CN105813449B - Mounting device, loading testing method and its program - Google Patents
Mounting device, loading testing method and its program Download PDFInfo
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- CN105813449B CN105813449B CN201610040711.0A CN201610040711A CN105813449B CN 105813449 B CN105813449 B CN 105813449B CN 201610040711 A CN201610040711 A CN 201610040711A CN 105813449 B CN105813449 B CN 105813449B
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- suction nozzle
- component
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- pressing
- mounting device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
Abstract
Loading of pressing in when accurately detecting to substrate boarded parts, without the use of load cell.A kind of loading testing method, it shrinks the helical spring (39) for being set to suction nozzle (35) one side using mounting device (1), the loading of pressing in for component when being pressed by the component of suction (P) to substrate (W) is detected on one side, the loading testing method is configured to, suction nozzle is set to be moved to the control position of target and be pressed into component, suction nozzle is shot at the control position (Hb) of the target and generates shooting image, the identification position (Ha) of the suction nozzle shot in image is transformed to the current location (Hc) of suction nozzle, the shrinkage of the helical spring found out based on the difference between control position and the current location of suction nozzle according to target, calculate the loading of pressing in for being directed to component.
Description
Technical field
It the present invention relates to the use of mounting device from component to substrate, loading testing method and its journey that adsorption head installs
Sequence.
Background technique
The adsorption head of mounting device use the suction nozzle with helical spring, on one side make coil spring contracts, while will be by suction nozzle
The component of absorption is pressed into substrate, thus by component mounting to substrate.As this adsorption head, it is known that detection is directed to the pressure of component
Enter the adsorption head of load (for example, referring to patent document 1,2).The adsorption head of patent document 1 has load cell, is passed by dynamometry
Sensor detect the reaction force that is subject to from component of suction nozzle when component is pressed into and as loading of pressing in.The absorption of patent document 2
Head detects the shrinkage of helical spring in component indentation, calculates needle according to the known spring constant of helical spring
To the loading of pressing in of component.
Patent document 1: Japanese Unexamined Patent Publication 2005-032860 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2002-151893 bulletin
Adsorption head documented by patent document 1 can be directed to the loading of pressing in of component using load cell detection, but deposit
With number of components increase and adsorption head weight and cost increase the problem of.In addition, absorption documented by patent document 2
Head can simply calculate the shrinkage of helical spring for component multiplied by spring constant if being flat substrate
Loading of pressing in.It, can not be to spiral but in practical situations due to the warpage of substrate or the flexure generated because carrying load
The actual shrinkage of spring is detected, and the loading of pressing in for component can not be accurately calculated.
Summary of the invention
The present invention is exactly to propose in view of the foregoing, and its purpose is to provide can accurately detection part carry
When for substrate loading of pressing in, without the use of the mounting device, loading testing method and its program of load cell.
Mounting device of the invention, by being shunk on one side the preload portion for making to be set to suction nozzle, while will be by the suction nozzle
The component of absorption is pressed into substrate, so that the mounting device is characterized in that having by the component mounting to the substrate:
Suction nozzle shoot part, the control position for the target for being moved to the suction nozzle in control shaft and the component is pressed into, utilize the suction
Mouth shoot part shoots the suction nozzle at the control position of the target and generates shooting image；Evolution portion, will
The identification evolution for shooting the suction nozzle in image is the current location of the suction nozzle in real space；And loadometer
Calculation portion is found out described pre- based on the difference between control position and the current location of the suction nozzle according to the target
The shrinkage in tight portion, calculates the loading of pressing in for being directed to the component.
Loading testing method of the invention, the preload portion for making to be set to suction nozzle to one side in the mounting device shrinks, one
While the loading of pressing in for component when being pressed by the component of the suction to substrate is detected, load inspection
Survey method is characterized in that, has a following step: the control position for the target for being moved to the suction nozzle in control shaft and by institute
Component indentation is stated, the suction nozzle is shot at the control position of the target and generates shooting image；It will shoot in image
The suction nozzle identification evolution be real space in the suction nozzle current location；And based on according to the target
Control position and the current location of the suction nozzle between difference and the shrinkage in the preload portion that finds out, calculate and be directed to institute
State the loading of pressing in of component.
According to these structures, in component indentation on one side shrink preload portion, while utilize component to push back suction nozzle, therefore
Between the current location of suction nozzle in the control position and real space of the target of the suction nozzle in control shaft in component indentation
Produce deviation.The deviation shows the shrinkage in preload portion, thus the shooting image of suction nozzle when can be pressed into according to component and
The current location for finding out suction nozzle is found out pre- according to the difference between control position and the current location of suction nozzle of the target of suction nozzle
The actual shrinkage in tight portion.Even if can also find out the reality in preload portion in the case where warpage or flexure occur for substrate as a result,
The shrinkage on border, therefore the loading of pressing in for component can be accurately detected, without the use of load cell.
In above-mentioned mounting device, the shoot part is in the calibration before the carrying of the component acts, at a distance of institute
The different distance of mounting surface for stating substrate repeatedly shoots the suction nozzle, and the evolution portion is based on multiple shooting images
In the suction nozzle suction nozzle when being taken of identification position and multiple shooting image control position between correspondence
Relationship and converted.
In above-mentioned loading testing method, when there is the calibration before the carrying movement of the component, at a distance of described
The step of different distance of the mounting surface of substrate repeatedly shoots the suction nozzle, the step of carrying out the transformation are to be based on
The control bit of the suction nozzle when identification position of the suction nozzle in multiple shooting images and multiple shooting image are taken
Corresponding relationship between setting, and converted.
Suction nozzle will not be pushed back by component, therefore control according to these structures in the calibration before the carrying of component acts
The control position of the target of suction nozzle on axis is consistent with the current location of the suction nozzle in real space.Therefore, by finding out shooting
Corresponding relationship between the identification position of suction nozzle in image and the control position of suction nozzle, so as to which the suction in image will be shot
The identification evolution of mouth is the real position of suction nozzle.
In above-mentioned mounting device, has storage unit, the shooting figure of suction nozzle when which is pressed into component
It picture and is stored in association for the loading of pressing in of the component as tracing information.According to this structure, as being used for
The objective evidence tested afterwards to the failure generated when component is pressed by the shooting image of suction nozzle and can be directed to portion
The loading of pressing in of part retains in association.In addition, even if component indentation when loading of pressing in produce exception in the case where, also without
Need to the shooting image again to the component on substrate shoot.
In above-mentioned mounting device, have determination unit, the determination unit for the component loading of pressing in be greater than or
It is determined as exception in the case where equal to threshold value, in the case where being determined as exception in the determination unit, stops taking for the component
Load movement.According to this structure, stop carrying movement, Neng Goufang
The only subsequent failure caused by substrate due to the loading of pressing in of component.
In above-mentioned mounting device, has notification unit, which is determined as abnormal situation in the determination unit
Under, notify the exception of loading of pressing in.According to this structure, it will be pressed into the abnormal of load to notify to operator, can prompt to operate
Personnel carry out reason and are set for industry really.
Program of the invention is characterized in that, the mounting device is made to execute each step of above-mentioned loading testing method.
According to this structure, by installation procedure in the mounting device, so as to add the detection function of loading of pressing in the mounting device
Energy.Thereby, it is possible to the detection function of loading of pressing in is easily imported into mounting device possessed by client.
The effect of invention
In accordance with the invention it is possible to the shooting image of suction nozzle when being pressed into according to component and find out the current location of suction nozzle, root
The actual shrinkage in preload portion is found out according to the difference between control position and the current location of suction nozzle of the target of suction nozzle.By
This, is even if also can accurately detect the loading of pressing in for component in the case where warpage or flexure occur for substrate, without
Use load cell.
Detailed description of the invention
Fig. 1 is the schematic top plan view of mounting device involved in present embodiment.
Fig. 2 is the explanatory diagram of the detection operation of loading of pressing in involved in comparative example.
Fig. 3 is the schematic diagram of the control structure of mounting device involved in present embodiment.
Fig. 4 is the explanatory diagram of the detection operation of loading of pressing in involved in present embodiment.
Fig. 5 is the explanatory diagram of the detection operation of loading of pressing in involved in present embodiment.
The explanation of label
1 mounting device
22 suction nozzle shoot parts (shoot part)
31 adsorption heads
35 suction nozzles
39 helical springs (preload portion)
42 evolution portions
43 LOAD FOR portions
44 storage units
45 determination units
46 notification units
The identification position of Ha suction nozzle
The control position of Hb suction nozzle
The current location of Hc suction nozzle
P component
W substrate
Specific embodiment
In the following, being illustrated referring to attached drawing to mounting device involved in present embodiment.Fig. 1 is present embodiment institute
The schematic top plan view for the mounting device being related to.Fig. 2 is the explanatory diagram of the detection operation of loading of pressing in involved in comparative example.This
Outside, mounting device involved in present embodiment is not limited to structure shown in FIG. 1, can suitably change.
As shown in Figure 1, mounting device 1 is configured to, by the component P supplied from the components such as belt-type feeder supply unit 13 (ginseng
According to Fig. 2) it is pressed into using adsorption head 31 to substrate W, to be carried.In the substantial middle of the pedestal 11 of mounting device 1, along X
Axis direction is configured with substrate delivery section 12.Substrate delivery section 12 conveys the substrate W before component mounting from the one end of X-direction
And position to specified position, the substrate W after component mounting is moved out from the another side of X-direction.In addition, on the base 11,
It is configured with multiple component supply units 13 along the x axis transversely arrangedly in the two sides across substrate delivery section 12.
It can freely be loaded and unloaded at component supply unit 13 and tep reel 14 is installed, material containing band is wound on tep reel 14, the material containing
Band is packaged with multiple component P.Material containing band is provided with hole portion (not shown) with fixed spacing.It is arranged in the front end of component supply unit 13
There is sprocket wheel (not shown), becomes the state that the tooth of sprocket wheel is engaged with the hole portion of material containing band.Each component supply unit 13 passes through sprocket wheel
Rotation successively extracts component P out towards the delivery position picked up by adsorption head 31.At the delivery position of adsorption head 31, from load
The covering on surface exposes the component P in the pocket of material containing band to outside with removing by material strip.In addition, in present embodiment
In, belt-type feeder is exemplified as component supply unit 13, but can also be made of spherical feeder etc..
It is provided with XY moving portion 16 on the base 11, which makes adsorption head 31 along the x axis and Y direction is moved
It is dynamic.XY moving portion 16 includes a pair of of Y-axis workbench 17, they are extended parallel to Y direction；And X-axis workbench 18,
It is extended parallel to X-direction.The support portion that a pair of of Y-axis workbench 17 is uprightly arranged in the quadrangle of pedestal 11 branch (not shown)
Support, X-axis workbench 18 can be movably arranged at along the y axis on a pair of of Y-axis workbench 17.It is arranged on X-axis workbench 18
Have adsorption head 31, which can move along the x axis, adsorption head 31 by X-axis workbench 18, Y-axis workbench 17 from
It is moved in the horizontal direction with defined height the upper surface of substrate W.
Adsorption head 31 has multiple (being in the present embodiment 3) heads 32, which has aftermentioned suction nozzle 35.
Head 32 moves up and down suction nozzle 35 along Z-direction using Z axis motor (not shown), and utilizes θ motor (not shown)
Rotate suction nozzle 35 about the z axis.In addition, each suction nozzle 35 is connect with source (not shown) is attracted, by the attraction pair for coming self-gravitation source
Component P carries out absorption holding.In addition, being provided with helical spring 39 (referring to Fig. 3) at suction nozzle 35, on one side receive helical spring 39
It contracts, on one side by the component P adsorbed from suction nozzle 35 to substrate W indentation, to carrying component P to substrate W.
In addition, being provided with substrate imaging portion 21 at adsorption head 31, the label on substrate W is clapped from surface
It takes the photograph；And suction nozzle shoot part 22, the carrying of the component P carried out from oblique upper shooting by suction nozzle 35 act.In substrate imaging portion
In 21, the shooting image based on label and identify the position of substrate W, gradient, flexible etc., generated based on these recognition results
Control information of the component P relative to the loading position of substrate W.Using suction nozzle shoot part 22 to by being located at component supply unit 13
Suction nozzle 35 to before the absorption of component P, after absorption each image, by before the carrying that carries out of suction nozzle 35 that is located on substrate W, carry
In, carry after each image shot, saved using these each images as tracing information.
It is provided with component shoot part 23 on the base 11, the component shoot part 23 is from below to the component adsorbed by suction nozzle 35
P is shot.In component shoot part 23, the shooting image based on component P and identify in the adsorption site and component of suction nozzle 35
The gradient of position deviation amount, component P between the heart, the absorption position and direction of suction nozzle 35 are generated based on these recognition results
Control information.In addition, being provided with suction nozzle maintaining part (ATC:Automatic Tool Changer) 19, the suction on the base 11
Mouth maintaining part 19 keeps the suction nozzle 35 there are many replacement.Adsorption head 31 is by being moved to suction nozzle maintaining part 19, so as to incite somebody to action
Suction nozzle 35 in installation is removed and is changed the outfit as new suction nozzle 35.
In the mounting device 1 constituted in the manner described above, so that adsorption head 31 is moved to component supply unit 13, utilize suction nozzle
35 pick up the component P supplied from component supply unit 13, and component P is carried to the desired position of substrate W.In addition, this implementation
Component P is pressed by mounting device 1 involved in mode when to substrate W boarded parts to substrate W, by being applied to component P
Loading of pressing in detected, thus notice for component P loading of pressing in exception.
In general, by the way that load cell is arranged at adsorption head 31, thus the reaction force being subject to suction nozzle 35 from component P
Detected and as loading of pressing in, but with number of components increase and adsorption head 31 weight and cost increase.Therefore, it examines
Consider following methods, that is, replace setting load cell, according to the contraction for the helical spring 39 (referring to Fig. 3) for being set to suction nozzle 35
Loading of pressing in when measuring to component mounting detects.It, can be with substrate W but in the case where warpage or flexure occur for substrate W
Warpage or flexure shrink helical spring 39 redundantly, therefore, it is difficult to find out the actual contraction of helical spring 39
Amount, can not detect the loading of pressing in for component P.
As shown in the left side of fig 2, in the case where the mounting surface Wa of substrate W is flat, if suction nozzle 35 is moved to control shaft
On target control position Hb, then with for component P intrusion correspondingly make helical spring 39 shrink.For example, target
Control position Hb is correspondingly set with the loading of pressing in applied to component P is wished, is set as pressing component P with 0.5mm herein
Enter.If suction nozzle 35 is moved to the control position Hb of target, suction nozzle 35 is pushed back and made with 0.5mm by the upper surface Pa of component P
Helical spring 39 is shunk.It, can be by by control amount since the control amount of indentation is consistent with the shrinkage of helical spring 39
Loading of pressing in is calculated multiplied by spring constant.
In contrast, as illustrated at the right side of figure 2, in the case where mounting surface Wa high (for example, 0.3mm) of substrate W, if
Suction nozzle 35 is transferred to the control position Hb of target, then also makes spiral shell on the basis of the intrusion of component P with the height of mounting surface Wa
Spring 39 is revolved to shrink.In this case, suction nozzle 35 is moved to the control position Hb of target, so that suction nozzle 35 is by the upper table of component P
Face Pa is pushed back and is shunk helical spring 39 with 0.8mm., can also be with that is, although component P is is pressed into 0.5mm by control
The 0.3mm of the height value of mounting surface Wa shrinks helical spring 39 redundantly.Due to the control amount and spiral bullet of indentation
The shrinkage of spring 39 is inconsistent, therefore can not calculate actual loading of pressing in, and can not notify exception.
Therefore, in the present embodiment, the shooting image of the suction nozzle 35 when being pressed into according to component has found out the reality of suction nozzle 35
Current location Hc (referring to Fig. 4 C) in the space of border, according to the current location of control the position Hb and suction nozzle 35 of the target of suction nozzle 35
Difference between Hc has found out the actual shrinkage of helical spring 39.Even if the feelings of warpage or flexure occur in substrate W as a result,
Under condition, the actual shrinkage of helical spring 39 can be also found out, can accurately detect the loading of pressing in for component P,
Without the use of load cell.
Hereinafter, the loading testing method carried out by mounting device is described in detail referring to Fig. 3.Fig. 3 is this reality
Apply the schematic diagram of the control structure of mounting device involved in mode.In addition, in Fig. 3, for ease of description, only illustrate with
The related structure of the detection of loading of pressing in.
As shown in figure 3, suction nozzle axis 33 is extended downward from head 32, the energy at the suction nozzle shell 34 of the front end of suction nozzle axis 33
Suction nozzle 35 is installed to enough handling.The bar 38 of suction nozzle sliding block 37 can be slidably inserted into being pacified at suction nozzle shell 34 by suction nozzle 35
It is constituted in the hole of the suction nozzle inner casing 36 of dress.Helical spring 39 is installed at the bar 38 of suction nozzle sliding block 37, utilizes helical spring
39 pre-tighten downwards suction nozzle sliding block 37 always.It is formed with the suction port being connected with attraction source in the front end of suction nozzle sliding block 37, leads to
The negative pressure for crossing suction port adsorbs component P.
Suction nozzle shoot part 22 is provided near suction nozzle 35, the suction nozzle shoot part 22 is in order to clapping suction nozzle 35
Take the photograph and obliquely downward by optical axis.Suction nozzle shoot part 22 shoots suction nozzle 35 when component is pressed into and generates shooting image.
In this case, the control position of the target when making suction nozzle 35 be moved to component mounting in control shaft and by component P to substrate W
Indentation shoots and shooting image when the indentation of generating unit P suction nozzle 35 at the control position of the target.In addition,
When the calibration of suction nozzle 35 of the suction nozzle shoot part 22 before the carrying movement of component P, using the height of the mounting surface Wa of substrate W as base
It is quasi- and repeatedly suction nozzle 35 is shot and generates multiple shooting images (reference Fig. 4 A) at distance that up and down direction is different.Separately
Outside, the height that component P is moved to the mounting surface Wa of substrate W by the state of component P can also be maintained in suction nozzle 35, with component
On the basis of the height of the upper surface Pa of P and repeatedly suction nozzle 35 is shot at the different distance of up and down direction and generates multiple bats
Take the photograph image.In addition, needing not to be the suction nozzle with helical spring 39 as the suction nozzle used in calibration, more preferably carry out
Template suction nozzle after the length management of suction nozzle 35.
In addition, in mounting device 1, as control structure related with the detection of loading of pressing in, be provided with driving portion 41,
Evolution portion 42, LOAD FOR portion 43, storage unit 44, determination unit 45, notification unit 46.These each portions are by executing various processing
Processor and memory etc. are constituted.Memory is depending on the application by ROM (Read Only Memory), RAM (Random Access
) etc. Memory one or more storage mediums are constituted, and are deposited to the program for making mounting device 1 execute loading testing method
Storage.
Driving portion 41 controls the movement at the control shaft (Z axis) of suction nozzle 35, separates suction nozzle 35 relative to substrate W
Or control position that is close and being moved to target.42 pairs of evolution portion shooting image real-time image processing, according to shooting image
And the identification position of suction nozzle 35 is found out, and be the real space of suction nozzle 35 by the identification evolution of the shooting image of suction nozzle 35
The current location of (Z axis).In this case, evolution portion 42 obtains the multiple shooting images taken in calibration in advance
In suction nozzle 35 suction nozzle 35 when being taken of identification position and multiple shooting image control position between corresponding close
System, implements conversion process based on the corresponding relationship.
In the calibration before the carrying of component P acts, suction nozzle 35 will not be pushed back by component P, therefore the suction nozzle in control shaft
35 control position is consistent with the current location of actual suction nozzle 35.Therefore, the knowledge of the suction nozzle 35 in shooting image can be found out
Corresponding relationship between the control position of suction nozzle 35 on other position and control shaft, can will shoot the knowledge of the suction nozzle 35 in image
Other evolution is the real position of suction nozzle 35.Evolution portion 42 is using the corresponding relationship found out in the calibration, by component
The identification evolution of the suction nozzle 35 of shooting image when indentation is the current location of the suction nozzle 35 of real space.
In addition, corresponding relationship can be following arbitrary forms, that is, by the corresponding present bit in identification position with suction nozzle 35
List data made of setting graph data made of drafting, corresponding to the identification position of suction nozzle 35 and current location one to one,
And the function information of current location is found out for the identification position according to suction nozzle 35.In addition, in the present embodiment, being set as making
The structure of the corresponding relationship found out when used in calibration, but also can be used and predefine the defined corresponding relationship of going out.In addition, simultaneously
The structure that multiple shooting images when being not limited to calibration are shot as static image, is also possible to continuous with dynamic image
Ground shoots and extracts from dynamic image the structure of multiple shooting images.In addition, corresponding relationship is stored in above-mentioned memory
In.
LOAD FOR portion 43 calculates the loading of pressing in when the component carried out by suction nozzle 35 is pressed into for component P.
Helical spring 39 is pushed back by suction nozzle 35 by component P shrinks, therefore the control position of the target of suction nozzle 35 and real space
Deviation between the current location of suction nozzle 35 shows the shrinkage of helical spring 39.Therefore, according to the suction nozzle 35 in control shaft
Difference between the current location of the suction nozzle 35 of the control position and real space of target and find out the actual of helical spring 39
Shrinkage, the shrinkage based on the helical spring 39 calculate the loading of pressing in for being directed to component P.In addition, loading of pressing in is by by spiral shell
The shrinkage of rotation spring 39 is calculated multiplied by known spring constant.
The shooting image of suction nozzle 35 when component is pressed by storage unit 44 and for component P loading of pressing in as retrospect letter
It ceases and stores in association.Therefore, as the objective card for testing to the failure generated when component is pressed into afterwards
According to can retain in association by the shooting image of suction nozzle 35 and for the loading of pressing in of component P.In addition, even if in component pressure
In the case where producing exception in fashionable loading of pressing in, without using the suction nozzle shoot part 22 again bat to the component P on substrate W
It takes the photograph image to be shot, the operation of operator can be simplified and quickly responded to.
Determination unit 45 is compared by the threshold value for becoming determinating reference and for the loading of pressing in of component P, is being directed to component P
Loading of pressing in be greater than or equal to threshold value in the case where be determined as exception.In addition, determination unit 45 is in the case where being determined as exception
The carrying of the component P carried out by mounting device 1 is acted to stop.As a result, in the situation of the loading of pressing in exception for component P
Under automatically make carrying movement stop, the subsequent failure caused by substrate W due to the loading of pressing in of component P can be prevented.It is logical
Know the exception that loading of pressing in is notified in the case that portion 46 is determined as exception in determination unit 45.It will be pressed into the abnormal to operation of load
Personnel's notice can prompt operator to carry out reason and be set for industry really.
Referring to Fig. 4 and Fig. 5, the detection operation of the loading of pressing in carried out by mounting device is illustrated.Fig. 4 and Fig. 5
It is the explanatory diagram of the detection operation of loading of pressing in involved in present embodiment.In addition, Fig. 4 and loading of pressing in shown in fig. 5
Detection operation shows an example, therefore is not limited to the structure.
Firstly, as shown in Figure 4 A, in order to make in control shaft control position and shoot image on identification position consistency and
Implement calibration.In the calibration before the carrying of component P acts, the front end of suction nozzle 35 is located in the mounting surface Wa's of substrate W
Highly, on one side made along the vertical direction on the basis of the height of the mounting surface Wa of substrate W the front end of suction nozzle 35 it is mobile, while continuously
Suction nozzle 35 is shot.Then, as shown in Figure 4 B, image procossing is carried out to each shooting image, finds out the suction in shooting image
The identification position Ha of the front end of mouth 35 finds out multiple identification position Ha for shooting the suction nozzle 35 in images and multiple shooting figure
As the corresponding relationship of the suction nozzle 35 when being taken controlled between the Hb of position.
Herein, the identification position Ha of suction nozzle 35 shows the coordinate position of the front end of the suction nozzle 35 in shooting image.Suction nozzle
35 control position Hb, which is shown, makes that the front end of suction nozzle 35 is mobile, movement in control shaft using driving portion 41 (referring to Fig. 3)
Position.As noted above, in calibration, the current location Hc mono- of the suction nozzle 35 of the control position Hb and real space of suction nozzle 35
It causes, therefore the corresponding relationship finds out suction nozzle 35 as the identification position Ha according to the front end of the suction nozzle 35 in shooting image
Front end current location Hc control information carry out using.
Then, as shown in Figure 4 C, in component mounting, towards the control position of the target for the minimum point for becoming indentation movement
Hb keeps the suction nozzle 35 for being adsorbed with component P mobile.The control position Hb of target is opposite with the loading of pressing in for wishing to apply to component P
It sets with answering.If suction nozzle 35 is moved to the control position Hb of target, on one side make helical spring 39 shrink, while utilize suction nozzle
35 are pressed into component P to substrate W.At this point, the front end of suction nozzle 35 is pushed back by the upper surface Pa of component P, the suction nozzle pushed back 35
Front end is shot by suction nozzle shoot part 22 from oblique upper.Then, image procossing is carried out to shooting image, found out in shooting image
Suction nozzle 35 identification position Ha.
Then, as shown in Figure 4 D, using above-mentioned corresponding relationship, the identification position Ha for shooting the suction nozzle 35 in image is become
It is changed to the current location Hc of the suction nozzle 35 in real space.Then, according to the control position Hb of the target of suction nozzle 35 and suction nozzle 35
Current location Hc between difference, calculate helical spring 39 actual shrinkage.Then, by by the receipts of helical spring 39
Contracting amount is multiplied by spring constant, to accurately calculate the loading of pressing in for being directed to component P.By above-mentioned structure, even if in base
In the case that warpage or flexure occur for plate W, the loading of pressing in for component P also can be accurately calculated, without the use of dynamometry
Sensor.
For example, as shown in figure 5, also can even if the mounting surface Wa of substrate W is flat or the mounting surface Wa of substrate W forms high
The actual receipts of helical spring 39 are calculated according to the difference between the current location Hc of suction nozzle 35 and the control position Hb of target
Contracting amount.As shown in the left side of Fig. 5, in the case where the mounting surface Wa of substrate W is flat, it will be calculated with the consistent 0.5mm of intrusion
For the shrinkage of helical spring 39.Then, the 0.5mm of the shrinkage of helical spring 39 is calculated multiplied by spring constant for portion
The intrusion of part P.In this case, helical spring 39 is shunk with the intrusion of target, therefore applies pressure appropriate to component P
Enter load.
On the other hand, it as shown in the right side of Fig. 5, in the case where the mounting surface Wa high of substrate W, will be added in intrusion
0.8mm obtained from the height of mounting surface Wa is calculated as the shrinkage of helical spring 39.Then, by the shrinkage of helical spring 39
0.8mm the intrusion for component P is calculated multiplied by spring constant.In this case, with 0.3mm more than the intrusion than target
Helical spring 39 is shunk, therefore applies the load bigger than loading of pressing in appropriate to component P.It is determined as loading of pressing in as a result,
Exception and stop installation action, and will be pressed into the abnormal determination for notifying to operator and prompt to carry out reason of load.
As previously discussed, mounting device 1 involved in present embodiment on one side receives helical spring 39 in component indentation
Contracting using component P is pushed back suction nozzle 35 on one side, therefore the control bit of the target of the suction nozzle 35 in the control shaft in component indentation
It sets and generates deviation between the current location Hc of the suction nozzle of Hb and real space.The deviation shows the shrinkage of helical spring 39, because
The shooting image of suction nozzle 35 when this can be pressed into according to component and the current location Hc for finding out suction nozzle 35, according to the mesh of suction nozzle 35
Difference between the target control position Hb and current location Hc of suction nozzle 35 and find out the actual shrinkage of helical spring 39.By
This, even if can also find out the actual shrinkage of helical spring 39, therefore in the case where warpage or flexure occur for substrate W
The loading of pressing in for component P can be accurately detected, without the use of load cell.
In addition, being able to carry out various changes the present invention is not limited to above embodiment and implementing.In above-mentioned embodiment party
In formula, about the size and shape etc. illustrated in the accompanying drawings, it's not limited to that, can be in the range for realizing effect of the invention
Inside suitably changed.Furthermore it is possible to not suitably changed and implemented in the range of departing from the purpose of the present invention.
For example, in the present embodiment, being set as the structure shot to the front end of suction nozzle 35, but be not limited to the knot
Structure.As long as the structure of the current location of suction nozzle 35 can be identified according to shooting image, for example, can be set to suction nozzle 35
The structure that subsidiary label is shot.
In addition, in the present embodiment, having illustrated and described helical spring 39 as preload portion, but be not limited to the knot
Structure.As long as preload portion allow on one side shrink, while structure from the component P that suction nozzle 35 adsorbs to substrate W that will be pressed into from, example
Such as, it can also be made of leaf spring or air spring.
In addition, in the present embodiment, being set as using existing suction nozzle shoot part 22 as load detection use and to suction nozzle
35 structures shot, but it is not limited to the structure.It can also be used as load detection to use and shoot part is newly arranged.
In addition, in the present embodiment, can make the front end of suction nozzle 35 on the basis of the mounting surface Wa of substrate W along upper on one side
Lower direction is mobile, continuously shoots the front end of suction nozzle 35 on one side and implements to calibrate, can also be on one side from the camera site of minimum point
Be moved upward, on one side continuously shoot and implement to calibrate, can also on one side be moved downwards from the camera site of highest point, one
Side continuously shoots and implements to calibrate.
In addition, in the present embodiment, notification unit 46 can notify the exception of loading of pressing in, for example, can pass through
The flashing of lamp, lighting, buzz, voice message, picture show and are notified.
Industrial applicibility
As described above, the present invention have following effects, that is, can accurately detection part to substrate carry when
Loading of pressing in, without the use of load cell, particularly, to using mounting device from adsorption head to substrate installation portion part, carry
Lotus detection method and its program are effective.
Claims (9)
1. a kind of mounting device, by one side shrink the preload portion for being set to suction nozzle, while will be by the suction
Component is pressed into substrate, thus by the component mounting to the substrate,
The mounting device is characterized in that having:
Suction nozzle shoot part, the control position for the target for being moved to the suction nozzle in control shaft and the component is pressed into, utilize
The suction nozzle shoot part shoots the suction nozzle at the control position of the target and generates shooting image；
The identification evolution for shooting the suction nozzle in image is the suction nozzle in real space by evolution portion
Current location；And
LOAD FOR portion is asked based on the difference between control position and the current location of the suction nozzle according to the target
The shrinkage in the preload portion out calculates the loading of pressing in for being directed to the component.
2. mounting device according to claim 1, which is characterized in that
The suction nozzle shoot part is different with the mounting surface at a distance of the substrate in the calibration before the carrying of the component acts
Distance repeatedly shoots the suction nozzle,
The evolution portion is clapped in identification position and multiple shooting image based on the suction nozzle in multiple shooting images
Corresponding relationship between the control position of suction nozzle when taking the photograph, and converted.
3. mounting device according to claim 1 or 2, which is characterized in that
Has storage unit, the shooting image of suction nozzle when which is pressed into component and the indentation for the component carry
Lotus is stored in association as tracing information.
4. mounting device according to claim 1 or 2, which is characterized in that
Has determination unit, which is determined as different in the case where the loading of pressing in for the component is greater than or equal to threshold value
Often,
In the case where being determined as exception in the determination unit, stop the carrying movement of the component.
5. mounting device according to claim 3, which is characterized in that
Has determination unit, which is determined as different in the case where the loading of pressing in for the component is greater than or equal to threshold value
Often,
In the case where being determined as exception in the determination unit, stop the carrying movement of the component.
6. mounting device according to claim 4, which is characterized in that
Have notification unit, in the case which is determined as exception in the determination unit, notifies the exception of loading of pressing in.
7. mounting device according to claim 5, which is characterized in that
Have notification unit, in the case which is determined as exception in the determination unit, notifies the exception of loading of pressing in.
8. a kind of loading testing method, in the mounting device to will be by institute while shrinking the preload portion for being set to suction nozzle
The component for stating suction is detected to the loading of pressing in for component when substrate indentation,
The loading testing method is characterized in that thering is following step:
The control position for the target for being moved to the suction nozzle in control shaft and the component is pressed into, in the control bit of the target
The place of setting shoots the suction nozzle and generates shooting image；
It is the current location of the suction nozzle in real space by the identification evolution for shooting the suction nozzle in image；And
The preload found out based on the difference between control position and the current location of the suction nozzle according to the target
The shrinkage in portion calculates the loading of pressing in for being directed to the component.
9. loading testing method according to claim 8, which is characterized in that
With the carrying of the component movement before calibration when, at a distance of the substrate mounting surface it is different distance it is repeatedly right
The step of suction nozzle is shot,
The step of carrying out the transformation is identification position and multiple shooting based on the suction nozzle in multiple shooting images
Corresponding relationship between the control position of suction nozzle when image is taken, and converted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-009506 | 2015-01-21 | ||
| JP2015009506A JP6415996B2 (en) | 2015-01-21 | 2015-01-21 | Mounting device, load detection method and program thereof |
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| Publication Number | Publication Date |
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| CN105813449A CN105813449A (en) | 2016-07-27 |
| CN105813449B true CN105813449B (en) | 2019-11-08 |
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| CN201610040711.0A Active CN105813449B (en) | 2015-01-21 | 2016-01-21 | Mounting device, loading testing method and its program |
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| JP (1) | JP6415996B2 (en) |
| CN (1) | CN105813449B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110431932B (en) * | 2017-03-22 | 2020-12-25 | 雅马哈发动机株式会社 | Component mounting machine and suction nozzle height control method |
| JP6870070B2 (en) * | 2017-04-04 | 2021-05-12 | 株式会社Ｆｕｊｉ | Component mounting line management system |
| US10324127B2 (en) | 2017-06-08 | 2019-06-18 | Advantest Corporation | Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method |
| JP6811322B2 (en) * | 2017-06-26 | 2021-01-13 | 株式会社Ｆｕｊｉ | Electronic component mounting machine |
| JP7177915B2 (en) * | 2019-04-11 | 2022-11-24 | 株式会社Fuji | Parts mounting machine and parts mounting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273493A (en) * | 1994-03-30 | 1995-10-20 | Hitachi Techno Eng Co Ltd | Mounting machine |
| JP2005166944A (en) * | 2003-12-02 | 2005-06-23 | Yamaha Motor Co Ltd | Component mounting method and surface mounting machine |
| JP2008227140A (en) * | 2007-03-13 | 2008-09-25 | Juki Corp | Method and apparatus for mounting parts |
| CN103621196A (en) * | 2011-08-29 | 2014-03-05 | 松下电器产业株式会社 | Component-mounting device, nozzle, and component-mounting-position correction method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3056549B2 (en) * | 1991-07-29 | 2000-06-26 | ヤマハ発動機株式会社 | Parts transfer device |
| JP3358847B2 (en) * | 1993-06-29 | 2002-12-24 | 三洋電機株式会社 | Control device for component mounting machine |
| JP5950436B2 (en) * | 2012-01-17 | 2016-07-13 | ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． | Electronic component mounting equipment |
-
2015
- 2015-01-21 JP JP2015009506A patent/JP6415996B2/en active Active
-
2016
- 2016-01-21 CN CN201610040711.0A patent/CN105813449B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273493A (en) * | 1994-03-30 | 1995-10-20 | Hitachi Techno Eng Co Ltd | Mounting machine |
| JP2005166944A (en) * | 2003-12-02 | 2005-06-23 | Yamaha Motor Co Ltd | Component mounting method and surface mounting machine |
| JP2008227140A (en) * | 2007-03-13 | 2008-09-25 | Juki Corp | Method and apparatus for mounting parts |
| CN103621196A (en) * | 2011-08-29 | 2014-03-05 | 松下电器产业株式会社 | Component-mounting device, nozzle, and component-mounting-position correction method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105813449A (en) | 2016-07-27 |
| JP2016134560A (en) | 2016-07-25 |
| JP6415996B2 (en) | 2018-10-31 |
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