CN105837928A - Protective film for electronic component - Google Patents

Protective film for electronic component Download PDF

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Publication number
CN105837928A
CN105837928A CN201610435290.1A CN201610435290A CN105837928A CN 105837928 A CN105837928 A CN 105837928A CN 201610435290 A CN201610435290 A CN 201610435290A CN 105837928 A CN105837928 A CN 105837928A
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film
components
electronic devices
low
protective film
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不公告发明人
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Individual
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Priority to CN201610652074.2A priority Critical patent/CN106220982A/en
Priority to CN201610652160.3A priority patent/CN106220983A/en
Priority to CN201610435290.1A priority patent/CN105837928A/en
Publication of CN105837928A publication Critical patent/CN105837928A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09D123/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2407/00—Characterised by the use of natural rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16—Fibres; Fibrils

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  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
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  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The invention discloses a protective film for an electronic component and belongs to the field of electronic components. The protective film is prepared from an ethylene-acrylic acid copolymer, a silane coupling agent, natural plant glue, plant ash, low-grade zinc oxide ore, stearic acid, zeolite powder and fatty acid polyethylene glycol ester; a prepared thin film with the thickness of 10 to 100 microns or a coating film with the thickness of 30 to 100 microns is treated at 200 DEG C for 1 hour, the tensile strength reaches 51MPa or more at 30 DEG C and the elongation percentage is 5 percent or less; the film has an excellent mechanical property and can be used as a self-supporting film or a base film of a composite film; the surface resistance value Rs of the film is more than or equal to 1*10<6> omega and smaller than 1*10<9> omega; the non-contact antistatic voltage value of the film reaches 12kv or more; the protective film has an excellent antistatic property and also has excellent acid and alkali resisting, and high-temperature and low-temperature resisting properties.

Description

Electronic devices and components protecting film
Technical field
The present invention relates to electronic devices and components field, particularly to a kind of electronic devices and components protecting film.
Background technology
Electronic devices and components are to constitute electronic equipment or the important component part of electromechanical equipment, and the kind of electronic devices and components is numerous Many, and volume is relatively small, is the most sporadically distributed.But, owing to electronic devices and components are using During, usually affected by environment and surrounding components and parts and be deformed, oxidized or easily by static interference.
Such as, solar cell backboard, it to use in environment even rugged environment, out of doors thus it requires have Higher mechanical performance is to realize self-supporting from extraneous physical damage, it is desirable to have outstanding oxidation and corrosion performance；
The electronic devices and components such as the most such as integrated circuit (IC) components and parts, IC electronic tag, LED, LCD, for the requirement of antistatic The highest, especially IC, electrostatic specifically includes that Electrostatic Absorption dust, the resistance changed between circuit for the impact of electronic devices and components Anti-, affect function and the life-span of product, because electric field or electric current destroy insulation or the conductor of element, make components and parts not work (complete Total loss is bad), the heat produced because of electric field or the electric current of moment, components and parts are injured；
It is to say, because be deformed, oxidized corrosion or the reason of electrostatic, frequently can lead to the function of electronic devices and components It is affected, and then makes whole equipment suffer damage, cause great economic loss, the serious person the most even can occur Injury.
In order to prevent the generation of above-mentioned situation, the mode used at present includes the modes such as coat film, pad pasting, composite membrane, effect Fruit is the most not fully up to expectations, and the most existing technology typically uses organic material to form, and its antioxidation shielding property is poor, and Relatively costly, it is not suitable for industrialized great production application.
Summary of the invention
The goal of the invention of the present invention is: providing a kind of electronic devices and components protecting film, this protecting film has excellence simultaneously Mechanical performance, excellent oxidation-resistant corrosion-resistant performance and the antistatic performance of excellence, to solve the problems referred to above.
The technical solution used in the present invention is such that a kind of electronic devices and components film, by following weight percentages Component forms:
Ethylene-acrylic acid copolymer 35-45%
Silane coupler 3-5%
Natural plant 15-25%
Plant ash 2-5%
Low-grade zinc oxide ore 15-20%
Stearic acid 3-5%
Zeolite powder 2-5%
Fatty acid polyethylene glycol ester 1-3%；
Said components adds up to 100%.
In said components, the residue after plant ash is draft and xylophyta is fully burnt, wherein contains the most inorganic Ion and trace element, the plant ash preferred powder of the present invention is broken to particle diameter less than 30 μm；
Low-grade zinc oxide ore is the mineral products that in zinc resource, occupancy volume is more, wherein relatively low due to Zn content, causes it to utilize Rate is relatively low, serious waste of resources, inventors herein have recognized that, the main chemical compositions in typical low-grade zinc oxide ore contains Amount is: zinc carbonate 10.26%, zinc silicate 2.19%. zinc sulfide 0.89%, automolite 3.96%, silicon dioxide 25.35%, oxygen Changing calcium 28.05%, titanium 0.16%, vanadium 0.38% and trace alkali metal, the composition of " low-grade zinc oxide ore " in the application also refers to Above-mentioned composition, above-mentioned low-grade zinc oxide ore is crushed to particle diameter less than after 50 μm, and filters out suitable polymerization by the application Thing, works in coordination with other compositions, and the sizing material obtained can make thin film, or sizing material is coated in electronic devices and components surface, permissible There is the mechanical performance of excellence, excellent oxidation-resistant corrosion-resistant performance and the antistatic performance of excellence, meanwhile, also to prior art The resources such as the plant ash of middle waste, low-grade zinc oxide ore have carried out effectively recycling, have great economic benefit and Social benefit；
The preparation method of the electronic devices and components film of the present invention is to comprise the following steps:
(1) weigh: weigh in described ratio；
(2) pulverize: plant ash is crushed to particle diameter and is less than 30 μm, low-grade zinc oxide ore is crushed to particle diameter less than 50 μm；
(3) frit reaction: by ethylene-acrylic acid copolymer, silane coupler, natural plant, plant ash, stearic acid and fat Acid polyethylene glycol ester is mixed in described ratio, and 600r/min stirs 5min, is then heated to molten condition, and stirs at 185 DEG C Mix 20min, be subsequently adding low-grade zinc oxide ore and the zeolite powder of described ratio, at 178 DEG C, react 15min, obtain sizing material；
(4) masking or coating: sizing material step (3) obtained, uses the techniques such as blowing to make the thin film that thickness is 10-100 μm, Or use the mode of coating, obtain the thin film that thickness is 30-100 μm.
As preferred technical scheme: described silane coupler is isobutyl triethoxy silane.There is more preferably machinery Performance and oxidation-resistant corrosion-resistant performance.
As preferred technical scheme: described natural plant is gutta-percha.Its combination property is more preferably.It is of course also possible to Using other plant glue, other plant glue is the most first hydrated, the most again with other raw material hybrid reactions.
In sum, owing to have employed technique scheme, the invention has the beneficial effects as follows: the thickness that the present invention prepares is The thin film of 10-100 μm or the coat film that thickness is 30-100 μm, at 30 DEG C after processing with 200 DEG C × 1 hour Hot strength reaches more than 51MPa, percentage elongation for below 5%, has the mechanical performance of excellence, can as self-supported membrane or The basement membrane of person's composite membrane；Its sheet resistance value is 1 × 106Ω≤Rs ＜ 1 × 109Ω, noncontact antistatic magnitude of voltage reaches More than 12kv, has the antistatic performance of excellence, meanwhile, has the high temperature resistant cryogenic property of acid and alkali-resistance of excellence.
Detailed description of the invention
The present invention is described in detail below.
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment, to the present invention It is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to Limit the present invention.
Embodiment 1:
A kind of electronic devices and components film, is made up of following components in parts by weight:
Ethylene-acrylic acid copolymer 40%
Isobutyl triethoxy silane 3%
Gutta-percha 25%
Plant ash 3%
Low-grade zinc oxide ore 16%
Stearic acid 5%
Zeolite powder 5%
Fatty acid polyethylene glycol ester 3%
The preparation method of above-mentioned electronic devices and components film is to comprise the following steps:
(1) weigh: weigh in described ratio；
(2) pulverize: plant ash is crushed to particle diameter and is less than 30 μm, low-grade zinc oxide ore is crushed to particle diameter less than 50 μm；
(3) frit reaction: by ethylene-acrylic acid copolymer, silane coupler, natural plant, plant ash, stearic acid and fat Acid polyethylene glycol ester is mixed in described ratio, and 600r/min stirs 5min, is then heated to molten condition, and stirs at 185 DEG C Mix 20min, be subsequently adding low-grade zinc oxide ore and the zeolite powder of described ratio, at 178 DEG C, react 15min, obtain sizing material；
(4) masking or coating: sizing material step (3) obtained, uses the techniques such as blowing to make the " protecting film that thickness is 30 μm A”；
Performance test:
A, antistatic performance are tested:
A1, sheet resistance value: by " protecting film A " for the backboard of solaode, use sheet resistance tester to test it Sheet resistance value, its value is 3.21 × 107Ω；
A2: noncontact antistatic voltage:
Method of testing: by " protecting film A " for the backboard of solaode, test solaode electrostatic potential, open from 2 kV Beginning to increase, increase by 2 kV every time, until 20 kV, i.e. test electrostatic potential is respectively 2 kV, 4 kV, 6 kV, 8 kV, 10 KV, 12 kV, 14 kV, 16 kV, 18 kV, 20 kV, parallel testing 5 times, during result to 12kv, solaode is without any damage Bad, function is completely normal, starts occur that i.e. noncontact antistatic voltage is 12kv extremely during 14kv；
B, measuring mechanical property:
The hot strength at 30 DEG C after " protecting film A " (1*10cm) was processed with 200 DEG C × 1 hour as 61.6MPa, Percentage elongation is 3.1%；
C, oxidation-resistant corrosion-resistant performance test:
" protecting film A " is carried out respectively following experiment:
C1: acid resistance: immerse 60g/L H2SO4Taking out after 7 days in solution, result is without any damage, until taking out after the 10th day, Trickle damage occurs；
C2: alkali resistance: immerse in 60g/LNaOH solution and take out after 7 days, result, without any damage, until taking out after the 9th day, goes out Existing trickle damage；
C3: high temperature resistant moisture-proof: be heated to 160 DEG C in 30min from room temperature, then natural cooling, it is placed in water immersion 6h, takes Going out, then be heated to 160 DEG C in 30min from room temperature, then natural cooling, so circulation 10 times, result is without any damage；
In terms of above-mentioned the performance test results, protecting film A is especially suitable for solar cell backboard, because its mechanical performance is with anti- Oxidation Corrosion Protection is the most prominent.
Embodiment 2
A kind of electronic devices and components film, is made up of the component of following weight percentages:
Ethylene-acrylic acid copolymer 45%
Butadienyl triethoxysilicane 5%
Gutta-percha 15%
Plant ash 5%
Low-grade zinc oxide ore 20%
Stearic acid 3%
Zeolite powder 4%
Fatty acid polyethylene glycol ester 3%
The preparation method of above-mentioned electronic devices and components film is to comprise the following steps:
(1) weigh: weigh in described ratio；
(2) pulverize: plant ash is crushed to particle diameter and is less than 30 μm, low-grade zinc oxide ore is crushed to particle diameter less than 50 μm；
(3) frit reaction: by ethylene-acrylic acid copolymer, silane coupler, natural plant, plant ash, stearic acid and fat Acid polyethylene glycol ester is mixed in described ratio, and 600r/min stirs 5min, is then heated to molten condition, and stirs at 185 DEG C Mix 20min, be subsequently adding low-grade zinc oxide ore and the zeolite powder of described ratio, at 178 DEG C, react 15min, obtain sizing material；
(4) masking or coating: sizing material step (3) obtained, is coated on IC component surface, obtains " protecting film B "；
Performance test:
A, antistatic performance are tested:
A1, sheet resistance value: using sheet resistance tester to test its sheet resistance value, its value is 6.36 × 108Ω；
A2: noncontact antistatic voltage:
Method of testing: test its electrostatic potential, starts to increase from 2 kV, increases by 2 kV every time, until 20 kV, i.e. tests Electrostatic potential is respectively 2 kV, 4 kV, 6 kV, 8 kV, 10 kV, 12 kV, 14 kV, 16 kV, 18 kV, 20 kV, parallel survey Trying 5 times, during result to 16kv, solaode is without any damage, and function is completely normal, starts occur extremely during 18kv, the most non- Contact antistatic voltage is 16kv；
B, measuring mechanical property:
The hot strength at 30 DEG C after " protecting film B " (1*10cm) being processed with 200 DEG C × 1 hour is 53.9MPa, percentage elongation are 3.7%；
C, oxidation-resistant corrosion-resistant performance test:
" protecting film B " is carried out respectively following experiment:
C1: acid resistance: immerse 60g/L H2SO4Taking out after 6 days in solution, result, without any damage, until taking out after the 8th, goes out Existing trickle damage；
C2: alkali resistance: immerse in 60g/LNaOH solution and take out after 6 days, result, without any damage, until taking out after the 8th day, goes out Existing trickle damage；
C3: high temperature resistant moisture-proof: be heated to 160 DEG C in 30min from room temperature, then natural cooling, it is placed in water immersion 6h, takes Go out, then in 30min, be heated to 160 DEG C from room temperature, then natural cooling, so circulation 6 times, result without any damage,
In terms of above-mentioned the performance test results, protecting film B is particularly suitable for integrated circuit (IC) components and parts, RFID label tag etc., because Its antistatic performance is the most prominent.

Claims (3)

1. an electronic devices and components protecting film, it is characterised in that be made up of the component of following weight percentages:
Ethylene-acrylic acid copolymer 35-45%
Silane coupler 3-5%
Natural plant 15-25%
Plant ash 2-5%
Low-grade zinc oxide ore 15-20%
Stearic acid 3-5%
Zeolite powder 2-5%
Fatty acid polyethylene glycol ester 1-3%；
Said components adds up to 100%.
Electronic devices and components protecting film the most according to claim 1, it is characterised in that described silane coupler is isobutyl group Triethoxysilane.
Electronic devices and components protecting film the most according to claim 1, it is characterised in that described natural plant is gutta-percha.
CN201610435290.1A 2016-06-18 2016-06-18 Protective film for electronic component Pending CN105837928A (en)

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CN201610652074.2A CN106220982A (en) 2016-06-18 2016-06-18 Integrated circuit or RFID label tag components and parts protecting film
CN201610652160.3A CN106220983A (en) 2016-06-18 2016-06-18 The preparation method of electronic devices and components protecting film
CN201610435290.1A CN105837928A (en) 2016-06-18 2016-06-18 Protective film for electronic component

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