CN105762259A - A simple packaging device with jacking columns - Google Patents
A simple packaging device with jacking columns Download PDFInfo
- Publication number
- CN105762259A CN105762259A CN201410760863.9A CN201410760863A CN105762259A CN 105762259 A CN105762259 A CN 105762259A CN 201410760863 A CN201410760863 A CN 201410760863A CN 105762259 A CN105762259 A CN 105762259A
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- fore
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- packaging
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- pedestal
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the LED packaging technology, and especially relates to a simple packaging device with jacking columns. The simple packaging device mainly comprises an upper mold and a lower mold which can be buckled to each other to form a mold cavity. A cover sheet is fixed to the upper mold through a first vacuumizing device; a substrate is fixed to the lower mold; the cover sheet and the substrate are arranged in the mold cavity; the mold cavity is communicated with a second vacuumizing device; the lower mold comprises a second base; the second base comprises a top surface and a bottom surface which are oppositely arranged; the bottom surface is provided with a boss; the boss is provided with the jacking columns at the places close to side edges; and the jacking columns are located in the mold cavity. The vacuum packaging device is modified based on an original substrate and a forming mold, and is additionally provided with the upper mold, the lower mold and the vacuumizing devices; and the packaging device can provide a vacuum environment for substrate packaging glue pressing, so that when packaging glue is pressed, no residual gas exists, and air bubble generation in the packaging glue after packaging can be avoided.
Description
Technical field
The present invention relates to a kind of LED encapsulation technology, be specifically related to a kind of simple and easy sealed in unit with fore-set.
Background technology
Application number be 200710031666.3 Chinese invention patent disclose power LED and the manufacture method thereof of a kind of glue-filling formed bottom, its technical scheme comprises the following steps that: arrange hole for injecting glue and steam vent on substrate, after substrate being installed LED chip and completing electrical connection, mould for lens imaging is pressed in substrate, packing colloid is injected from base plate bottom hole for injecting glue, band injecting glue completes mold removal after colloid hardens, and namely completes the molding of the package lens of LED chip.
Above-mentioned prior art there is the problem that in mould and the cavity of substrate in combination and the molding cavity of package lens there is air, in the process of packaging plastic compacting, packaging plastic can produce more bubble, cause encapsulating products defective, if there is bubble in lens, light can be made to produce refraction, make the distribution curve flux of lens deform, affect the light-out effect of LED, and then reduce the light efficiency of LED.
Therefore, for problems of the prior art, need a kind of LED package device of offer badly particularly important.
Summary of the invention
For the deficiency in background technology, it is provided that the simple and easy sealed in unit with fore-set that a kind of qualification rate is high, packaging effect is good.
The technical scheme is that and be achieved in that:
Simple and easy sealed in unit with fore-set of the present invention, mainly include mutually fastening the upper die and lower die forming die cavity, described upper mould is fixed with cover plate by the first vacuum extractor, described counterdie is fixed with substrate, described cover plate and described substrate are positioned at described die cavity, described die cavity connects the second vacuum extractor, described counterdie includes the second pedestal, described second pedestal includes the end face and the bottom surface that are oppositely arranged, described bottom surface is provided with boss, described boss is provided with fore-set near the position of side, and described fore-set is positioned at described die cavity.
As preferably, described fore-set has four, is oppositely arranged between two.
As preferably, described fore-set is made up of metal material.
As preferably, described upper mould includes the first pedestal, and described first pedestal is enclosed to set by side by first be oppositely arranged and second and forms, and described second is provided with framework, and described fore-set abuts described second.
The present invention is compared with prior art, there is advantages below: vacuum package device provided by the invention is to reequip on original substrate and shaping mould, upper mould, lower film and vacuum suction device are added, packaging plastic is suppressed for substrate, provide the environment of vacuum, when making compacting packaging plastic, it does not have gas is remaining, therefore also avoid after encapsulation completes, in packaging plastic, to produce bubble.
Accompanying drawing explanation
Fig. 1 is the decomposition texture schematic diagram of the present invention；
Fig. 2 is present invention cross-sectional view when coordinating；
Fig. 3 is the structural representation of mould in the present invention；
Fig. 4 is the structural scheme of mechanism of counterdie of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
As shown in accompanying drawing 1 to 3, the simple and easy sealed in unit with fore-set that the present invention discloses, mainly include, mutually fasten the upper mould 1 forming die cavity 6 and counterdie 2, described upper mould 1 is fixed with cover plate 3, described counterdie 2 is fixed with substrate 4, described upper mould 1 is communicated with the first vacuum extractor 5, described die cavity 6 connects the second vacuum extractor 7.
Described upper mould 1 includes the first pedestal 11, and described first pedestal 11 is enclosed to set by side 113 by the first face 111 being oppositely arranged and the second face 112 and forms.Described first pedestal 11 by its side 113 to its inside offer the vacuum line 114 of horizontally set, described vacuum line 114 connects the first vacuum extractor 5 and sucker 115, described sucker 115 is vertically arranged, towards described second face 112 opening, described die cavity 6 is connected with described vacuum line 114.Described second face 112 is provided with framework 12, for the ease of described first pedestal 11 is offered hole 116, location, the area of described framework 12 is less than the area of described first pedestal 11, and described second vacuum extractor 7 passes a side of described framework 12 and connects described die cavity 6, in order to die cavity 6 evacuation.
Described counterdie 2 includes the second pedestal 21, described second pedestal 21 includes the end face 211 and the bottom surface 212 that are oppositely arranged, described bottom surface 212 is provided with boss 22, installing, in order to facilitate, the locating dowel 23 being made up of metal material on described second pedestal 21, the area of described boss 22 is less than the area of described second pedestal 21.The locating dowel 23 of described counterdie 2 is installed in the hole, location 116 of described upper mould 1, thus being fixed up with counterdie 2 by upper mould 1.Described boss 22 is provided with four fore-sets 24 being made of metal near the position of side, four fore-sets 24 are oppositely arranged between two, when described upper mould 1 is fastened on described counterdie 2, described fore-set 24 can stop the second face 112 of described first pedestal 11 to be mounted directly on the surface of boss 22, it is ensured that the formation of die cavity 6 between described upper mould 1 and counterdie 2.
During encapsulation, cover plate 3 is positioned on the first pedestal 11, makes the corresponding sucker 115 of cover plate 3 arrange；After placing, open the first vacuum extractor 5, by the first vacuum extractor 5 evacuation, described cover plate 3 is adsorbed on the second face 112 of described first pedestal 11；Described substrate 4 is positioned on the boss 22 of described counterdie 2, and on described substrate 4, puts glue；Then the upper mould 1 placing cover plate 3 is fastened on described counterdie 2, described cover plate 3 is made to be respectively positioned in described die cavity 6 with described substrate 4, this opens the second vacuum extractor 7 to die cavity 6 evacuation, after the vacuum environment of die cavity 6 reaches needs, regulate the first vacuum extractor 5 and carry out pressure release, in the process of pressure release, cover plate 3 departs from upper mould 1, it is fastened on the substrate 4 on counterdie 2, in this process, owing to be vacuum environment in die cavity 6, it does not have gas remnants, therefore can be avoided after encapsulation completes, in packaging plastic, produce bubble.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (4)
1. the simple and easy sealed in unit with fore-set, it is characterized in that: mainly include mutually fastening the upper die and lower die forming die cavity, described upper mould is fixed with cover plate by the first vacuum extractor, described counterdie is fixed with substrate, described cover plate and described substrate are positioned at described die cavity, described die cavity connects the second vacuum extractor, described counterdie includes the second pedestal, described second pedestal includes the end face and the bottom surface that are oppositely arranged, described bottom surface is provided with boss, described boss is provided with fore-set near the position of side, and described fore-set is positioned at described die cavity.
2. the simple and easy sealed in unit with fore-set according to claim 1, it is characterised in that: described fore-set has four, is oppositely arranged between two.
3. the simple and easy sealed in unit with fore-set according to claim 1, it is characterised in that: described fore-set is made up of metal material.
4. the simple and easy sealed in unit with fore-set according to claim 1, it is characterized in that: described upper mould includes the first pedestal, described first pedestal is enclosed to set by side by first be oppositely arranged and second and forms, and described second is provided with framework, and described fore-set abuts described second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410760863.9A CN105762259A (en) | 2014-12-13 | 2014-12-13 | A simple packaging device with jacking columns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410760863.9A CN105762259A (en) | 2014-12-13 | 2014-12-13 | A simple packaging device with jacking columns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105762259A true CN105762259A (en) | 2016-07-13 |
Family
ID=56335595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410760863.9A Pending CN105762259A (en) | 2014-12-13 | 2014-12-13 | A simple packaging device with jacking columns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105762259A (en) |
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2014
- 2014-12-13 CN CN201410760863.9A patent/CN105762259A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160713 |
|
| WD01 | Invention patent application deemed withdrawn after publication |