CN105798459A - Combined laser processing device - Google Patents

Combined laser processing device Download PDF

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Publication number
CN105798459A
CN105798459A CN201410857152.3A CN201410857152A CN105798459A CN 105798459 A CN105798459 A CN 105798459A CN 201410857152 A CN201410857152 A CN 201410857152A CN 105798459 A CN105798459 A CN 105798459A
Authority
CN
China
Prior art keywords
cutting
guide rail
welding
head mirror
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410857152.3A
Other languages
Chinese (zh)
Inventor
罗敬文
勇航
陈孝山
刁陶陶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI UNITY PURUI LASER EQUIPMENT CO Ltd
Original Assignee
SHANGHAI UNITY PURUI LASER EQUIPMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI UNITY PURUI LASER EQUIPMENT CO Ltd filed Critical SHANGHAI UNITY PURUI LASER EQUIPMENT CO Ltd
Priority to CN201410857152.3A priority Critical patent/CN105798459A/en
Publication of CN105798459A publication Critical patent/CN105798459A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a combined laser processing device fixed on a laser processing machine tool. The combined laser processing device comprises a protecting cavity, and an optical path conversion mechanism, a cutting head mirror cavity and a welding head mirror cavity arranged in the protecting cavity; a cutting process position and a welding process position are arranged in the protecting cavity; the optical path conversion mechanism can switch between the cutting process position and the cutting process position; the cutting head mirror cavity is formed below the cutting process position; the welding head mirror cavity is formed below the welding process position; a cutting head is connected below the cutting head mirror cavity; and a welding head is connected below the welding head mirror cavity. The combined laser processing device is simplified by two independent laser processing systems, so that the number of equipment needed to finish laser cutting and laser welding processes is reduced, the equipment cost is reduced, and the process link is shortened; and the cutting process and the welding process adopt the same path, so that the programming process of numerical control processing procedures is simplified, the movement precision of a processing head is improved, and the processing speed is quickened.

Description

Combined laser processing device
Technical field
The present invention relates to Laser Processing, particularly relate to a kind of combined laser processing device.
Background technology
Cut and laser weld are two kinds of wide variety of techniques in the application of Materialbearbeitung mit Laserlicht technology.Wherein cut is the contactless processing that a kind of high-energy-density controllability is good, can produce high energy density after laser beam focus in minimum region, by evaporating and metal and nonmetallic materials are cut by the material removing method such as fusing.Laser weld refers to by controlling the parameters such as the width of laser pulse, energy, peak power and repetition rate, makes workpiece melt, forms specific molten bath, thus reaching of the same race or welding dissimilar materials purpose.
It is the pattern of an a kind of processing head of laser instrument fixed configurations that domestic existing cut and welding equipment all adopt, and namely cutting technique and welding procedure are overlapped independent laser-processing systems by two respectively and completed.If having needed cutting and two kinds of techniques of welding, then generally requiring a set of laser weld system of processing and a set of Laser cutting system, two set laser-processing systems are by certain technological process cooperation, and cost is high, and complicated operation.
Summary of the invention
The purpose of the present invention, it is simply that in order to solve the problems referred to above, it is provided that a kind of axial distance is short and the better combined laser processing device of radiating effect.
In order to achieve the above object, present invention employs techniques below scheme: a kind of combined laser processing device, be fixed on laser process machine, including protecting chamber and being arranged on the light path converting mechanism of protection intracavity, cutting head mirror chamber and welding head mirror chamber;Protection intracavity is provided with cutting technique position and welding procedure position, and light path converting mechanism can switch between cutting technique position and welding procedure position, and cutting head mirror chamber is arranged on below cutting technique position;Welding head mirror chamber is arranged on below welding procedure position;It is connected below cutting head in cutting head mirror chamber, is connected below plumb joint in welding head mirror chamber.
Described light path converting mechanism includes self adaptation microscope base, cylinder, guide rail slide block and guide rail;Wherein, guide rail bracket is located at protection intracavity, and guide rail slide block is erected on guide rail and can move left and right along guide rail, and self adaptation microscope base is arranged on guide rail slide block and can move with guide rail slide block, and cylinder is fixed on the one end in protection chamber and is connected with guide rail slide block transmission.
Described protection chamber is provided with pedestal, and described device is fixed on laser process machine by pedestal.
Compared with prior art, the present invention has the following advantages that and feature:
1, two platform independent laser-processing systems being simplified is a combination laser system of processing, has decreased cut and laser weld processing technique equipment needed thereby quantity, has reduced equipment cost.
2, shortening processing technique chain, the switching efficiency between different processing technique is high, reduces the time of workpiece location.
3, cutting technique adopts identical path with welding procedure, simplifies the compilation process of nc program, improves kinematic accuracy and the process velocity of processing head.
Accompanying drawing explanation
Fig. 1 is the structural representation of combined laser processing device of the present invention.
Detailed description of the invention
Referring to Fig. 1, combined laser processing device of the present invention, it is fixed on laser process machine, including protecting chamber 1 and being arranged on the light path converting mechanism of protection intracavity, cutting head mirror chamber 3 and welding head mirror chamber 4.Protection is provided with cutting technique position 11 and welding procedure position 12 in chamber 1, and light path converting mechanism can switch between cutting technique position and welding procedure position, and cutting head mirror chamber 3 is arranged on below cutting technique position;Welding head mirror chamber 4 is arranged on below welding procedure position;It is connected below cutting head 5 in cutting head mirror chamber 3, is connected below plumb joint 6 in welding head mirror chamber 4.
Above-mentioned light path converting mechanism includes self adaptation microscope base 21, cylinder 22, guide rail slide block 23 and guide rail 24;Wherein, guide rail 24 is erected in protection chamber 1, and guide rail slide block 23 is erected on guide rail and can move left and right along guide rail, and self adaptation microscope base 21 is arranged on guide rail slide block and can move with guide rail slide block, and cylinder 22 is fixed on the one end in protection chamber and is connected with guide rail slide block transmission.
Being provided with pedestal 7 on protection chamber 1, device is fixed on laser process machine by pedestal 7.
The operation principle of the present invention is:
When needs carry out Laser cutting, digital control system sends signal and drives cylinder 22 action, coupled self adaptation microscope base 21 is moved to cutting technique position 11 by the guide rail slide block 23 being positioned on guide rail 24, be positioned on self adaptation microscope base 21 slant reflection mirror by laser beam import cutting head mirror chamber 3, by the focusing of focus lamp in cutting head 5, the secondary air of fit with nozzle injection carries out the technological operation of cut.
Man-hour is added when needs carry out laser weld, digital control system sends signal and drives cylinder 22 action, coupled self adaptation microscope base 21 is moved to welding procedure position 12 by the guide rail slide block 23 being positioned on guide rail 24, be positioned on self adaptation microscope base 21 slant reflection mirror by laser beam import welding head mirror chamber 4, by the focusing of focus lamp in plumb joint 6, the secondary air of fit with nozzle injection carries out the technological operation of laser weld.
The action of cylinder 22 determines the process station residing for self adaptation microscope base 21: when cylinder 22 ejects, and promotes self adaptation microscope base 21 to be positioned at welding procedure position;When cylinder 22 shrinks, self adaptation microscope base 21 is promoted to be positioned at cutting technique position.With crossing the slant reflection mirror being arranged on self adaptation microscope base 21, incoming laser beam is reflected into cutting head 5 or plumb joint 6, it is achieved both switching application.
Cylinder 22 is under the control of digital control system, and its movement time is short, and cylinder 22 can promote self adaptation microscope base 21 to move to cutting technique position or welding procedure position, accurate positioning.Laser beam can be imported the processing head specifying application by light path switching device accurately and rapidly, completes cutting technique or welding procedure.

Claims (3)

1. a combined laser processing device, is fixed on laser process machine, it is characterised in that includes protection chamber and is arranged on the light path converting mechanism of protection intracavity, cutting head mirror chamber and welding head mirror chamber;Protection intracavity is provided with cutting technique position and welding procedure position, and light path converting mechanism can switch between cutting technique position and welding procedure position, and cutting head mirror chamber is arranged on below cutting technique position;Welding head mirror chamber is arranged on below welding procedure position;It is connected below cutting head in cutting head mirror chamber, is connected below plumb joint in welding head mirror chamber.
2. combined laser processing device as claimed in claim 1, it is characterised in that: described light path converting mechanism includes self adaptation microscope base, cylinder, guide rail slide block and guide rail;Wherein, guide rail bracket is located at protection intracavity, and guide rail slide block is erected on guide rail and can move left and right along guide rail, and self adaptation microscope base is arranged on guide rail slide block and can move with guide rail slide block, and cylinder is fixed on the one end in protection chamber and is connected with guide rail slide block transmission.
3. combined laser processing device as claimed in claim 1, it is characterised in that: described protection chamber is provided with pedestal, and described device is fixed on laser process machine by pedestal.
CN201410857152.3A 2014-12-30 2014-12-30 Combined laser processing device Pending CN105798459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410857152.3A CN105798459A (en) 2014-12-30 2014-12-30 Combined laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410857152.3A CN105798459A (en) 2014-12-30 2014-12-30 Combined laser processing device

Publications (1)

Publication Number Publication Date
CN105798459A true CN105798459A (en) 2016-07-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410857152.3A Pending CN105798459A (en) 2014-12-30 2014-12-30 Combined laser processing device

Country Status (1)

Country Link
CN (1) CN105798459A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106624362A (en) * 2017-01-10 2017-05-10 温州职业技术学院 Cup joint hollow copper pipe manufacturing method and device based on laser cutting and welding
CN111660017A (en) * 2020-06-29 2020-09-15 莱芜钢铁集团有限公司 Multifunctional cutting and welding integrated machine
CN112296508A (en) * 2020-11-02 2021-02-02 吉林大学 Laser automatic processing platform
CN117086498A (en) * 2023-10-19 2023-11-21 深圳市铭镭激光设备有限公司 Laser cutting welding machine and operation method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6174794A (en) * 1984-09-17 1986-04-17 Mitsubishi Electric Corp Working head of laser working device
US6822187B1 (en) * 1998-09-09 2004-11-23 Gsi Lumonics Corporation Robotically operated laser head
CN201371317Y (en) * 2009-03-27 2009-12-30 华中科技大学 Multi-functional laser machining equipment
CN201769010U (en) * 2010-08-18 2011-03-23 武汉钢铁(集团)公司 Combined laser processing device
CN203390396U (en) * 2013-07-08 2014-01-15 广东大族粤铭激光科技股份有限公司 Combined laser cutting device
CN204397163U (en) * 2014-12-30 2015-06-17 上海团结普瑞玛激光设备有限公司 combined laser processing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6174794A (en) * 1984-09-17 1986-04-17 Mitsubishi Electric Corp Working head of laser working device
US6822187B1 (en) * 1998-09-09 2004-11-23 Gsi Lumonics Corporation Robotically operated laser head
CN201371317Y (en) * 2009-03-27 2009-12-30 华中科技大学 Multi-functional laser machining equipment
CN201769010U (en) * 2010-08-18 2011-03-23 武汉钢铁(集团)公司 Combined laser processing device
CN203390396U (en) * 2013-07-08 2014-01-15 广东大族粤铭激光科技股份有限公司 Combined laser cutting device
CN204397163U (en) * 2014-12-30 2015-06-17 上海团结普瑞玛激光设备有限公司 combined laser processing device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106624362A (en) * 2017-01-10 2017-05-10 温州职业技术学院 Cup joint hollow copper pipe manufacturing method and device based on laser cutting and welding
CN106624362B (en) * 2017-01-10 2018-04-24 温州职业技术学院 A kind of socket hollow copper tubing preparation method and device based on laser cutting and welding
CN111660017A (en) * 2020-06-29 2020-09-15 莱芜钢铁集团有限公司 Multifunctional cutting and welding integrated machine
CN112296508A (en) * 2020-11-02 2021-02-02 吉林大学 Laser automatic processing platform
CN117086498A (en) * 2023-10-19 2023-11-21 深圳市铭镭激光设备有限公司 Laser cutting welding machine and operation method
CN117086498B (en) * 2023-10-19 2024-02-23 深圳市铭镭激光设备有限公司 Laser cutting welding machine and operation method

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Application publication date: 20160727

WD01 Invention patent application deemed withdrawn after publication