CN105859311A - High-temperature adhesive - Google Patents
High-temperature adhesive Download PDFInfo
- Publication number
- CN105859311A CN105859311A CN201610208090.2A CN201610208090A CN105859311A CN 105859311 A CN105859311 A CN 105859311A CN 201610208090 A CN201610208090 A CN 201610208090A CN 105859311 A CN105859311 A CN 105859311A
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- CN
- China
- Prior art keywords
- temperature adhesive
- high temperature
- water
- adhesive
- bentonite
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/66—Monolithic refractories or refractory mortars, including those whether or not containing clay
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a high-temperature adhesive which is composed of the following components in percentage by weight: 5-8% of bentonite, 38-42% of silica sol solution, 20-25% of fluoropolysilicate, 6-10% of alundum powder and 20-25% of water, totaling 100%. The method for preparing the high-temperature adhesive comprises the following steps: preparing the components according to the required proportions; and uniformly mixing and stirring the bentonite, silica sol solution, fluoropolysilicate, alundum powder and water, heating to 60-70 DEG C, standing for 4 hours, cooling to 30-35 DEG C, and curing for 3 hours, thereby obtaining the high-temperature adhesive. The high-temperature adhesive has better impact resistance and lower brittleness, and has the advantages of high temperature resistance and favorable bonding strength of the inorganic adhesive, thereby enhancing the physical service performance and better satisfying the practical production demands.
Description
Technical field
The invention belongs to chemical field, particularly to a kind of high temperature adhesive for heat insulating work.
Background technology
High temperature adhesive is again high-temperature adhesives, high temperature adhesives, high temperature adhesive.For water white transparency or yellowish
Thick liquid, soluble in water, in faintly acid, without sodium ion.Bond under the conditions of being applicable to 300 DEG C of high temperature above, the suitableeest
Build by laying bricks or stones for High-temp. kiln or repair.As pottery etc. bonding, various High-temp. kilns, heat-treatment furnace are built by laying bricks or stones and are repaired, stove take turns
The gunning refractory repaiied, and paste aluminosilicate refractory fiber etc..It is the highest is resistant to temperature 1500 DEG C, and the short time is resistant to 1800 DEG C even more
High.Especially on High-temp. kiln is built by laying bricks or stones or repaired, the stove built by laying bricks or stones with the clay of refractory material furnishing has antidetonation, anti-stripping
Fall, resistance to suddenly cold and hot, high temperature resistant airflow scouring, brick are firmly combined with brick, do not fall the features such as brick, not runout.Due to without sodium from
Son, when pasting aluminosilicate refractory fiber, can prevent mullite powdered crystalline, and construction and maintenance is convenient, can save energy 30%~
50%;For building stove by laying bricks or stones or repairing stove, furnace service life 1~3 times can be extended, decrease factory and repair stove expense and idle cost.
But currently used high temperature adhesive is relatively costly, it is impossible to well adapt to the needs in market.
Summary of the invention
It is an object of the invention to provide a kind of with low cost and that adhesive effect is good high temperature adhesive.
A kind of high temperature adhesive, the percentage by weight of its component is: bentonite 5%~8%, silicon sol solution 38%~42%,
Fluorine polysilicates 20%~25%, schmigel 6~10%, water 20%~25%;Each component sum is 100%;
The preparation process using said components to prepare high temperature adhesive is: first each component got ready by required usage ratio;Then
By bentonite, silicon sol solution, fluorine polysilicates, schmigel and water mixing and stirring, under conditions of being heated to 60~70 DEG C
Stand 4 hours, be then cooled to 30~35 DEG C of ripenings 3 hours, both obtained high temperature adhesive.
Further, the percentage by weight of described high temperature adhesive is: bentonite 6%, silicon sol solution 40%, fluorine polysilicates
22%, schmigel %7, water 25%.
It is an advantage of the invention that possess more preferable resistance to impact and lower fragility, also possess the resistance to of inorganic adhesive simultaneously
High temperature, the advantage that adhesive strength is good, thus improve its physics serviceability, more preferably meet needs of production.1300 degree of heating
Within 24 hours, shrinkage factor is less than 4%, reduces by more than 18% than original powder-type cost, and pyroconductivity is less than or equal to 0.16, and glues
Connect intensity and reach 10kgf/cm2.
Detailed description of the invention
High temperature adhesive is divided into inorganic adhesive and the big class of organic adhesive two.Inorganic adhesive has the high temperature resistant of excellence
Performance, adhesive strength is good, but resistance to acids and bases and poor water resistance, fragility is big, not impact resistance.And organic binder bond is with organic viscous
Knot agent carboxymethyl sodium cellulosate is main formula, is mixed into viscosifier, reinforcing agent and preservative, becomes pellet organic binder bond,
Or add oxidant, accelerator and viscosifier etherified be reacted to around tie mining organic binder bond.Its advantage is to improve ferrum
Grade, reduces energy consumption, improves yield.The range of inorganic adhesive and organic adhesive is had nothing in common with each other.
The present invention is the high temperature adhesive that technical staff goes out through repeatedly practice summary, and the percentage ratio of its component is: swelling
Soil 5%~8%, silicon sol solution 38%~42%, fluorine polysilicates 20%~25%, schmigel 6~10%, water 20%~25%;Each component
Sum is 100%.
The preparation process using said components to prepare high temperature adhesive is: first each component got ready by required usage ratio;
Then by bentonite, silicon sol solution, fluorine polysilicates, schmigel and water mixing and stirring, it is heated to the bar of 60~70 DEG C
Stand 4 hours under part, be then cooled to 30~35 DEG C of ripenings 3 hours, both obtained high temperature adhesive.
Technical staff finds in repeatedly practice, and high temperature connects the preferred weight percent of agent and is: bentonite 6%, Ludox are molten
Liquid 40%, fluorine polysilicates 22%, schmigel %7, water 25%.
Bentonite is a kind of claystone, also known as smectite clay rock, containing a small amount of illite, kaolinite, galapectite, green mud
Stone, zeolite, quartz, Anhydrite, calcite etc.;Main chemical compositions is silicon dioxide, aluminium sesquioxide and water, possibly together with ferrum, magnesium,
Bentonitic physicochemical properties and process technology performance are affected the biggest by element, Na2O and the CaO content such as calcium, sodium, potassium.Swelling
Soil has stronger hygroscopicity and dilatancy, and the water yield of adsorbable 8~15 times of own vols, volumetric expansion is up to several times to 30
Times;Can be dispersed into as a form of gel and suspension in aqueous medium, this medium solution has certain viscosity, thixotropy and lubrication
Property;There is stronger cation exchange capacity (CEC);Various gases, liquid, organic substance there are certain absorbability, maximal absorptive capacity
The weight of self up to 5 times;It has plasticity and cohesiveness with the admixture of water, mud or fine sand.
Ludox is a kind of high activity adsorbing material, genus amorphous substance, and water insoluble and any solvent is nonpoisonous and tasteless,
Stable chemical nature, does not reacts with any material in addition to highly basic, Fluohydric acid..Therefore one of component of operation bonding agent, can
To improve the water-fast and resistance to acids and bases of bonding agent.
Fluorine polysilicates can play furtherance membrane interaction, to being initially attached with large effect.
Schmigel has good insulating properties, is suitable for crystal, the fine abrasive of electron trade and polishing and makes senior resistance to
Fire material etc..
Embodiment 1:5kg bentonite, 42kg silicon sol solution, 25kg fluorine polysilicates, 6 schmigels, mixing 22kg
After water, under conditions of being heated to 60~70 DEG C, stand 4 hours, be then cooled to 30~35 DEG C of ripenings 3 hours, both obtained high temperature bonding
Agent.
Embodiment 2:6kg bentonite, 40kg silicon sol solution, 22kg fluorine polysilicates, 7 schmigels, mixing 25kg
After water, stir and stand 4 hours under conditions of within 10 minutes, being heated to 60~70 DEG C, be then cooled to 30~35 DEG C of ripenings 3 hours, both
Obtain high temperature adhesive.
Embodiment 3:8kg bentonite, 38kg silicon sol solution, 20kg fluorine polysilicates, 10 schmigels, mixing 24kg
After water, stir and treat its mix homogeneously in 10 minutes, stand 4 hours under conditions of being heated to 60~70 DEG C, be then cooled to 30~35
DEG C ripening 3 hours, both high temperature adhesive.
The present invention is especially suitable for High-temp. kiln to build by laying bricks or stones or repair, the stove tool built by laying bricks or stones with the clay of refractory material furnishing
Antidetonation, anti-strip, resistance to suddenly cold and hot, high temperature resistant airflow scouring, brick and brick is had to be firmly combined with, do not fall the features such as brick, not runout.By
In without sodium ion, when pasting aluminosilicate refractory fiber, mullite powdered crystalline can be prevented, and construction and maintenance is convenient,
Can save energy 30%~50%;For building stove by laying bricks or stones or repairing stove, furnace service life 1~3 times can be extended, decrease factory and repair stove expense
And idle cost.
Claims (2)
1. a high temperature adhesive, it is characterised in that: the percentage by weight of described high temperature adhesive component is: bentonite 5%~
8%, silicon sol solution 38%~42%, fluorine polysilicates 20%~25%, schmigel 6~10%, water 20%~25%;Each component sum is
100%;
The preparation process using said components to prepare high temperature adhesive is: first each component got ready by required usage ratio;Then
By bentonite, silicon sol solution, fluorine polysilicates, schmigel and water mixing and stirring, under conditions of being heated to 60~70 DEG C
Stand 4 hours, be then cooled to 30~35 DEG C of ripenings 3 hours, both obtained high temperature adhesive.
2. seek high temperature adhesive described in 1 according to right frost, it is characterised in that: the percentage by weight of described high temperature adhesive is: swollen
Profit soil 6%, silicon sol solution 40%, fluorine polysilicates 22%, schmigel %7, water 25%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610208090.2A CN105859311A (en) | 2016-04-06 | 2016-04-06 | High-temperature adhesive |
Applications Claiming Priority (1)
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---|---|---|---|
CN201610208090.2A CN105859311A (en) | 2016-04-06 | 2016-04-06 | High-temperature adhesive |
Publications (1)
Publication Number | Publication Date |
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CN105859311A true CN105859311A (en) | 2016-08-17 |
Family
ID=56628256
Family Applications (1)
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CN201610208090.2A Pending CN105859311A (en) | 2016-04-06 | 2016-04-06 | High-temperature adhesive |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116396628A (en) * | 2021-12-27 | 2023-07-07 | 山东工业陶瓷研究设计院有限公司 | High-temperature-resistant protective coating repairing material and online repairing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101117550A (en) * | 2007-09-10 | 2008-02-06 | 山东鲁阳股份有限公司 | High temperature binding agent and preparation method thereof |
CN101586016A (en) * | 2008-05-23 | 2009-11-25 | 彭文表 | High-temperature adhesive and high temperature energy-saving compound material therewith |
WO2011104010A3 (en) * | 2010-02-24 | 2011-10-20 | TDH - GmbH Technischer Dämmstoffhandel | Light paste-like refractory adhesives and their use |
CN104087190A (en) * | 2014-07-14 | 2014-10-08 | 宁波优欧利胶粘科技有限公司 | Single-side anti-aging and waterproof adhesive tape |
-
2016
- 2016-04-06 CN CN201610208090.2A patent/CN105859311A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101117550A (en) * | 2007-09-10 | 2008-02-06 | 山东鲁阳股份有限公司 | High temperature binding agent and preparation method thereof |
CN101586016A (en) * | 2008-05-23 | 2009-11-25 | 彭文表 | High-temperature adhesive and high temperature energy-saving compound material therewith |
WO2011104010A3 (en) * | 2010-02-24 | 2011-10-20 | TDH - GmbH Technischer Dämmstoffhandel | Light paste-like refractory adhesives and their use |
CN104087190A (en) * | 2014-07-14 | 2014-10-08 | 宁波优欧利胶粘科技有限公司 | Single-side anti-aging and waterproof adhesive tape |
Non-Patent Citations (1)
Title |
---|
曾正明: "《工业炉技术问答》", 30 June 1998, 机械工业出版社 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116396628A (en) * | 2021-12-27 | 2023-07-07 | 山东工业陶瓷研究设计院有限公司 | High-temperature-resistant protective coating repairing material and online repairing method |
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Application publication date: 20160817 |
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RJ01 | Rejection of invention patent application after publication |