CN105846219A - High-speed data transmission connector module - Google Patents
High-speed data transmission connector module Download PDFInfo
- Publication number
- CN105846219A CN105846219A CN201610259462.4A CN201610259462A CN105846219A CN 105846219 A CN105846219 A CN 105846219A CN 201610259462 A CN201610259462 A CN 201610259462A CN 105846219 A CN105846219 A CN 105846219A
- Authority
- CN
- China
- Prior art keywords
- speed data
- data transfer
- high speed
- adapter module
- integrated entity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
Landscapes
- Installation Of Indoor Wiring (AREA)
Abstract
The present invention provides a high-speed data transmission connector module. The high-speed data transmission connector module comprises an integration main body, a wiring harness connection structure, a PCB and a contact terminal. The PCB, the contact terminal and the wiring harness connection structure are connected with the main body, the upper side surface and the lower side surface of the integration main body are provided with the upper neck and a lower neck connected with the cabinet, and one end of the integration main body is provided with an external expansion structure. According to the technical scheme, a plurality of elements in the cabinet are integrated to form modularization, the space is saved, the assembly links are reduced, the assembly precision is improved, the product cost is reduced, and the structure intensity of the product is enhanced.
Description
Technical field
The present invention relates to a kind of communication field, refer in particular to a kind of high speed data transfer adapter module used on desktop computer or high-speed servers.
Background technology
The server of industry and the inner body of desktop computer are more at present, and AUI separates with components and parts, assembles cumbersome, needs to take considerable time, and relatively costly, and packaging technology is many, and reliability requirement is high.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of space of saving, minimizing assembling link, improves assembly precision, increases the high speed data transfer adapter module of product structure intensity.
In order to solve above-mentioned technical problem, the technical scheme is that high speed data transfer adapter module, including integrated entity, wire harness attachment structure, PCB and contact terminal, described PCB, contact terminal are connected with main body with wire harness attachment structure, the upper side of described integrated entity and downside are provided with the upper draw-in groove and lower bayonet slot being connected with cabinet, and one end of integrated entity arranges outside expansion structure.
Further, the upper side of described integrated entity and downside are equipped with multiple clamping boss, and described clamping boss is distributed in the both sides of upper side and the both sides of downside, form upper draw-in groove and lower bayonet slot between clamping boss.
Preferably, described clamping boss is provided with guiding chamfering.
Further, the both sides, position that described integrated entity is connected with PCB are provided with guiding fitting recess, and bottom is provided with position limiting structure, and described PCB enters in position limiting structure fixing by guiding fitting recess.
Preferably, described position limiting structure uses the installation tooth that two rows are arranged in parallel.
Further, filling in after also including a plastic cement, after described plastic cement, plug is connected with the installation tooth of integrated entity.
Further, described wire harness attachment structure includes that wire harness, Nei Mo and external mold, described wire harness are fixed by interior mould, mould in external mold parcel.
Further, after the external mold of described wire harness bindiny mechanism is connected with integrated entity, the surface of external mold collectively constitutes draw-in groove higher than the bottom surface of the upper draw-in groove of integrated entity, external mold and clamping boss.
Preferably, the external mold of described wire harness bindiny mechanism is identical with the height of clamping boss, and external mold and clamping boss collectively constitute draw-in groove.
Further, also include a connection support, described connection support two ends are provided with guide ledges, two sides are provided with multiple fixing lug boss, forming gathering sill between fixing lug boss, the bottom connecting support is provided with grab, and described connection support is connected with outside expansion structure, the position that outside expansion structure correspondence connects support guide ledges is provided with guiding fitting recess, and the corresponding position connecting support grab is provided with hole clipping.
Multiple element sets in cabinet are integrally formed modularity, the energy saving space by technical scheme, reduce assembling link, improve assembly precision, reduce product cost, strengthen product structure intensity.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is described in further detail.
Fig. 1 is present configuration schematic diagram；
Fig. 2 is present configuration explosive view；
Fig. 3 is PCB of the present invention and integrated entity attachment structure schematic diagram；
Fig. 4 is the present invention and cabinet connection diagram；
Fig. 5 is the outside expansion structure schematic diagram of the present invention；
Fig. 6 is connection mounting structure schematic diagram of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and detailed description of the invention, the present invention will be further described.
nullSuch as Fig. 1、Shown in 2，High speed data transfer adapter module，Including integrated entity 10、Wire harness attachment structure 20、PCB 30 and contact terminal 40，The upper side of integrated entity 10 and downside are provided with multiple clamping boss 14，Described clamping boss 14 is distributed in the both sides of upper side and downside，Formed between clamping boss 14 and be provided with the upper draw-in groove 11 and lower bayonet slot 12 being connected with cabinet，One end of integrated entity 10 arranges outside expansion structure 13，Wire harness attachment structure 20、PCB 30 and contact terminal 40 are connected with integrated entity 10，Described wire harness attachment structure 20 includes wire harness 21、Interior mould and external mold 22，Described wire harness 21 is fixed by interior mould，External mold 22 wraps up interior mould，After the external mold 22 of wire harness bindiny mechanism 20 is connected with integrated entity 10，The surface of external mold 22 is higher than the bottom surface of the upper draw-in groove 11 of integrated entity 10，External mold 22 and clamping boss 14 collectively constitute draw-in groove 11，Optimum situation is，The external mold 22 of wire harness bindiny mechanism 20 is identical with the height of clamping boss 14，External mold 22 and clamping boss 14 collectively constitute draw-in groove 11.
Such as Fig. 2, shown in 3, the both sides, position that integrated entity 10 is connected with PCB 30 are provided with guiding fitting recess 15, bottom is provided with two row's position limiting structures 16, described PCB 30 enters region between position limiting structure 16 by guiding fitting recess 15 and fixes, the position-limit mechanism 16 be given in the present embodiment uses the installation tooth that two rows are arranged in parallel, but it is not limited to toothing is installed, limited block can also be used, limited impression, other structures such as spacing fixture block, based on the case for this embodiment, this high speed data transfer adapter module fills in 50 after also including a plastic cement, fill in 50 after plastic cement to be connected with the installation tooth of integrated entity 10.
As shown in Figure 4, frame it is provided with in cabinet, frame includes the fixing end 61 being connected with cabinet and the linking arm 62 being connected with upper draw-in groove 11, lower bayonet slot 12, linking arm 61 is connected fixing along upper draw-in groove 11, lower bayonet slot 12 with integrated entity 10, preferably situation, clamping boss 14 is provided with guiding chamfering 141, gives linking arm 62 guide effect.
nullSuch as Fig. 2、5、Shown in 6，The use embodiment of outside expansion structure 13，Including a connection support 70，Connect support 70 two ends and be provided with guide ledges 71，Two sides are provided with multiple fixing lug boss 72，Gathering sill is formed between fixing lug boss 72，The bottom connecting support 70 is provided with grab 73，Described connection support 70 is connected with outside expansion structure 13，The position of the corresponding guide ledges 71 connecting support 70 of outside expansion structure 13 is provided with guiding fitting recess 131，The position of the corresponding grab 33 connecting support 70 is provided with hole clipping 132，The bottom of outside expansion structure 13 is provided with installing space 133，In the present embodiment，Installing space 133 mounted inside has LED or switch 80，Specifically used installation elements selects according to the actual requirements，Can also be to control element、Display element、To connection module、Transfer element etc..
Although specifically showing in conjunction with preferred embodiment and describing the present invention; but those skilled in the art should be understood that; in the spirit and scope of the present invention limited without departing from appended claims; in the form and details the present invention is made a variety of changes, be protection scope of the present invention.
Claims (10)
1. high speed data transfer adapter module, it is characterized in that: include integrated entity, wire harness attachment structure, PCB and contact terminal, described PCB, contact terminal are connected with main body with wire harness attachment structure, the upper side of described integrated entity and downside are provided with the upper draw-in groove and lower bayonet slot being connected with cabinet, and one end of integrated entity arranges outside expansion structure.
High speed data transfer adapter module the most according to claim 1, it is characterized in that: the upper side of described integrated entity and downside are equipped with multiple clamping boss, described clamping boss is distributed in the both sides of upper side and the both sides of downside, forms upper draw-in groove and lower bayonet slot between clamping boss.
High speed data transfer adapter module the most according to claim 2, it is characterised in that: described clamping boss is provided with guiding chamfering.
High speed data transfer adapter module the most according to claim 1, it is characterized in that: the both sides, position that described integrated entity is connected with PCB are provided with guiding fitting recess, bottom is provided with position limiting structure, and described PCB enters in position limiting structure fixing by guiding fitting recess.
High speed data transfer adapter module the most according to claim 4, it is characterised in that: described position limiting structure uses the installation tooth that two rows are arranged in parallel.
High speed data transfer adapter module the most according to claim 5, it is characterised in that: filling in after also including a plastic cement, after described plastic cement, plug is connected with the installation tooth of integrated entity.
7. according to described high speed data transfer adapter module arbitrary in claim 1 to 6, it is characterised in that: described wire harness attachment structure includes that wire harness, Nei Mo and external mold, described wire harness are fixed by interior mould, mould in external mold parcel.
High speed data transfer adapter module the most according to claim 7, it is characterized in that: after the external mold of described wire harness bindiny mechanism is connected with integrated entity, the surface of external mold collectively constitutes draw-in groove higher than the bottom surface of the upper draw-in groove of integrated entity, external mold and clamping boss.
High speed data transfer adapter module the most according to claim 8, it is characterised in that: the external mold of described wire harness bindiny mechanism is identical with the height of clamping boss, and external mold and clamping boss collectively constitute draw-in groove.
High speed data transfer adapter module the most according to claim 1, it is characterized in that: also include a connection support, described connection support two ends are provided with guide ledges, two sides are provided with multiple fixing lug boss, gathering sill is formed between fixing lug boss, the bottom connecting support is provided with grab, described connection support is connected with outside expansion structure, the position that outside expansion structure correspondence connects support guide ledges is provided with guiding fitting recess, the corresponding position connecting support grab is provided with hole clipping, and the bottom of outside expansion structure is provided with installing space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610259462.4A CN105846219A (en) | 2016-04-25 | 2016-04-25 | High-speed data transmission connector module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610259462.4A CN105846219A (en) | 2016-04-25 | 2016-04-25 | High-speed data transmission connector module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105846219A true CN105846219A (en) | 2016-08-10 |
Family
ID=56588947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610259462.4A Pending CN105846219A (en) | 2016-04-25 | 2016-04-25 | High-speed data transmission connector module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105846219A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652936A (en) * | 1991-06-06 | 1994-02-25 | Molex Inc | Electric connector |
| CN202838954U (en) * | 2012-08-15 | 2013-03-27 | 惠州市德赛西威汽车电子有限公司 | Vehicle-mounted player |
| CN205583313U (en) * | 2016-04-25 | 2016-09-14 | 安费诺电子装配（厦门）有限公司 | High speed data transmission connector module |
-
2016
- 2016-04-25 CN CN201610259462.4A patent/CN105846219A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652936A (en) * | 1991-06-06 | 1994-02-25 | Molex Inc | Electric connector |
| CN202838954U (en) * | 2012-08-15 | 2013-03-27 | 惠州市德赛西威汽车电子有限公司 | Vehicle-mounted player |
| CN205583313U (en) * | 2016-04-25 | 2016-09-14 | 安费诺电子装配（厦门）有限公司 | High speed data transmission connector module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160810 |