two is arranged side by side in the same direction；By sealed plastic box around described the most also
The peripheral coating of the unit of row's arrangement, described sealed plastic box is also along the unit being arranged side by side in the same direction described in composition
The junction of liquid crystal panel is linearly coated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416625.5A CN105892163A (en) | 2016-06-12 | 2016-06-12 | Mother board and frame sealing glue coating manner for mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416625.5A CN105892163A (en) | 2016-06-12 | 2016-06-12 | Mother board and frame sealing glue coating manner for mother board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105892163A true CN105892163A (en) | 2016-08-24 |
Family
ID=56730517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610416625.5A Pending CN105892163A (en) | 2016-06-12 | 2016-06-12 | Mother board and frame sealing glue coating manner for mother board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105892163A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008089775A (en) * | 2006-09-29 | 2008-04-17 | Optrex Corp | Manufacturing method of mother substrate and liquid crystal display panel |
| JP2010128454A (en) * | 2008-12-01 | 2010-06-10 | Sharp Corp | Liquid crystal display panel and method of manufacturing the same |
| CN102844703A (en) * | 2010-04-23 | 2012-12-26 | 夏普株式会社 | Method for forming separation-inducing groove, mother liquid crystal panel, and separation method |
| CN103885224A (en) * | 2012-12-19 | 2014-06-25 | 株式会社日本显示器 | Manufacture method of LCD device and motherboard |
| CN103995385A (en) * | 2014-05-09 | 2014-08-20 | 京东方科技集团股份有限公司 | Display motherboard and cutting method thereof |
-
2016
- 2016-06-12 CN CN201610416625.5A patent/CN105892163A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008089775A (en) * | 2006-09-29 | 2008-04-17 | Optrex Corp | Manufacturing method of mother substrate and liquid crystal display panel |
| JP2010128454A (en) * | 2008-12-01 | 2010-06-10 | Sharp Corp | Liquid crystal display panel and method of manufacturing the same |
| CN102844703A (en) * | 2010-04-23 | 2012-12-26 | 夏普株式会社 | Method for forming separation-inducing groove, mother liquid crystal panel, and separation method |
| CN103885224A (en) * | 2012-12-19 | 2014-06-25 | 株式会社日本显示器 | Manufacture method of LCD device and motherboard |
| CN103995385A (en) * | 2014-05-09 | 2014-08-20 | 京东方科技集团股份有限公司 | Display motherboard and cutting method thereof |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160824 |
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| RJ01 | Rejection of invention patent application after publication |