CN105805685B - Open type illuminator - Google Patents
Open type illuminator Download PDFInfo
- Publication number
- CN105805685B CN105805685B CN201610195468.XA CN201610195468A CN105805685B CN 105805685 B CN105805685 B CN 105805685B CN 201610195468 A CN201610195468 A CN 201610195468A CN 105805685 B CN105805685 B CN 105805685B
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- CN
- China
- Prior art keywords
- heat
- dissipating pipe
- lampshade
- open type
- mounting cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
- F21S6/002—Table lamps, e.g. for ambient lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/10—Pendants, arms, or standards; Fixing lighting devices to pendants, arms, or standards
- F21V21/108—Arms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A kind of open type illuminator, including pedestal, circuit mechanism, supporting rack, lampshade, heat-dissipating pipe and LED module.Pedestal includes bottom plate and mounting cup, and mounting cup covers at bottom plate.Supporting rack is installed on mounting cup, and supporting rack includes two supporting rods, and supporting rod has sequentially connected support portion, bending part, bending section and fixed part, and support portion is set to mounting cup.Lampshade end is connect with supporting rack.The second end of lampshade offers thermovent.The first end of heat-dissipating pipe is fixed on the first end of lampshade, the hollow setting of heat-dissipating pipe, and the second end of heat-dissipating pipe and is connected with outside.LED module includes several LED sub-light sources, and several LED sub-light sources are set to the lateral wall of heat-dissipating pipe.The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe of above-mentioned open type illuminator, and lampshade offers thermovent, more rapidly and in time the heat that several LED sub-light sources generate can scatter and disappear to the external world, good heat dispersion performance.
Description
Technical field
The present invention relates to illuminating and heat radiating technical field, more particularly to a kind of open type illuminator.
Background technology
At present, in existing lighting device, main heater element is generally the PCB aluminum substrates being in direct contact with light source,
With the circuit board for driving the light source luminescent.In order to enable lighting device is integrated, usually PCB aluminum substrates and circuit board are placed in
The inside of the lighting device.
Common, PCB aluminum substrates and circuit board are generally transferred heat to by housing in air.It dissipates using the above structure
The lighting device of heat, heat conduction efficiency is low, and radiating rate is slower so that the lighting device has internal electricity easily due to poor heat radiation
Mechanism heat in road carries excessively high security risk.
Invention content
Based on this, it is necessary to provide a kind of open type illuminator of good heat dispersion performance.
A kind of open type illuminator, including：
Pedestal, the pedestal include bottom plate and mounting cup, and the mounting cup covers at the bottom plate, and the mounting cup
Inside forms accommodating cavity；
Circuit mechanism, the circuit mechanism are set to the accommodating inside cavity；
Supporting rack, the first end of support frame as described above are fixedly installed in the mounting cup, wherein, support frame as described above includes two
Supporting rod, the supporting rod have sequentially connected support portion, bending part, bending section and fixed part, and the support portion is set to
The mounting cup；
Lampshade, the first end of the lampshade and the second end of support frame as described above connect, the hollow setting of lampshade, interior shape
Into installation cavity, the outer surface of the lampshade has the curved-surface structure of gentle transition, and the second end of the lampshade offers heat dissipation
Mouthful；
Heat-dissipating pipe, the heat-dissipating pipe is fixed on the installation cavity, and the first end of the heat-dissipating pipe is fixed on the lamp
The first end of cover, the hollow setting of heat-dissipating pipe is interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe connects with outside
It is logical；
LED module, the LED module include several LED sub-light sources, and several LED sub-light sources are set to the heat dissipation
The lateral wall of pipe, the LED sub-light sources are electrically connected with the circuit mechanism.
The supporting rod has the cross section of square structure in one of the embodiments,.
In one of the embodiments, the material of the supporting rod include be cascading alloy-layer, laminboard layer and
Plastic layer.
The supporting rod inner hollow setting, the alloy-layer are located in the supporting rod in one of the embodiments,
Portion, the plastic layer are placed on outside.
The thickness of the laminboard layer, the alloy-layer and the plastic layer is incremented by successively in one of the embodiments,.
The laminboard layer includes the wire of several mutual winding settings in one of the embodiments,.
The wire has helical structure in one of the embodiments,.
In one of the embodiments, adhesive is filled with inside the laminboard layer.
The lateral wall of the support portion is provided with external screw thread in one of the embodiments, and the mounting cup offers spiral shell
Hole, the madial wall of the screw hole offer internal thread, and the external screw thread is spirally connected with the internal thread.
The support portion is vertically arranged with the plane where the top of the mounting cup in one of the embodiments,.
The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe of above-mentioned open type illuminator, and lampshade offers heat dissipation
Mouthful, more rapidly and in time the heat that several LED sub-light sources generate can be scattered and disappeared to the external world, good heat dispersion performance.
Description of the drawings
Fig. 1 is the structure diagram of the open type illuminator of an embodiment of the present invention；
Fig. 2 is the partial structural diagram of the open type illuminator of an embodiment of the present invention；
Fig. 3 is the structure diagram of another angle of the open type illuminator of an embodiment of the present invention；
Fig. 4 is the partial structural diagram of the open type illuminator of another embodiment of the present invention；
Fig. 5 is the partial structural diagram of the open type illuminator of another embodiment of the present invention；
Fig. 6 is the partial structural diagram of the open type illuminator of another embodiment of the present invention；
Fig. 7 is the partial structural diagram of the open type illuminator of another embodiment of the present invention.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more
The arbitrary and all combination of relevant Listed Items.
For example, a kind of open type illuminator, including：Pedestal, the pedestal include bottom plate and mounting cup, the mounting cup
The bottom plate is covered at, and accommodating cavity is formed inside the mounting cup；Circuit mechanism, the circuit mechanism are set to described
Accommodating inside cavity；Supporting rack, the first end of support frame as described above are fixedly installed in the mounting cup, wherein, support frame as described above packet
Two supporting rods are included, the supporting rod has sequentially connected support portion, bending part, bending section and fixed part, the support portion
It is set to the mounting cup；Lampshade, the first end of the lampshade and the second end of support frame as described above connect, and the lampshade is hollow to be set
It puts, interior to form installation cavity, the outer surface of the lampshade has the curved-surface structure of gentle transition, and the second end of the lampshade is opened
Equipped with thermovent；Heat-dissipating pipe, the heat-dissipating pipe are fixed on the installation cavity, and the first end of the heat-dissipating pipe be fixed on it is described
The first end of lampshade, the hollow setting of heat-dissipating pipe are interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe and outside
Connection；LED module, the LED module include several LED sub-light sources, and several LED sub-light sources are set to the heat-dissipating pipe
Lateral wall, the LED sub-light sources are electrically connected with the circuit mechanism.
For a further understanding of above-mentioned open type illuminator, another example is a kind of open type illuminator, packet
Include the open type illuminator described in any of the above-described embodiment.
Also referring to Fig. 1 and Fig. 2, open type illuminator 10 includes：Pedestal 100, circuit mechanism 200, supporting rack
300th, lampshade 400, heat-dissipating pipe 500 and LED module 600, circuit mechanism 200 are placed in pedestal 100, supporting rack 300 respectively with bottom
100 lampshades 400 of seat connect, and heat-dissipating pipe 500 is set to inside lampshade 400, and LED module 600 is set to 500 lateral wall of heat-dissipating pipe.
Referring to Fig. 2, pedestal 100 includes bottom plate 110 and mounting cup 120, mounting cup 120 covers at bottom plate 110, and pacifies
It fills 120 inside of cover and forms accommodating cavitys, the accommodating cavity is used to house the circuit mechanism.
Referring to Fig. 2, circuit mechanism 200 is set to the accommodating inside cavity, circuit mechanism 200 is used for the LED moulds
Group is electrically connected, the normal luminous of the LED module to be given to provide electric energy.
For the convenience for improving the portability of the open type illuminator and using, for example, the circuit mechanism packet
Power supply, circuit board and driving module are included, the power supply and the driving module are electrically connected respectively with the circuit board；The electricity
Source includes battery；For another example, the battery is rechargeable battery；For another example, the battery is solar cell；For another example, the circuit machine
Structure further includes wireless receiving module and microprocessor module, the wireless receiving module and the microprocessor module respectively with
The circuit board is electrically connected；For another example, the side protrusion of the bottom plate sets several mounting posts, and several mounting posts wear institute
State circuit board；For another example, several mounting posts are arranged at intervals successively；For another example, several mounting post rectangular array arrangements；Again
Such as, the circuit mechanism further includes conducting wire, and the first end of the conducting wire is electrically connected with the circuit board, and the conducting wire is at least
Part is placed in inside support frame as described above, and the second end of the conducting wire is electrically connected with the LED sub-light sources；For another example, it is described to lead
Line has enamel-cover cable architecture, in this way, the convenience that the portability that can improve the open type illuminator uses.Certainly, institute
It states battery can be omitted, in addition, the circuit mechanism is connect with external power supply, e.g., be connect with external power supply.
Referring to Fig. 3, the first end of supporting rack 300 is fixedly installed in mounting cup 120, the second end and lamp of supporting rack 300
The first end of cover 400 is fixedly connected.Specifically, supporting rack 300 includes two supporting rods 310, supporting rod 310, which has, to be sequentially connected
Support portion 311, bending part 312, bending section 313 and fixed part 314, support portion 311 is set to mounting cup 120, fixed part 314
It is set to lampshade 400.
In order to improve the integrally-built mechanical strength of open type illuminator, for example, the supporting rod is with rectangular
The cross section of structure；For another example, the material of the supporting rod includes the alloy-layer, laminboard layer and the plastic layer that are cascading；Again
Such as, the supporting rod inner hollow setting, the alloy-layer are located inside the supporting rod, and the plastic layer is placed on outside；
For another example, the thickness of the laminboard layer, the alloy-layer and the plastic layer is incremented by successively；For another example, the laminboard layer includes several
The mutually wire of winding setting；For another example, the wire has helical structure；For another example, it is filled with inside the laminboard layer
Adhesive；For another example, the lateral wall of the support portion is provided with external screw thread, and the mounting cup offers screw hole, the screw hole it is interior
Side wall offers internal thread, and the external screw thread is spirally connected with the internal thread；For another example, the top of the support portion and the mounting cup
The plane at place is vertically arranged, in this way, the integrally-built mechanical strength of open type illuminator can be improved.
Also referring to Fig. 1 and Fig. 2, the first end of lampshade 400 is connect with the second end of supporting rack 300.Lampshade 400 is hollow
Setting, interior formed install cavity, described to install cavity for installing heat-dissipating pipe 500 and LED module 600.
The outer surface of lampshade 400 has the curved-surface structure of gentle transition.For example, the curved-surface structure includes but is not limited to
Hyperboloid, saddle camber and Surface of Sphere；For another example, the curved-surface structure includes sequentially connected hyperboloid, saddle camber and Surface of Sphere, again
Such as, the curved-surface structure is shunk in two ends of the lampshade, is expanded and is protruded in the medium position of the lampshade；For another example, institute
State the cross section of ellipsoidal structure of the lampshade with gap type.
The second end of lampshade 400 offers thermovent 410, and the installation cavity is connected by the thermovent with outside,
For being scattered and disappeared the heat gathered in the installation cavity body to external environment by the thermovent.For example, the thermovent tool
There is circular configuration；For another example, the thermovent has ellipsoidal structure.In this way, it can realize that open type, opened type or front end dissipate
The effect of hot type.
Referring to Fig. 1, heat-dissipating pipe 500 is fixed on the installation cavity, specifically, the first end of heat-dissipating pipe 500 is fixed on
The first end of lampshade 400, for example, the first end of the heat-dissipating pipe is fixed on the link position of the lampshade and support frame as described above
Place；For another example, the central axis of the lampshade is overlapped with the central axis of the heat-dissipating pipe.For example, the heat-dissipating pipe has circle
Tubular structure.
Referring to Fig. 1,500 hollow setting of heat-dissipating pipe, in form heat-dissipating cavity, and the second end of heat-dissipating pipe 500 with
Outside connection in this way, the heat-dissipating cavity is connected by the opening of the second end of the heat-dissipating pipe with outside, is more advantageous to described
Heat in heat emission wall scatters and disappears to outside；For another example, the plane where the opening of the second end of the heat-dissipating pipe and the heat dissipation
Plane where mouthful overlaps setting.
It should be noted that at least part of the second end of the heat-dissipating pipe is placed on outside the thermovent, and certainly, institute
The installation inside cavity can also be placed in completely by stating the second end of heat-dissipating pipe, can be adjusted according to actual conditions.Again
Such as, the first end of the heat-dissipating pipe wears the lampshade, and is placed on outside the lampshade, certainly, the first of the heat-dissipating pipe
End card can be placed in the installation inside cavity completely, can be adjusted according to actual conditions, as long as ensuring the heat dissipation
Pipe can reach the radiating requirements of the open type illuminator.
Referring to Fig. 1, LED module 600 includes several LED sub-light sources 610, several LED sub-light sources 610 are set to heat-dissipating pipe
500 lateral wall.LED sub-light sources 610 are electrically connected with the circuit mechanism, and the circuit mechanism is used for the LED sub-lights
Source powers, so that the LED sub-light sources perform normal light emission operation.For example, the LED sub-light sources include but is not limited to
LED lamp bead and LED chip etc..
It should be pointed out that since the inside of heat-dissipating pipe 500 forms the heat-dissipating cavity, several LED sub-light sources hairs
The sub-fraction for the heat that light generates is transferred to the installation inside cavity, and pass through the thermovent and be transferred to the external world, several
Shine another part of heat of generation of the LED sub-light sources is transferred in the heat-dissipating pipe, wherein, it is transferred to the heat-dissipating pipe
A heat part scattered and disappeared by its surface except, another part is transferred to inside the heat-dissipating cavity, is dissipated by the heat-dissipating cavity
It loses to the external world, in this way, the heat dissipation performance of the open type illuminator can be greatlyd improve.Be particularly suitable for it is high-power and
The higher design structure of more LED sub-light sources class cooling requirements, preferably reduces the shadow that the LED sub-light sources are generated due to light decay
It rings.
The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe 500 of above-mentioned open type illuminator 10, and lampshade 400 is opened
Equipped with thermovent 410, more rapidly and in time the heat that several LED sub-light sources 610 generate can be scattered and disappeared to the external world, thermal diffusivity
It can be preferably.
In order to further improve heat dissipation performance, for example, referring to Fig. 4, the lateral wall of the first end of heat-dissipating pipe 500 is equipped with
Bladeless fan 700, the round wind outlet of the bladeless fan are set towards the thermovent, and the bladeless fan includes fan sheet
Body and connecting rod, the fan body are placed on the lateral wall of the first end of the heat-dissipating pipe, and are provided with interval between the two,
The first end of the connecting rod is connect with the lateral wall of the first end of the heat-dissipating pipe, the second end of the connecting rod and the wind
Fan ontology connection；For another example, several connecting rods are set；For another example, several connecting rods are in put with the center of the heat-dissipating pipe
Penetrate shape distribution；For another example, the connecting rod has hollow-core construction；For another example, the connecting rod has the cross section of cirque structure；Again
Such as, the thermovent has the cross section of cirque structure, in this way, being generated using the bladeless fan steady and lasting new
Wind can preferably be taken away when the LED sub-light sources shine and generate heat, and pass through the thermovent and dispel to the external world.
In order to further improve heat dissipation performance, for example, referring to Fig. 5, inside heat-dissipating pipe 500, i.e., in described heat-dissipating cavity
Portion sets several heat sink strips 800, and the madial wall of the both ends of the heat sink strip with the heat-dissipating pipe connect, and several described scattered
Hot bar shaped reticulates structure, and several heat sink strips specifically include first group of heat sink strip, second group of heat sink strip, third group heat sink strip
With the 4th group of heat sink strip, first group of heat sink strip, second group of heat sink strip, the third group heat sink strip and 4th group described
Heat sink strip is respectively provided with reticular structure, first group of heat sink strip, second group of heat sink strip, the third group heat sink strip and described
4th group of heat sink strip is arranged at intervals successively；For another example, heat sink strip described in each group includes several heat sink strips, and these heat sink strips
It is generally aligned in the same plane, the plane and the central axis upright of the heat-dissipating pipe；For another example, first group of heat sink strip is close to institute
The first end setting of heat-dissipating pipe is stated, the 4th group of heat sink strip is set close to the second end of the heat-dissipating pipe；For another example, the heat dissipation
Item has hollow-core construction；For another example, the heat sink strip has the cross section of cirque structure；For another example, the heat sink strip has spiral
Shape structure；For another example, the material of the heat sink strip is heat dissipation alloy, in this way, heat dissipation area can be greatly increased, for further
Improve heat dissipation performance.
In order to further improve heat dissipation performance, for example, referring to Fig. 6, heat-dissipating pipe 500 offers several heat emission holes 510, if
It does the heat emission hole to radially distribute with the center of the heat-dissipating pipe, and the first end of the heat emission hole and the heat-dissipating cavity
Connection, the second end of the heat emission hole are connected with the installation cavity；The aperture of the first end of the heat emission hole is less than described dissipate
The aperture of the second end of hot hole；For another example, the aperture of the heat emission hole gradually increases from its first end to second end；For another example, it is described
The aperture of the second end of heat emission hole is 2mm~5mm；For another example, the aperture of the second end of the heat emission hole is 2mm~3mm；For another example,
The aperture of the second end of the heat emission hole is 2.5mm；For another example, the sidewall thickness of the heat-dissipating pipe is 3cm~5cm；For another example, it is described
The sidewall thickness of heat-dissipating pipe is 4cm~5cm；For another example, the sidewall thickness of the heat-dissipating pipe is 4.5cm, in this way, can greatly increase
Add heat dissipation area, on the other hand, can make to form linkage heat dissipation system between the installation cavity and the heat-dissipating cavity, be used for
Further improve heat dissipation performance.
It is appreciated that since the LED module sets several LED sub-light sources, it is larger based on its power, and far from scattered
On the basis of hot systems or structure, other than solving its radiating requirements, it is necessary to solve its circuit mechanism because energizing excessive production
The problem of raw load is larger, i.e., described circuit mechanism can lead to the problem of local component scorification because load is excessive, that is, occur
Short circuit problem, at this point, the circuit mechanism is easy to catch fire, there are the danger of fire, greatly threaten user the person and
Property safety.
In order to improve security performance, for example, referring to Fig. 2, the open type illuminator further includes release mechanism 900,
Release mechanism 900 includes fire prevention solid material filling part 910 and trigger unit 920, bottom plate 110 offer safe cavity 111, safety
The bottom of cavity 111 offer triggering hole 112, triggering hole 112 respectively with safe cavity 111 and the institute of the inside of mounting cup 120
Accommodating cavity connection is stated, fire prevention solid material filling part 910 is filled in inside safe cavity 111, and trigger unit 920 is set to triggering
Hole 112, and close triggering hole 112.For example, the trigger unit has membranaceous or laminated structure, e.g., the material of the trigger unit is
High molecule plastic, when the circuit mechanism catches fire or during failure heat production, the effect based on high temperature, the trigger unit melted by heat.
For example, the material of the fire prevention solid material filling part is fire prevention solid material, when the fire prevention solid material is made by high temperature
Chemical action can occur for the used time, volatilize a large amount of fire-retardant gas, e.g., carbon dioxide.
The operation principle of above-mentioned release mechanism 900 is as follows：
When the circuit mechanism short circuit occurred inside and when catching fire, the effect based on high temperature is described in the triggering hole
Trigger unit melted by heat makes the triggering hole be connected with the accommodating cavity, in the process, the institute of the safe inside cavity
It states fire prevention solid material filling part to be heated and decompose or chemically react, releases a large amount of fire-retardant gas, e.g., carbon dioxide, institute
It states fire-retardant gas to be ejected in the accommodating cavity by the triggering hole, based on the fire retardation of the fire-retardant gas, be used for
Circuit mechanism described in burning is put out, for avoiding the sprawling of the intensity of a fire, avoids that large-scale fire, security performance higher occurs.
In order to further improve the security can, for example, it is described fire prevention solid material filling part material for fire prevention solid material
Material, the fire prevention solid material is by activity fire extinguishing material, hydrophobic material and inert material component, for example, activity fire extinguishing material, dredging
The mass ratio of water material and inert material is 1：0.1：2；For another example, it is described activity fire extinguishing material include ammonium phosphate salt, sodium bicarbonate,
At least one of sodium chloride and potassium chloride；For another example, the activity puts out a fire material as ultra-fine grain diameter activity fire extinguishing material, grain size
To be less than or equal to 0.5 μm, preferably less than 0.5 μm, in this way, using the mobility of its own, powder-gas can be reached
Flame-retardant system, security performance higher；For another example, the hydrophobic material includes at least one of silicone oil and hydrophobic silicic aerogels；For another example,
The inert material is talcum powder.
It is appreciated that since several LED sub-light sources are directly mounted at the heat-dissipating pipe, the heat-dissipating pipe bears larger
Heat carry, the especially higher situation of power and brightness requirement, therefore, it is necessary to improve the heat dissipation performance of the heat-dissipating pipe
Can, in order to further improve the heat dissipation performance of the heat-dissipating pipe, to improve the heat dissipation performance of the open type illuminator entirety,
For example, referring to Fig. 7, heat-dissipating pipe 500 includes the safe floor 520 being cascading, heat-conducting layer 530, heat transfer layer 540 and heat dissipation
Layer 550, safe floor 520 are set towards the installation cavity setting, heat dissipating layer 550 towards the heat-dissipating cavity.
For example, the open type illuminator of an embodiment, the safe floor include each group of following mass parts
Point：80 parts~90 parts of silicon nitride, 30 parts~45 parts of titanium dioxide, 2 parts~8 parts of silica, 2 parts~15 parts of kaolin, lightweight
0.2 part~0.5 part of 0.5 part~2 parts of calcium and rare earth oxide.For example, the rare earth oxide includes lanthana, cerium oxide, oxygen
Change at least one of praseodymium, europium oxide and terbium oxide, for example, lanthana, cerium oxide, praseodymium oxide, europium oxide and terbium oxide quality
Than being 1：1：1：1：1.
Above-mentioned safe floor has the advantages of insulation effect is good, and thermal conductivity factor is big and coefficient of thermal expansion is low, in this way, as LED
When the heat of light source is directly delivered to the safe floor, the safe floor can be quickly and in time by area near LED sub-light sources
The heat transfer of domain aggregation is to the heat-conducting layer, to ensure the normal work of LED sub-light sources.Secondly as the safe floor with
LED sub-light sources are in direct contact or closer to the distance, and the heat conduction load undertaken is maximum, and above-mentioned safe floor uses silicon nitride as mainly
Raw material, and mixed other materials can have relatively low coefficient of thermal expansion, so as to avoid the safe floor and the heat conduction
Gap is generated between layer and the safe floor itself is avoided to generate gap, and then can be to avoid the gap and gap filling air
The problem of thermal conductivity factor generated afterwards reduces.Further, since being in direct contact between the safe floor and LED sub-light sources or distance
It is relatively near, electric elements easily occur, such as the situation that conducting wire is directly contacted with the safe floor, above-mentioned safe floor is made using silicon nitride
For primary raw material, and mixed other materials can have preferable insulating properties, so as to which the safe floor is avoided to be powered, so as to
The security performance of the open type illuminator is improved, safety standard is higher.
For example, the open type illuminator of an embodiment, the heat-conducting layer include each group of following mass parts
Point：90 parts~95 parts of nano-graphene fiber, 0.5 part~15 parts of multi-walled carbon nanotube, 0.1 part~5 parts of single-walled carbon nanotube and
0.1 part~10 parts of carbon nano-fiber.
Above-mentioned heat-conducting layer uses nano-graphene fiber as primary raw material, and using multi-walled carbon nanotube, single
Pipe and carbon nano-fiber are as auxiliary material so that the heat-conducting layer has larger thermal conductivity factor, and heat-conducting effect is preferable.It needs
, it is noted that addition multi-walled carbon nanotube, single-walled carbon nanotube and carbon nano-fiber, can form micro- dissipate in the heat-conducting layer
Hot channel, for further improving heat dissipation performance, in this way, can be quick by the heat of the safe floor and institute be transferred in time
It states in heat transfer layer.
It should be noted that because the LED sub-light sources shine generation heat pass through before two layers, i.e., described safe floor and institute
After stating heat-conducting layer, understand the heat of some and be lost in extraneous air.Further, since the cost of the heat-conducting layer is higher,
Itself main reason is that, the primary raw material of the heat-conducting layer nano-graphene fiber higher for manufacturing cost, therefore, based on institute
State heat transfer layer heat transfer and heat dissipation load it is relatively small in the case of, the heat transfer layer can use the more common gold in current market
Belong to heat sink material, to achieve the effect that reduce cost and obtain preferable heat transfer property.
For example, the heat transfer layer of an embodiment of the present invention, include each component of following mass parts：85 parts~90 parts of copper,
2 parts~4.5 parts of titanium, 0.1 part~0.3 part of nickel, 0.2 part~1.2 parts of magnesium, 0.2 part~0.7 part of iron, 0.2 part~1.2 parts of vanadium, manganese
0.1 part~0.4 part and 0.1 part~0.3 part of chromium.
Above-mentioned heat transfer layer has preferable heat transfer property using what 85 parts~90 parts of copper can make heat transfer layer, so as to
More quickly the heat being transmitted on the heat-conducting layer is passed, and then be evenly dispersed in the structure of the heat transfer layer entirety
On, to prevent heat from being accumulated on the contact position between the heat-conducting layer and the heat transfer layer, cause hot-spot phenomenon
It generates.In addition, above-mentioned heat transfer layer has, thermal conductivity factor is high, perfect heat-dissipating, good mechanical property and lower-cost advantage, such as
This, when the heat transfer of the heat-conducting layer gives the heat transfer layer, then the heat that the heat-conducting layer is absorbed into can be more fast
It is transmitted to fastly in the heat dissipation, and during heat transfer, the heat of part can also be directly delivered to by the heat transfer layer
In extraneous air.
It should be noted that the heat generated when the LED sub-light sources is by three first layers, i.e., respectively described safe floor,
After the heat-conducting layer and the heat transfer layer, have relatively large a part of heat and scatter and disappear in air medium in transmission, in addition,
Since the primary raw material of the heat transfer layer is copper, heavier mass is therefore, relatively small based on heat dissipating layer heat dissipation load
In the case of, the heat dissipating layer can be preferable using heat dissipation effect, and lighter in weight, lower-cost material reduce cost to reach
And weight and the effect for obtaining preferable heat dissipation performance.
For example, the heat dissipating layer of an embodiment of the present invention, include each component of following mass parts：70 parts~75 parts of aluminium,
35 parts~45 parts of copper, 0.2 part~0.7 part of magnesium, 0.1 part~0.3 part of nickel, 0.2 part~0.7 part of iron, 0.2 part~0.5 part of manganese, titanium
0.1 part~0.3 part of 0.1 part~0.3 part, 0.05 part~0.1 part of chromium and vanadium.
Aluminium and 35 part~45 part of copper of the above-mentioned heat dissipating layer using 70 parts~75 parts, can be such that the heat dissipating layer still has
Preferable heat dissipation performance, so as to ensure that the heat dissipating layer can rapidly dissipate the heat passed over by the heat transfer layer
It loses in air medium, e.g., is dissipated in inside the heat-dissipating cavity, and then heat is avoided to be accumulated on the heat dissipating layer, causes
Hot-spot phenomenon generates.Relative to the prior art, merely using price costly and the larger copper of quality, above-mentioned heat dissipating layer
Both there is good heat dissipation effect, rapidly heat can be lost in air, and there is lighter weight, be easily installed casting, price
The advantages of less expensive.Meanwhile relative to the prior art, merely using the poor aluminium alloy of heat dissipation effect, above-mentioned heat dissipating layer tool
There is more preferably heat transfer property.
For example, the safe floor, the heat-conducting layer, the heat transfer layer and the heat dissipating layer thickness ratio be 0.5~1.1：
0.1~0.3：3~3.5：4~4.5, for optimizing the structure of the heat-dissipating pipe, for improving heat dissipation performance.
It should be noted that the technical characteristic that the other embodiment of the present invention is further included in the various embodiments described above be combined with each other
The open type illuminator that can implement formed.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but
Can not the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that the ordinary skill people for this field
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of open type illuminator, which is characterized in that including：
Pedestal, the pedestal include bottom plate and mounting cup, and the mounting cup covers at the bottom plate, and inside the mounting cup
Form accommodating cavity；
Circuit mechanism, the circuit mechanism are set to the accommodating inside cavity；
Supporting rack, the first end of support frame as described above are fixedly installed in the mounting cup, wherein, support frame as described above includes two supports
Bar, the supporting rod have sequentially connected support portion, bending part, bending section and fixed part, and the support portion is set to described
Mounting cup；
Lampshade, the first end of the lampshade and the second end of support frame as described above connect, and the hollow setting of lampshade is interior to form peace
It behave affectedly body, the outer surface of the lampshade has the curved-surface structure of gentle transition, and the second end of the lampshade offers thermovent；
Heat-dissipating pipe, the heat-dissipating pipe is fixed on the installation cavity, and the first end of the heat-dissipating pipe is fixed on the lampshade
First end, the hollow setting of heat-dissipating pipe is interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe is connected with outside；
LED module, the LED module include several LED sub-light sources, and several LED sub-light sources are set to the heat-dissipating pipe
Lateral wall, the LED sub-light sources are electrically connected with the circuit mechanism；
The material of the supporting rod includes the alloy-layer, laminboard layer and the plastic layer that are cascading, in the supporting rod inside
Sky setting, the alloy-layer are located inside the supporting rod, and the plastic layer is placed on outside, the laminboard layer, the alloy
The thickness of layer and the plastic layer is incremented by successively；
The open type illuminator further includes release mechanism, and the release mechanism includes fire prevention solid material filling part and triggering
Portion, the bottom plate offer safe cavity, and the bottom of the safe cavity offers triggering hole, the triggering hole respectively with it is described
The accommodating cavity connection of the inside of safe cavity and the mounting cup, the fire prevention solid material filling part is filled in described
Safe inside cavity, the trigger unit are set to the triggering hole, and close the triggering hole；The trigger unit have it is membranaceous or
Laminated structure, the material of the trigger unit is high molecule plastic, and the material of the fire prevention solid material filling part is fire prevention solid
Material.
2. open type illuminator according to claim 1, which is characterized in that the supporting rod has the horizontal stroke of square structure
Section.
3. open type illuminator according to claim 1, which is characterized in that the laminboard layer includes several mutual windings
The wire of setting.
4. open type illuminator according to claim 3, which is characterized in that the wire has helical structure.
5. open type illuminator according to claim 4, which is characterized in that gluing is filled with inside the laminboard layer
Agent.
6. open type illuminator according to claim 1, which is characterized in that the lateral wall of the support portion is provided with outer
Screw thread, the mounting cup offer screw hole, and the madial wall of the screw hole offers internal thread, the external screw thread and the internal thread
It is spirally connected.
7. open type illuminator according to claim 6, which is characterized in that the top of the support portion and the mounting cup
Plane where portion is vertically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195468.XA CN105805685B (en) | 2016-03-30 | 2016-03-30 | Open type illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195468.XA CN105805685B (en) | 2016-03-30 | 2016-03-30 | Open type illuminator |
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| Publication Number | Publication Date |
|---|---|
| CN105805685A CN105805685A (en) | 2016-07-27 |
| CN105805685B true CN105805685B (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195468.XA Active CN105805685B (en) | 2016-03-30 | 2016-03-30 | Open type illuminator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107692572A (en) * | 2017-10-31 | 2018-02-16 | 绍兴文理学院 | A kind of file cabinet with smart lock |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202660300U (en) * | 2012-05-28 | 2013-01-09 | 东莞市闻誉实业有限公司 | Efficient lamp heat dissipation cup |
| CN103727445A (en) * | 2013-12-06 | 2014-04-16 | 无锡合众信息科技有限公司 | Table lamp |
| CN104180232A (en) * | 2014-09-12 | 2014-12-03 | 东莞市闻誉实业有限公司 | Efficient LED heat dissipation lamp |
| CN104696761A (en) * | 2015-03-27 | 2015-06-10 | 东莞市闻誉实业有限公司 | LED heat-dissipating lamp |
| CN105351781A (en) * | 2015-11-27 | 2016-02-24 | 杨小晨 | High heat dissipation type LED (light-emitting diode) corn lamp |
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2016
- 2016-03-30 CN CN201610195468.XA patent/CN105805685B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202660300U (en) * | 2012-05-28 | 2013-01-09 | 东莞市闻誉实业有限公司 | Efficient lamp heat dissipation cup |
| CN103727445A (en) * | 2013-12-06 | 2014-04-16 | 无锡合众信息科技有限公司 | Table lamp |
| CN104180232A (en) * | 2014-09-12 | 2014-12-03 | 东莞市闻誉实业有限公司 | Efficient LED heat dissipation lamp |
| CN104696761A (en) * | 2015-03-27 | 2015-06-10 | 东莞市闻誉实业有限公司 | LED heat-dissipating lamp |
| CN105351781A (en) * | 2015-11-27 | 2016-02-24 | 杨小晨 | High heat dissipation type LED (light-emitting diode) corn lamp |
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| CN105805685A (en) | 2016-07-27 |
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