CN105792507A - Printed circuit board with cavity and processing method of printed circuit board - Google Patents
Printed circuit board with cavity and processing method of printed circuit board Download PDFInfo
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- CN105792507A CN105792507A CN201610262279.XA CN201610262279A CN105792507A CN 105792507 A CN105792507 A CN 105792507A CN 201610262279 A CN201610262279 A CN 201610262279A CN 105792507 A CN105792507 A CN 105792507A
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- hole
- resin glue
- adhesive film
- epoxide
- substrate layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention discloses a printed circuit board with a cavity and a processing method of the printed circuit board. The printed circuit board with the cavity is characterized in that a copper foil layer through hole is arranged in a copper foil layer, a base material layer through hole is arranged in a base material layer, an upper connecting through hole is arranged in an epoxy resin glue-on glue film layer, and a lower connecting through hole is arranged on an epoxy resin glue-under glue film layer; the upper surface of a bottom plate is fixed to the lower surface of the base material layer via the epoxy resin glue-under glue film layer, the upper surface of the base material layer is fixed to the lower surface of the copper foil layer via the epoxy resin glue-on glue film layer, and the side boundaries of the copper foil layer through hole, the base material layer through hole, the upper connecting through hole and the lower connecting through hole align in a vertical direction. The processing method of the printed circuit board comprises the steps of holing in the base material layer, the epoxy resin glue-on glue film layer and the epoxy resin glue-under glue film layer, stacking, hot pressing, curing and holing in the copper foil layer. According to the present invention, the shape, the size and the depth of the cavity can be combined at will, the design is simple, and the processing is easy, so that the product design can be extended better, and further the product function diversity can be realized.
Description
Technical field
The invention discloses a kind of printed substrate with cavity, the processing method that the invention also discloses a kind of printed substrate with cavity.
Background technology
High speed development along with electronic product, much special product is in requisition for special demand, traditional wiring board design is difficult to meet some specific demands, such as: bury components and parts, operatic tunes demand, blind hole is made according to traditional radium-shine blind hole mode, general diameter is at 75 ~ 150um, the degree of depth is at 30 ~ 100um, if desired big blind hole is made, or deeper of blind hole, then need to spend longer radium-shine time and bigger radium-shine energy to carry out operation, so can cause radium-shine puncturing, the problems such as glue slag residual, pass abnormity
According to the mode of mechanical blind brill, then the degree of depth is difficult to control, and bottom cannot be substantially flat, and cavity configuration design is also restricted, it is impossible to meet the product function of client and the demand of reliability.
Summary of the invention
The present invention one of purpose be overcome the deficiencies in the prior art, it is provided that a kind of various shapes, size are adjustable, make the design of product have bigger extension and then can realize the multifarious printed substrate with cavity of product function.
The processing method that it is a further object of the present invention to provide a kind of printed substrate with cavity.
According to technical scheme provided by the invention, the described printed substrate with cavity, including copper foil layer, substrate layer, adhesive film on epoxide-resin glue, base plate and adhesive film under epoxide-resin glue, copper foil layer offers copper foil layer through hole, substrate layer offers substrate layer through hole, epoxide-resin glue connects on offering on adhesive film through hole, adhesive film offers lower connection through hole under epoxide-resin glue, the upper surface of base plate is fixed by the lower surface of adhesive film under epoxide-resin glue Yu substrate layer, the upper surface of substrate layer is fixed by the lower surface of adhesive film on epoxide-resin glue Yu copper foil layer, and copper foil layer through hole, substrate layer through hole, upper connection through hole aligns with the lower sideline in the vertical direction being connected through hole.
The processing method of a kind of printed substrate with cavity comprises the following steps:
A, on substrate layer, process substrate layer through hole, interim hole on processing on adhesive film on epoxide-resin glue, adhesive film processes lower interim hole under epoxide-resin glue, guarantee the equal sized of upper interim hole and lower interim hole and the single side size 0.1 ~ 0.5mm bigger than the single side size of substrate layer through hole in upper interim hole；
B, adhesive film on epoxide-resin glue is attached to the upper surface of substrate layer, adhesive film under epoxide-resin glue is attached to the lower surface of substrate layer, guarantee the center alignment of upper connection through hole, lower connection through hole and substrate layer through hole, on epoxide-resin glue, the upper surface of adhesive film covers lid layer copper foil layer, under epoxide-resin glue, one piece of base plate of the lower surface pad of adhesive film, obtains stacking plate；
C, by stacking plate by hot-press solidifying integral, in the process of hot-press solidifying, on epoxide-resin glue, adhesive film can extend to the marginal position of substrate layer through hole after melting, interim hole is made to reduce and be formed and connect through hole, under epoxide-resin glue, adhesive film can extend to the marginal position of substrate layer through hole after melting, make lower interim hole reduce and be formed down and connect through hole, obtain printed wire boards half-finished product；
D, the downward perforate from the upper surface of copper foil layer along the sideline of substrate layer through hole so that on copper foil layer, form copper foil layer through hole, obtain the printed wire board finished product with cavity.
The material of described base plate is FR4, metal, pottery, Teflon or paper.
In step a, substrate layer adopt the mode of stamp or milling cutter molding process substrate layer through hole.
In step a, epoxide-resin glue adopt the mode of stamp or milling cutter molding process interim hole on adhesive film.
In step a, adhesive film adopt the mode of stamp or milling cutter molding to process lower interim hole under epoxide-resin glue.
In step d, the downward perforate of mode etched by radium-shine cutting or liquid medicine from the upper surface of copper foil layer along the sideline of substrate layer through hole.
Described copper foil layer through hole, substrate layer through hole, upper connection through hole and circle, ellipse, square, rectangle, triangle or other polygons that lower connection through hole is that shape is consistent.
In step c, the temperature of hot-press solidifying controls at 180 ~ 200 DEG C, and the Stress control of hot-press solidifying is at 2.4 ~ 3.4Mpa.
The thickness of described copper foil layer is 12 ~ 38 μm, and the thickness of substrate layer is 0.2 ~ 3mm, and on epoxide-resin glue, the thickness of adhesive film is 25 ~ 90 μm, and the thickness of base plate is 0.2 ~ 3mm, and under epoxide-resin glue, the thickness of adhesive film is 25 ~ 90 μm.
The invention enables the shape of cavity, size and the degree of depth can combination in any, shape, size can realize by selecting the formula of punching mould or milling cutter molding, the degree of depth can realize by selecting the tellite of different-thickness, and glue-free slag residual, various shapes, size are adjustable, the simple easily processing of design so that the design of product has bigger extension, and then can realize the multiformity of product function.
Accompanying drawing explanation
Fig. 1 is the structural representation of substrate layer in the present invention.
Fig. 2 is the structural representation of the substrate layer having offered substrate layer through hole in the present invention.
Fig. 3 is the structural representation of adhesive film on epoxy resin glue of the present invention.
Fig. 4 has offered the structural representation of adhesive film on the epoxide-resin glue in interim hole in the present invention.
Fig. 5 is the structural representation of adhesive film under epoxy resin glue of the present invention.
Fig. 6 has offered the structural representation of adhesive film under the epoxide-resin glue in lower interim hole in the present invention.
Fig. 7 is the structural representation of stacking plate in the present invention.
Fig. 8 is the half-finished structural representation of printed substrate in the present invention.
Fig. 9 is the structural representation of printed wire board finished product in the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
The processing method of a kind of printed substrate with cavity comprises the following steps:
A, process on the substrate layer 102 that thickness is 0.2mm circle substrate layer through hole 107, the epoxide-resin glue that thickness is 25 μm process into circular upper interim hole 110 on adhesive film 103, adhesive film 105 processes the lower interim hole 111 of circle under the epoxide-resin glue that thickness is 25 μm, guarantee the equal diameters in upper interim hole 110 and lower interim hole 111 and the big 0.1 ~ 0.5mm of radius of the radius ratio substrate layer through hole 107 in upper interim hole 110；
B, adhesive film on epoxide-resin glue 103 is attached to the upper surface of substrate layer 102, adhesive film under epoxide-resin glue 105 is attached to the lower surface of substrate layer 102, guarantee the center alignment of upper connection through hole 108, lower connection through hole 109 and substrate layer through hole 107, on epoxide-resin glue, the upper surface of adhesive film 103 covers the copper foil layer 101 that a layer thickness is 12 μm, under epoxide-resin glue, one piece of thickness of the lower surface pad of adhesive film 105 is the base plate 104 of 0.2mm, obtains stacking plate；
C, by stacking plate by hot-press solidifying integral, in the process of hot-press solidifying, on epoxide-resin glue, adhesive film 103 can extend to the marginal position of substrate layer through hole 107 after melting, interim hole 110 is made to reduce and form connection through hole 108, under epoxide-resin glue, adhesive film 105 can extend to the marginal position of substrate layer through hole 107 after melting, make lower interim hole 111 reduce and form lower connection through hole 109, obtain printed wire boards half-finished product；
D, from the upper surface of copper foil layer 101 along the downward perforate in sideline of substrate layer through hole 107 so that on copper foil layer 101 formed copper foil layer through hole 106, obtain the printed wire board finished product with cavity.
The material of described base plate 104 is FR4, metal, pottery, Teflon or paper.
In step a, substrate layer 102 adopt the mode of stamp or milling cutter molding process substrate layer through hole 110.
In step a, epoxide-resin glue adopt the mode of stamp or milling cutter molding process interim hole 110 on adhesive film 103.
In step a, adhesive film 105 adopt the mode of stamp or milling cutter molding to process lower interim hole 111 under epoxide-resin glue.
In step d, the downward perforate of mode etched by radium-shine cutting or liquid medicine from the upper surface of copper foil layer 101 along the sideline of substrate layer through hole 107, and etching solution is for mainly containing copper chloride, hydrochloric acid and hypochlorous mixed solution, etch process is common process.
In step c, the temperature of hot-press solidifying controls at 180 ~ 200 DEG C, and the Stress control of hot-press solidifying is at 2.4 ~ 3.4Mpa.
nullWhat the embodiment of the present invention 1 obtained has the printed substrate of cavity，Including copper foil layer 101、Substrate layer 102、Adhesive film 103 on epoxide-resin glue、Base plate 104 and adhesive film 105 under epoxide-resin glue，Copper foil layer 101 offers copper foil layer through hole 106，Substrate layer 102 offers substrate layer through hole 107，Epoxide-resin glue offers on adhesive film 103 connection through hole 108，Adhesive film 105 offers lower connection through hole 109 under epoxide-resin glue，The upper surface of base plate 104 is fixed by the lower surface of adhesive film under epoxide-resin glue 105 with substrate layer 102，The upper surface of substrate layer 102 is fixed by the lower surface of adhesive film on epoxide-resin glue 103 with copper foil layer 101，And copper foil layer through hole 106、Substrate layer through hole 107、Upper connection through hole 108 is equal with the diameter of lower connection through hole 109，And copper foil layer through hole 106、Substrate layer through hole 107、Upper connection through hole 108 with under be connected through hole 109 in being coaxially disposed.
Embodiment 2
The processing method of a kind of printed substrate with cavity comprises the following steps:
A, on the substrate layer 102 that thickness is 3mm, process foursquare substrate layer through hole 107, the epoxide-resin glue that thickness is 90 μm process into hole 110 interim foursquare on adhesive film 103, adhesive film 105 processes foursquare lower interim hole 111 under the epoxide-resin glue that thickness is 90 μm, guarantee the equal sized of upper interim hole 110 and lower interim hole 111 and the single side size 0.1 ~ 0.5mm bigger than the single side size of substrate layer through hole 107 in upper interim hole 110；
B, adhesive film on epoxide-resin glue 103 is attached to the upper surface of substrate layer 102, adhesive film under epoxide-resin glue 105 is attached to the lower surface of substrate layer 102, guarantee the center alignment of upper connection through hole 108, lower connection through hole 109 and substrate layer through hole 107, on epoxide-resin glue, the upper surface of adhesive film 103 covers the copper foil layer 101 that a layer thickness is 38 μm, under epoxide-resin glue, one piece of thickness of the lower surface pad of adhesive film 105 is the base plate 104 of 3mm, obtains stacking plate；
C, by stacking plate by hot-press solidifying integral, in the process of hot-press solidifying, on epoxide-resin glue, adhesive film 103 can extend to the marginal position of substrate layer through hole 107 after melting, interim hole 110 is made to reduce and form connection through hole 108, under epoxide-resin glue, adhesive film 105 can extend to the marginal position of substrate layer through hole 107 after melting, make lower interim hole 111 reduce and form lower connection through hole 109, obtain printed wire boards half-finished product；
D, from the upper surface of copper foil layer 101 along the downward perforate in sideline of substrate layer through hole 107 so that on copper foil layer 101 formed copper foil layer through hole 106, obtain the printed wire board finished product with cavity.
The material of described base plate 104 is FR4, metal, pottery, Teflon or paper.
In step a, substrate layer 102 adopt the mode of stamp or milling cutter molding process substrate layer through hole 110.
In step a, epoxide-resin glue adopt the mode of stamp or milling cutter molding process interim hole 110 on adhesive film 103.
In step a, adhesive film 105 adopt the mode of stamp or milling cutter molding to process lower interim hole 111 under epoxide-resin glue.
In step d, the downward perforate of mode etched by radium-shine cutting or liquid medicine from the upper surface of copper foil layer 101 along the sideline of substrate layer through hole 107, and etching solution is for mainly containing copper chloride, hydrochloric acid and hypochlorous mixed solution, etch process is common process.
In step c, the temperature of hot-press solidifying controls at 180 ~ 200 DEG C, and the Stress control of hot-press solidifying is at 2.4 ~ 3.4Mpa.
nullWhat the embodiment of the present invention 2 obtained has the printed substrate of cavity，Including copper foil layer 101、Substrate layer 102、Adhesive film 103 on epoxide-resin glue、Base plate 104 and adhesive film 105 under epoxide-resin glue，Copper foil layer 101 offers copper foil layer through hole 106，Substrate layer 102 offers substrate layer through hole 107，Epoxide-resin glue offers on adhesive film 103 connection through hole 108，Adhesive film 105 offers lower connection through hole 109 under epoxide-resin glue，The upper surface of base plate 104 is fixed by the lower surface of adhesive film under epoxide-resin glue 105 with substrate layer 102，The upper surface of substrate layer 102 is fixed by the lower surface of adhesive film on epoxide-resin glue 103 with copper foil layer 101，And copper foil layer through hole 106、Substrate layer through hole 107、Upper connection through hole 108 aligns with the lower sideline in the vertical direction being connected through hole 109.
Embodiment 3
The processing method of a kind of printed substrate with cavity comprises the following steps:
A, on the substrate layer 102 that thickness is 1mm, process orthohexagonal substrate layer through hole 107, the epoxide-resin glue that thickness is 60 μm process into hole 110 interim orthohexagonal on adhesive film 103, it is that adhesive film 105 processes under 60 μm of epoxide-resin glues orthohexagonal lower interim hole 111 at thickness, guarantee the equal sized of upper interim hole 110 and lower interim hole 111 and the single side size 0.1 ~ 0.5mm bigger than the single side size of substrate layer through hole 107 in upper interim hole 110；
B, adhesive film on epoxide-resin glue 103 is attached to the upper surface of substrate layer 102, adhesive film under epoxide-resin glue 105 is attached to the lower surface of substrate layer 102, guarantee the center alignment of upper connection through hole 108, lower connection through hole 109 and substrate layer through hole 107, on epoxide-resin glue, the upper surface of adhesive film 103 covers the copper foil layer 101 that a layer thickness is 25 μm, under epoxide-resin glue, one piece of thickness of the lower surface pad of adhesive film 105 is the base plate 104 of 2mm, obtains stacking plate；
C, by stacking plate by hot-press solidifying integral, in the process of hot-press solidifying, on epoxide-resin glue, adhesive film 103 can extend to the marginal position of substrate layer through hole 107 after melting, interim hole 110 is made to reduce and form connection through hole 108, under epoxide-resin glue, adhesive film 105 can extend to the marginal position of substrate layer through hole 107 after melting, make lower interim hole 111 reduce and form lower connection through hole 109, obtain printed wire boards half-finished product；
D, from the upper surface of copper foil layer 101 along the downward perforate in sideline of substrate layer through hole 107 so that on copper foil layer 101 formed copper foil layer through hole 106, obtain the printed wire board finished product with cavity.
The material of described base plate 104 is FR4, metal, pottery, Teflon or paper.
In step a, substrate layer 102 adopt the mode of stamp or milling cutter molding process substrate layer through hole 110.
In step a, epoxide-resin glue adopt the mode of stamp or milling cutter molding process interim hole 110 on adhesive film 103.
In step a, adhesive film 105 adopt the mode of stamp or milling cutter molding to process lower interim hole 111 under epoxide-resin glue.
In step d, the downward perforate of mode etched by radium-shine cutting or liquid medicine from the upper surface of copper foil layer 101 along the sideline of substrate layer through hole 107, and etching solution is for mainly containing copper chloride, hydrochloric acid and hypochlorous mixed solution, etch process is common process.
In step c, the temperature of hot-press solidifying controls at 180 ~ 200 DEG C, and the Stress control of hot-press solidifying is at 2.4 ~ 3.4Mpa.
nullWhat the embodiment of the present invention 3 obtained has the printed substrate of cavity，Including copper foil layer 101、Substrate layer 102、Adhesive film 103 on epoxide-resin glue、Base plate 104 and adhesive film 105 under epoxide-resin glue，Copper foil layer 101 offers copper foil layer through hole 106，Substrate layer 102 offers substrate layer through hole 107，Epoxide-resin glue offers on adhesive film 103 connection through hole 108，Adhesive film 105 offers lower connection through hole 109 under epoxide-resin glue，The upper surface of base plate 104 is fixed by the lower surface of adhesive film under epoxide-resin glue 105 with substrate layer 102，The upper surface of substrate layer 102 is fixed by the lower surface of adhesive film on epoxide-resin glue 103 with copper foil layer 101，And copper foil layer through hole 106、Substrate layer through hole 107、Upper connection through hole 108 aligns with the lower sideline in the vertical direction being connected through hole 109.
Claims (10)
- null1. a printed substrate with cavity，Including copper foil layer (101)、Substrate layer (102)、Adhesive film (103) on epoxide-resin glue、Base plate (104) and adhesive film (105) under epoxide-resin glue，It is characterized in that: on copper foil layer (101), offer copper foil layer through hole (106)，Substrate layer (102) offers substrate layer through hole (107)，Epoxide-resin glue offers on adhesive film (103) upper connection through hole (108)，Adhesive film (105) offers lower connection through hole (109) under epoxide-resin glue，The upper surface of base plate (104) is fixed by the lower surface of adhesive film under epoxide-resin glue (105) Yu substrate layer (102)，The upper surface of substrate layer (102) is fixed by the lower surface of adhesive film on epoxide-resin glue (103) Yu copper foil layer (101)，And copper foil layer through hole (106)、Substrate layer through hole (107)、Upper connection through hole (108) is alignd with the lower sideline in the vertical direction being connected through hole (109).
- 2. a processing method with the printed substrate of cavity, is characterized in that this processing method comprises the following steps:A, on substrate layer (102), process substrate layer through hole (107), epoxide-resin glue processes on adhesive film (103) upper interim hole (110), adhesive film (105) processes lower interim hole (111) under epoxide-resin glue, guarantee the equal sized of upper interim hole (110) and lower interim hole (111) and the single side size 0.1 ~ 0.5mm bigger than the single side size of substrate layer through hole (107) in upper interim hole (110)；B, adhesive film on epoxide-resin glue (103) is attached to the upper surface of substrate layer (102), adhesive film under epoxide-resin glue (105) is attached to the lower surface of substrate layer (102), guarantee the center alignment of upper connection through hole (108), lower connection through hole (109) and substrate layer through hole (107), on epoxide-resin glue, the upper surface of adhesive film (103) covers lid layer copper foil layer (101), under epoxide-resin glue, one piece of base plate (104) of the lower surface pad of adhesive film (105), obtains stacking plate；C, by stacking plate by hot-press solidifying integral, in the process of hot-press solidifying, on epoxide-resin glue, adhesive film (103) can extend to the marginal position of substrate layer through hole (107) after melting, interim hole (110) is made to reduce and be formed and connect through hole (108), under epoxide-resin glue, adhesive film (105) can extend to the marginal position of substrate layer through hole (107) after melting, make lower interim hole (111) reduce and be formed down and connect through hole (109), obtain printed wire boards half-finished product；D, from the upper surface of copper foil layer (101) along the downward perforate in sideline of substrate layer through hole (107) so that form copper foil layer through hole (106) copper foil layer (101) is upper, obtain the printed wire board finished product with cavity.
- 3. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: the material of described base plate (104) is FR4, metal, pottery, Teflon or paper.
- 4. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: in step a, processes substrate layer through hole (107) in the upper mode adopting stamp or milling cutter molding of substrate layer (102).
- 5. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: in step a, and on epoxide-resin glue, the upper mode adopting stamp or milling cutter molding of adhesive film (103) processes upper interim hole (110).
- 6. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: in step a, and under epoxide-resin glue, the upper mode adopting stamp or milling cutter molding of adhesive film (105) processes lower interim hole (111).
- 7. the processing method of a kind of printed substrate with cavity according to claim 2, it is characterized in that: in step d, the downward perforate of mode etched by radium-shine cutting or liquid medicine from the upper surface of copper foil layer (101) along the sideline of substrate layer through hole (107).
- 8. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: described copper foil layer through hole (106), substrate layer through hole (107), upper connection through hole (108) and lower connection through hole (109) are the consistent circle of shape, ellipse, square, rectangle or triangle.
- 9. the processing method of a kind of printed substrate with cavity according to claim 2, is characterized in that: in step c, and the temperature of hot-press solidifying controls at 180 ~ 200 DEG C, and the Stress control of hot-press solidifying is at 2.4 ~ 3.4Mpa.
- 10. the processing method of a kind of printed substrate with cavity according to claim 2, it is characterized in that: the thickness of described copper foil layer (101) is 12 ~ 38 μm, the thickness of substrate layer (102) is 0.2 ~ 3mm, on epoxide-resin glue, the thickness of adhesive film (103) is 25 ~ 90 μm, the thickness of base plate (104) is 0.2 ~ 3 μm, and under epoxide-resin glue, the thickness of adhesive film (105) is 25 ~ 90 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610262279.XA CN105792507A (en) | 2016-04-25 | 2016-04-25 | Printed circuit board with cavity and processing method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610262279.XA CN105792507A (en) | 2016-04-25 | 2016-04-25 | Printed circuit board with cavity and processing method of printed circuit board |
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| CN105792507A true CN105792507A (en) | 2016-07-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113923901A (en) * | 2021-10-12 | 2022-01-11 | 高德（江苏）电子科技有限公司 | Manufacturing method of printed circuit board capable of improving gold penetration of printing ink at cavity junction |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
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| US20060032051A1 (en) * | 2004-08-16 | 2006-02-16 | Pericom Semiconductor Corp. | Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank |
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| CN113923901A (en) * | 2021-10-12 | 2022-01-11 | 高德（江苏）电子科技有限公司 | Manufacturing method of printed circuit board capable of improving gold penetration of printing ink at cavity junction |
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| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
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