CN105824380A - Automatically controlled computer mainframe cooling system - Google Patents
Automatically controlled computer mainframe cooling system Download PDFInfo
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- CN105824380A CN105824380A CN201610355675.7A CN201610355675A CN105824380A CN 105824380 A CN105824380 A CN 105824380A CN 201610355675 A CN201610355675 A CN 201610355675A CN 105824380 A CN105824380 A CN 105824380A
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- 238000001816 cooling Methods 0.000 title claims abstract description 22
- 239000000523 sample Substances 0.000 claims abstract description 15
- 238000002955 isolation Methods 0.000 claims description 24
- 230000008878 coupling Effects 0.000 claims description 19
- 238000010168 coupling process Methods 0.000 claims description 19
- 238000005859 coupling reaction Methods 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 19
- 244000273618 Sphenoclea zeylanica Species 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000010165 autogamy Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention relates to an automatically controlled computer mainframe cooling system. A mainboard is installed in a mainframe case. A slide rail is installed at the left end of the inner surface of the mainframe case. A slide block slides on the slide rail. A telescopic rod is connected to the slide block. A probe is connected to the top end of the telescopic rod. An L-shaped hollow rod is connected to an inner rod of the telescopic rod. A fan is connected to the L-shaped hollow rod. An arc-shaped groove is formed in the outer end of the slide block and cooperates with a pushing rod in use. The inner end of the slide block is connected with a rotary shaft through a shaft sleeve I. Directional blades are connected to the rotary shaft. A shaft sleeve II is connected to the rotary shaft and connected with a locating clamp rod. The locating clamp rod cooperates with a locating hole in use. The locating hole is formed in the inner end of the slide rail. The inner end of the slide rail is fixedly connected with a stop dog with an arc groove. The automatically controlled computer mainframe cooling system is used for cooling a computer mainframe.
Description
Technical field
The present invention relates to a kind of main frame cooling system automatically controlled.
Background technology
Present computer autogamy heat emission fan, but owing to routine use is frequent, add heat, make the mainboard in mainframe box easily and cause computer to use paralysis because of overheated, or the speed of service is extremely slow, brings inconvenience to the life and work of people.
Summary of the invention
It is an object of the invention to provide a kind of main frame cooling system automatically controlled, utilize probe to form bi-directional probing temperature with thermocouple, after carry out automatically turning on the system that fan carries out dispelling the heat under the control of temperature sensor.
Above-mentioned purpose is realized by following technical scheme:
nullA kind of main frame cooling system automatically controlled，Its composition includes: probe 6、Mainframe box 1、Mainboard 2，Mainboard 2 is loaded in described mainframe box 1，The left end of the inner surface of described mainframe box 1 installs slideway 3，Sliding slider 4 on described slideway 3，Connection expansion link 5 on described slide block 4，The top of described expansion link 5 connects probe 6，L-shaped hollow stem 7 is connected on the interior bar of described expansion link 5，Fan 8 is connected on described L-shaped hollow stem 7，The outer end of described slide block 4 has arc groove 9，Described arc groove 9 coordinates pushing ram 10 to use，Axle sleeve I 11 connection rotating shaft 12 is passed through in the inner of described slide block 4，Orienting piece 13 is connected in described rotating shaft 12，Connecting bushing II 14 in described rotating shaft 12，Described shaft sleeve II 14 connects location kelly 15，Described location kelly 15 coordinates hole 16, location to use，Described hole 16, location is opened in the inner of slideway 3，The block 17 connecting band arc groove is fixed in the inner of described slideway 3.
The described main frame cooling system automatically controlled, thermocouple 19 is loaded in described mainboard 2 and the dead slot 18 of the right-hand member of the inner surface of mainframe box 1, described thermocouple 19 is all connected with temperature sensor with probe 6, described temperature sensor includes that shell body 20, described shell body 20 connect the right-hand member of the outer surface of mainframe box 1 by flexible clamp piece 21.
The described main frame cooling system automatically controlled, described flexible clamp piece 21 includes C-shaped plate 22, the end face of described C-shaped plate 22 connects spring 23, the bottom surface of described spring 23 connects pressing plate 24, described pressing plate 24 is arranged on the interior of C-shaped plate 22, the vertical edge of described C-shaped plate 22 has slip port 25, and described slip port 25 slides on fixed block 26, and described fixed block 26 is connected on pressing plate 24.
The described main frame cooling system automatically controlled, button and charactron are installed on the shell body 20 of described temperature sensor, circuit board is loaded in described shell body 20, signal is passed to the linear optical coupling amplifying circuit of circuit board by described thermocouple 19, the signal of described linear optical coupling amplifying circuit also receiving transducer 6, signal is also passed to transducer by described probe 6, and signal is passed to SPI interface, control knob, pulse width modulation output, light-coupled isolation II, light-coupled isolation III, UART interface and PC interface by described transducer；
Signal is passed to charactron by described SPI interface；
Signal is passed to outside extended menory by described PC interface；
Signal is passed to light-coupled isolation I by described pulse width modulation output, and signal is passed to wave filter by described light-coupled isolation I, and signal is passed to current output terminal by described wave filter；
Signal is passed to relay by described light-coupled isolation II, and signal is passed to output switch parameter end by described relay；
Signal is passed to pulse transformer by described light-coupled isolation III, and described pulse transformer passes to fan 8 by triggering signal；
Signal is passed to light-coupled isolation IV by described UART interface, and signal is passed to computer by described light-coupled isolation IV.
nullThe described main frame cooling system automatically controlled，Described linear optical coupling amplifying circuit includes positive input terminal and negative input end，The positive input terminal of transport and placing device A1 is connected after described positive input terminal series resistance R2，One end of the negative input end of transport and placing device A1 in parallel and resistance R3 after described negative input end series resistance R1，The other end of outfan parallel resistance R3 of described transport and placing device A1 and one end of resistance R6，Described transport and placing device A1 parallel connection variable resistance R4，The other end of described resistance R6 connects the positive input terminal of transport and placing device A2，Negative input end parallel resistance R5 of described transport and placing device A2 and one end of resistance R7，The outfan of the other end parallel connection transport and placing device A2 of described resistance R7 and one end of resistance R8，The other end of described resistance R8 connects the positive input terminal of transport and placing device A3，Negative input end parallel resistance R9 of described described transport and placing device A3 and No. 2 pins of linear optical coupling，After outfan series resistance R10 of described transport and placing device A1, No. 1 pin with linear optical coupling is connected，No. 3 pins of described linear optical coupling connect one end of resistance R11，Other end parallel resistance R12 of described resistance R11 and variable resistance R13.
Beneficial effect:
1. the slideway of the present invention coordinates slide block to use arrival of can conveniently popping one's head in specify thermometric place, and the block of hole, the location mating band arc groove on slideway uses, and helps location kelly to insert in hole, location, and convenient location is with fixing.
2. the arc groove on the slide block of the present invention coordinates location kelly to use, and is conveniently replaced probe or overhauls, cleans.
3. the thermocouple of the present invention and two-way thermometric of popping one's head in, reach the effect more accurately measured, in actual use, the temperature of more convenient detection mainboard each several part, is also convenient for controlling the temperature of mainboard each several part.
4. the flexible clamp piece of the present invention makes temperature sensor be connected more closely with mainframe box, convenient use.
5. the top board of the C-shaped plate of the present invention facilitates the base plate of C-shaped plate to connect with the L-shaped draw-in groove of mainframe box by the cooperation between spring with pressing plate.
6. in the mainframe box of the present invention, various signal disturbing are many, easily cause control inaccurate, and circuit board capacity of resisting disturbance is strong.
Accompanying drawing illustrates:
Accompanying drawing 1 is the structural representation of the present invention.
Accompanying drawing 2 is the schematic diagram of slideway of the present invention and slide block.
Accompanying drawing 3 is the close-up schematic view of flexible clamp piece of the present invention.
Accompanying drawing 4 is the electrical diagram of circuit board of the present invention.
Accompanying drawing 5 is the circuit theory diagrams of linear optical coupling amplifying circuit of the present invention.
Detailed description of the invention:
Embodiment 1
nullA kind of main frame cooling system automatically controlled，Its composition includes: probe 6、Mainframe box 1、Mainboard 2，Mainboard 2 is loaded in described mainframe box 1，The left end (with mainboard apart from remote inner surface) of the inner surface of described mainframe box 1 installs slideway 3，Sliding slider 4 on described slideway 3，Connection expansion link 5 on described slide block 4，The top of described expansion link 5 connects probe 6，L-shaped hollow stem 7 is connected on the interior bar of described expansion link 5，Fan 8 is connected on described L-shaped hollow stem 7，The outer end of described slide block 4 has arc groove 9，Described arc groove 9 coordinates pushing ram 10 to use，Axle sleeve I 11 connection rotating shaft 12 is passed through in the inner of described slide block 4，Orienting piece 13 is connected in described rotating shaft 12，Connecting bushing II 14 in described rotating shaft 12，Described shaft sleeve II 14 connects location kelly 15，Described location kelly 15 coordinates hole 16, location to use，Described hole 16, location is opened in the inner of slideway 3，The block 17 connecting band arc groove is fixed in the inner of described slideway 3.
Embodiment 2
The main frame cooling system automatically controlled described in embodiment 1, thermocouple 19 is loaded in described mainboard 2 and the dead slot 18 of the right-hand member of the inner surface of mainframe box 1, described thermocouple 19 is all connected with temperature sensor with probe 6, described temperature sensor includes that shell body 20, described shell body 20 connect the right-hand member of the outer surface of mainframe box 1 by flexible clamp piece 21.
Embodiment 3
The main frame cooling system automatically controlled described in embodiment 2, described flexible clamp piece 21 includes C-shaped plate 22, the end face of described C-shaped plate 22 connects spring 23, the bottom surface of described spring 23 connects pressing plate 24, described pressing plate 24 is arranged on the interior of C-shaped plate 22, the vertical edge of described C-shaped plate 22 has slip port 25, and described slip port 25 slides on fixed block 26, and described fixed block 26 is connected on pressing plate 24.The right-hand member of the outer surface of described mainframe box 1 has L-shaped draw-in groove 27, loads flexible clamp piece 21 in described L-shaped draw-in groove 27.
Embodiment 4
The main frame cooling system automatically controlled described in embodiment 2, button and charactron are installed on the shell body 20 of described temperature sensor, circuit board is loaded in described shell body 20, signal is passed to the linear optical coupling amplifying circuit of circuit board by described thermocouple 19, the signal of described linear optical coupling amplifying circuit also receiving transducer 6, signal is also passed to transducer by described probe 6, and signal is passed to SPI interface, control knob, pulse width modulation output, light-coupled isolation II, light-coupled isolation III, UART interface and PC interface by described transducer；
Signal is passed to charactron by described SPI interface；
Signal is passed to outside extended menory by described PC interface；
Signal is passed to light-coupled isolation I by described pulse width modulation output, and signal is passed to wave filter by described light-coupled isolation I, and signal is passed to current output terminal by described wave filter；
Signal is passed to relay by described light-coupled isolation II, and signal is passed to output switch parameter end by described relay；
Signal is passed to pulse transformer by described light-coupled isolation III, and described pulse transformer passes to fan 8 by triggering signal；
Signal is passed to light-coupled isolation IV by described UART interface, and signal is passed to computer by described light-coupled isolation IV.
Embodiment 5
nullThe main frame cooling system automatically controlled described in embodiment 4，Described linear optical coupling amplifying circuit includes positive input terminal and negative input end，The positive input terminal of transport and placing device A1 is connected after described positive input terminal series resistance R2，One end of the negative input end of transport and placing device A1 in parallel and resistance R3 after described negative input end series resistance R1，The other end of outfan parallel resistance R3 of described transport and placing device A1 and one end of resistance R6，Described transport and placing device A1 parallel connection variable resistance R4，The other end of described resistance R6 connects the positive input terminal of transport and placing device A2，Negative input end parallel resistance R5 of described transport and placing device A2 and one end of resistance R7，The outfan of the other end parallel connection transport and placing device A2 of described resistance R7 and one end of resistance R8，The other end of described resistance R8 connects the positive input terminal of transport and placing device A3，Negative input end parallel resistance R9 of described described transport and placing device A3 and No. 2 pins of linear optical coupling，After outfan series resistance R10 of described transport and placing device A1, No. 1 pin with linear optical coupling is connected，No. 3 pins of described linear optical coupling connect one end of resistance R11，Other end parallel resistance R12 of described resistance R11 and variable resistance R13.
Certainly, described above is not limitation of the present invention, and the present invention is also not limited to the example above, change that those skilled in the art are made in the essential scope of the present invention, retrofits, adds or replaces, and also should belong to protection scope of the present invention.
Claims (5)
- null1. the main frame cooling system that a kind automatically controls，Its composition includes: probe (6)、Mainframe box (1)、Mainboard (2)，It is characterized in that: in described mainframe box (1), load mainboard (2)，The left end of the inner surface of described mainframe box (1) installs slideway (3)，The upper sliding slider (4) of described slideway (3)，The upper connection expansion link (5) of described slide block (4)，The top of described expansion link (5) connects probe (6)，L-shaped hollow stem (7) is connected on the interior bar of described expansion link (5)，Fan (8) is connected on described L-shaped hollow stem (7)，The outer end of described slide block (4) has arc groove (9)，Described arc groove (9) coordinates pushing ram (10) to use，Axle sleeve I (11) connection rotating shaft (12) is passed through in the inner of described slide block (4)，Orienting piece (13) is connected in described rotating shaft (12)，The upper connecting bushing II (14) of described rotating shaft (12)，Described shaft sleeve II (14) connects location kelly (15)，Described location kelly (15) coordinates hole, location (16) to use，Described hole, location (16) is opened in the inner of slideway (3)，The block (17) connecting band arc groove is fixed in the inner of described slideway (3).
- The main frame cooling system automatically controlled the most according to claim 1, it is characterized in that: in described mainboard (2) and the dead slot (18) of the right-hand member of the inner surface of mainframe box (1), load thermocouple (19), described thermocouple (19) is all connected with temperature sensor with probe (6), described temperature sensor includes shell body (20), and described shell body (20) connects the right-hand member of the outer surface of mainframe box (1) by flexible clamp piece (21).
- The main frame cooling system automatically controlled the most according to claim 2, it is characterized in that: described flexible clamp piece (21) includes C-shaped plate (22), the end face of described C-shaped plate (22) connects spring (23), the bottom surface of described spring (23) connects pressing plate (24), described pressing plate (24) is arranged on the interior of C-shaped plate (22), the vertical edge of described C-shaped plate (22) has slip port (25), described slip port (25) is in the upper slip of fixed block (26), and described fixed block (26) is connected on pressing plate (24).
- The main frame cooling system automatically controlled the most according to claim 2, it is characterized in that: the shell body (20) of described temperature sensor is upper installs button and charactron, circuit board is loaded in described shell body (20), signal is passed to the linear optical coupling amplifying circuit of circuit board by described thermocouple (19), the signal of described linear optical coupling amplifying circuit also receiving transducer (6), signal is also passed to transducer by described probe (6), signal is passed to SPI interface by described transducer, control knob, pulse width modulation exports, light-coupled isolation II, light-coupled isolation III, UART interface and PC interface；Signal is passed to charactron by described SPI interface；Signal is passed to outside extended menory by described PC interface；Signal is passed to light-coupled isolation I by described pulse width modulation output, and signal is passed to wave filter by described light-coupled isolation I, and signal is passed to current output terminal by described wave filter；Signal is passed to relay by described light-coupled isolation II, and signal is passed to output switch parameter end by described relay；Signal is passed to pulse transformer by described light-coupled isolation III, and described pulse transformer passes to fan (8) by triggering signal；Signal is passed to light-coupled isolation IV by described UART interface, and signal is passed to computer by described light-coupled isolation IV.
- nullThe main frame cooling system automatically controlled the most according to claim 4，It is characterized in that: described linear optical coupling amplifying circuit includes positive input terminal and negative input end，The positive input terminal of transport and placing device A1 is connected after described positive input terminal series resistance R2，One end of the negative input end of transport and placing device A1 in parallel and resistance R3 after described negative input end series resistance R1，The other end of outfan parallel resistance R3 of described transport and placing device A1 and one end of resistance R6，Described transport and placing device A1 parallel connection variable resistance R4，The other end of described resistance R6 connects the positive input terminal of transport and placing device A2，Negative input end parallel resistance R5 of described transport and placing device A2 and one end of resistance R7，The outfan of the other end parallel connection transport and placing device A2 of described resistance R7 and one end of resistance R8，The other end of described resistance R8 connects the positive input terminal of transport and placing device A3，Negative input end parallel resistance R9 of described described transport and placing device A3 and No. 2 pins of linear optical coupling，After outfan series resistance R10 of described transport and placing device A1, No. 1 pin with linear optical coupling is connected，No. 3 pins of described linear optical coupling connect one end of resistance R11，Other end parallel resistance R12 of described resistance R11 and variable resistance R13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610355675.7A CN105824380B (en) | 2016-05-26 | 2016-05-26 | The main frame cooling system of automatic control |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610355675.7A CN105824380B (en) | 2016-05-26 | 2016-05-26 | The main frame cooling system of automatic control |
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| CN105824380A true CN105824380A (en) | 2016-08-03 |
| CN105824380B CN105824380B (en) | 2019-01-18 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337861A (en) * | 2018-02-22 | 2018-07-27 | 德清利维通讯科技股份有限公司 | Filter protection device |
| CN112135203A (en) * | 2020-09-14 | 2020-12-25 | 南京玖婧艳网络科技有限公司 | Energy-concerving and environment-protective type network switch heat dissipation mechanism |
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| EP2493278A2 (en) * | 2011-02-25 | 2012-08-29 | NEC Corporation | Electric device |
| US20130235520A1 (en) * | 2012-03-09 | 2013-09-12 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
| CN103376412A (en) * | 2012-04-19 | 2013-10-30 | 李朝林 | Constant temperature device for battery charge-discharge testing |
| CN203799316U (en) * | 2014-01-09 | 2014-08-27 | 哈尔滨学院 | Automatic heat dissipation computer case |
| CN204925955U (en) * | 2015-07-25 | 2015-12-30 | 天津津情科技有限公司 | Heat abstractor is assisted to desktop |
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2016
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6384733B1 (en) * | 2001-02-15 | 2002-05-07 | Matthias Seesemann | Temperature monitoring apparatus for microprocessor cooling devices |
| EP2493278A2 (en) * | 2011-02-25 | 2012-08-29 | NEC Corporation | Electric device |
| US20130235520A1 (en) * | 2012-03-09 | 2013-09-12 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
| CN103376412A (en) * | 2012-04-19 | 2013-10-30 | 李朝林 | Constant temperature device for battery charge-discharge testing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337861A (en) * | 2018-02-22 | 2018-07-27 | 德清利维通讯科技股份有限公司 | Filter protection device |
| CN112135203A (en) * | 2020-09-14 | 2020-12-25 | 南京玖婧艳网络科技有限公司 | Energy-concerving and environment-protective type network switch heat dissipation mechanism |
| CN112135203B (en) * | 2020-09-14 | 2021-09-03 | 南京壹陆壹大数据科技有限公司 | Energy-concerving and environment-protective type network switch heat dissipation mechanism |
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| CN105824380B (en) | 2019-01-18 |
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