CN105760591B - The bonding method of package substrate bonding wire - Google Patents
The bonding method of package substrate bonding wire Download PDFInfo
- Publication number
- CN105760591B CN105760591B CN201610080973.XA CN201610080973A CN105760591B CN 105760591 B CN105760591 B CN 105760591B CN 201610080973 A CN201610080973 A CN 201610080973A CN 105760591 B CN105760591 B CN 105760591B
- Authority
- CN
- China
- Prior art keywords
- parameter
- bonding
- friction
- test data
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Pure & Applied Mathematics (AREA)
- Mathematical Optimization (AREA)
- Mathematical Analysis (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Computational Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to by a kind of bonding method of package substrate bonding wire, by the way that the mode combinations of bonding parameter to be set as to " dynamics+friction ", the corresponding parameter of dynamics mode has USG1, time t, pressure F1, and the corresponding parameter of friction pattern has USG2, pressure F2；According to the corresponding range of each parameter, n group test data is designed using 5 factor n horizontal homogeneous contrived experiment methods, generate matched curve, obtain the corresponding optimal parameter section of each parameter, 8 groups of test datas are designed using 5 factor, 2 horizontal quadrature contrived experiment method, obtain the maximum value in 8 bond strength measured values, and using the corresponding test data set of the maximum value as the best bonding parameter of bonding equipment.This method process is simply clear, the number of parameters being related to is few, convenient for fast searching, this method is applicable not only to the parameter optimization of different type bonding wire to reduce alarm rate and improve bond strength, and the parameter optimization of the bonding wire of same type different size line footpath is equally applicable.
Description
Technical field
The present invention relates to package substrate bonding wire bonding techniques field, in particular to a kind of package substrate bonding wire
Bonding method.
Background technique
Package substrate bonding techniques use gold thread as bonding wire earliest, since the good ductility of gold thread, hardness are small,
So the parameter of gold thread bonding easily establishes, process window mouth width, alarm rate is low and bond strength is high, but cost is very high.It compares
In gold thread bonding, the cheap bonding wire bonding such as alloy wire, plating palladium copper wire, copper wire can be greatly reduced cost, reduce in cost
Under driving effect, the development and application of cheap bonding wire bonding techniques is the hot spot of industry in recent years, but due to being inexpensively bonded
The ductility of lead is generally not so good as gold thread, and hardness is bigger than gold thread, cause the bonding alarm rate of cheap bonding wire high and
Bond strength is low.Alarm rate height influences production capacity, is unfavorable for scale of mass production；The low influence reliability of bond strength, choice of parameters with
The heavy workload of optimization, engineering staff can not quickly determine the efficient combination of parameter and the optimal parameter of optimization, thus cheap key
The parameter for closing lead bonding is established and optimization long-standing problem engineering staff.
Summary of the invention
The purpose of the present invention is to provide a kind of bonding methods of package substrate bonding wire, can quickly determine best nation
Determine parameter, improve bond strength and reduces alarm rate.
To achieve the purpose of the present invention, it adopts the technical scheme that:
A kind of bonding method of package substrate bonding wire determines the best bonding parameter of bonding equipment, including following step
It is rapid:
(1), the mode combinations of bonding parameter are set as " dynamics+friction ", the corresponding parameter of dynamics mode have USG1, when
Between t, pressure F1, the corresponding parameter of friction pattern has USG2, pressure F2；Set the reception standard of matched curve are as follows: R-Sq and R-
The difference that Sq (adjustment) is all larger than 90%, R-Sq and R-Sq (adjustment) is δ, and curve P value and each factor P value are respectively less than 0.05,
In -5%≤δ≤5%；
(2), each corresponding range of parameter is set；
(3), according to the corresponding range of each parameter, n group is designed using 5 factor n horizontal homogeneous contrived experiment methods
Test data, every group of test data includes USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters, wherein 10≤n
≤20；
(4), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test
The corresponding bond strength measured value of data；
(5), according to every group of test data and corresponding bond strength measured value, matched curve is generated；
(6) if, generate matched curve meet reception standard, then follow the steps (7)；If the matched curve generated is unsatisfactory for
Reception standard then re-execute the steps (2) to (5)；
(7), according to matched curve and parameter designing boundary, the corresponding optimal parameter section of each parameter is calculated, often
The corresponding optimal parameter section of a parameter has upper limit value and lower limit value；
(8), it according to the corresponding upper limit value of each parameter and lower limit value, is designed using 5 factor, 2 horizontal quadrature contrived experiment method
8 groups of test datas out, every group of test data include USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters；
(9), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test
The corresponding bond strength measured value of data；
(10), obtain the maximum value in 8 bond strength measured values, and using the corresponding test data set of the maximum value as
The best bonding parameter of bonding equipment.
This method process is simply clear, and the number of parameters being related to is few, and the search of parameter and optimization method determine, generally applicable
In all kinds of bonding wire bondings, this method is applicable not only to the parameter optimization of different type bonding wire to reduce alarm rate and mention
The parameter optimization of high bond strength, the bonding wire of same type different size line footpath is equally applicable, can quickly really by this method
Fixed best bonding parameter improves bond strength and reduces alarm rate.
Technical solution is further illustrated below:
Further, in step (3), n=12.
Further, in step (7), the corresponding curvilinear equation of matched curve be y=a+b × USG1+c × t+d ×
F1+e × USG2+f × F2+g × USG1 × USG1+h × t × F1, wherein a, b, c, d, e, f, g, h are not equal to 0, to the curve
Equation seeks extreme value, obtains the corresponding optimal parameter section of each parameter.
Further, after the best bonding parameter of determination, the corresponding auxiliary parameter of adjustment friction pattern, auxiliary ginseng
Number includes friction period, friction amplitude and friction frequency, and first adjustment rubs the period, then adjusts friction amplitude, and finally adjustment rubs
Wipe frequency.Under the premise of meeting the requirements bond strength, alarm rate is reduced.
Further, the adjustment unit of friction period and the amplitude that rubs is 1, the adjustment unit for the frequency that rubs is 50.
Further, the auxiliary parameter further includes friction phase, friction phase settings are circle.Bonded interface rubs
Wiping effect more sufficiently, is more advantageous to the raising of bond strength relative to " in line " and " Perp ".
Further, the friction period is 5 when bonding wire is 1.0mil copper wire, friction amplitude is 2, and rub frequency
It is 400.
Further, bonding wire is gold thread, alloy wire, plating palladium copper wire or copper wire.
Further, the optimal parameter section of USG1 is 90-160mAmps when bonding wire is 1.0mil copper wire,
The optimal parameter section of time t is 26-28ms, and the optimal parameter section of pressure F1 is 10-65g, the optimal parameter section of USG2
For 75-120mAmps, the optimal parameter section of pressure F2 is 25-40g.
Further, best bonding parameter are as follows: USG1=160mAmps, time t=28ms, pressure F1=10g, USG2
=75mAmps, pressure F2=40g.Bond strength reaches 9.873g, and bond strength is big, highly reliable.
Compared with prior art, the invention has the following advantages:
Process of the present invention is simply clear, and the number of parameters being related to is few, and the search of parameter and optimization method determine, generally applicable
In all kinds of bonding wire bondings, this method is applicable not only to the parameter optimization of different type bonding wire to reduce alarm rate and mention
The parameter optimization of high bond strength, the bonding wire of same type different size line footpath is equally applicable, can quickly really by this method
Fixed best bonding parameter improves bond strength and reduces alarm rate.For 1.0mil bonding wire, copper replaces gold that can lower 75%
Cost.
Detailed description of the invention
Fig. 1 is the flow diagram of the bonding method of package substrate bonding wire of the embodiment of the present invention；
Fig. 2 is the design scheme of 5 factor of 1.0mil copper wire, 12 horizontal homogeneous experimental method；
Fig. 3 is regression analysis detailed data table；
Fig. 4 is the best bonding section of 1.0mil copper wire；
Fig. 5 is the design scheme of 5 factor of 1.0mil copper wire, 2 horizontal quadrature experimental method.
Specific embodiment
The embodiment of the present invention is described in detail with reference to the accompanying drawing:
As shown in Figure 1, a kind of bonding method of package substrate bonding wire, determines the best bonding parameter of bonding equipment,
The following steps are included:
(1), the mode combinations of bonding parameter are set as " dynamics+friction ", the corresponding parameter of dynamics mode have USG1, when
Between t, pressure F1, the corresponding parameter of friction pattern has USG2, pressure F2；Set the reception standard of matched curve are as follows: R-Sq and R-
The difference that Sq (adjustment) is all larger than 90%, R-Sq and R-Sq (adjustment) is δ, and curve P value and each factor P value are respectively less than 0.05,
In -5%≤δ≤5%；
(2), each corresponding range of parameter is set；
(3), according to the corresponding range of each parameter, n group is designed using 5 factor n horizontal homogeneous contrived experiment methods
Test data, every group of test data includes USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters, wherein 10≤n
≤20；
(4), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test
The corresponding bond strength measured value of data；
(5), according to every group of test data and corresponding bond strength measured value, matched curve is generated；
(6) if, generate matched curve meet reception standard, then follow the steps (7)；If the matched curve generated is unsatisfactory for
Reception standard then re-execute the steps (2) to (5)；
(7), according to matched curve and parameter designing boundary, the corresponding optimal parameter section of each parameter is calculated, often
The corresponding optimal parameter section of a parameter has upper limit value and lower limit value；
(8), it according to the corresponding upper limit value of each parameter and lower limit value, is designed using 5 factor, 2 horizontal quadrature contrived experiment method
8 groups of test datas out, every group of test data include USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters；
(9), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test
The corresponding bond strength measured value of data；
(10), obtain the maximum value in 8 bond strength measured values, and using the corresponding test data set of the maximum value as
The best bonding parameter of bonding equipment.
This method process is simply clear, and the number of parameters being related to is few, and the search of parameter and optimization method determine, suitable extensively
For all kinds of bonding wire bondings, this method be applicable not only to the parameter optimization of different type bonding wire with reduce alarm rate and
Bond strength is improved, the parameter optimization of the bonding wire of same type different size line footpath is equally applicable, can be quick by this method
It determines best bonding parameter, improve bond strength and reduces alarm rate.
In the present embodiment, bonding wire is 1.0mil copper wire, and for 1.0mil bonding wire, copper replaces gold that can lower
75% cost, the reception standard of the corresponding bond strength of 1.0mil copper wire are not less than 4g, in step (2), each parameter
Range is as shown in table 1, n=12, designs 12 groups of test datas, every group of test using 5 factor, 12 horizontal homogeneous contrived experiment method
The corresponding bond strength of data is as shown in table 1.
It is counted using data of the Minitab software to table 1, generates matched curve, and carry out regression analysis, fitting is bent
The corresponding curvilinear equation of line are as follows: y=-5.12+0.144 × USG1+0.361 × t+0.0670 × F1+0.0213 × USG2-
The detailed data of 0.0280 × F2-0.000600 × USG1 × USG1-0.00794 × t × F1, regression analysis are shown in Table 2.By table 2
As it can be seen that curvilinear equation P=0.000 < 0.05, while each factor P value is respectively less than 0.05, R-Sq=100.0% and R-Sq (adjustment)
=99.9%, the two is close, and S=0.0525754 < bond strength standard deviation × 10%, bond strength standard deviation is by table 1 12
A bond strength values are calculated, and matched curve meets reception standard, can be used for predicting the optimal bonding parameter of 1.0mil copper wire
Range.
In conjunction with table 2, by asking curvilinear equation the optimal parameter section of each parameter determined after extreme value, see Table 3 for details.In order to
The validity of each parameter in proof list 3, setting 5 factor, 2 horizontal quadrature are verified, design 8 groups of test datas, be detailed in
Table 4.
By table 4 as it can be seen that in the parameter area that table 3 determines, bond strength is stablized between 7.553-9.873g, and
The bond strength of CpKmin=1.71 >=1.67 significantly improves.Best bonding parameter is USG1=160mAmps, time t=28ms,
Pressure F1=10g, USG2=75mAmps, pressure F2=40g.Bond strength reaches 9.873g, and bond strength is big, highly reliable.
After the best bonding parameter of determination, in order to further decrease alarm rate, to the corresponding auxiliary parameter of friction pattern into
Row adjustment, the auxiliary parameter include friction period, friction amplitude and friction frequency, first adjust the friction period, then adjust friction
Amplitude, finally adjustment friction frequency, under the premise of meeting the requirements bond strength, reduces alarm rate.
Auxiliary parameter further includes friction phase, and friction phase settings are circle.The rubbing action of bonded interface is relative to " line
It is interior " and " Perp " is more sufficiently, is more advantageous to the raising of bond strength.
These auxiliary parameters are adjusted to improve alarm rate, will not usually significantly change bond strength, the change of bond strength
Change amount controls within 10%.Therefore when bond strength is sufficiently high, the appropriate bond strength that reduces is to guarantee the significant of alarm rate
Decline improves production capacity.During the adjustment, the adjustment unit of friction period and the amplitude that rubs is 1, the adjustment unit for the frequency that rubs
It is 50.
It is 1.0mil copper wire for bonding wire, the friction period is 5, and friction amplitude is 2, and friction frequency is 400, and rub phase
Position is circle, and in 100ppm, bond strength is controlled in 7g or more for the alarm rate control of bonding wire, makes alarm rate and bond strength
It meets the requirements simultaneously, is conducive to scale of mass production.
In the present embodiment, bonding wire is 1.0mil copper wire, and it is gold thread, alloy wire or plating that this method, which applies also for material,
The determination of the best bonding parameter of other bonding wires such as palladium copper wire, is also applied for the bonding wire of same type different size line footpath
Parameter optimization such as develops 0.8mil copper wire on the basis of 1.0mil copper wire.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of bonding method of package substrate bonding wire determines the best bonding parameter of bonding equipment, which is characterized in that packet
Include following steps:
(1), the mode combinations of bonding parameter are set as " dynamics+friction ", the corresponding parameter of dynamics mode have USG1, time t,
Pressure F1, the corresponding parameter of friction pattern have USG2, pressure F2；Set the reception standard of matched curve are as follows: R-Sq and R-Sq tune
The whole difference for being all larger than 90%, R-Sq and R-Sq adjustment is δ, and curve P value and each factor P value are respectively less than 0.05, wherein -5%≤δ
≤ 5%；
(2), each corresponding range of parameter is set；
(3), according to the corresponding range of each parameter, the test of n group is designed using 5 factor n horizontal homogeneous contrived experiment methods
Data, every group of test data include USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters, wherein 10≤n≤
20；
(4), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test data
Corresponding bond strength measured value；
(5), according to every group of test data and corresponding bond strength measured value, matched curve is generated；
(6) if, generate matched curve meet reception standard, then follow the steps (7)；If the matched curve generated is unsatisfactory for receiving
Standard then re-execute the steps (2) to (5)；
(7), according to matched curve and parameter designing boundary, the corresponding optimal parameter section of each parameter, Mei Gecan are calculated
The corresponding optimal parameter section of number has upper limit value and lower limit value；
(8), according to the corresponding upper limit value of each parameter and lower limit value, 8 are designed using 5 factor, 2 horizontal quadrature contrived experiment method
Group test data, every group of test data include USG1, time t, pressure F1, USG2, pressure F2 this 5 parameters；
(9), every group of test data is inputted into bonding equipment, every group of test data is tested, and record every group of test data
Corresponding bond strength measured value；
(10), the maximum value in 8 bond strength measured values is obtained, and using the corresponding test data set of the maximum value as bonding
The best bonding parameter of equipment.
2. the bonding method of package substrate bonding wire according to claim 1, which is characterized in that in step (3), n
=12.
3. the bonding method of package substrate bonding wire according to claim 1, which is characterized in that in step (7), intend
Close the corresponding curvilinear equation of curve be y=a+b × USG1+c × t+d × F1+e × USG2+f × F2+g × USG1 × USG1+h ×
T × F1, wherein a, b, c, d, e, f, g, h are not equal to 0, seek extreme value to the curvilinear equation, it is corresponding to obtain each parameter
Optimal parameter section.
4. the bonding method of package substrate bonding wire according to claim 1, which is characterized in that in the best bonding of determination
After parameter, the corresponding auxiliary parameter of adjustment friction pattern, the auxiliary parameter includes friction period, friction amplitude and friction frequency
Rate, first adjustment rubs the period, then adjusts friction amplitude, finally adjustment friction frequency.
5. the bonding method of bonding wire according to claim 4, which is characterized in that the tune in friction period and the amplitude that rubs
Whole unit is 1, and the adjustment unit for the frequency that rubs is 50.
6. the bonding method of bonding wire according to claim 4, which is characterized in that the auxiliary parameter further includes friction
Phase, friction phase settings are circle.
7. the bonding method of package substrate bonding wire according to claim 6, which is characterized in that when bonding wire is
When 1.0mil copper wire, the friction period is 5, and friction amplitude is 2, and friction frequency is 400.
8. the bonding method of bonding wire according to any one of claims 1 to 7, which is characterized in that bonding wire is gold
Line, alloy wire, plating palladium copper wire or copper wire.
9. the bonding method of bonding wire according to claim 8, which is characterized in that when bonding wire is 1.0mil copper wire
When, the optimal parameter section of USG1 is 90-160mAmps, and the optimal parameter section of time t is 26-28ms, and pressure F1's is best
Parameter section is 10-65g, and the optimal parameter section of USG2 is 75-120mAmps, and the optimal parameter section of pressure F2 is 25-
40g。
10. the bonding method of bonding wire according to claim 9, which is characterized in that best bonding parameter are as follows: USG1=
160mAmps, time t=28ms, pressure F1=10g, USG2=75mAmps, pressure F2=40g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080973.XA CN105760591B (en) | 2016-02-04 | 2016-02-04 | The bonding method of package substrate bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080973.XA CN105760591B (en) | 2016-02-04 | 2016-02-04 | The bonding method of package substrate bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105760591A CN105760591A (en) | 2016-07-13 |
| CN105760591B true CN105760591B (en) | 2019-01-25 |
Family
ID=56329944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610080973.XA Active CN105760591B (en) | 2016-02-04 | 2016-02-04 | The bonding method of package substrate bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105760591B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6564115B1 (en) * | 2000-02-01 | 2003-05-13 | Texas Instruments Incorporated | Combined system, method and apparatus for wire bonding and testing |
| CN1497694A (en) * | 2002-10-16 | 2004-05-19 | ESECó��˾ | Method for determining optimum bonding parameter when bonding by lead bonding apparatus |
| CN1828858A (en) * | 2003-05-06 | 2006-09-06 | 北京大学 | Method for detecting semiconductor micro device bonding strength |
| CN102420150A (en) * | 2010-09-27 | 2012-04-18 | 库利克和索夫工业公司 | Methods of forming wire bonds for wire loops and conductive bumps |
-
2016
- 2016-02-04 CN CN201610080973.XA patent/CN105760591B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6564115B1 (en) * | 2000-02-01 | 2003-05-13 | Texas Instruments Incorporated | Combined system, method and apparatus for wire bonding and testing |
| CN1497694A (en) * | 2002-10-16 | 2004-05-19 | ESECó��˾ | Method for determining optimum bonding parameter when bonding by lead bonding apparatus |
| CN1828858A (en) * | 2003-05-06 | 2006-09-06 | 北京大学 | Method for detecting semiconductor micro device bonding strength |
| CN102420150A (en) * | 2010-09-27 | 2012-04-18 | 库利克和索夫工业公司 | Methods of forming wire bonds for wire loops and conductive bumps |
Non-Patent Citations (4)
| Title |
|---|
| "Numerical Study on the Effects of Bond Parameters on Thermosonic Bond Strength";Jun He.et al.;《2007 8th International Conference on Electronic Packaging Technology》;20080128;第1-10页 |
| "Optimizing the IC wire bonding process using a neural networks/genetic algotithms approach";chao-ton su.et al.;《Journal of Intellignet Manufacturing》;20030430;第14卷(第2期);第229-237页 |
| "引线健合工艺的稳健性参数优化研究";周林;《中国优秀硕士学位论文全文数据库 信息科技辑》;20150315;第17-19页 |
| "引线键合工艺参数的有限元分析";秦文;《机械设计与制造》;20110228;I135-210 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105760591A (en) | 2016-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102420150B (en) | Formed for wire loop and the method for the wire bonding of conductive salient point | |
| US20130054251A1 (en) | Automatic detection of audio compression parameters | |
| CN105760591B (en) | The bonding method of package substrate bonding wire | |
| CN104374353B (en) | Sensor mounting angle selecting method for three-point method roundness error isolation technology | |
| CN105827852B (en) | A kind of method and terminal adjusting volume | |
| US11495570B2 (en) | Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops | |
| CN109738004A (en) | The calibration method and device, electronic equipment and storage medium of proximity sensor | |
| CN108761105B (en) | Blood coagulation time determination method, electronic device, and storage medium | |
| TWI414030B (en) | Closed loop wire bonding methods and bonding force calibration | |
| CN106226826B (en) | Subregion metal detection machine and subregion metal detection control method | |
| US10352839B2 (en) | Method and device for measuring physical properties of fluid | |
| Gomes et al. | Development of a fast method for optimization of Au ball bond process | |
| CN217238092U (en) | Test device for detecting collapse performance of welding seam glue | |
| US20230030196A1 (en) | Resistance spot welding control system and method thereof | |
| CN102866308A (en) | SAS signal integrity analysis system and method | |
| CN109427193A (en) | Vehicle detection sensitivity setting method and device and computer equipment | |
| KR101144162B1 (en) | Apparatus for Detecting Audio Target Signal and Method of The same | |
| CN207753037U (en) | A kind of high-power LED bracket | |
| CN117151434B (en) | Preparation process optimization method and system based on high-strength gypsum with different strengths | |
| CN106130544B (en) | Automatic frequency band calibration method and system | |
| CN112858868A (en) | Poor connection detection device for semiconductor | |
| CN111007314B (en) | Method for measuring stability of SOC signal through oscilloscope afterglow mode | |
| CN107436384A (en) | The test system and its control system of semiconductor mobile ion | |
| WO2016082441A1 (en) | Test strip electrode control method and system | |
| US20180218996A1 (en) | Method For Producing Wire Bond Connection And Arrangement For Implementing The Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |