CN105785508B - 基于bcb键合工艺的耦合器结构及其制作方法 - Google Patents
基于bcb键合工艺的耦合器结构及其制作方法 Download PDFInfo
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- CN105785508B CN105785508B CN201410821688.XA CN201410821688A CN105785508B CN 105785508 B CN105785508 B CN 105785508B CN 201410821688 A CN201410821688 A CN 201410821688A CN 105785508 B CN105785508 B CN 105785508B
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- 238000010168 coupling process Methods 0.000 claims abstract description 159
- 238000005859 coupling reaction Methods 0.000 claims abstract description 159
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 118
- 239000010703 silicon Substances 0.000 claims abstract description 118
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 117
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6864336B2 (ja) * | 2016-09-05 | 2021-04-28 | 国立大学法人東京工業大学 | 層間結合器 |
US10614843B2 (en) * | 2018-07-17 | 2020-04-07 | Seagate Technology Llc | Input coupler with features to divert stray light from a waveguide |
CN109119500B (zh) * | 2018-08-21 | 2019-12-06 | 南通赛勒光电科技有限公司 | 一种横向锗探测器结构及制备方法 |
CN112630886B (zh) * | 2020-12-22 | 2024-07-12 | 联合微电子中心有限责任公司 | 端面耦合器及其制造方法 |
CN115220149B (zh) * | 2021-04-20 | 2024-04-12 | 北京邮电大学 | 端面耦合器 |
CN113534337B (zh) * | 2021-07-15 | 2022-08-16 | 中南大学 | 一种硅光子芯片光耦合结构加工方法及结构 |
CN113848609A (zh) * | 2021-09-28 | 2021-12-28 | 南京航空航天大学 | 光子集成耦合结构、光子集成器件 |
CN113885132B (zh) * | 2021-10-22 | 2022-05-13 | 清华大学 | 一种光纤与光学波导耦合的模斑变换器及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2266004A1 (en) * | 1996-09-17 | 1998-03-26 | Telefonaktiebolaget Lm Ericsson | Method for manufacturing an optoelectrical component and an optoelectrical component manufactured according to the method |
CN102904159A (zh) * | 2012-10-26 | 2013-01-30 | 江苏尚飞光电科技有限公司 | 一种基于bcb键合工艺的混合集成激光器及其制作方法 |
CN103197386A (zh) * | 2013-04-01 | 2013-07-10 | 北京工业大学 | 一种金属键合的垂直耦合光栅耦合器及其制作方法 |
CN204302527U (zh) * | 2014-12-25 | 2015-04-29 | 江苏尚飞光电科技有限公司 | 基于bcb键合工艺的耦合器结构 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2266004A1 (en) * | 1996-09-17 | 1998-03-26 | Telefonaktiebolaget Lm Ericsson | Method for manufacturing an optoelectrical component and an optoelectrical component manufactured according to the method |
CN102904159A (zh) * | 2012-10-26 | 2013-01-30 | 江苏尚飞光电科技有限公司 | 一种基于bcb键合工艺的混合集成激光器及其制作方法 |
CN103197386A (zh) * | 2013-04-01 | 2013-07-10 | 北京工业大学 | 一种金属键合的垂直耦合光栅耦合器及其制作方法 |
CN204302527U (zh) * | 2014-12-25 | 2015-04-29 | 江苏尚飞光电科技有限公司 | 基于bcb键合工艺的耦合器结构 |
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