CN105798773B - A kind of attrition process track uniformity detecting method based on latitude and longitude - Google Patents

A kind of attrition process track uniformity detecting method based on latitude and longitude Download PDF

Info

Publication number
CN105798773B
CN105798773B CN201610141859.3A CN201610141859A CN105798773B CN 105798773 B CN105798773 B CN 105798773B CN 201610141859 A CN201610141859 A CN 201610141859A CN 105798773 B CN105798773 B CN 105798773B
Authority
CN
China
Prior art keywords
warp
latitude
attrition process
longitude
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610141859.3A
Other languages
Chinese (zh)
Other versions
CN105798773A (en
Inventor
文东辉
陈珍珍
鲁聪达
蔡东海
王扬渝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang University of Technology ZJUT
Original Assignee
Zhejiang University of Technology ZJUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University of Technology ZJUT filed Critical Zhejiang University of Technology ZJUT
Priority to CN201610141859.3A priority Critical patent/CN105798773B/en
Publication of CN105798773A publication Critical patent/CN105798773A/en
Application granted granted Critical
Publication of CN105798773B publication Critical patent/CN105798773B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明公开了一种基于经纬线的研磨加工轨迹均匀性检测方法,首先在圆形基片上建立经纬线模型,其中包括经线(1、2、…、i、…、n)和纬线(1、2、…、j、…、m);依次计算研磨加工轨迹线通过经线1、经线2…、经线i、…、经线n的次数;分别计算经线1上研磨加工轨迹通过纬线(j‑1)和纬线j之间的次数、经线2上研磨加工轨迹通过纬线(j‑1)和纬线j之间的次数、经线i上研磨加工轨迹通过纬线(j‑1)和纬线j之间的次数(1≤j≤m),以此类推,直至得到经线n上经线i上研磨加工轨迹通过纬线(j‑1)和纬线j之间的次数。本发明只需合理设计一定数量的经线和纬线,便可逐一辨识出研磨加工轨迹线的密度分布。

The invention discloses a method for detecting the uniformity of grinding processing tracks based on latitude and longitude. First, a model of latitude and longitude is established on a circular substrate, including warp (1, 2, ..., i, ..., n) and latitude (1, 2, ..., j, ..., m); successively calculate the number of times that the grinding processing trajectory passes through warp 1, warp 2 ..., warp i, ..., warp n; respectively calculate the grinding process trajectory on warp 1 passing through the latitude (j-1) The number of times between the latitude and the latitude j, the number of times the grinding process on the warp 2 passes between the latitude (j-1) and the latitude j, the number of the grinding process on the warp i passes between the latitude (j-1) and the latitude j ( 1≤j≤m), and so on, until the number of times that the grinding track on the warp line n on the warp line i passes through the latitude line (j‑1) and the latitude line j is obtained. The present invention only needs to rationally design a certain number of warp threads and weft threads, and can identify the density distribution of the grinding processing track lines one by one.

Description

一种基于经纬线的研磨加工轨迹均匀性检测方法A method for detecting the uniformity of grinding track based on latitude and longitude

技术领域technical field

本发明涉及平面研磨加工领域,更具体的说,尤其涉及一种基于经纬线的研磨加工轨迹均匀性检测方法。The invention relates to the field of plane grinding, and more specifically, to a method for detecting the uniformity of grinding track based on latitude and longitude lines.

背景技术Background technique

平面研磨加工是获取光学元件、蓝宝石衬底、单晶硅衬底等高精度表面的重要手段之一,在电子、通信、计算机、激光、航空航天等技术领域有着广泛的应用。平面研磨加工须确保平面度、表面粗糙度、表层及亚表层位错形态和残余应力等,高精度平面研磨加工是超光滑抛光加工的必备基础。研磨加工轨迹均匀性检测方法是制约平面研磨加工精度的主要因素之一。而以往的研究主要针对如何提高研磨加工的均匀性这个问题,而有关检测研磨加工轨迹均匀性的方法却少提及。Planar grinding is one of the important means to obtain high-precision surfaces such as optical components, sapphire substrates, and single-crystal silicon substrates. It is widely used in electronics, communications, computers, lasers, aerospace and other technical fields. Plane grinding must ensure flatness, surface roughness, surface and subsurface dislocation morphology and residual stress, etc. High-precision plane grinding is the necessary basis for ultra-smooth polishing. The detection method of the uniformity of the grinding track is one of the main factors restricting the precision of the plane grinding. However, the previous research mainly focused on how to improve the uniformity of grinding process, but the method of detecting the uniformity of grinding process track was seldom mentioned.

现有技术中对圆形基片进行研磨加工过程轨迹线分布的检测方法主要有两种,按芯片尺寸划分区域、沿半径和圆周方向的划分区域的检测方法。前者可以检测研磨加工轨迹线通过芯片面积的次数,但不考虑边缘无效芯片面积;后者以工件被加工表面的圆心为中心,径向绘制一定间距的同心圆,沿直径方向对整个被加工表面的同心圆进行等分,可以实现全局指导研磨加工运动学设计。但这两类检测方法具有共性的缺陷,具体体现为:只是单一的统计了通过局部区域轨迹线的次数,而对局部区域轨迹线是否均匀分布没有做出判别,容易产生失真问题,无法正确指导研磨加工运动学的设计。In the prior art, there are mainly two detection methods for the distribution of track lines in the grinding process of a circular substrate, the detection method of dividing the area according to the chip size, and the area dividing along the radius and circumference. The former can detect the number of times the grinding trajectory passes through the chip area, but does not consider the edge invalid chip area; the latter draws concentric circles at a certain distance in the radial direction with the center of the workpiece processed surface as the center, and the entire processed surface along the diameter direction The concentric circles are divided equally, which can realize the kinematics design of the global guidance grinding process. However, these two types of detection methods have common defects, which are specifically reflected in the following: they only count the number of times the trajectory lines in the local area pass through, but do not make a judgment on whether the trajectory lines in the local area are evenly distributed, which is prone to distortion problems and cannot be correctly guided. Design of milling kinematics.

发明内容Contents of the invention

本发明的目的在于解决现有研磨加工过程中轨迹线密度分布在芯片内和边缘处度量值失真的问题,提出了一种基于经纬线的研磨加工轨迹均匀性检测方法,可以全覆盖性地检测圆形基片研磨加工轨迹的密度分布,为研磨加工轨迹的均匀性和研磨盘均匀磨损的运动学设计提供全局的技术支撑。The purpose of the present invention is to solve the problem that the trajectory line density is distributed in the chip and at the edge in the existing grinding process, and the measured value is distorted, and a method for detecting the uniformity of the grinding process track based on the latitude and longitude lines is proposed, which can detect with full coverage The density distribution of the grinding track of the circular substrate provides global technical support for the uniformity of the grinding track and the kinematics design of the uniform wear of the grinding disc.

本发明通过以下技术方案来实现上述目的:一种基于经纬线的研磨加工轨迹均匀性检测方法,包括如下步骤:The present invention achieves the above object through the following technical solutions: a method for detecting the uniformity of the grinding track based on the latitude and longitude, comprising the following steps:

1)、首先在圆形基片上建立经纬线模型,其中包括经线(1、2、…、i、…、n)和纬线(1、2、…、j、…、m);1), first establish a warp and latitude model on a circular substrate, including warp (1, 2, ..., i, ..., n) and latitude (1, 2, ..., j, ..., m);

2)、依次计算研磨加工轨迹线通过经线1、经线2…、经线i、…、经线n的次数;2), sequentially calculate the number of times that the grinding processing trajectory passes through warp 1, warp 2..., warp i,..., warp n;

3)、分别计算经线1上研磨加工轨迹通过纬线(j-1)和纬线j之间的次数、经线2上研磨加工轨迹通过纬线(j-1)和纬线j之间的次数、经线i上研磨加工轨迹通过纬线(j-1)和纬线j之间的次数(1≤j≤m),以此类推,直至得到经线n上研磨加工轨迹通过纬线(j-1)和纬线j之间的次数;3), respectively calculate the number of times that the grinding process track on the warp 1 passes between the latitude (j-1) and the latitude j, the number of times that the grinding process on the warp 2 passes between the latitude (j-1) and the latitude j, and the number of times on the warp i The number of times that the grinding track passes between the latitude (j-1) and the latitude j (1≤j≤m), and so on, until the grinding process on the warp n passes through the latitude (j-1) frequency;

4)依次取j的不同值,得到不同经纬段上局部线段区间上的研磨加工轨迹的分布密度,根据上述分布密度得出研磨加工轨迹均匀性。4) Different values of j are taken in turn to obtain the distribution density of grinding processing tracks on local line segment intervals on different latitude and longitude segments, and the uniformity of grinding processing tracks can be obtained according to the above distribution density.

进一步的,不同经线段上局部线段区间上的研磨加工轨迹线的密度分布逐一进行辨识。Further, the density distribution of grinding trajectory lines on local line segment intervals on different meridian line segments is identified one by one.

进一步的,研磨加工轨迹的均匀性通过分布密度标准差Cd表示,Cd为不同经纬段上局部线段区间上的研磨加工轨迹的分布密度与标准值之间的差值,Cd越小表示研磨加工轨迹越均匀。Further, the uniformity of the grinding processing trajectory is represented by the standard deviation C d of the distribution density, C d is the difference between the distribution density of the grinding processing trajectory on the local line segment interval on different latitude and longitude segments and the standard value, and the smaller the C d is, the The more uniform the grinding track is.

本发明的有益效果在于:本发明只需合理设计一定数量的经线和纬线,便可逐一辨识出研磨加工轨迹线的密度分布;本发明能够很好地解决极坐标和笛卡尔坐标评价均匀性方法在圆形基片边缘处测量值失真的问题;本发明通过引入二次判别,可判断任一研磨加工运动学参数下研磨加工轨迹的合理性,为合理优化研磨加工运动学参数提供有力支撑。The beneficial effect of the present invention is that: the present invention only needs to rationally design a certain number of warps and wefts, and can identify the density distribution of the grinding processing trajectory line one by one; the present invention can well solve the polar coordinate and Cartesian coordinate evaluation uniformity method The problem of distortion of the measured value at the edge of the circular substrate; the invention can judge the rationality of the grinding process trajectory under any grinding kinematic parameters by introducing secondary discrimination, and provide strong support for rationally optimizing the grinding kinematic parameters.

附图说明Description of drawings

图1是地球表面的经纬度示意图。Figure 1 is a schematic diagram of latitude and longitude on the surface of the earth.

图2是按照斜轴等面积圆锥投影经纬线形状示意图。Fig. 2 is a schematic diagram of the shape of longitude and latitude according to the oblique-axis equal-area conic projection.

图3是本发明圆形基片的经线示意图。Fig. 3 is a schematic meridian diagram of a circular substrate of the present invention.

图4是本发明圆形基片的纬线示意图。Fig. 4 is a schematic diagram of the latitude of the circular substrate of the present invention.

图5是本发明经线1和经线i上研磨加工轨迹线密度分布示意图。Fig. 5 is a schematic diagram of the linear density distribution of the grinding track on warp 1 and warp i according to the present invention.

具体实施方式detailed description

下面结合附图对本发明作进一步说明:The present invention will be further described below in conjunction with accompanying drawing:

如图1、图2、图3、图4和图5所示,依据地球表面任意一点都可以用经度和纬度来定位的原理,如图1,将图1按照斜轴等面积圆锥投影经纬线形状得到图2,依据此思想可将其投影到赤道基圆上形成平面经纬线,通过合理划分的经线和纬线段上研磨加工轨迹通过次数,可以全覆盖地评价研磨加工轨迹的密度分布。为此可构造圆形基片的经线和纬线,定义基片内以圆心为起点、外圆为重点的直径方向线段为经线,可以将圆一次划分为经线1、经线2、经线i...、经线n。同理,以圆心为圆点,可以构造出纬线1、纬线2、纬线j…、纬线m。圆形基片的经线和纬线分别如图3、4所示。As shown in Figure 1, Figure 2, Figure 3, Figure 4 and Figure 5, according to the principle that any point on the earth's surface can be positioned by longitude and latitude, as shown in Figure 1, the longitude and latitude lines of Figure 1 are projected according to the oblique axis equal-area conic projection The shape is obtained in Figure 2. According to this idea, it can be projected onto the equatorial base circle to form plane latitude and longitude lines. Through the number of passes of the grinding process track on the reasonably divided meridian and latitude line segments, the density distribution of the grinding process track can be evaluated in full coverage. To this end, the longitude and latitude of the circular substrate can be constructed, and the diameter line segment in the substrate with the center as the starting point and the outer circle as the focus is defined as the meridian, and the circle can be divided into meridian 1, meridian 2, meridian i... , Longitude n. Similarly, with the center of the circle as the dot, we can construct weft 1, weft 2, weft j..., weft m. The warp and weft of the circular substrate are shown in Figures 3 and 4, respectively.

为全覆盖地评判研磨加工轨迹的密度分布只需要如下两个步骤:第一,先依次计算研磨加工轨迹线通过经线1、经线2、经线i...、经线n的次数;第二,再分别计算经线1上研磨加工轨迹通过次数位于纬线(j-1)和纬线j之间的次数、经线2上研磨加工轨迹通过次数位于纬线(j-1)和纬线j之间的次数、经线i上研磨加工轨迹通过次数位于纬线(j-1)和纬线j之间的次数(1≤j≤m),以此类推,可以得到不同经线段上局部线段区间上的研磨加工轨迹分布密度。In order to judge the density distribution of the grinding process track in full coverage, only the following two steps are required: first, first calculate the number of times that the grinding process track line passes through warp line 1, warp line 2, warp line i..., and warp line n; secondly, Calculate the number of passing times of the grinding track on warp 1 between latitude (j-1) and latitude j, the number of times of grinding track passing on warp 2 between latitude (j-1) and latitude j, and the number of times of warp i The number of passing times of the upper grinding track between the latitude line (j-1) and the latitude line j (1≤j≤m), and so on, can obtain the grinding process track distribution density on the local line segment intervals on different meridian segments.

本实施例中,以经线1和经线i为例进行对比分析,如图5所示,通过经线1和经线i的研磨加工轨迹线的数量N=8,但其轨迹线的密度分布是截然不同的,通过引入另一判据,亦即纬线(j-1)和纬线j之间的轨迹线次数进行二次判别,即可知实现经线1的研磨加工轨迹的研磨加工运动学参数更为合理。因此,只需合理设计一定数量的经线和纬线,便可逐一辨识出研磨加工轨迹线的密度分布,为合理优化研磨加工运动学参数提供有力支撑。In the present embodiment, taking warp 1 and warp i as an example for comparative analysis, as shown in Figure 5, the number of grinding trajectory lines passing through warp 1 and warp i is N=8, but the density distribution of the trajectory lines is completely different Yes, by introducing another criterion, that is, the number of trajectory lines between latitude (j-1) and latitude j for secondary discrimination, it can be known that the grinding kinematics parameters of the grinding trajectory of warp 1 are more reasonable. Therefore, only a certain number of warps and wefts need to be reasonably designed to identify the density distribution of the grinding trajectory lines one by one, which provides a strong support for rationally optimizing the kinematic parameters of the grinding process.

上述实施例只是本发明的较佳实施例,并不是对本发明技术方案的限制,只要是不经过创造性劳动即可在上述实施例的基础上实现的技术方案,均应视为落入本发明专利的权利保护范围内。The above-described embodiments are only preferred embodiments of the present invention, and are not limitations to the technical solutions of the present invention. As long as they are technical solutions that can be realized on the basis of the above-mentioned embodiments without creative work, they should be regarded as falling into the scope of the patent of the present invention. within the scope of protection of rights.

Claims (3)

1. a kind of attrition process track uniformity detecting method based on latitude and longitude, it is characterised in that:Comprise the following steps:
1) longitude and latitude line model, is set up on circular substrate first, including warp (1,2 ..., i ..., n) and parallel (1, 2、…、j、…、m);
2), calculate successively attrition process trajectory by warp 1, warp 2 ..., warp i ..., warp n number of times;
3) attrition process track on warp 1, is calculated respectively passes through grinding on the number of times between parallel (j-1) and parallel j, warp 2 Machining locus passes through parallel (j-1) and parallel by attrition process track on the number of times between parallel (j-1) and parallel j, warp i Number of times (1≤j≤m) between j, by that analogy, until obtaining attrition process track on warp n passes through parallel (j-1) and parallel j Between number of times;
4) j different value is taken successively, obtains the distribution density of the attrition process track on the different upper local line segment intervals of longitude and latitude section, Attrition process track uniformity is drawn according to above-mentioned distribution density.
2. a kind of attrition process track uniformity detecting method based on latitude and longitude according to claim 1, its feature exists In:The Density Distribution of the different attrition process trajectories through on line segment on local line segment interval is recognized one by one.
3. a kind of attrition process track uniformity detecting method based on latitude and longitude according to claim 1, its feature exists In:The uniformity of attrition process track passes through distribution density standard deviation CdRepresent, CdFor on the upper local line segment interval of different longitudes and latitudes section Attrition process track distribution density and standard value between difference, CdSmaller expression attrition process track is more uniform.
CN201610141859.3A 2016-03-11 2016-03-11 A kind of attrition process track uniformity detecting method based on latitude and longitude Active CN105798773B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610141859.3A CN105798773B (en) 2016-03-11 2016-03-11 A kind of attrition process track uniformity detecting method based on latitude and longitude

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610141859.3A CN105798773B (en) 2016-03-11 2016-03-11 A kind of attrition process track uniformity detecting method based on latitude and longitude

Publications (2)

Publication Number Publication Date
CN105798773A CN105798773A (en) 2016-07-27
CN105798773B true CN105798773B (en) 2017-11-07

Family

ID=56468190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610141859.3A Active CN105798773B (en) 2016-03-11 2016-03-11 A kind of attrition process track uniformity detecting method based on latitude and longitude

Country Status (1)

Country Link
CN (1) CN105798773B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115502892B (en) * 2022-11-15 2023-02-28 山西恒跃锻造有限公司 Method and system for removing surface material of steel material during ultra-precise grinding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000088585A (en) * 1998-09-14 2000-03-31 Kenwood Corp Distance calculation device and position calculation device
CN100576484C (en) * 2007-02-27 2009-12-30 中芯国际集成电路制造(上海)有限公司 Method for distributing wafer plainness measuring point
CN101655343B (en) * 2008-08-18 2011-11-09 北京航天计量测试技术研究所 Target, base and reference meter for calibrating spatial coordinate measuring system of electronic theodolite
CN101655344B (en) * 2008-08-18 2011-11-09 北京航天计量测试技术研究所 Method for calibrating spatial coordinate measuring system of electronic theodolite
US8662957B2 (en) * 2009-06-30 2014-03-04 Applied Materials, Inc. Leak proof pad for CMP endpoint detection
CN102866399B (en) * 2012-09-05 2013-09-18 重庆大学 Omnidirectional-array ultrasonic abnormally-moved target monitoring system and movement locus tracking method

Also Published As

Publication number Publication date
CN105798773A (en) 2016-07-27

Similar Documents

Publication Publication Date Title
US9403257B2 (en) Apparatus and method for double-side polishing of work
KR100887269B1 (en) Semiconductor wafers with highly precise edge profile and method for producing them
JP6286256B2 (en) Wafer marking / grinding apparatus and wafer marking / grinding method
CN104385064A (en) Large-caliber plane machining method combining numerical control small tool and ring polishing machine
TWI851876B (en) Systems and methods for enhanced wafer manufacturing
CN106855895B (en) A kind of complex-curved removal function computational methods based on ion beam technology
CN103791836A (en) Numerically controlled tool cutting edge measuring method based on laser scanning confocal technology
KR101944148B1 (en) Device and method for aligning substrates
CN105798773B (en) A kind of attrition process track uniformity detecting method based on latitude and longitude
JP6397790B2 (en) Wafer positioning detection apparatus, method and program
CN116657249A (en) Silicon carbide wafer with uniformly distributed stress and nondestructive and accurate wafer directional stress measuring method
WO2017195460A1 (en) Template assembly sorting method, workpiece-polishing method, and template assembly
McDonald et al. Design and validation of a grinding wheel optical scanner system to repeatedly measure and characterize wheel surface topography
CN106926134A (en) Aspheric grinding Arc Diamond Wheel 3D shape error precision measurement method in place
Zhao et al. Machine vision online detection for abrasive protrusion height on the surface of electroplated diamond wire saw
CN104132944B (en) Method for detecting subsurface damage degree characterization parameters of spherical optical element
US9343348B2 (en) Substrate-product substrate combination and device and method for producing a substrate-product substrate combination
EP3968363A1 (en) Method and system for automated detection and control of defects on wafer
CN104253113A (en) Positioning mark used during measuring and recognition method thereof
Chian et al. Determination of tool nose radii of cutting inserts using machine vision
CN104596461A (en) Characteristic sample piece and method used for detecting positioning accuracy of three-axis diamond lathe
CN208772643U (en) Collector ring detecting tool
CN101750004B (en) Measuring tool
CN108971678A (en) Collector ring detecting tool and its processing method
CN107309720A (en) The method for grinding and grinding trajectory design method of gradual change chamfering tool

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant