CN105810715A - Flexible display apparatus and preparation method therefor, and electronic equipment - Google Patents

Flexible display apparatus and preparation method therefor, and electronic equipment Download PDF

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Publication number
CN105810715A
CN105810715A CN201610164058.9A CN201610164058A CN105810715A CN 105810715 A CN105810715 A CN 105810715A CN 201610164058 A CN201610164058 A CN 201610164058A CN 105810715 A CN105810715 A CN 105810715A
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China
Prior art keywords
layer
display apparatus
flexible display
protecting film
oled
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CN201610164058.9A
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CN105810715B (en
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丁立薇
张婷婷
朱晖
张小宝
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Kunshan New Flat Panel Display Technology Center Co Ltd
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Kunshan New Flat Panel Display Technology Center Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a flexible display apparatus and a preparation method therefor, and electronic equipment. The flexible display apparatus comprises a substrate layer, a TFT layer formed on the substrate layer, a positive electrode layer formed on the TFT layer, an OLED layer formed on the positive electrode layer, a negative electrode layer formed on the OLED layer and the substrate layer which is not covered with the OLED layer, and a packaging layer formed on the negative electrode layer and the substrate layer which is not covered with the negative electrode layer, wherein a packaging space is formed by the packaging layer, the negative electrode layer and the substrate layer; the flexible display apparatus also comprises a protective film which is bent and deformed along with the flexible display apparatus; and the protective film is formed in at least one position as follows: the surface, deviating from the TFT layer, of the substrate layer, the position between the TFT layer and the positive electrode layer, the position between the positive electrode layer and the OLED layer, the position between the OLED layer and the negative electrode layer, the position between the negative electrode layer and the packaging layer, and the surface, deviating from the negative electrode layer, of the packaging layer. The problem of uneven display effect of the screen of the conventional flexible display apparatus is effectively solved.

Description

Flexible display apparatus and preparation method and electronic equipment
Technical field
The present invention relates to display technology field, particularly relate to a kind of flexible display apparatus and preparation method and electronic equipment.
Background technology
At present, AMOLED (Active-matrixorganiclight-emittingdiode, active matrix organic light-emitting diode) as a kind of new display, there is high chroma, high-contrast, wide viewing angle, high brightness, self-luminous, fast response time, the features such as Flexible Displays can be realized, be widely used on the electronic equipment such as mobile phone and media player.
Wherein, adopt the AMOLED flexible display apparatus realized to have and can operationally keep deployed condition to facilitate operation, keep rolled state to be convenient for carrying during collecting, advantages such as presenting wearable state with it can also be hung over so that it is by extensive concern simultaneously.But, when traditional flexible display apparatus is applied to the occasion of Flexible Displays, owing to the crooked radian of each viewing area of the screen body of flexible display apparatus is incomplete same, in flexible display apparatus dynamic bending process, its internal structure is easy to the phenomenon occurring the situation of tomography or layering and circuit to damage, thus causing that the overall display effect of screen body is uneven.
Summary of the invention
Based on this, it is necessary to be susceptible to tomography or layering for traditional flexible display apparatus screen body and the uneven problem of the overall display effect that causes, it is provided that a kind of flexible display apparatus and preparation method and electronic equipment.
For realizing a kind of flexible display apparatus that the object of the invention provides, including:
Substrate layer;
TFT layer, described TFT layer is formed on described substrate layer;
Anode layer, described anode layer is formed on described TFT layer;
Oled layer, described oled layer is formed on described anode layer;
Cathode layer, described cathode layer is formed on described oled layer and on the described substrate layer that do not covered by described oled layer;
Encapsulated layer, described encapsulated layer is formed on described cathode layer and on the described substrate layer that do not covered by cathode layer, and forms coating space with described cathode layer and described substrate layer;
Described coating space is coated with described TFT layer, described anode layer, described oled layer and described cathode layer;
The protecting film also including the bending with described flexible display apparatus and deform;
Described protecting film is formed at least one place in following position:
Described protecting film is formed at that described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
Wherein in an embodiment, described protecting film includes:
Absorbed layer, the energy produced during for absorbing described protecting film deformation;
First conversion layer, described first conversion layer is formed on described absorbed layer, for provide described protecting film along described flexible display apparatus bending direction deform time support force;
First memory layer, described first memory layer is formed on described first conversion layer, for maintaining the original form of described protecting film;With
Glue-line, described glue-line is formed on described first memory layer.
Wherein in an embodiment, described protecting film also includes:
Second conversion layer, described second conversion layer is formed at described absorbed layer and deviates from the surface of described first conversion layer, for providing and the support force of described first conversion layer different directions;
Second memory layer, described second memory layer is formed at described second conversion layer and deviates from the surface of described absorbed layer, for maintaining the original form of described protecting film.
Wherein in an embodiment, the material of described absorbed layer is polyimides, polymethyl methacrylate, cyclic olefin polymer or Merlon.
Wherein in an embodiment, the material of described first memory layer and described second memory layer is memory metal, ferroelectric material or dielectric material.
Wherein in an embodiment, the material of described first conversion layer and described second conversion layer is metal simple-substance or metal alloy.
Accordingly, the preparation method that present invention also offers a kind of flexible display apparatus, comprise the steps:
Substrate surface after the pre-treatment prepares PI layer;
On described PI layer surface, preparation forms substrate layer;
On described substrate layer surface, preparation forms TFT layer;
On described TFT layer surface, preparation forms anode layer;
On described anode layer surface, preparation forms oled layer;
Cathode layer is formed on described oled layer surface and the described substrate layer surface preparation not covered by described oled layer;
On described cathode layer surface, preparation forms encapsulated layer;
Described substrate and described PI layer are peeled off by described substrate layer;
Wherein, the step preparing protecting film is also included;And
The preparation of described protecting film is formed at least one place in following position:
Described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
Wherein in an embodiment, the step that described preparation forms protecting film includes:
Coating process is adopted to prepare absorbed layer;
On the surface of described absorbed layer, preparation forms the first conversion layer;
The first memory layer is formed in the preparation of the surface of described first conversion layer;
Glue-line is formed in the described first surface preparation remembering layer.
Wherein in an embodiment, described employing coating process also comprises the steps: before preparing absorbed layer
Coating process is adopted to prepare the second memory layer;
The second conversion layer is formed in the described second surface preparation remembering layer;
Wherein, the described absorbed layer that prepared by described employing coating process is formed on described second conversion layer.
Accordingly, present invention also offers a kind of electronic equipment, including flexible display apparatus;
Described flexible display apparatus is arranged on described electronic equipment, including substrate layer and the TFT layer, anode layer, oled layer, cathode layer and the encapsulated layer that are sequentially formed on described substrate layer;
The protecting film that described flexible display apparatus also includes the bending with described flexible display apparatus and deforms;
Described protecting film is formed at least one place in following position:
Described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
Above-mentioned flexible display apparatus, by arranging substrate layer, TFT layer, anode layer, oled layer, cathode layer, encapsulated layer and protecting film, and protecting film is set it is formed at substrate layer and deviates between the surface of TFT layer, TFT layer and anode layer, between anode layer and oled layer, between oled layer and cathode layer, between cathode layer and encapsulated layer and/or encapsulated layer deviates from the surface of cathode layer.Meanwhile, this protecting film deforms along with the bending of flexible display apparatus.Thus, when flexible display apparatus is when bending, the part that fits with protecting film in its internal structure (as: substrate layer, TFT layer, anode layer, oled layer, cathode layer and/or encapsulated layer) under the metamorphosis of protecting film, also can present identical case of bending therewith, thus avoiding the phenomenon of flexible display apparatus internal structure generation tomography or layering, this has also just been effectively ensured overall display effect during flexible display apparatus bending.Finally efficiently solve the problem that the overall display effect of traditional flexible display apparatus screen body is uneven.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the embodiment one of the flexible display apparatus of the present invention;
Fig. 2 is the cross-sectional view of the embodiment two of the flexible display apparatus of the present invention;
Fig. 3 is the cross-sectional view of the embodiment three of the flexible display apparatus of the present invention;
Fig. 4 is the cross-sectional view of the embodiment one of the protecting film in the flexible display apparatus of the present invention;
Fig. 5 is the cross-sectional view of the embodiment two of the protecting film in the flexible display apparatus of the present invention.
Detailed description of the invention
For making technical solution of the present invention clearly, below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
First, it should be noted that flexible display apparatus refers to and adopts soft material to make, the flexible display device of changeable type.
Referring to Fig. 1 to Fig. 3, as a specific embodiment of the flexible display apparatus of the present invention, it includes substrate layer 110, TFT layer 120, anode layer 130, oled layer 140, cathode layer 150, encapsulated layer 160 and protecting film 170.
Herein, it should be noted that, substrate layer 110 refers in preparing flexible display apparatus process, after substrate 200 surface adopts spin coating proceeding to prepare PI (Polyimide) layer 300, at BL (Bufferlayer) layer prepared by PI layer 300 surface.
TFT layer 120 then refers to TFT (ThinFilmTransistor, the thin film transistor (TFT)) array in flexible display apparatus internal structure.
Anode layer 130 refers to the anode electrode of flexible display apparatus.Accordingly, cathode layer 150 is then the cathode electrode of flexible display apparatus.
Oled layer 140 then refers to the luminous component of flexible display apparatus.It specifically includes the hole injection layer 141, hole transmission layer 142, electronic barrier layer 143, luminescent layer 144, hole blocking layer 145, electron transfer layer 146 and the electron injecting layer 147 that are sequentially formed on anode layer 130.Its luminescence mechanism is: electronics injects and arrives light-emitting zone trichroism for RGB (namely by electron injecting layer (EIL) 147, electron transfer layer (ETL) 146, hole blocking layer 145, luminescent layer 144), carry out recombination luminescence at light-emitting zone trichroism for RGB and hole;(namely hole arrives light-emitting zone trichroism for RGB by hole injection layer (HIL) 141, hole transmission layer (HTL) 142, electronic barrier layer 143, luminescent layer 144), carry out recombination luminescence at light-emitting zone trichroism for RGB and electronics.
Wherein, TFT layer 120 is formed on substrate layer 110.Anode layer 130 is formed on TFT layer 120.Oled layer 140 is then formed on anode layer 130.Further, cathode layer 150 is formed on oled layer 140 and on the substrate layer 110 not covered by oled layer 140.Encapsulated layer 160, then be formed on cathode layer 150 and on the substrate layer 110 that do not covered by cathode layer 150, and form coating space with cathode layer 150 and substrate layer 110.Wherein, this coating space cladding TFT layer 120, anode layer 130, oled layer 140 and cathode layer 150.
Meanwhile, protecting film 170 is then formed at substrate layer 110 and deviates between the surface of TFT layer 120, TFT layer 120 and anode layer 130, between anode layer 130 and oled layer 140, between oled layer 140 and cathode layer 150, between cathode layer 150 and encapsulated layer 160 and/or encapsulated layer 160 deviates from the surface of cathode layer 150.Further, protecting film 170 deforms along with the bending of flexible display apparatus.
Thus, flexible display apparatus is in BENDING PROCESS, all can there is corresponding bending along with the deformation of protecting film 170 in each Rotating fields being close to protecting film 170 in its internal structure, this just effectively have adjusted each Rotating fields of next-door neighbour's protecting film 170 Stress Release in BENDING PROCESS, so that the phenomenon of tomography or layering will not be there is between the double-layer structure of next-door neighbour's protecting film 170, finally ensure that the concordance of the display effect at each viewing area place of flexible display apparatus.
Wherein, it should be noted that protecting film 170 both can be formed at outside the coating space of encapsulated layer 160 and cathode layer 150 and substrate layer 110 formation, it is possible to is formed between each Rotating fields within this coating space.Referring to Fig. 1, cross-sectional view when being formed at for protecting film 170 outside the coating space of encapsulated layer 160 and cathode layer 150 and substrate layer 110 formation.Now, protecting film 170 is formed at substrate layer 110 and deviates from the surface of TFT layer 120.That is, protecting film 170 is formed at the periphery of flexible display apparatus.Referring to Fig. 2, then it is formed at cross-sectional view during this coating space inside for protecting film 170.That is, protecting film 170 is formed at the inside of flexible display apparatus.Wherein, when protecting film 170 is formed at the inside of flexible display apparatus, it can be formed in internal structure between any layer.
And, in order to better ensure the display effect of the whole screen body of flexible display apparatus, the display effect making whole screen body is more consistent, preferably, referring to Fig. 3, protecting film 170 is simultaneously formed at periphery and the inside of flexible display apparatus, and protecting film 170 is also formed between each Rotating fields in the internal structure of flexible display apparatus.That is, protecting film 170 is simultaneously formed at substrate layer 110 and deviates between the surface of TFT layer 120, TFT layer 120 and anode layer 130, between anode layer 130 and oled layer 140, between oled layer 140 and cathode layer 150, between cathode layer 150 and encapsulated layer 160 and encapsulated layer 160 deviates from the surface of cathode layer 150.
Further, referring to Fig. 4, as the embodiment one of protecting film in the flexible display apparatus of the present invention 170, it specifically can include absorbed layer the 171, first conversion layer 172, first and remember layer 173 and glue-line 174.Wherein, the first conversion layer 172 is formed on absorbed layer 171.First memory layer 173 is formed on the first conversion layer 172.Glue-line 174 is formed on the first memory layer 173.
It should be noted that, absorbed layer 171, for absorbing deformation energy when protecting film 170 deforms in the bending along with flexible display apparatus.It can adopt polyimides (PI, Polymide), polymethyl methacrylate (PMMA), cyclic olefin polymer (that is, a kind of new material Zeonor cyclic olefin polymer (CycioOlefinsPolymer, COP).Its maximum advantage is in that proportion is low, and relatively PMMA is poor for water absorption) and the material such as Merlon (PC) be prepared from, thus reaching to absorb external force in the way of deformation.
First memory layer 173, then for maintaining the original form of protecting film 170.It can adopt ductility poor, the good material of pliability, as: memory metal (as: Nitinol).May be used without the material with store-memory function, as: ferroelectric material and dielectric material etc..
First conversion layer 172, it is then for when flexible display apparatus bends in one direction, for the deformation support function power consistent with bending direction to protecting film 170 offer, to ensure that protecting film 170 can deform accordingly along with the bending of flexible display apparatus.It can adopt ductility and flexibility material all preferably, as: the metal simple-substances such as aluminum and silver, metal alloy also can be adopted to prepare.Its internal structure is similar to brush, includes multiple equally distributed support column.
Glue-line 174, then for ensureing can fit completely between the screen body of flexible display apparatus and protecting film 170.It can adopt the material that adhesion is stronger.Meanwhile, when selecting glue to prepare glue-line 174, after glue is solidified, its surface tension should be consistent with the first memory layer 173.Wherein, glue is the general name with water for solvent or the glue of disperse medium, for common solvent-borne type glue (that is, the glue with organic solvent for solvent or disperse medium).
Additionally, it should be noted that due to flexible display apparatus be applied to Flexible Displays occasion time, the bending direction of its whole screen body can't always in the same direction, it is also possible to along different directions bend.Therefore, screen body in order to ensure flexible display apparatus still has good display effect when bending along different directions, as the embodiment two of the protecting film 170 in the flexible display apparatus of the present invention, referring to Fig. 5, it also includes the second conversion layer 176 and the second memory layer 175.Wherein, the second conversion layer 176 is formed at absorbed layer 171 and deviates from the surface of the first conversion layer 172.Second memory layer 175 is formed at the second conversion layer 176 and deviates from the surface of absorbed layer 171.
It should be noted that, the second conversion layer 176 has the effect identical with the first conversion layer 172, the material of its selection can be identical with the first conversion layer 172, it is possible to different.And, second conversion layer 176 and the first conversion layer 172 institute the difference is that, deformation direction and the first conversion layer 172 that second conversion layer 176 provides should be different, and thus guarantee protecting film 170 makes consistent deformation along with the screen body of flexible display apparatus along the bending of different directions.Simultaneously, it is noted that the number of plies of the conversion layer in protecting film 170 specifically can set according to the most multidirectional case of bending that flexible display apparatus finally can present.That is, when the screen body of flexible display apparatus can bend along three different directions, the conversion layer of protecting film 170 then relative set three layers.
Further, the second memory layer 175 has the effect identical with the first memory layer 173.The material of its selection equally can be identical with the first memory layer 173, it is possible to different.
Accordingly, based on unified inventive concept, in order to realize any of the above-described kind of flexible display apparatus, present invention also offers a kind of flexible display apparatus preparation method.
As a specific embodiment of the flexible display apparatus preparation method of the present invention, it comprises the steps:
First, by step S100, substrate surface after the pre-treatment prepares PI layer.Wherein, substrate can be glass substrate.Meanwhile, the pretreatment of substrate being specially and is cleaned substrate processing, it specifically can pass through ultrasonic waves for cleaning.It addition, the substrate surface after processing through cleaning prepares PI layer, spin coating proceeding can be adopted to be prepared.Then, by step S200, on PI layer surface, preparation forms substrate layer.Wherein, the preparation of substrate layer can adopt CVD (ChemicalVaporDeposition, chemical vapour deposition (CVD)) technique.And then, by step S300, on substrate layer surface, preparation forms TFT layer.Wherein, the preparation of TFT layer then can adopt CVD technique, sputtering sedimentation (Sputter) technique, gold-tinted, etching etc..Meanwhile, also by step S400, on TFT layer surface, preparation forms anode layer.Wherein, the preparation of anode layer is the preparation of anode electrode, and it can adopt CVD technique, sputtering sedimentation (Sputter) technique, gold-tinted, etching etc. equally.Step S500, on anode layer surface, preparation forms oled layer.Wherein, the preparation of oled layer specifically includes successively at anode layer surface preparation formation hole injection layer, hole transmission layer, electronic barrier layer, luminescent layer, hole blocking layer, electron transfer layer and electron injecting layer.It all can adopt evaporation mode to prepare.Step S600, forms cathode layer on oled layer surface and the substrate layer surface preparation not covered by oled layer.The preparation of cathode layer then can adopt evaporation process.Step S700, on cathode layer surface, preparation forms encapsulated layer.Step S800, peels off substrate and PI layer by substrate layer.
Wherein, also include step S900, substrate layer deviate between the surface of TFT layer, TFT layer and anode layer, between anode layer and oled layer, between oled layer and cathode layer, between cathode layer and encapsulated layer and/or encapsulated layer deviate from cathode layer surface preparation formed protecting film.
Concrete, the preparation of protecting film includes step S910, adopts coating process to prepare absorbed layer.Step S920, on the surface of absorbed layer, preparation forms the first conversion layer.Step S930, forms the first memory layer in the preparation of the surface of the first conversion layer.Step S940, forms glue-line in the first surface preparation remembering layer.
Further, screen body in order to ensure flexible display apparatus still has good display effect when bending along different directions, prepare in the process of protecting film, before preparing absorbed layer, also include adopting coating process to prepare the second memory layer, then form the step of the second conversion layer in the second surface preparation remembering layer.
Namely, the second memory layer is prepared initially with coating process, then the second conversion layer is formed in the second surface preparation remembering layer, and then on the surface of the second conversion layer, preparation forms absorbed layer again, on the surface of absorbed layer, preparation forms the first conversion layer, forming the first memory layer in the preparation of the surface of the first conversion layer, finally the surface of the first memory layer forms glue-line again, thus completing the preparation of protecting film.
It addition, also, it should be noted both can be formed at the periphery of flexible display apparatus due to protecting film, can be formed at again in the internal structure of flexible display apparatus.Therefore, it is formed at the periphery of flexible display apparatus for protecting film individually below and is formed in the internal structure of flexible display apparatus, the flexible display apparatus preparation method of the present invention is described in more detail.
Wherein, when protecting film is formed at flexible display apparatus peripheral, it both can be attached on the screen body of flexible display apparatus, can be formed at the screen body of flexible display apparatus by preparation technology again peripheral.
Embodiment one
The present embodiment is protecting film is formed at preparation technology during flexible display apparatus peripheral by preparation technology.Concrete:
First, glass substrate is cleaned pretreatment.Then, spin coating proceeding is adopted to prepare formation PI layer on the glass substrate.And then form protecting film in the preparation of PI layer.And then, then adopt CVD technique to prepare formation BL layer on protecting film.And then the preparation of TFT structure part and anode part it is sequentially carried out again on BL layer surface.Wherein, the preparation technology of TFT structure part and anode part is based on CVD/Sputter, gold-tinted, etching etc..
And then carry out the preparation of oled layer again.Concrete, first, prepare hole injection layer (HIL) on the surface of anode layer.Wherein, hole injection layer is organic material, adopts evaporation mode to make, and, hole injection layer is hole main carriers.Then, hole transmission layer (HIL) is prepared on the surface of hole injection layer.Wherein, hole transport is organic material, and same employing evaporation mode makes, and hole transport (HTL) is the approach of hole transport.And then, then prepare electronic barrier layer on the surface of hole transmission layer.Wherein, electronic barrier layer is organic material, and evaporation mode can be adopted equally to make;Further, the Main Function of electronic barrier layer is for preventing light-emitting zone (that is, luminescent layer) trichroism for electron detachment RGB.Then, then on the surface of electronic barrier layer evaporation process is adopted to prepare the trichroism luminescent layer of RGB.And adopt evaporation process to prepare hole blocking layer on the surface of luminescent layer.It should be noted that, hole blocking layer is similarly organic material, its Main Function is for preventing hole from departing from the trichroism light-emitting zone of RGB.After formation hole blocking layer to be prepared, then evaporation process is adopted to prepare the electron transfer layer for providing electric transmission approach on the surface of hole blocking layer.Wherein, electron transfer layer (ETL) can adopt organic material to prepare equally.And then prepare electron injecting layer on the surface of electron transfer layer again.Wherein, electron injecting layer (EIL) is organic material, adopts evaporation mode to make.Further, electron injecting layer (EIL) is electronics main carriers.
And then, then prepare cathode electrode on the surface of electron injecting layer.Wherein, cathode electrode may be used without evaporation mode and makes.Finally, then be packaged and glass substrate peel off.Thus being finally completed the preparation of the flexible display apparatus of the present invention.
Embodiment two
The present embodiment is that protecting film passes through to fit preparation technology when being formed at flexible display apparatus peripheral.
Concrete:
First, glass substrate is cleaned pretreatment.Then, spin coating proceeding is adopted to prepare formation PI layer on the glass substrate.And then, then adopt CVD technique to prepare formation BL layer on protecting film.And then the preparation of TFT structure part and anode part it is sequentially carried out again on BL layer surface.Wherein, the preparation technology of TFT structure part and anode part is based on CVD/Sputter, gold-tinted, etching etc..
And then carry out the preparation of oled layer again.Concrete, first, prepare hole injection layer (HIL) on the surface of anode layer.Wherein, hole injection layer is organic material, adopts evaporation mode to make, and, hole injection layer is hole main carriers.Then, hole transmission layer (HIL) is prepared on the surface of hole injection layer.Wherein, hole transport is organic material, and same employing evaporation mode makes, and hole transport (HTL) is the approach of hole transport.And then, then prepare electronic barrier layer on the surface of hole transmission layer.Wherein, electronic barrier layer is organic material, and evaporation mode can be adopted equally to make;Further, the Main Function of electronic barrier layer is for preventing light-emitting zone (that is, luminescent layer) trichroism for electron detachment RGB.Then, then on the surface of electronic barrier layer evaporation process is adopted to prepare the trichroism luminescent layer of RGB.And adopt evaporation process to prepare hole blocking layer on the surface of luminescent layer.It should be noted that, hole blocking layer is similarly organic material, its Main Function is for preventing hole from departing from the trichroism light-emitting zone of RGB.After formation hole blocking layer to be prepared, then evaporation process is adopted to prepare the electron transfer layer for providing electric transmission approach on the surface of hole blocking layer.Wherein, electron transfer layer (ETL) can adopt organic material to prepare equally.And then prepare electron injecting layer on the surface of electron transfer layer again.Wherein, electron injecting layer (EIL) is organic material, adopts evaporation mode to make.Further, electron injecting layer (EIL) is electronics main carriers.
And then, then prepare cathode electrode on the surface of electron injecting layer.Wherein, cathode electrode may be used without evaporation mode and makes.Then, then be packaged and glass substrate peel off.Finally, then by previously prepared good protecting film the BL layer after peeling off substrate is directly fitted to.Thus being finally completed the preparation of the flexible display apparatus of the present invention.
Embodiment three
The present embodiment is protecting film preparation technology when being formed between the TFT layer in the internal structure of flexible display apparatus and anode layer.
Concrete:
First, glass substrate is cleaned pretreatment.Then, spin coating proceeding is adopted to prepare formation PI layer on the glass substrate.And then, then adopt CVD technique to prepare formation BL layer on protecting film.And then the preparation of TFT structure part is carried out again on BL layer surface.Wherein, the preparation technology of TFT structure part is based on CVD/Sputter, gold-tinted, etching etc..
And then, then prepare protecting film on the surface of TFT structure part.Then carry out the preparation of anode part on the surface of protecting film then,.Wherein, the preparation technology of anode part is equally possible based on CVD/Sputter, gold-tinted, etching etc..
Subsequently, then carry out the preparation of oled layer.Concrete, first, prepare hole injection layer (HIL) on the surface of anode layer.Wherein, hole injection layer is organic material, adopts evaporation mode to make, and, hole injection layer is hole main carriers.Then, hole transmission layer (HIL) is prepared on the surface of hole injection layer.Wherein, hole transport is organic material, and same employing evaporation mode makes, and hole transport (HTL) is the approach of hole transport.And then, then prepare electronic barrier layer on the surface of hole transmission layer.Wherein, electronic barrier layer is organic material, and evaporation mode can be adopted equally to make;Further, the Main Function of electronic barrier layer is for preventing light-emitting zone (that is, luminescent layer) trichroism for electron detachment RGB.Then, then on the surface of electronic barrier layer evaporation process is adopted to prepare the trichroism luminescent layer of RGB.And adopt evaporation process to prepare hole blocking layer on the surface of luminescent layer.It should be noted that, hole blocking layer is similarly organic material, its Main Function is for preventing hole from departing from the trichroism light-emitting zone of RGB.After formation hole blocking layer to be prepared, then evaporation process is adopted to prepare the electron transfer layer for providing electric transmission approach on the surface of hole blocking layer.Wherein, electron transfer layer (ETL) can adopt organic material to prepare equally.And then prepare electron injecting layer on the surface of electron transfer layer again.Wherein, electron injecting layer (EIL) is organic material, adopts evaporation mode to make.Further, electron injecting layer (EIL) is electronics main carriers.
And then, then prepare cathode electrode on the surface of electron injecting layer.Wherein, cathode electrode may be used without evaporation mode and makes.Finally, then be packaged and glass substrate peel off.Thus being finally completed the preparation of the flexible display apparatus of the present invention.
Further, present invention also offers a kind of electronic equipment.Wherein, the display part of electronic equipment provided by the invention adopts as above arbitrary described flexible display apparatus.Wherein, flexible display apparatus is installed on an electronic device, including substrate layer and the TFT layer, anode layer, oled layer, cathode layer and the encapsulated layer that are sequentially formed on substrate layer.Meanwhile, flexible display apparatus also includes the protecting film that deforms with the bending of flexible display apparatus.This protecting film is formed at substrate layer and deviates between the surface of TFT layer, TFT layer and anode layer, between anode layer and oled layer, between oled layer and cathode layer, between cathode layer and encapsulated layer and/or encapsulated layer deviates from the surface of cathode layer.
By adopting flexible display apparatus provided by the invention as the display part of electronic equipment, it, while ensureing the portability of electronic equipment, also effectively ensure that the display effect of electronic equipment, thus being effectively increased the reliability and stability of electronic equipment.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a flexible display apparatus, it is characterised in that including:
Substrate layer;
TFT layer, described TFT layer is formed on described substrate layer;
Anode layer, described anode layer is formed on described TFT layer;
Oled layer, described oled layer is formed on described anode layer;
Cathode layer, described cathode layer is formed on described oled layer and on the described substrate layer that do not covered by described oled layer;
Encapsulated layer, described encapsulated layer is formed on described cathode layer and on the described substrate layer that do not covered by cathode layer, and forms coating space with described cathode layer and described substrate layer;
Described coating space is coated with described TFT layer, described anode layer, described oled layer and described cathode layer;
The protecting film also including the bending with described flexible display apparatus and deform;
Described protecting film is formed at least one place in following position:
Described protecting film is formed at that described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
2. flexible display apparatus according to claim 1, it is characterised in that described protecting film includes:
Absorbed layer, the energy produced during for absorbing described protecting film deformation;
First conversion layer, described first conversion layer is formed on described absorbed layer, for provide described protecting film along described flexible display apparatus bending direction deform time support force;
First memory layer, described first memory layer is formed on described first conversion layer, for maintaining the original form of described protecting film;With
Glue-line, described glue-line is formed on described first memory layer.
3. flexible display apparatus according to claim 2, it is characterised in that described protecting film also includes:
Second conversion layer, described second conversion layer is formed at described absorbed layer and deviates from the surface of described first conversion layer, for providing and the support force of described first conversion layer different directions;
Second memory layer, described second memory layer is formed at described second conversion layer and deviates from the surface of described absorbed layer, for maintaining the original form of described protecting film.
4. the flexible display apparatus according to Claims 2 or 3, it is characterised in that the material of described absorbed layer is polyimides, polymethyl methacrylate, cyclic olefin polymer or Merlon.
5. flexible display apparatus according to claim 3, it is characterised in that the material of described first memory layer and described second memory layer is memory metal, ferroelectric material or dielectric material.
6. flexible display apparatus according to claim 3, it is characterised in that the material of described first conversion layer and described second conversion layer is metal simple-substance or metal alloy.
7. the preparation method of a flexible display apparatus, it is characterised in that comprise the steps:
Substrate surface after the pre-treatment prepares PI layer;
On described PI layer surface, preparation forms substrate layer;
On described substrate layer surface, preparation forms TFT layer;
On described TFT layer surface, preparation forms anode layer;
On described anode layer surface, preparation forms oled layer;
Cathode layer is formed on described oled layer surface and the described substrate layer surface preparation not covered by described oled layer;
On described cathode layer surface, preparation forms encapsulated layer;
Described substrate and described PI layer are peeled off by described substrate layer;
Wherein, the step preparing protecting film is also included;And
The preparation of described protecting film is formed at least one place in following position:
Described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
8. flexible display apparatus preparation method according to claim 7, it is characterised in that described preparation forms the step of protecting film and includes:
Coating process is adopted to prepare absorbed layer;
On the surface of described absorbed layer, preparation forms the first conversion layer;
The first memory layer is formed in the preparation of the surface of described first conversion layer;
Glue-line is formed in the described first surface preparation remembering layer.
9. flexible display apparatus preparation method according to claim 8, it is characterised in that described employing coating process also comprises the steps: before preparing absorbed layer
Coating process is adopted to prepare the second memory layer;
The second conversion layer is formed in the described second surface preparation remembering layer;
Wherein, the described absorbed layer that prepared by described employing coating process is formed on described second conversion layer.
10. an electronic equipment, it is characterised in that include flexible display apparatus;
Described flexible display apparatus is arranged on described electronic equipment, including substrate layer and the TFT layer, anode layer, oled layer, cathode layer and the encapsulated layer that are sequentially formed on described substrate layer;
The protecting film that described flexible display apparatus also includes the bending with described flexible display apparatus and deforms;
Described protecting film is formed at least one place in following position:
Described substrate layer deviates between the surface of described TFT layer, described TFT layer and described anode layer, between described anode layer and described oled layer, between described oled layer and described cathode layer, between described cathode layer and described encapsulated layer, described encapsulated layer deviates from the surface of described cathode layer.
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