CN105862092A - Electroplate liquid of alkaline electrocoppering titanium alloy and preparing method and electroplating technology of electroplate liquid - Google Patents
Electroplate liquid of alkaline electrocoppering titanium alloy and preparing method and electroplating technology of electroplate liquid Download PDFInfo
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- CN105862092A CN105862092A CN201610237598.5A CN201610237598A CN105862092A CN 105862092 A CN105862092 A CN 105862092A CN 201610237598 A CN201610237598 A CN 201610237598A CN 105862092 A CN105862092 A CN 105862092A
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- electroplate liquid
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- titanium alloy
- basic plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Abstract
The invention discloses electroplate liquid of an alkaline electrocoppering titanium alloy and a preparing method and an electroplating technology of the electroplate liquid. According to the formula, the electroplate liquid comprises 25 g/L to 40 g/L of blue copperas, 90 g/L to 110 g/L of citric acid, 10 g/L to 15 g/L of succinimide, 10 g/L to 25 g/L of titanium sulfate, 100 g/L to 120 g/L of potassium hydroxide, 25 g/L to 35 g/L of boric acid, 0.01 mg/L to 0.05 mg/L of a copper-prevention displacing agent and 8 mg/L to 12 mg/L of a gloss agent. The electroplate liquid is free of cyanide and phosphorus, and under the electroplating technology, a copper-titanium alloy coating with brightness, delicateness, hardness and wear resistance higher than those of a pure copper layer can be obtained, and the copper-titanium alloy coating is good in binding force with meridian rubber and higher in sulfide corrosion resistance.
Description
Technical field
The present invention relates to field of metal surface treatment technology, be specifically related to electroplate liquid and the system thereof of basic plating copper-titanium alloy
Preparation Method and electroplating technology.
Background technology
It is known that utilize the means of transport of wheel type mobile, load-carrying work apparatus (such as automobile, tractor, aircraft, mine
And building machinery) be required on wheel hub the solid rubber inner tube of a tyre with inflation of set and be made up of meridian, pierce tap, rubber etc. outside
Tire, can move transport.Wherein, the effect particular importance of pierce tap, need the rigidity of extra-heavy, flexibility and with meridian, rubber
The adhesion of glue, the etch resistant properties to sulfide.But pierce tap is poor to the rubber corrosion resistance of sulfur compound due to self, from
And have impact on the adhesion of it and rubber, time serious, pierce tap can rupture, and the object born is lost supporting role, causes great
Accident, so machine (car) ruin people and die.In order to overcome this defect, being generally individually first to electroplate one layer of copper on pierce tap, it is right to improve
The etch resistant properties of sulfide；And, layers of copper has again fabulous affinity to rubber, it is ensured that the adhesion between them.
Existing copper-plated technique on pierce tap in cover, often uses pyrophosphate, the plating solution of organic phosphine system
But, there are the following problems: the layers of copper hardness that (1) plates out is relatively low, tire bears truck, mining machine cutter, aircraft etc.
Gravity the strongest；(2) easily producing metathesis in steel and iron parts due to copper makes coating and pierce tap adhesion poor；(3) phosphorous
The alkaline copper plating process current of (phosphine) is inefficient, plating solution anti-impurity ability；(4) copper plating bath contains substantial amounts of Phos and has
Machine phosphine, causes the waste water of discharge to be difficult to process, causes the pollution of ambient water quality.
Summary of the invention
For overcoming the deficiencies in the prior art, present invention aim to provide the plating of a kind of basic plating copper-titanium alloy
Liquid and preparation method thereof and electroplating technology.The electroplate liquid cyanide-free of this invention, without phosphorus, available light under this electroplating technology,
The simple layers of copper of careful, hardness ratio is high, wearability is strong, closes with the copper titanium that belted rubber adhesion is good, resisting sulfide corrosion is strong
Gold plate.
For realizing this purpose, the electroplate liquid of a kind of basic plating copper-titanium alloy provided by the present invention, its plating solution formula
As follows:
Preferably, the electroplate liquid of described basic plating copper-titanium alloy, its formula is as follows:
As preferred plan ground, the electroplate liquid of described basic plating copper-titanium alloy, its formula is as follows:
Further, the solvent that described plating solution formula uses is water.
A kind of electroplate liquid method preparing above-mentioned basic plating copper-titanium alloy, comprises the steps:
(1) boric acid is inserted in hot water stir, add copper sulphate pentahydrate and be mixed with stirring, obtain solution
a；
(2) citric acid, succimide are inserted in hot water, mixing and stirring, obtain solution b；
(3) titanium sulfate is inserted in sulphuric acid, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
Preferably, in described step (1) and step (2), the temperature of hot water is 50～60 DEG C.
Preferably, in described step (3), the mass percent of sulphuric acid is 2～8%.
The electroplate liquid of a kind of above-mentioned basic plating copper-titanium alloy carries out electroplating technique, electroplating temperature is 40～50 DEG C,
The pH value of electroplate liquid is 8～10, cathode-current density is 0.2～3.5A/dm2, anode be electrolytic copper plate.
Preferably, the described electroplate liquid utilizing basic plating copper-titanium alloy carries out electroplating technique, plating
Temperature is 45～50 DEG C, the pH value of electroplate liquid is 8.5～9.5, cathode-current density is 0.2～2.2A/dm2, anode for electrolysis
Copper coin.
Compared with prior art, advantages of the present invention:
(1) during metal titanium salt is joined the copper electrolyte of alkalescence by the present invention with the form of complexation, at boric acid, conducting salt, light
Under the synergism of pool agent, anti-copper displacer etc., and under different operating conditions, obtain the copper-titanium alloy copper of different Ti content
Layer, its alloy-layer titaniferous amount is between 0.5～2.5% (mass percent).
(2) the electroplate liquid cyanide-free, without phosphorus of the present invention, under this electroplating technology available bright, careful, hardness ratio is simple
Layers of copper is high, wearability is strong, with the copper-titanium alloy coating that belted rubber adhesion is good, resisting sulfide corrosion is strong.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail:
Embodiment 1:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide are inserted in the hot water that temperature is 50 DEG C, mixing and stirring, obtain solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 40 DEG C, electroplate liquid
PH value be 8, cathode-current density be 0.2A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 2:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide are inserted in the hot water that temperature is 60 DEG C, mixing and stirring, obtain solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 45 DEG C, electroplate liquid
PH value be 9, cathode-current density be 0.4A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 3:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide are inserted in the hot water that temperature is 60 DEG C, mixing and stirring, obtain solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 50 DEG C, electroplate liquid
PH value be 10, cathode-current density be 3A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 4:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 50 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 60 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 45 DEG C, electroplate liquid
PH value be 9.5, cathode-current density be 3.5A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 5:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 55 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 55 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 2%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 45 DEG C, electroplate liquid
PH value be 8.5, cathode-current density be 2.2A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 6:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 55 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 8%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 45 DEG C, electroplate liquid
PH value be 9.5, cathode-current density be 2.8A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 7:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 50 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 60 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 8%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 50 DEG C, electroplate liquid
PH value be 10, cathode-current density be 0.5A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 8:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 50 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 45 DEG C, electroplate liquid
PH value be 8, cathode-current density be 2.8A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 9:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 55 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 60 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 5%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 50 DEG C, electroplate liquid
PH value be 8.8, cathode-current density be 3.2A/dm2, anode be electrolytic copper plate.
After tested, the copper-titanium alloy coating of gained is bright, careful, and the simple layers of copper of hardness ratio is high, wearability is strong, with meridian
Rubber adhesion is good, resisting sulfide corrosion is strong.
Embodiment 10:
A kind of electroplate liquid of basic plating copper-titanium alloy, its plating solution formula is as follows:
The preparation method of the present invention, comprises the steps:
(1) boric acid is inserted in the hot water that temperature is 60 DEG C and stir, add copper sulphate pentahydrate and be mixed with stirring
Uniformly, solution a is obtained；
(2) citric acid, succimide being inserted temperature is in 60 DEG C of hot water, and mixing and stirring obtains solution b；
(3) titanium sulfate is inserted in the sulphuric acid that mass percent is 7%, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring,
Again through standing, filtering, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid utilizing above-mentioned basic plating copper-titanium alloy carries out electroplating technique, and electroplating temperature is 50 DEG C, electroplate liquid
PH value be 9.2, cathode-current density be 1A/dm2, anode be electrolytic copper plate.
The content that this specification is not described in detail belongs to prior art known to professional and technical personnel in the field.
Claims (9)
1. the electroplate liquid of a basic plating copper-titanium alloy, it is characterised in that its plating solution formula is as follows:
The electroplate liquid of basic plating copper-titanium alloy the most according to claim 1, it is characterised in that its plating solution formula is such as
Under:
The electroplate liquid of basic plating copper-titanium alloy the most according to claim 1, it is characterised in that its plating solution formula is such as
Under:
4. according to the electroplate liquid of the basic plating copper-titanium alloy described in claim 1 or 2 or 3, it is characterised in that described electroplate liquid
The solvent that formula uses is water.
5. the electroplate liquid method of the basic plating copper-titanium alloy that a kind is prepared described in claim 4, it is characterised in that include as follows
Step:
(1) boric acid is inserted in hot water stir, add copper sulphate pentahydrate and be mixed with stirring, obtain solution a；
(2) citric acid, succimide are inserted in hot water, mixing and stirring, obtain solution b；
(3) titanium sulfate is inserted in sulphuric acid, be sufficiently stirred for dissolving, obtain solution c；
(4) potassium hydroxide is inserted in cold water, be sufficiently stirred for dissolving, obtain solution d；
(5) after the solution a of above-mentioned steps gained, solution b, solution c, solution d being cooled to room temperature, mixing and stirring, then warp
Stand, filter, add anti-copper displacer, polishing material, fill into water constant volume,.
The electroplate liquid preparation method of basic plating copper-titanium alloy the most according to claim 5, it is characterised in that described step
(1) temperature of hot water is 50～60 DEG C and in step (2).
The electroplate liquid preparation method of basic plating copper-titanium alloy the most according to claim 5, it is characterised in that described step
(3), in, the mass percent of sulphuric acid is 2～8%.
8. the electroplate liquid utilizing the basic plating copper-titanium alloy described in claim 1 or 2 or 3 carries out an electroplating technique, its
It is characterised by: electroplating temperature is 40～50 DEG C, the pH value of electroplate liquid is 8～10, cathode-current density is 0.2～3.5A/dm2、
Anode is electrolytic copper plate.
The electroplate liquid utilizing basic plating copper-titanium alloy the most according to claim 8 carries out electroplating technique, and its feature exists
In: electroplating temperature be 45～50 DEG C, the pH value of electroplate liquid be 8.5～9.5, cathode-current density be 0.2～2.2A/dm2, anode
For electrolytic copper plate.
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| CN201610237598.5A CN105862092A (en) | 2016-04-18 | 2016-04-18 | Electroplate liquid of alkaline electrocoppering titanium alloy and preparing method and electroplating technology of electroplate liquid |
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| CN201610237598.5A CN105862092A (en) | 2016-04-18 | 2016-04-18 | Electroplate liquid of alkaline electrocoppering titanium alloy and preparing method and electroplating technology of electroplate liquid |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028785A (en) * | 1973-06-06 | 1977-06-14 | Yorkshire Imperial Metals Limited | Tubular products |
| CN101050492A (en) * | 2007-05-16 | 2007-10-10 | 赵景财 | Material of titanium copper alloy, and production method |
| CN101665962A (en) * | 2009-09-04 | 2010-03-10 | 厦门大学 | Alkaline non-cyanide plating solution for copper-plating used on iron and steel base and preparation method thereof |
| JP2012001805A (en) * | 2010-05-18 | 2012-01-05 | Jfe Steel Corp | Method for producing surface-treated steel sheet |
| CN102995077A (en) * | 2012-12-28 | 2013-03-27 | 武汉吉和昌化工科技有限公司 | Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof |
-
2016
- 2016-04-18 CN CN201610237598.5A patent/CN105862092A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028785A (en) * | 1973-06-06 | 1977-06-14 | Yorkshire Imperial Metals Limited | Tubular products |
| CN101050492A (en) * | 2007-05-16 | 2007-10-10 | 赵景财 | Material of titanium copper alloy, and production method |
| CN101665962A (en) * | 2009-09-04 | 2010-03-10 | 厦门大学 | Alkaline non-cyanide plating solution for copper-plating used on iron and steel base and preparation method thereof |
| JP2012001805A (en) * | 2010-05-18 | 2012-01-05 | Jfe Steel Corp | Method for producing surface-treated steel sheet |
| CN102995077A (en) * | 2012-12-28 | 2013-03-27 | 武汉吉和昌化工科技有限公司 | Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof |
Non-Patent Citations (1)
| Title |
|---|
| KUN ZHAO ET AL.,: "Electrochemical preparation of titanium and titanium–copper alloys with K2Ti6O13 in KF–KCl melts", 《RARE MATALS》 * |
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Application publication date: 20160817 |