CN105885421A - Organic silicon material for packaging and preparation method thereof - Google Patents
Organic silicon material for packaging and preparation method thereof Download PDFInfo
- Publication number
- CN105885421A CN105885421A CN201610314486.5A CN201610314486A CN105885421A CN 105885421 A CN105885421 A CN 105885421A CN 201610314486 A CN201610314486 A CN 201610314486A CN 105885421 A CN105885421 A CN 105885421A
- Authority
- CN
- China
- Prior art keywords
- packaging
- organic silicon
- catalyst
- organosilicon
- diluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses an organic silicon material for packaging and a preparation method thereof. The organic silicon material is prepared by mixing components: composite silicon resin, organic silicon silicone oil, a catalyst and a diluent. According to the organic silicon material for packaging, which is disclosed by the invention, by repeatedly testing and combining performance of each material, the best formula is obtained; by adding the composite silicon resin, strength of the packaging material is effectively reinforced. Light transmittance can reach 98 percent, and curing time of the packaging material can be changed by regulating the quantity of the catalyst. When the prepared organic silicon packaging material is applied to a high-power white light LED (Light-Emitting Diode), luminous flux of the white light LED can reach 42.65lm by measurement, so that a good application effect is achieved.
Description
Technical field
The present invention relates to field of new, be specifically related to a kind of organosilicon material for packaging and preparation method thereof.
Background technology
The most perfect along with power type white light LED manufacturing technology, its luminous efficiency, brightness and power all have increased significantly.Meanwhile, LED encapsulating material is also faced with huge challenge, uses high refractive index, high resistance to ultraviolet ability and heat-proof aging ability, the encapsulating material of low stress, can significantly improve optical output power and the service life of illuminating device.Domestic currently used more still epoxy resin encapsulating material, after epoxy resin cure, crosslink density is high, and internal stress is big, and fragility is big, poor impact resistance, and, temperature rising and blue light and ultraviolet irradiation can make the transparency degradation of epoxy resin.Under big current conditions, encapsulating material even can carbonization.
Summary of the invention
Present invention aim at, it is provided that a kind of organosilicon material for packaging.
It is another object of the present invention to provide the preparation method of a kind of organosilicon material for packaging.
The technical solution adopted in the present invention is:
A kind of organosilicon material for packaging, it is characterised in that mixed by weight percentage by following components:
Comprehensive silicon resin
10-25 part
Organosilicon silicone oil
60-85 part
Catalyst
3-5 part
Diluent
8-15 part.
Further, described catalyst is platinum catalyst.
Further, described diluent is ethyl acetate.
Wherein, the method preparing organosilicon material for packaging, step is as follows:
(1) by appropriate comprehensive silicon resin, join in organosilicon silicone oil, stir, obtain component A；
(2) in component A, add catalyst and diluent, and stir, react 1-2h, obtain organosilicon material for packaging.
The present invention provides the benefit that relative to prior art: the organosilicon material for packaging of the present invention, through test repeatedly, in conjunction with the performance of each material, obtains optimal formula, by adding comprehensive silicon resin, effectively enhances the intensity of encapsulating material.Light transmittance may be up to 98 %, and encapsulating material can be changed by the amount of regulation catalyst hardening time.Applying on large power white light LED by the organosilicon encapsulating material of preparation, the luminous flux of measurement white light LEDs, up to 42.65 lm, has reached preferable application effect.
Detailed description of the invention
Below with reference to embodiment, the design of the present invention and the technique effect of generation are clearly and completely described, to be completely understood by the purpose of the present invention, feature and effect.Obviously; described embodiment is a part of embodiment of the present invention rather than whole embodiment, based on embodiments of the invention; other embodiments that those skilled in the art is obtained on the premise of not paying creative work, belong to the scope of protection of the invention.
Embodiment 1: a kind of organosilicon material for packaging, it is characterised in that mixed by weight percentage by following components:
Comprehensive silicon resin
15 parts
Organosilicon silicone oil
73 parts
Catalyst
3 parts
Diluent
9 parts.
Embodiment 2: a kind of organosilicon material for packaging, it is characterised in that mixed by weight percentage by following components:
Comprehensive silicon resin
20 parts
Organosilicon silicone oil
64 parts
Platinum catalyst
4 parts
Ethyl acetate
12 parts.
Wherein, the method preparing organosilicon material for packaging, step is as follows:
(1) by appropriate comprehensive silicon resin, join in organosilicon silicone oil, stir, obtain component A；
(2) in component A, add catalyst and diluent, and stir, react 1-2h, obtain organosilicon material for packaging.
Above the better embodiment of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent modifications or replacement on the premise of spirit of the present invention, and modification or the replacement of these equivalents are all contained in the application claim limited range.
Claims (4)
1. an organosilicon material for packaging, it is characterised in that mixed by weight percentage by following components:
Comprehensive silicon resin
10-25 part
Organosilicon silicone oil
60-85 part
Catalyst
3-5 part
Diluent
8-15 part.
Organosilicon material for packaging the most according to claim 1, it is characterised in that described catalyst is platinum catalyst.
Organosilicon material for packaging the most according to claim 1, it is characterised in that described diluent is ethyl acetate.
4. the method preparing organosilicon material for packaging, step is as follows:
(1) by appropriate comprehensive silicon resin, join in organosilicon silicone oil, stir, obtain component A；
(2) in component A, add catalyst and diluent, and stir, react 1-2h, obtain organosilicon material for packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610314486.5A CN105885421A (en) | 2016-05-13 | 2016-05-13 | Organic silicon material for packaging and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610314486.5A CN105885421A (en) | 2016-05-13 | 2016-05-13 | Organic silicon material for packaging and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105885421A true CN105885421A (en) | 2016-08-24 |
Family
ID=56715900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610314486.5A Withdrawn CN105885421A (en) | 2016-05-13 | 2016-05-13 | Organic silicon material for packaging and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105885421A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205235A (en) * | 2013-02-19 | 2013-07-17 | 浙江中天氟硅材料有限公司 | Novel transparent deep curing electronic pouring sealant and preparation method thereof |
| CN103665879A (en) * | 2013-11-04 | 2014-03-26 | 北京石油化工学院 | Organic silicon gel composition for high-power LED (light-emitting diode) packaging |
| CN104448835A (en) * | 2013-09-25 | 2015-03-25 | 江苏尚明光电有限公司 | Silicone rubber for LED packaging |
-
2016
- 2016-05-13 CN CN201610314486.5A patent/CN105885421A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205235A (en) * | 2013-02-19 | 2013-07-17 | 浙江中天氟硅材料有限公司 | Novel transparent deep curing electronic pouring sealant and preparation method thereof |
| CN104448835A (en) * | 2013-09-25 | 2015-03-25 | 江苏尚明光电有限公司 | Silicone rubber for LED packaging |
| CN103665879A (en) * | 2013-11-04 | 2014-03-26 | 北京石油化工学院 | Organic silicon gel composition for high-power LED (light-emitting diode) packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160824 |
|
| WW01 | Invention patent application withdrawn after publication |