CN105798773B - A kind of attrition process track uniformity detecting method based on latitude and longitude - Google Patents
A kind of attrition process track uniformity detecting method based on latitude and longitude Download PDFInfo
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- CN105798773B CN105798773B CN201610141859.3A CN201610141859A CN105798773B CN 105798773 B CN105798773 B CN 105798773B CN 201610141859 A CN201610141859 A CN 201610141859A CN 105798773 B CN105798773 B CN 105798773B
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- attrition process
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- process track
- longitude
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- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000009826 distribution Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000003754 machining Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 2
- 238000013316 zoning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The invention discloses a kind of attrition process track uniformity detecting method based on latitude and longitude, longitude and latitude line model is set up on circular substrate first, including warp (1,2 ..., i ..., n) and parallel (1,2 ..., j ..., m)；Calculate successively attrition process trajectory by warp 1, warp 2 ..., warp i ..., warp n number of times；Attrition process track on warp 1 is calculated respectively, and the number of times (1≤j≤m) between parallel (j 1) and parallel j is passed through by attrition process track on the number of times between parallel (j 1) and parallel j, warp i by attrition process track on the number of times between parallel (j 1) and parallel j, warp 2, by that analogy, up to obtaining on warp n, attrition process track passes through the number of times between parallel (j 1) and parallel j on warp i.The present invention only need to rationally design a number of warp and weft, and the Density Distribution of attrition process trajectory just can be picked out one by one.
Description
Technical field
The present invention relates to plane lapping manufacture field, in particular, more particularly to a kind of grinding based on latitude and longitude adds
Work track uniformity detecting method.
Background technology
Plane lapping processing is the important hand for obtaining the high-precision surfaces such as optical element, Sapphire Substrate, monocrystalline substrate
One of section, has a wide range of applications in technical fields such as electronics, communication, computer, laser, Aero-Space.Plane lapping is processed
Flatness, surface roughness, top layer and subsurface stratum dislocation etching pits and residual stress etc. must be ensured, high precision plane attrition process is
The indispensability basis of design processing.Attrition process track uniformity detecting method is the master for restricting plane lapping machining accuracy
Want one of factor.And how conventional research mainly for improving the uniformity of attrition process this problem, and relevant detection is ground
The method of mill machining locus uniformity is but referred to less.
Being ground the detection method of process trajectory distribution to circular substrate in the prior art mainly has two kinds, presses
Chip size zoning, along radius and the detection method of the zoning of circumferencial direction.The former can detect attrition process rail
Trace does not consider the invalid chip area in edge by the number of times of chip area；The latter using the center of circle of workpiece surface to be machined as
Center, radially draws the concentric circles of a determining deviation, diametrically carries out decile to the concentric circles of whole surface to be machined, can be with
Realize that the overall situation instructs attrition process kinematic design.But this two classes detection method has the defect of general character, is embodied as：Simply
Single statistics is by the number of times of regional area trajectory, and whether localized region trajectory is uniformly distributed not make and sentences
Not, problem of dtmf distortion DTMF is easily produced, it is impossible to the kinematic design of accurate instruction attrition process.
The content of the invention
It is an object of the invention to solve during existing attrition process track linear-density distribution in chip and edge
A kind of the problem of metric distortion, it is proposed that attrition process track uniformity detecting method based on latitude and longitude, can be with all standing
The Density Distribution of circular substrate attrition process track is detected to property, is uniformity and the abrasive disk uniform wear of attrition process track
Kinematic design global technical support is provided.
The present invention is achieved through the following technical solutions above-mentioned purpose：A kind of attrition process track based on latitude and longitude is uniform
Property detection method, comprises the following steps：
1) longitude and latitude line model, is set up on circular substrate first, including warp (1,2 ..., i ..., n) and parallel
(1、2、…、j、…、m)；
2), calculate successively attrition process trajectory by warp 1, warp 2 ..., warp i ..., warp n number of times；
3) attrition process track on warp 1, is calculated respectively to pass through on the number of times between parallel (j-1) and parallel j, warp 2
Attrition process track by attrition process track on the number of times between parallel (j-1) and parallel j, warp i by parallel (j-1) and
Number of times (1≤j≤m) between parallel j, by that analogy, until obtain on warp n attrition process track by parallel (j-1) and
Number of times between parallel j；
4) j different value is taken successively, obtains the distribution of the attrition process track on the different upper local line segment intervals of longitude and latitude section
Density, attrition process track uniformity is drawn according to above-mentioned distribution density.
Further, the Density Distribution of the different attrition process trajectories through on line segment on local line segment interval is carried out one by one
Identification.
Further, the uniformity of attrition process track passes through distribution density standard deviation CdRepresent, CdFor in different longitudes and latitudes section
Difference between the distribution density and standard value of attrition process track on local line segment interval, CdSmaller expression attrition process rail
Mark is more uniform.
The beneficial effects of the present invention are：The present invention only need to rationally design a number of warp and weft, just can be one by one
Pick out the Density Distribution of attrition process trajectory；The present invention can solve polar coordinates well and cartesian coordinate evaluates uniform
Property method is the problem of the measured value distortion of circular substrate edge；The present invention can determine whether any grinding by introducing secondary discrimination
The reasonability of attrition process track under working motion parameter, strong branch is provided for reasonably optimizing attrition process kinematics parameters
Support.
Brief description of the drawings
Fig. 1 is the longitude and latitude schematic diagram of earth surface.
Fig. 2 is according to inclined shaft homalographic conical projection latitude and longitude schematic shapes.
Fig. 3 is the warp schematic diagram of circular substrate of the present invention.
Fig. 4 is the parallel schematic diagram of circular substrate of the present invention.
Fig. 5 is attrition process track linear-density distribution schematic diagram on warp 1 of the present invention and warp i.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings：
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5, it can be determined according to earth surface any point with longitude and latitude
Fig. 1 is obtained Fig. 2 by the principle of position, such as Fig. 1 according to inclined shaft homalographic conical projection longitude and latitude wire shaped, can be by it according to this thought
Formation plane latitude and longitude on the basic circle of equator are projected to, are passed through by the upper attrition process track of warp and weft section of classifying rationally secondary
Number, can evaluate the Density Distribution of attrition process track with all standing.The warp and weft of circular substrate can be constructed for this, are defined
In substrate by starting point of the center of circle, the cylindrical diametric(al) line segment attached most importance to be warp, circle can be once divided into warp 1, warp
Line 2, warp i..., warp n.Similarly, using the center of circle as round dot, parallel 1, parallel 2, parallel j ..., parallel m can be constructed.It is circular
The warp and weft difference of substrate is as shown in Figure 3,4.
The Density Distribution that attrition process track is judged for all standing only needs to following two steps：First, first count successively
Calculate attrition process trajectory by warp 1, warp 2, warp i..., warp n number of times；Second, then respectively calculate warp 1 on grind
Grind machining locus number of pass times attrition process track number of pass times on the number of times between parallel (j-1) and parallel j, warp 2
Attrition process track number of pass times is located at parallel (j-1) and parallel on number of times, warp i between parallel (j-1) and parallel j
Number of times (1≤j≤m) between j, by that analogy, can obtain the different attrition process rails through on line segment on local line segment interval
Mark distribution density.
In the present embodiment, it is analyzed by taking warp 1 and warp i as an example, as shown in figure 5, passing through warp 1 and warp i
Attrition process trajectory quantity N=8, but the Density Distribution of its trajectory is completely different, by introducing another criterion,
That is, the trajectory number of times between parallel (j-1) and parallel j carries out secondary discrimination, you can know the attrition process rail for realizing warp 1
The attrition process kinematics parameters of mark are more reasonable.Therefore, a number of warp and weft need to be rationally only designed, just can be one by one
The Density Distribution of attrition process trajectory is picked out, is that reasonably optimizing attrition process kinematics parameters provide strong support.
Above-described embodiment is presently preferred embodiments of the present invention, is not the limitation to technical solution of the present invention, as long as
The technical scheme that can be realized without creative work on the basis of above-described embodiment, is regarded as falling into patent of the present invention
Rights protection scope in.
Claims (3)
1. a kind of attrition process track uniformity detecting method based on latitude and longitude, it is characterised in that：Comprise the following steps：
1) longitude and latitude line model, is set up on circular substrate first, including warp (1,2 ..., i ..., n) and parallel (1,
2、…、j、…、m)；
2), calculate successively attrition process trajectory by warp 1, warp 2 ..., warp i ..., warp n number of times；
3) attrition process track on warp 1, is calculated respectively passes through grinding on the number of times between parallel (j-1) and parallel j, warp 2
Machining locus passes through parallel (j-1) and parallel by attrition process track on the number of times between parallel (j-1) and parallel j, warp i
Number of times (1≤j≤m) between j, by that analogy, until obtaining attrition process track on warp n passes through parallel (j-1) and parallel j
Between number of times；
4) j different value is taken successively, obtains the distribution density of the attrition process track on the different upper local line segment intervals of longitude and latitude section,
Attrition process track uniformity is drawn according to above-mentioned distribution density.
2. a kind of attrition process track uniformity detecting method based on latitude and longitude according to claim 1, its feature exists
In：The Density Distribution of the different attrition process trajectories through on line segment on local line segment interval is recognized one by one.
3. a kind of attrition process track uniformity detecting method based on latitude and longitude according to claim 1, its feature exists
In：The uniformity of attrition process track passes through distribution density standard deviation CdRepresent, CdFor on the upper local line segment interval of different longitudes and latitudes section
Attrition process track distribution density and standard value between difference, CdSmaller expression attrition process track is more uniform.
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| CN201610141859.3A CN105798773B (en) | 2016-03-11 | 2016-03-11 | A kind of attrition process track uniformity detecting method based on latitude and longitude |
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| CN201610141859.3A CN105798773B (en) | 2016-03-11 | 2016-03-11 | A kind of attrition process track uniformity detecting method based on latitude and longitude |
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| CN105798773B true CN105798773B (en) | 2017-11-07 |
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| CN115502892B (en) * | 2022-11-15 | 2023-02-28 | 山西恒跃锻造有限公司 | Method and system for removing surface material of steel material during ultra-precise grinding |
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| JP2000088585A (en) * | 1998-09-14 | 2000-03-31 | Kenwood Corp | Distance calculation device and position calculation device |
| CN100576484C (en) * | 2007-02-27 | 2009-12-30 | 中芯国际集成电路制造(上海)有限公司 | Method for distributing wafer plainness measuring point |
| CN101655343B (en) * | 2008-08-18 | 2011-11-09 | 北京航天计量测试技术研究所 | Target, base and reference meter for calibrating spatial coordinate measuring system of electronic theodolite |
| CN101655344B (en) * | 2008-08-18 | 2011-11-09 | 北京航天计量测试技术研究所 | Method for calibrating spatial coordinate measuring system of electronic theodolite |
| WO2011008499A2 (en) * | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
| CN102866399B (en) * | 2012-09-05 | 2013-09-18 | 重庆大学 | Omnidirectional-array ultrasonic abnormally-moved target monitoring system and movement locus tracking method |
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