CN105847711A - High integration infrared imaging system based on high performance FPGA+DDR3 chips - Google Patents

High integration infrared imaging system based on high performance FPGA+DDR3 chips Download PDF

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Publication number
CN105847711A
CN105847711A CN201610217195.4A CN201610217195A CN105847711A CN 105847711 A CN105847711 A CN 105847711A CN 201610217195 A CN201610217195 A CN 201610217195A CN 105847711 A CN105847711 A CN 105847711A
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CN
China
Prior art keywords
infrared
ddr3
chip
fpga
module
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CN201610217195.4A
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Chinese (zh)
Inventor
傅强
刘晗
何锁纯
魏小林
董婓
周阳
常虹
林森
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China Academy of Launch Vehicle Technology CALT
Beijing Aerospace Institute for Metrology and Measurement Technology
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China Academy of Launch Vehicle Technology CALT
Beijing Aerospace Institute for Metrology and Measurement Technology
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Application filed by China Academy of Launch Vehicle Technology CALT, Beijing Aerospace Institute for Metrology and Measurement Technology filed Critical China Academy of Launch Vehicle Technology CALT
Priority to CN201610217195.4A priority Critical patent/CN105847711A/en
Publication of CN105847711A publication Critical patent/CN105847711A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/33Transforming infrared radiation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Image Processing (AREA)

Abstract

The invention relates to a high integration infrared imaging system based on high performance FPGA+DDR3 chips. The system comprises an infrared detector 1, an infrared pre-processing circuit 2, an FPGA chip 3, a DDR3 chip 4 and a simulation/digital video coding circuit 5, wherein the infrared detector 1 is used for acquiring infrared signals of a target scene, is provided with the driving sequence through the FPGA chip 3 and sends output signals to the infrared pre-processing circuit 2, the infrared pre-processing circuit 2 is used for conditioning and sampling the output signals of the infrared detector 1 and transmitting the data to the FPGA chip 3, and the FPGA chip 3 and the DDR3 chip 4 are used for transmitting the processed infrared image data to the simulation/digital video coding circuit 5 for output.

Description

A kind of highly integrated infrared imaging system based on high-performance FPGA+DDR3
Technical field
This technology belongs to infrared imaging field, is specifically related to a kind of based on high-performance FPGA+DDR3 highly integrated Change infrared imaging system.
Background technology
Nature object, due to inherent molecule, the warm-up movement of atom, all can be launched infrared ray, i.e. produce hot spoke Penetrate.The heat radiation of object is relevant with temperature with body surface state, and therefore the infrared emanation image of object can With by object in the case of visible ray details reproduction.
Thermal infrared imager is a kind of with infrared focal plane array as core, and the infra-red radiation of detectable target is logical Cross the means such as opto-electronic conversion, signal processing, the infrared signature of target object is converted into human eye visible The equipment of greyscale video image.Infrared thermal imaging technique is widely used in meteorological watch, resource exploration and environment Monitoring, the measurement of accurate space photography, Space surveillance and the field such as early warning and extraterrestrial target search, have and wear Thoroughly smog ability by force, not climate condition impact, the advantage such as operating distance is remote, identification ability is strong, be light harvesting, The sophisticated technology such as mechanical, electrical is in the new high-tech product of one.
Being limited to the level of development of infrared device, the imaging effect of thermal infrared imager is the most preferable, mainly shows For infrared image noise compared with big, contrast is low, spatial resolution is poor, echo signal is faint, edge blurry, The shortcomings such as visual effect is bad, have impact on thermal infrared imager effect in actual applications.The reddest Outer Imaging processing techniques has become the key technology in thermal infrared imager.Simultaneously along with thermal infrared imager is at each The extensive application of industry, to the miniaturization of system, integrated it is also proposed more requirement.
Summary of the invention
It is an object of the invention to: in order to eliminate, the contrast of infrared image is low, spatial discrimination rate variance, target The inherent characters such as weak output signal, noise are bigger than normal, improve picture quality, improve image visual effect, after convenience While continuous target following, pattern recognition etc. process, the size of infrared imaging system is greatly reduced, reaches Miniaturization, target integrated, unitized, devise a kind of high based on monolithic high-performance FPGA and monolithic The highly integrated infrared imagery technique of speed DDR3.
Technical scheme is as follows: a kind of highly integrated infrared imaging based on high-performance FPGA+DDR3 System, including Infrared Detectors, infrared preprocessing circuit, fpga chip, DDR3 chip, analog/digital Video coding circuit, wherein Infrared Detectors is for the infrared signal collection of target scene, and by output signal Sending into infrared preprocessing circuit, infrared preprocessing circuit is used for conditioning and the sampling of Infrared Detectors output signal, And passing data to fpga chip, the infrared picture data after fpga chip will process with DDR3 chip passes It is delivered to analog/digital video coding circuit export.
Fpga chip includes algoritic module, CACHE caching, dma controller, DDR3 controller, wherein calculates Method module include Nonuniformity Correction module, blind element detection with replacement module, self-adapting histogram equilibrium module, Image scaling and flip module, and each algoritic module have CACHE caching in a corresponding bank with Correspondence, the read-write data of corresponding algoritic module can be buffered by each bank, CACHE caching in All Bank all accesses dma controller, and by the instruction queue module in dma controller to each bank The order of transmission is ranked up by default priority, handles it according still further to the order after sequence;DMA controls Device 8 is accessed in DDR3 chip by DDR3 controller, and DDR3 chip can be as each algorithm in fpga chip The shared external memory storage of module.
Infrared Detectors, for the infrared signal collection of target scene, is provided driver' s timing by fpga chip.
When whole Bank in CACHE caching are automatically performed CACHE consistency maintenance and CACHE hit disappearance Automaticdata load.
The remarkable result of the present invention is: reduce system dimension, be effectively increased simultaneously data throughput and System bandwidth.Prove by analysis and test, showing that the method is reliable and stable, and be greatly improved hardware Utilization rate.It addition, in different application occasion or by the infrared imaging system of algorithms of different module composition, The method all can ensure that FPGA each algoritic module cell data read-write capability is normal, has good practical valency Value.
Accompanying drawing explanation
Fig. 1 is a kind of highly integrated infrared imaging system based on high-performance FPGA+DDR3 of the present invention Schematic diagram
Fig. 2 is a kind of highly integrated infrared imaging system based on high-performance FPGA+DDR3 of the present invention FPGA schematic diagram
In figure: 1 Infrared Detectors, 2 infrared preprocessing circuit, 3FPGA chip, 4DDR3 chip, 5 moulds Plan/digital video coding circuit, 6 algoritic modules, 7CACHE caching, 8DMA controller, 9DDR3 control Device, 10 Nonuniformity Correction modules, 11 blind elements detection with replacement module, 12 self-adapting histogram equilibrium modules, 13 image scalings and flip module, 14 instruction queue modules,
Detailed description of the invention
Below in conjunction with the accompanying drawings and the present invention is described in further detail by specific embodiment.
A kind of highly integrated infrared imaging system based on high-performance FPGA+DDR3, including Infrared Detectors 1, Infrared preprocessing circuit 2, fpga chip 3, DDR3 chip 4, analog/digital video coding circuit 5, its Mid-infrared detector 1 is for the infrared signal collection of target scene, and it is provided driver' s timing by fpga chip 3, And output signal is sent into infrared preprocessing circuit 2, infrared preprocessing circuit 2 exports for Infrared Detectors 1 The conditioning of signal and sampling, and pass data to fpga chip 3, fpga chip 3 and DDR3 chip 4 Infrared picture data after processing is delivered to analog/digital video coding circuit 5 and exports.
Fpga chip 3 includes algoritic module 6, CACHE caching 7, dma controller 8, DDR3 controller 9, Wherein algoritic module 6 includes the detection of Nonuniformity Correction module 10, blind element and replacement module 11, self-adaptive direct Side's figure balance module 12, image scaling and flip module 13, and each algoritic module have CACHE caching 7 In a corresponding bank the most corresponding, the read-write data of corresponding algoritic module can be entered by each bank Row buffering, the whole Bank in CACHE caching 7 all access dma controller 8, and by dma controller 8 In instruction queue module 14 order that each bank is transmitted be ranked up by default priority, then press Order after phototypesetting sequence is handled it, and when being automatically performed CACHE consistency maintenance and CACHE hit disappearance Automaticdata load.Dma controller 8 accesses in DDR3 chip 4 by DDR3 controller 9, DDR3 Chip 4 can be as the shared external memory storage of each algoritic module in fpga chip 3.

Claims (4)

1. a highly integrated infrared imaging system based on high-performance FPGA+DDR3, it is characterised in that: include Infrared Detectors (1), infrared preprocessing circuit (2), fpga chip (3), DDR3 chip (4), simulation / digital video coding circuit (5), wherein Infrared Detectors (1) is for the infrared signal collection of target scene, And output signal is sent into infrared preprocessing circuit (2), infrared preprocessing circuit (2) is used for Infrared Detectors (1) conditioning of output signal and sampling, and pass data to fpga chip (3), fpga chip (3) Infrared picture data after processing with DDR3 chip (4) is delivered to analog/digital video coding circuit (5) Export.
2. according to a kind of based on high-performance FPGA+DDR3 the highly integrated infrared imaging system described in claim System, it is characterised in that: fpga chip (3) includes that algoritic module (6), CACHE caching (7), DMA control Device (8), DDR3 controller (9), wherein algoritic module (6) include Nonuniformity Correction module (10), Blind element detection and replacement module (11), self-adapting histogram equilibrium module (12), image scaling and turning mould Block (13), and the corresponding bank that each algoritic module has CACHE to cache in (7) is the most corresponding, The read-write data of corresponding algoritic module can be buffered by each bank, the whole Bank in CACHE caching 7 All access dma controller (8), and by the instruction queue module (14) in dma controller (8) to respectively The order of individual bank transmission is ranked up by default priority, handles it according still further to the order after sequence; Dma controller (8) accesses in DDR3 chip (4) by DDR3 controller (9), DDR3 chip (4) Can be as the shared external memory storage of each algoritic module in fpga chip (3).
3. according to a kind of based on high-performance FPGA+DDR3 the highly integrated infrared imaging system described in claim System, it is characterised in that: Infrared Detectors (1) is for the infrared signal collection of target scene, by fpga chip (3) driver' s timing is provided.
4. according to a kind of based on high-performance FPGA+DDR3 the highly integrated infrared imaging system described in claim System, it is characterised in that: CACHE caching (7) in whole Bank be automatically performed CACHE consistency maintenance and Automaticdata during CACHE hit disappearance loads.
CN201610217195.4A 2016-04-08 2016-04-08 High integration infrared imaging system based on high performance FPGA+DDR3 chips Pending CN105847711A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106803900A (en) * 2017-04-01 2017-06-06 江苏北方湖光光电有限公司 A kind of small-sized uncooled ir movement based on monolithic FPGA
CN114526824A (en) * 2022-03-08 2022-05-24 云南师范大学 Infrared imaging system based on Zynq SOPC framework
CN114584708A (en) * 2022-03-03 2022-06-03 杭州图谱光电科技有限公司 Multi-functional industry camera system based on monolithic FPGA

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US20150262633A1 (en) * 2014-03-12 2015-09-17 Futurewei Technologies, Inc. Dual-port ddr4-dimms of sdram and nvram for ssd-blades and multi-cpu servers
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106803900A (en) * 2017-04-01 2017-06-06 江苏北方湖光光电有限公司 A kind of small-sized uncooled ir movement based on monolithic FPGA
CN114584708A (en) * 2022-03-03 2022-06-03 杭州图谱光电科技有限公司 Multi-functional industry camera system based on monolithic FPGA
CN114526824A (en) * 2022-03-08 2022-05-24 云南师范大学 Infrared imaging system based on Zynq SOPC framework

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