CN105805686B - Lamps and lanterns - Google Patents

Lamps and lanterns Download PDF

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Publication number
CN105805686B
CN105805686B CN201610196652.6A CN201610196652A CN105805686B CN 105805686 B CN105805686 B CN 105805686B CN 201610196652 A CN201610196652 A CN 201610196652A CN 105805686 B CN105805686 B CN 105805686B
Authority
CN
China
Prior art keywords
heat
lanterns
lamps
dissipating pipe
lampshade
Prior art date
Application number
CN201610196652.6A
Other languages
Chinese (zh)
Other versions
CN105805686A (en
Inventor
叶伟炳
Original Assignee
东莞市闻誉实业有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201610196652.6A priority Critical patent/CN105805686B/en
Publication of CN105805686A publication Critical patent/CN105805686A/en
Application granted granted Critical
Publication of CN105805686B publication Critical patent/CN105805686B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/10—Pendants, arms, or standards; Fixing lighting devices to pendants, arms, or standards
    • F21V21/108—Arms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Abstract

A kind of lamps and lanterns, including pedestal, circuit mechanism, supporting rack, lampshade, heat-dissipating pipe and LED module.Pedestal includes bottom plate and mounting cup, and mounting cup covers at bottom plate.Supporting rack is installed on mounting cup.Circuit mechanism includes power supply, circuit board and driving module, and power supply and driving module are electrically connected with circuit board respectively.Lampshade end is connect with supporting rack.The second end of lampshade offers thermovent.The first end of heat-dissipating pipe is fixed on the first end of lampshade, the hollow setting of heat-dissipating pipe, and the second end of heat-dissipating pipe and is connected to outside.LED module includes several LED sub-light sources, and several LED sub-light sources are set to the lateral wall of heat-dissipating pipe.The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe of above-mentioned lamps and lanterns, and lampshade offers thermovent, the heat loss that can more rapidly and in time generate several LED sub-light sources to the external world, good heat dispersion performance.

Description

Lamps and lanterns
Technical field
The present invention relates to illuminating and heat radiating technical fields, more particularly to a kind of lamps and lanterns.
Background technology
Currently, in existing lighting device, main heater element is generally the PCB aluminum substrates being in direct contact with light source, With the circuit board for driving the light source luminescent.In order to enable lighting device is integrated, usually PCB aluminum substrates and circuit board are placed in The inside of the lighting device.
Common, PCB aluminum substrates and circuit board are generally transferred heat to by shell in air.It dissipates using the above structure The lighting device of heat, heat conduction efficiency is low, and radiating rate is slower so that the lighting device easily has internal electricity because of poor heat radiation Mechanism heat in road carries excessively high security risk.
Invention content
Based on this, it is necessary to provide a kind of lamps and lanterns of good heat dispersion performance.
A kind of lamps and lanterns, including：
Pedestal, the pedestal include bottom plate and mounting cup, and the mounting cup covers at the bottom plate, and the mounting cup Inside, which is formed, houses cavity；
Circuit mechanism, the circuit mechanism are set to the accommodating inside cavity, wherein the circuit mechanism includes electricity Source, circuit board and driving module, the power supply and the driving module are electrically connected with the circuit board respectively；
The first end of supporting rack, support frame as described above is fixedly installed in the mounting cup；
Lampshade, the first end of the lampshade and the second end of support frame as described above connect, the hollow setting of lampshade, interior shape At installation cavity, there is the curved-surface structure of gentle transition, the second end of the lampshade to offer heat dissipation for the outer surface of the lampshade Mouthful；
Heat-dissipating pipe, the heat-dissipating pipe is fixed on the installation cavity, and the first end of the heat-dissipating pipe is fixed on the lamp The first end of cover, the hollow setting of heat-dissipating pipe is interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe connects with outside It is logical；
LED module, the LED module include several LED sub-light sources, and several LED sub-light sources are set to the heat dissipation The lateral wall of pipe, the LED sub-light sources are electrically connected with the circuit mechanism.
The power supply includes battery in one of the embodiments,.
The battery is rechargeable battery in one of the embodiments,.
The battery is solar cell in one of the embodiments,.
The circuit mechanism further includes wireless receiving module and microprocessor module in one of the embodiments, described Wireless receiving module and the microprocessor module are electrically connected with the circuit board respectively.
Several mounting posts are arranged in the side protrusion of the bottom plate in one of the embodiments, and several mounting posts are worn If the circuit board.
Several mounting posts are spaced setting successively in one of the embodiments,.
Several mounting post rectangular array arrangements in one of the embodiments,.
The circuit mechanism further includes conducting wire in one of the embodiments, the first end of the conducting wire and the circuit Plate is electrically connected, and the conducting wire is at least partly placed in inside support frame as described above, the second end of the conducting wire and LED Light source is electrically connected.
The conducting wire has enamel-cover cable architecture in one of the embodiments,.
The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe of above-mentioned lamps and lanterns, and lampshade offers thermovent, Ke Yigeng Quickly and in time by the heat loss of several LED sub-light sources generation to the external world, good heat dispersion performance.
Description of the drawings
Fig. 1 is the structural schematic diagram of the lamps and lanterns of an embodiment of the present invention；
Fig. 2 is the partial structural diagram of the lamps and lanterns of an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another angle of the lamps and lanterns of an embodiment of the present invention；
Fig. 4 is the partial structural diagram of the lamps and lanterns of another embodiment of the present invention；
Fig. 5 is the partial structural diagram of the lamps and lanterns of another embodiment of the present invention；
Fig. 6 is the partial structural diagram of the lamps and lanterns of another embodiment of the present invention；
Fig. 7 is the partial structural diagram of the lamps and lanterns of another embodiment of the present invention.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant Listed Items.
For example, a kind of lamps and lanterns, including：Pedestal, the pedestal include bottom plate and mounting cup, and the mounting cup covers at described Bottom plate, and formed inside the mounting cup and house cavity；Circuit mechanism, the circuit mechanism are set in the accommodating cavity body Portion, wherein the circuit mechanism includes power supply, circuit board and driving module, the power supply and the driving module respectively with institute State circuit board electric connection；The first end of supporting rack, support frame as described above is fixedly installed in the mounting cup；Lampshade, the lampshade First end and support frame as described above second end connect, the hollow setting of lampshade, in formed installation cavity, the lampshade There is the curved-surface structure of gentle transition, the second end of the lampshade to offer thermovent for outer surface；Heat-dissipating pipe, the heat-dissipating pipe are solid Due to the installation cavity, and the first end of the heat-dissipating pipe is fixed on the first end of the lampshade, and the heat-dissipating pipe is hollow to be set It sets, it is interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe is connected to outside；LED module, the LED module include Several LED sub-light sources, several LED sub-light sources are set to the lateral wall of the heat-dissipating pipe, the LED sub-light sources and the electricity Road mechanism is electrically connected.
For a further understanding of above-mentioned lamps and lanterns, another example is a kind of lamps and lanterns comprising described in any of the above-described embodiment Lamps and lanterns.
Also referring to Fig. 1 and Fig. 2, lamps and lanterns 10 include：Pedestal 100, circuit mechanism 200, supporting rack 300, lampshade 400, Heat-dissipating pipe 500 and LED module 600, circuit mechanism 200 are placed in pedestal 100, supporting rack 300 respectively with 100 lampshade 400 of pedestal Connection, heat-dissipating pipe 500 are set to inside lampshade 400, and LED module 600 is set to 500 lateral wall of heat-dissipating pipe.
Referring to Fig. 2, pedestal 100 includes bottom plate 110 and mounting cup 120, mounting cup 120 covers at bottom plate 110, and pacifies 120 inside of dress cover, which is formed, houses cavity, and the accommodating cavity is for housing the circuit mechanism.
Referring to Fig. 2, circuit mechanism 200 is set to the accommodating inside cavity, circuit mechanism 200 is used for the LED moulds Group is electrically connected, to provide electric energy to the normal luminous of the LED module.
For the convenience for improving the portability of the lamps and lanterns and using, for example, the circuit mechanism includes power supply, circuit Plate and driving module, the power supply and the driving module are electrically connected with the circuit board respectively；The power supply includes battery； For another example, the battery is rechargeable battery；For another example, the battery is solar cell；For another example, the circuit mechanism further includes wireless Receiving module and microprocessor module, the wireless receiving module and the microprocessor module are electrical with the circuit board respectively Connection；For another example, several mounting posts are arranged in the side protrusion of the bottom plate, and several mounting posts wear the circuit board；For another example, Several mounting posts are spaced setting successively；For another example, several mounting post rectangular array arrangements；For another example, the circuit machine Structure further includes conducting wire, and the first end of the conducting wire is electrically connected with the circuit board, and the conducting wire is at least partly placed in institute It states inside supporting rack, the second end of the conducting wire is electrically connected with the LED sub-light sources；For another example, the conducting wire has enameled wire Structure, in this way, the convenience that the portability that can improve the lamps and lanterns uses.Certainly, the battery can be omitted, in addition, institute It states circuit mechanism to connect with external power supply, e.g., be connect with external power supply.
Referring to Fig. 3, the first end of supporting rack 300 is fixedly installed in mounting cup 120, the second end and lamp of supporting rack 300 The first end of cover 400 is fixedly connected.Specifically, supporting rack 300 includes two supporting rods 310, supporting rod 310, which has, to be sequentially connected Support portion 311, bending part 312, bending section 313 and fixed part 314, support portion 311 is set to mounting cup 120, fixed part 314 It is set to lampshade 400.
In order to improve the integrally-built mechanical strength of the lamps and lanterns, for example, the supporting rod has the transversal of square structure Face；For another example, the material of the supporting rod includes the alloy-layer, laminboard layer and plastic layer being cascading；For another example, the support Bar inner hollow is arranged, and the alloy-layer is located inside the supporting rod, and the plastic layer is placed on outside；For another example, the folder The thickness of sandwich layer, the alloy-layer and the plastic layer is incremented by successively；For another example, the laminboard layer includes several mutual winding settings Wire；For another example, the wire has helical structure；For another example, it is filled with adhesive inside the laminboard layer；For another example, The lateral wall of the support portion is provided with external screw thread, and the mounting cup offers screw hole, in the madial wall of the screw hole offers Screw thread, the external screw thread are spirally connected with the internal thread；For another example, the support portion hangs down with the plane where the top of the mounting cup Straight setting, in this way, the integrally-built mechanical strength of the lamps and lanterns can be improved.
Also referring to Fig. 1 and Fig. 2, the first end of lampshade 400 is connect with the second end of supporting rack 300.Lampshade 400 is hollow Setting, interior to form installation cavity, the installation cavity is for installing heat-dissipating pipe 500 and LED module 600.
The outer surface of lampshade 400 has the curved-surface structure of gentle transition.For example, the curved-surface structure includes but is not limited to Hyperboloid, saddle camber and Surface of Sphere；For another example, the curved-surface structure includes sequentially connected hyperboloid, saddle camber and Surface of Sphere, again Such as, the curved-surface structure is shunk in two ends of the lampshade, is expanded and is protruded in the medium position of the lampshade；For another example, institute State the cross section of ellipsoidal structure of the lampshade with gap type.
The second end of lampshade 400 offers thermovent 410, and the installation cavity is connected to by the thermovent with outside, For being scattered and disappeared the heat gathered in the installation cavity body to external environment by the thermovent.For example, the thermovent tool There is circular configuration；For another example, the thermovent has ellipsoidal structure.It is dissipated in this way, open type, opened type or front end may be implemented The effect of hot type.
Referring to Fig. 1, heat-dissipating pipe 500 is fixed on the installation cavity, specifically, the first end of heat-dissipating pipe 500 is fixed on The first end of lampshade 400, for example, the first end of the heat-dissipating pipe is fixed on the link position of the lampshade and support frame as described above Place；For another example, the central axis of the lampshade is overlapped with the central axis of the heat-dissipating pipe.For example, the heat-dissipating pipe has circle Tubular structure.
Referring to Fig. 1,500 hollow setting of heat-dissipating pipe, in form heat-dissipating cavity, and the second end of heat-dissipating pipe 500 with Outside connection is more advantageous to described in this way, the heat-dissipating cavity is connected to by the opening of the second end of the heat-dissipating pipe with outside Heat loss in heat emission wall is to outside；For another example, the plane where the opening of the second end of the heat-dissipating pipe and the heat dissipation Plane where mouthful overlaps setting.
It should be noted that the second end of the heat-dissipating pipe is at least partly placed on outside the thermovent, and certainly, institute The installation inside cavity can also be placed in completely by stating the second end of heat-dissipating pipe, can be adjusted according to actual conditions.Again Such as, the first end of the heat-dissipating pipe wears the lampshade, and is placed on outside the lampshade, certainly, the first of the heat-dissipating pipe End card can be placed in the installation inside cavity completely, can be adjusted according to actual conditions, as long as ensuring the heat dissipation Pipe can reach the radiating requirements of the lamps and lanterns.
Referring to Fig. 1, LED module 600 includes several LED sub-light sources 610, several LED sub-light sources 610 are set to heat-dissipating pipe 500 lateral wall.LED sub-light sources 610 are electrically connected with the circuit mechanism, and the circuit mechanism is used for the LED sub-lights Source powers, so that the LED sub-light sources execute normal light emission operation.For example, the LED sub-light sources include but is not limited to LED lamp bead and LED chip etc..
It should be pointed out that since the inside of heat-dissipating pipe 500 forms the heat-dissipating cavity, several LED sub-light sources hairs The sub-fraction for the heat that light generates is transferred to the installation inside cavity, and is transferred to the external world by the thermovent, several Another part of the luminous heat generated of the LED sub-light sources is transferred in the heat-dissipating pipe, wherein is transferred to the heat-dissipating pipe A heat part by its surface scatter and disappear except, another part is transferred to inside the heat-dissipating cavity, is dissipated by the heat-dissipating cavity It loses to the external world, in this way, the heat dissipation performance of the lamps and lanterns can be greatlyd improve.It is particularly suitable for high-power and more LED sub-lights Class cooling requirements higher design structure in source preferably reduces the influence that the LED sub-light sources are generated due to light decay.
The heat-dissipating cavity that is in communication with the outside is formed in the heat-dissipating pipe 500 of above-mentioned lamps and lanterns 10, and lampshade 400 offers thermovent 410, the heat loss that can more rapidly and in time generate several LED sub-light sources 610 to the external world, good heat dispersion performance.
In order to further increase heat dissipation performance, for example, referring to Fig. 4, the lateral wall of the first end of heat-dissipating pipe 500 is equipped with The round wind outlet of bladeless fan 700, the bladeless fan is arranged towards the thermovent, and the bladeless fan includes fan sheet Body and connecting rod, the fan body are placed on the lateral wall of the first end of the heat-dissipating pipe, and are provided with interval between the two, The first end of the connecting rod is connect with the lateral wall of the first end of the heat-dissipating pipe, the second end of the connecting rod and the wind Fan ontology connection；For another example, several connecting rods are set；For another example, several connecting rods are in put with the center of the heat-dissipating pipe Penetrate shape distribution；For another example, the connecting rod has hollow-core construction；For another example, the connecting rod has the cross section of cirque structure；Again Such as, the thermovent has the cross section of cirque structure, in this way, being generated using the bladeless fan steady and lasting new Wind can preferably be taken away when the LED sub-light sources shine and generate heat, and be dispelled to the external world by the thermovent.
In order to further increase heat dissipation performance, for example, referring to Fig. 5, inside heat-dissipating pipe 500, i.e., in the described heat-dissipating cavity Several heat sink strips 800 are arranged in portion, and the both ends of the heat sink strip are connect with the madial wall of the heat-dissipating pipe, and several described scattered Hot bar shaped reticulates structure, and several heat sink strips specifically include first group of heat sink strip, second group of heat sink strip, third group heat sink strip With the 4th group of heat sink strip, first group of heat sink strip, second group of heat sink strip, the third group heat sink strip and 4th group described Heat sink strip all has reticular structure, first group of heat sink strip, second group of heat sink strip, the third group heat sink strip and described 4th group of heat sink strip is spaced setting successively；For another example, heat sink strip described in each group includes several heat sink strips, and these heat sink strips It is generally aligned in the same plane, the central axis upright of the plane and the heat-dissipating pipe；For another example, first group of heat sink strip is close to institute The first end setting of heat-dissipating pipe is stated, the 4th group of heat sink strip is arranged close to the second end of the heat-dissipating pipe；For another example, the heat dissipation Item has hollow-core construction；For another example, the heat sink strip has the cross section of cirque structure；For another example, the heat sink strip has spiral Shape structure；For another example, the material of the heat sink strip is heat dissipation alloy, in this way, heat dissipation area can be greatly increased, for further Improve heat dissipation performance.
In order to further increase heat dissipation performance, for example, referring to Fig. 6, heat-dissipating pipe 500 offers several heat emission holes 510, if It does the heat emission hole to radially distribute with the center of the heat-dissipating pipe, and the first end of the heat emission hole and the heat-dissipating cavity Connection, the second end of the heat emission hole are connected to the installation cavity；The aperture of the first end of the heat emission hole is less than described dissipate The aperture of the second end of hot hole；For another example, the aperture of the heat emission hole gradually increases from its first end to second end；For another example, described The aperture of the second end of heat emission hole is 2mm~5mm；For another example, the aperture of the second end of the heat emission hole is 2mm~3mm；For another example, The aperture of the second end of the heat emission hole is 2.5mm；For another example, the sidewall thickness of the heat-dissipating pipe is 3cm~5cm；For another example, described The sidewall thickness of heat-dissipating pipe is 4cm~5cm；For another example, the sidewall thickness of the heat-dissipating pipe is 4.5cm, in this way, can greatly increase Add heat dissipation area, on the other hand, can make to form linkage heat dissipation system between the installation cavity and the heat-dissipating cavity, be used for Further increase heat dissipation performance.
It is appreciated that since several LED sub-light sources are arranged in the LED module, it is larger based on its power, and far from scattered On the basis of hot systems or structure, other than solving its radiating requirements, it is necessary to solve its circuit mechanism because energizing excessive production The larger problem of raw load, i.e., the described circuit mechanism can lead to the problem of local component scorification because load is excessive, that is, occur Short circuit problem, at this point, the circuit mechanism is easy to catch fire, there are the danger of fire, greatly threaten user the person and Property safety.
In order to improve security performance, for example, referring to Fig. 2, the lamps and lanterns further include release mechanism 900, release mechanism 900 Safe cavity 111, the bottom of safe cavity 111 are offered including fire prevention solid material filling part 910 and trigger unit 920, bottom plate 110 Portion offers triggering hole 112, and triggering hole 112 connects with the accommodating cavity of the inside of safe cavity 111 and mounting cup 120 respectively Logical, fire prevention solid material filling part 910 is filled in inside safe cavity 111, and trigger unit 920 is set to triggering hole 112, and closes Trigger hole 112.For example, the trigger unit has membranaceous or laminated structure, e.g., the material of the trigger unit is high molecule plastic, When the circuit mechanism catches fire or when failure heat production, the effect based on high temperature, the trigger unit melted by heat.For example, described anti- The material of fiery solid material filling part is fire prevention solid material can send out when the fire prevention solid material is by high temperature action Biochemical effect volatilizes a large amount of fire-retardant gas, e.g., carbon dioxide.
The operation principle of above-mentioned release mechanism 900 is as follows：
When the circuit mechanism short circuit occurred inside and when catching fire, the effect based on high temperature is described in the triggering hole Trigger unit melted by heat makes the triggering hole be connected to the accommodating cavity, in the process, the institute of the safe inside cavity It states that fire prevention solid material filling part is heated to be decomposed or chemically react, releases a large amount of fire-retardant gas, e.g., carbon dioxide, institute It states fire-retardant gas to be ejected in the accommodating cavity by the triggering hole, based on the fire retardation of the fire-retardant gas, be used for Circuit mechanism described in burning is put out, the sprawling for avoiding the intensity of a fire avoids that large-scale fire, security performance higher occurs.
In order to further improve the security can, for example, it is described fire prevention solid material filling part material be fire prevention solid material Material, the fire prevention solid material is by activity fire extinguishing material, hydrophobic material and inert material component, for example, activity fire extinguishing material, thin The mass ratio of water material and inert material is 1：0.1：2；For another example, it is described activity fire extinguishing material include ammonium phosphate salt, sodium bicarbonate, At least one of sodium chloride and potassium chloride；For another example, the activity fire extinguishing material is ultra-fine grain diameter activity fire extinguishing material, grain size To be less than or equal to 0.5 μm, preferably less than 0.5 μm, in this way, using the mobility of its own, powder-gas can be reached Flame-retardant system, security performance higher；For another example, the hydrophobic material includes at least one of silicone oil and hydrophobic silicic aerogels；For another example, The inert material is talcum powder.
It is appreciated that since several LED sub-light sources are directly mounted at the heat-dissipating pipe, the heat-dissipating pipe bears larger Heat carry, especially power and the case where brightness requirement higher, therefore, it is necessary to improve the heat dissipation performance of the heat-dissipating pipe Can, in order to further increase the heat dissipation performance of the heat-dissipating pipe, to improve the heat dissipation performance of the lamps and lanterns entirety, for example, please join Fig. 7 is read, heat-dissipating pipe 500 includes safe floor 520, heat-conducting layer 530, heat transfer layer 540 and the heat dissipating layer 550 being cascading, peace Holostrome 520 is arranged towards the installation cavity, and heat dissipating layer 550 is arranged towards the heat-dissipating cavity.
For example, the lamps and lanterns of an embodiment, the safe floor includes each component of following mass parts：Silicon nitride 80 Part~90 parts, 30 parts~45 parts of titanium dioxide, 2 parts~8 parts of silica, 2 parts~15 parts of kaolin, 0.5 part~2 parts of light weight calcium With 0.2 part~0.5 part of rare earth oxide.For example, the rare earth oxide include lanthana, cerium oxide, praseodymium oxide, europium oxide and At least one of terbium oxide, for example, lanthana, cerium oxide, praseodymium oxide, europium oxide and terbium oxide mass ratio be 1：1：1：1：1.
Above-mentioned safe floor has insulation effect good, the advantage that thermal coefficient is big and coefficient of thermal expansion is low, in this way, working as LED When the heat of light source is directly delivered to the safe floor, the safe floor can be quickly and in time by area near LED sub-light sources The heat transfer of domain aggregation is to the heat-conducting layer, to ensure the normal work of LED sub-light sources.Secondly as the safe floor with LED sub-light sources are in direct contact or distance is closer, and the heat conduction load undertaken is maximum, and above-mentioned safe floor uses silicon nitride as mainly Raw material, and mixed other materials can have lower coefficient of thermal expansion, so as to avoid the safe floor and the heat conduction Gap is generated between layer, and the safe floor itself is avoided to generate gap, and then can be to avoid the gap and gap filling air The problem of thermal coefficient generated afterwards reduces.Further, since being in direct contact between the safe floor and LED sub-light sources or distance Relatively close, the case where being easy to happen electric elements, directly contacted with the safe floor such as conducting wire, above-mentioned safe floor is made using silicon nitride For primary raw material, and mixed other materials can have preferable insulating properties, so as to avoid the safe floor from being powered, to The security performance of the lamps and lanterns is improved, safety standard is higher.
For example, the lamps and lanterns of an embodiment, the heat-conducting layer includes each component of following mass parts：Nano-graphite 90 parts~95 parts of alkene fiber, 0.5 part~15 parts of multi-walled carbon nanotube, 0.1 part~5 parts of single-walled carbon nanotube and carbon nano-fiber 0.1 part~10 parts.
Above-mentioned heat-conducting layer uses nano-graphene fiber for primary raw material, and using multi-walled carbon nanotube, single Pipe and carbon nano-fiber are as auxiliary material so that the heat-conducting layer has larger thermal coefficient, heat-conducting effect preferable.It needs , it is noted that addition multi-walled carbon nanotube, single-walled carbon nanotube and carbon nano-fiber, can form micro- dissipate in the heat-conducting layer Heat pipeline, for further increasing heat dissipation performance, in this way, can the heat of the safe floor quickly and institute be transferred in time It states in heat transfer layer.
It should be noted that two layers before passing through because of the luminous heat generated of the LED sub-light sources, i.e., the described safe floor and institute After stating heat-conducting layer, understand in the heat loss of some to extraneous air.Further, since the cost of the heat-conducting layer is higher, Itself main reason is that, the primary raw material of the heat-conducting layer is the higher nano-graphene fiber of manufacturing cost, therefore, is based on institute State heat transfer layer heat transfer and heat dissipation load it is relatively small in the case of, the heat transfer layer can use the more common gold in current market Belong to heat sink material, to achieve the effect that reduce cost and obtain preferable heat transfer property.
For example, the heat transfer layer of an embodiment of the present invention comprising each component of following mass parts：85 parts~90 parts of copper, 2 parts~4.5 parts of titanium, 0.1 part~0.3 part of nickel, 0.2 part~1.2 parts of magnesium, 0.2 part~0.7 part of iron, 0.2 part~1.2 parts of vanadium, manganese 0.1 part~0.4 part and 0.1 part~0.3 part of chromium.
Above-mentioned heat transfer layer has preferable heat transfer property using what 85 parts~90 parts of copper can make heat transfer layer, so as to More quickly the heat being transmitted on the heat-conducting layer is passed, and then is evenly dispersed in the structure of the heat transfer layer entirety On, to prevent heat from being accumulated on the contact position between the heat-conducting layer and the heat transfer layer, cause hot-spot phenomenon It generates.In addition, above-mentioned heat transfer layer has, thermal coefficient is high, perfect heat-dissipating, good mechanical property and lower-cost advantage, such as This, when the heat transfer of the heat-conducting layer gives the heat transfer layer, then the heat that the heat-conducting layer is absorbed into can be more fast It is transmitted to fastly in the heat dissipation, and during heat transfer, the heat of part can also be directly delivered to by the heat transfer layer In extraneous air.
It should be noted that when the LED sub-light sources generate heat pass through three first layers, i.e., the respectively described safe floor, After the heat-conducting layer and the heat transfer layer, has relatively large a part of heat and scatter and disappear in air medium in transmission, in addition, Since the primary raw material of the heat transfer layer is copper, heavier mass is therefore, relatively small based on heat dissipating layer heat dissipation load In the case of, the heat dissipating layer can use heat dissipation effect preferable, and lighter in weight, lower-cost material reduce cost to reach And weight, and obtain the effect of preferable heat dissipation performance.
For example, the heat dissipating layer of an embodiment of the present invention comprising each component of following mass parts：70 parts~75 parts of aluminium, 35 parts~45 parts of copper, 0.2 part~0.7 part of magnesium, 0.1 part~0.3 part of nickel, 0.2 part~0.7 part of iron, 0.2 part~0.5 part of manganese, titanium 0.1 part~0.3 part of 0.1 part~0.3 part, 0.05 part~0.1 part of chromium and vanadium.
Above-mentioned heat dissipating layer uses 70 parts~75 parts of aluminium and 35 parts~45 parts of copper, and the heat dissipating layer can be made still to have Preferable heat dissipation performance, so as to ensure that the heat dissipating layer can rapidly dissipate the heat passed over by the heat transfer layer It loses in air medium, e.g., is dissipated in inside the heat-dissipating cavity, and then heat is avoided to be accumulated on the heat dissipating layer, causes Hot-spot phenomenon generates.Compared with the existing technology, merely use price costly and the larger copper of quality, above-mentioned heat dissipating layer Both there is good heat dissipation effect, can rapidly by heat loss to air, and with lighter weight, be easily installed casting, price Less expensive advantage.Meanwhile compared with the existing technology, the aluminium alloy for merely using heat dissipation effect poor, above-mentioned heat dissipating layer tool There is more preferably heat transfer property.
For example, the safe floor, the heat-conducting layer, the heat transfer layer and the heat dissipating layer thickness ratio be 0.5~1.1： 0.1~0.3：3~3.5：4~4.5, the structure for optimizing the heat-dissipating pipe, for improving heat dissipation performance.
It is combined with each other it should be noted that the other embodiment of the present invention further includes technical characteristic in the various embodiments described above It is formed by the lamps and lanterns that can implement.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Only several embodiments of the present invention are expressed for embodiment described above, the description thereof is more specific and detailed, but It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the present invention's Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of lamps and lanterns, which is characterized in that including：
Pedestal, the pedestal include bottom plate and mounting cup, and the mounting cup covers at the bottom plate, and inside the mounting cup It is formed and houses cavity；
Circuit mechanism, the circuit mechanism are set to the accommodating inside cavity, wherein the circuit mechanism includes power supply, electricity Road plate and driving module, the power supply and the driving module are electrically connected with the circuit board respectively；
The first end of supporting rack, support frame as described above is fixedly installed in the mounting cup；
Lampshade, the first end of the lampshade and the second end of support frame as described above connect, and the hollow setting of lampshade is interior to form peace It behave affectedly body, there is the curved-surface structure of gentle transition, the second end of the lampshade to offer thermovent for the outer surface of the lampshade；
Heat-dissipating pipe, the heat-dissipating pipe is fixed on the installation cavity, and the first end of the heat-dissipating pipe is fixed on the lampshade First end, the hollow setting of heat-dissipating pipe is interior to form heat-dissipating cavity, and the second end of the heat-dissipating pipe is connected to outside；
LED module, the LED module include several LED sub-light sources, and several LED sub-light sources are set to the heat-dissipating pipe Lateral wall, the LED sub-light sources are electrically connected with the circuit mechanism；
The lamps and lanterns further include release mechanism, and the release mechanism includes fire prevention solid material filling part and trigger unit, the bottom Plate offers safe cavity, and the bottom of the safe cavity offers triggering hole, the triggering hole respectively with the safe cavity And the accommodating cavity connection of the inside of the mounting cup, the fire prevention solid material filling part are filled in the safe cavity Inside, the trigger unit are set to triggering hole and close the triggering hole；The trigger unit has membranaceous or laminated structure, described The material of trigger unit is high molecule plastic；The material of the fire prevention solid material filling part is fire prevention solid material.
2. lamps and lanterns according to claim 1, which is characterized in that the power supply includes battery.
3. lamps and lanterns according to claim 2, which is characterized in that the battery is rechargeable battery.
4. lamps and lanterns according to claim 2, which is characterized in that the battery is solar cell.
5. lamps and lanterns according to claim 1, which is characterized in that the circuit mechanism further includes wireless receiving module and Wei Chu Device module is managed, the wireless receiving module and the microprocessor module are electrically connected with the circuit board respectively.
6. lamps and lanterns according to claim 1, which is characterized in that several mounting posts are arranged in the side protrusion of the bottom plate, if It does the mounting post and wears the circuit board.
7. lamps and lanterns according to claim 6, which is characterized in that several mounting posts are spaced setting successively.
8. lamps and lanterns according to claim 7, which is characterized in that several mounting post rectangular array arrangements.
9. lamps and lanterns according to claim 1, which is characterized in that the circuit mechanism further includes conducting wire, and the of the conducting wire One end and the circuit board are electrically connected, and the conducting wire is at least partly placed in inside support frame as described above, and the of the conducting wire Two ends are electrically connected with the LED sub-light sources.
10. lamps and lanterns according to claim 9, which is characterized in that the conducting wire has enamel-cover cable architecture.
CN201610196652.6A 2016-03-30 2016-03-30 Lamps and lanterns CN105805686B (en)

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Publication number Priority date Publication date Assignee Title
CN201779480U (en) * 2010-07-05 2011-03-30 林胡助 Light-emitting diode lamp source device
CN103727445A (en) * 2013-12-06 2014-04-16 无锡合众信息科技有限公司 Table lamp
CN204201535U (en) * 2014-10-14 2015-03-11 广东德豪润达电气股份有限公司 Led
CN105351781A (en) * 2015-11-27 2016-02-24 杨小晨 High heat dissipation type LED (light-emitting diode) corn lamp

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