CN105741690B - binding device and method - Google Patents
binding device and method Download PDFInfo
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- CN105741690B CN105741690B CN201610279986.XA CN201610279986A CN105741690B CN 105741690 B CN105741690 B CN 105741690B CN 201610279986 A CN201610279986 A CN 201610279986A CN 105741690 B CN105741690 B CN 105741690B
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- display panel
- binding
- platform
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- positioning
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of binding device and methods, belong to display technology field.The binding device includes：Bind platform, contraposition component, lower flattening bench and material loading platform；It is provided with moving assembly and at least two expansion bits on lower flattening bench；At least two locating rods corresponding with expansion bit position are provided on binding platform, at least two locating rods can be each passed through at least two positioning through hole；Contraposition component is used to carry out the contraposition of display panel and chip.The present invention drills out positioning through hole on a display panel by expansion bit, the locating rod bound on platform is penetrated into the positioning through hole later, display panel is avoided to crimp, it solves the display panel being located in the related technology on binding platform and is easy to happen curling, the problem of contraposition of the display panel and chip of curling is difficult to complete, then be difficult to be bound, having reached display panel will not crimp, display panel is easy to be aligned with chip, is then easy to the effect bound.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of binding device and method.
Background technology
Binding (English：Bonding the technique for) typically referring to be combined display panel with chip.
There is a kind of binding device in the related technology, which includes material loading platform (English：Load stage), binding platform
(English：Bonding stage), imaging sensor and moving assembly, be placed with display panel (display panel on material loading platform
The big display panel that can be made of uncut multiple single display panels can also be the single display surface after cutting
Plate), display panel is moved on binding platform by moving assembly, then display panel is adjusted on binding platform, makes to show
Show that panel reaches predeterminated position, complete display panel and bind the contraposition between platform, can be carried out later by imaging sensor
The contraposition of display panel and chip, is finally bound.
In the implementation of the present invention, the inventor finds that the existing technology has at least the following problems：It is in display panel
When display panel flexible, the display panel on binding platform is easy to happen curling, the display panel of curling and chip
Contraposition is difficult to complete, and is then difficult to be bound.
Invention content
In order to solve the display surface when display panel is display panel flexible, being located in the prior art on binding platform
The problem of plate is easy to happen curling, and the contraposition of the display panel and chip of curling is difficult to complete, then be difficult to be bound, this hair
Bright embodiment provides a kind of binding device and method.The technical solution is as follows：
According to the first aspect of the invention, a kind of binding device is provided, the binding device includes：
Bind platform, contraposition component, lower flattening bench and material loading platform；
Moving assembly and at least two expansion bits are provided on the lower flattening bench, at least two expansion bit is used
Drill out at least two positioning through hole on a display panel under the support in the material loading platform, the moving assembly is for moving
The display panel；
It is provided at least two locating rod corresponding with the expansion bit position on the binding platform, described at least two
A locating rod can be each passed through at least two positioning through hole；
The contraposition component is used to carry out the contraposition of the display panel and chip.
Optionally, the shape of the lower flattening bench is identical as the display panel, and the size of the lower flattening bench is less than
The display panel.
Optionally, the expansion bit is 4, and 4 expansion bits are located at 4 angles of the lower flattening bench
It falls.
Optionally, the moving assembly includes multiple vacuum sucking holes.
Optionally, the diameter of the locating rod is less than or equal to the diameter of the expansion bit.
Optionally, multiple vacuum sucking holes are provided on the binding platform.
Optionally, the contraposition component is imaging sensor.
Optionally, at least two expansion bit is used under the support of the material loading platform in the display panel
At least two positioning through hole are drilled out on garbage area.
According to the second aspect of the invention, a kind of binding method is provided, the method includes：
The display panel being located on material loading platform is pushed by lower flattening bench；
At least two are drilled out on said display panel by least two expansion bits being arranged on the lower flattening bench
Positioning through hole；
The display panel is moved on binding platform, at least two locating rods on the binding platform are each passed through
At least two positioning through hole；
The contraposition of the display panel and chip is carried out by contraposition component and is bound.
Optionally, the lower flattening bench is rectangle, and the size of the lower flattening bench is less than the display panel,
It is described to drill out at least two positioning through hole on said display panel by least two expansion bits, including：
It is whether smooth that the display panel is detected according to the part that the display panel exposes；
When the display panel is smooth, drilled out on said display panel by least two expansion bit described
At least two positioning through hole.
Optionally, described that the display panel is moved on binding platform, including：
The display panel is moved to above the binding platform；
At least two positioning through hole and at least two locating rod are aligned by imaging sensor；
The display panel is placed on the binding platform, at least two locating rods difference on the binding platform
Across at least two positioning through hole.
Optionally, at least two expansion bits by being arranged on the lower flattening bench bore on said display panel
Go out at least two positioning through hole, including：
It is drilled out on the garbage area of the display panel by least two expansion bits being arranged on the lower flattening bench
At least two positioning through hole.
According to the third aspect of the invention we, a kind of binding device is provided, the binding device includes：
Align component, binding platform and lower flattening bench；
At least two expansion bits are provided on the binding platform, at least two expansion bit is used under described
At least two positioning through hole are drilled out under the support of flattening bench on said display panel；
The contraposition component is used to carry out the contraposition of the display panel and chip.
According to the fourth aspect of the invention, a kind of binding method is provided, the method includes：
The display panel being located on binding platform is pushed by lower flattening bench；
At least two expansion bits stretched out on the binding platform drill out at least two positioning on said display panel
Through-hole；
Remove the lower flattening bench；
The contraposition of the display panel and chip is carried out by the contraposition component and is bound.
The advantageous effect that technical solution provided in an embodiment of the present invention is brought is：
Positioning through hole is drilled out on a display panel by expansion bit, and the locating rod bound on platform, which is penetrated this, later determines
Position through-hole, avoid display panel from crimping, solve in the related technology display panel for display panel flexible when, be located at
Display panel on binding platform is easy to happen curling, and the contraposition of the display panel and chip of curling is difficult to complete, then be difficult to
The problem of being bound, having reached display panel will not crimp, and display panel is easy to be aligned with chip, is then easy to
The effect bound.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of binding device shown in the embodiment of the present invention；
Fig. 2-1 is the structural schematic diagram of another binding device shown in the embodiment of the present invention；
Fig. 2-2 is showing on the display panel that lower flattening bench is pressed on material loading platform in binding device shown in Fig. 2-1
It is intended to；
Fig. 2-3 is the rearview of lower flattening bench shown in Fig. 2-2；
Fig. 3 is a kind of flow chart of binding method provided in an embodiment of the present invention；
Fig. 4-1 is the flow chart of another binding method provided in an embodiment of the present invention；
Fig. 4-2 is that lower flattening bench is pressed in the schematic diagram on display panel in Fig. 4-1 illustrated embodiments；
Fig. 4-3 is the schematic diagram that expansion bit drills out positioning through hole on a display panel in Fig. 4-1 illustrated embodiments；
Fig. 4-4 is that display panel is moved to the schematic diagram above binding platform in Fig. 4-1 illustrated embodiments；
Fig. 4-5 is schematic diagram when display panel is located on binding platform in Fig. 4-1 illustrated embodiments；
Fig. 5 is the structural schematic diagram of another binding device provided in an embodiment of the present invention；
Fig. 6-1 is the flow chart of another binding method provided in an embodiment of the present invention；
Fig. 6-2 is the schematic diagram that expansion bit bores positioning through hole on a display panel in Fig. 6-1 illustrated embodiments；
Fig. 6-3 is the schematic diagram removed in Fig. 6-1 illustrated embodiments after lower flattening bench.
In above-mentioned each attached drawing, the meaning of reference numeral can be：11- binds platform, and 12- aligns component, flattened under 13-
Platform, 14- material loading platforms, 132- moving assemblies, 131- expansion bits, 111- locating rods, the vacuum on 132a- moving assemblies are inhaled
Hole, 11a- bind the vacuum sucking holes on platform, 20- display panels, the region that L- display panels expose, 141- blind holes, 21- positioning
Through-hole, 51- align component, and 52- binds platform, flattening bench under 53-, 52a- expansion bits, 521- vacuum sucking holes, 531- blind holes,
60- display panels.
Through the above attached drawings, it has been shown that the specific embodiment of the present invention will be hereinafter described in more detail.These attached drawings
It is not intended to limit the scope of the inventive concept in any manner with verbal description, but is by referring to specific embodiments
Those skilled in the art illustrate idea of the invention.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
In the related technology when being bound to display panel, large stretch of display panel is typically cut into the aobvious of small pieces
Show and carries out again after panel, and the display panel in each embodiment of the present invention can be the display panel of small pieces, can also be
The display panel of uncut sheet.
Fig. 1 is a kind of structural schematic diagram of binding device shown in the embodiment of the present invention.The binding device may include：
Bind platform 11, contraposition component 12, lower flattening bench 13 and material loading platform 14.
Moving assembly 132 and at least two expansion bits 131, at least two expansion bits are provided on lower flattening bench 13
131 under the support of material loading platform 14 in display panel (not shown in figure 1) for drilling out at least two positioning through hole, mobile
Component 132 is for moving display panel.
At least two locating rod 111 corresponding with 131 position of expansion bit is provided on binding platform 11, at least two is fixed
Position bar 111 can be each passed through at least two positioning through hole on display panel.
Contraposition component 12 is used to carry out the contraposition of display panel and chip.
Fig. 1 is not to binding the position between the components such as platform 11, contraposition component 12, lower flattening bench 13 and material loading platform 14
Relationship makes restriction.
In conclusion binding device provided in an embodiment of the present invention, positioning is drilled out by expansion bit on a display panel
The locating rod bound on platform is penetrated the positioning through hole later, avoids display panel from crimping, solve related skill by through-hole
In art when display panel is display panel flexible, the display panel on binding platform is easy to happen curling, curling
The problem of contraposition of display panel and chip is difficult to complete, then be difficult to be bound, having reached display panel will not roll up
Song, display panel are easy to be aligned with chip, are then easy to the effect bound.
Further, -1 is please referred to Fig.2, it illustrates the structures of another binding device provided in an embodiment of the present invention to show
It is intended to, preferred component is increased on the basis of binding device binding device shown in Fig. 1, so that the present invention is real
The binding device for applying example offer has better performance.
Optionally, moving assembly 132 includes multiple vacuum sucking holes 132a.Moving assembly 132 can pass through vacuum sucking holes
132a adsorbs display panel, and mobile display panel.In addition, the moving assembly 132 can also be pressed in display in lower flattening bench
When on panel, display panel is adsorbed, when expansion bit being avoided to drill on a display panel, display panel crimps.
Optionally, it binds on platform 11 and is provided with multiple vacuum sucking holes 11a.Bind the vacuum sucking holes 11a energy on platform 11
Display panel is enough adsorbed, planarization of the display panel on binding platform 11 is improved.
Optionally, the shape of lower flattening bench 13 is identical as display panel, and the size of lower flattening bench 13 is less than display panel.
Display panel is generally rectangular, and the size of lower flattening bench 13 can be less than display panel, and flattening bench 13 is descended to be pressed in display surface in this way
When on plate, display panel can expose a part, can judge to be pressed in by a part for this exposing aobvious under lower flattening bench 13
Show whether panel is smooth, and when display panel is smooth, then drill, to ensure the accuracy of positioning through hole position.It can be with
The lower flattening bench of suitable dimension is selected according to the size for the display panel bound.
As shown in Fig. 2-2, it is pressed in the schematic diagram on the display panel 20 on material loading platform 14 for lower flattening bench 13,
Display panel 20 has the region L for the exposing for not being pressed down platform covering.
It should be noted that when lower flattening bench is pressed on display panel, center and the display panel of pushing platform can be made
Center overlap.
Optionally, as Figure 2-3, it is the rearview of lower flattening bench shown in Fig. 2-2, in Fig. 2-3, expansion bit
131 be 4, and 4 expansion bits 131 are located at 4 corners of lower flattening bench 13.4 expansion bits 131 can just exist
4 corners of display panel drill out 4 positioning through hole, and the corner that positioning through hole is located at display panel can further avoid showing
Show that panel crimps.Moving assembly is not shown in Fig. 2-3.
Expansion bit 131 can be punching press drill bit.
As shown in Fig. 2-1, the diameter of locating rod 111 is less than or equal to the diameter of expansion bit 131.It in this way can be conveniently fixed
Position bar 111 penetrates the positioning through hole that expansion bit 131 drills out on a display panel.
Optionally, contraposition component 12 is imaging sensor.Imaging sensor is the important composition portion for forming digital camera
Point.According to the difference of element, charge coupled cell (English can be divided into：Charge Coupled Device；Referred to as：CCD), and
Metal oxide semiconductor device (English：Complementary Metal-Oxide Semiconductor；Referred to as：CMOS)
Two major classes.
Optionally, at least two expansion bits 131 are used under the support of material loading platform 14 in the garbage area of display panel
On drill out at least two positioning through hole.Wherein, garbage area is display panel existing region in the fabrication process, which has no
Actual functional capability may be cut out in the subsequent process, thus bored positioning through hole in garbage area and can't be caused to display panel
It influences.
Optionally, it can be provided on material loading platform 14 corresponding blind with 131 position of expansion bit on lower flattening bench 13
Hole 141, the diameter of the blind hole 141 are more than the diameter of expansion bit 131, for facilitating expansion bit 131 fixed in display surface twist drill
When the through-hole of position, it can be drilled out from display panel, it is ensured that through-hole can be drilled out on a display panel.
Binding device provided in an embodiment of the present invention can be applied to flexible display panels.Flexible display panels can be had
Machine light emitting diode (English：Organic Light-Emitting Diode；Referred to as：OLED) display panel.
In addition, binding device provided in an embodiment of the present invention can be applied to the flexible display panels of uncut sheet,
Large stretch of flexible display panels are very easy to curling, and binding device provided in an embodiment of the present invention can be avoided greatly by locating rod
The flexible display panels of piece crimp.
In conclusion binding device provided in an embodiment of the present invention, positioning is drilled out by expansion bit on a display panel
The locating rod bound on platform is penetrated the positioning through hole later, avoids display panel from crimping, solve related skill by through-hole
In art when display panel is display panel flexible, the display panel on binding platform is easy to happen curling, curling
The problem of contraposition of display panel and chip is difficult to complete, then be difficult to be bound, having reached display panel will not roll up
Song, display panel are easy to be aligned with chip, are then easy to the effect bound.
Fig. 3 is a kind of flow chart of binding method provided in an embodiment of the present invention, which can be applied to Fig. 2-1
Shown in binding device, this method includes：
Step 301, the display panel being located on material loading platform is pushed by lower flattening bench.
Step 302, at least two are drilled out on a display panel by least two expansion bits being arranged on lower flattening bench
Positioning through hole.
Step 303, display panel is moved on binding platform, at least two locating rods bound on platform are each passed through
At least two positioning through hole.
Step 304, by aligning the contraposition of component progress display panel and chip and being bound.
In conclusion binding method provided in an embodiment of the present invention, positioning is drilled out by expansion bit on a display panel
The locating rod bound on platform is penetrated the positioning through hole later, avoids display panel from crimping, solve related skill by through-hole
In art when display panel is display panel flexible, the display panel on binding platform is easy to happen curling, curling
The problem of contraposition of display panel and chip is difficult to complete, then be difficult to be bound, having reached display panel will not roll up
Song, display panel are easy to be aligned with chip, are then easy to the effect bound.
Fig. 4-1 is the flow chart of another binding method provided in an embodiment of the present invention, which can be applied to
In binding device shown in Fig. 2-1, this method includes：
Step 401, the display panel being located on material loading platform is pushed by lower flattening bench.
When using binding method provided in an embodiment of the present invention, it can be pushed first by lower flattening bench flat positioned at feeding
Display panel on platform.Display panel can be made to tend to be smooth in this way, and prepared for follow-up drilling.
Optionally, lower flattening bench is rectangle, and the size of lower flattening bench is less than display panel, and lower flattening bench is pressed in display surface
When on plate, display panel can expose a part.
As shown in the Fig. 4-2, the schematic diagram of the display panel 20 positioned at material loading platform 14 is pressed in for lower flattening bench 13, L is
Display panel 20 is not pressed down the region of the covering of platform 13 and exposing.
It should be noted that when lower flattening bench is pressed on display panel, center and the display panel of pushing platform can be made
Center overlap.
Step 402, whether the part detection display panel exposed according to display panel is smooth.
It, can be according to the part of display panel exposing after lower flattening bench is pressed in the display panel on material loading platform
Whether smooth detect display panel.
, can whether smooth come really by observing the subregion L that display panel exposes in case of Fig. 4-2 is shown
Whether smooth determine display panel 20.
Step 403, when display panel is smooth, at least two are drilled out on a display panel by least two expansion bits
Positioning through hole.
When display panel is smooth, at least two positioning can be drilled out on a display panel by least two expansion bits
Through-hole.
When being drilled on a display panel by least two expansion bits, can be drilled out on the garbage area of display panel
At least two positioning through hole.Garbage area is that existing region, the region have no actual functional capability to display panel in the fabrication process, can
It can be cut out in the subsequent process, thus bore positioning through hole in garbage area and display panel can't be impacted.
Optionally, expansion bit can be 4, and 4 expansion bits are located at 4 corners of lower flattening bench, thus can
It is enough to drill out positioning through hole in 4 corners of display panel.The corner that positioning through hole is located at display panel can further avoid
Display panel crimps.
As shown in Fig. 4-3, is stretched out for expansion bit, drill out the schematic diagram of positioning through hole on a display panel, wherein on
It is provided with blind hole 141 corresponding with 131 position of expansion bit on lower flattening bench 13, the diameter of the blind hole 141 on material platform 14
More than the diameter of expansion bit 131, expansion bit 131 extends through display panel 20 and pierces blind hole 141,141 energy of blind hole
Enough facilitate expansion bit 131 when display panel 20 bores positioning through hole, can be drilled out from display panel 20, it is ensured that Neng Gou
Through-hole is drilled out on display panel 20.
When boring positioning through hole on a display panel by expansion bit, can be inhaled by the vacuum sucking holes on material loading platform
Attached firmly display panel, avoids display panel from being crimped in drilling, improves the accuracy of positioning through hole position.
In addition, in display panel out-of-flatness, it may lift up lower flattening bench and display panel be adjusted, execute later
Step 401.
After expansion bit 131 drills out positioning through hole on display panel 20, it can retract.
Step 404, display panel is moved to above binding platform.
Expansion bit can will be shown after display surface drills out positioning through hole on you by the moving assembly on lower flattening bench
Show that panel is fixed, and display panel is moved to above binding platform.
It is that display panel 20 is moved to the schematic diagram for binding 11 top of platform, on display panel 20 as shown in Fig. 4-4
In the presence of the positioning through hole 21 drilled out by expansion bit.The meaning that other in Fig. 4-4 mark can be no longer superfluous herein with reference chart 2-1
It states.
Step 405, at least two positioning through hole and at least two locating rods are aligned by imaging sensor.
It, can be by imaging sensor by least two positioning through hole after being moved to display panel above binding platform
It is aligned at least two locating rods.Imaging sensor is the important component for forming digital camera.According to element
Difference can be divided into CCD and CMOS two major classes.The process aligned by imaging sensor can refer to the relevant technologies, herein
It repeats no more.
Step 406, display panel is placed on binding platform, at least two locating rods bound on platform are each passed through
At least two positioning through hole.
It, can be accurately by display panel after the contraposition for completing at least two positioning through hole and at least two locating rods
It is placed on binding platform, and at least two locating rods bound on platform are each passed through at least two positioning through hole.
As illustrated in figures 4-5, it is that display panel 20 is determined on schematic diagram when binding on platform 11, binding platform 11
In the positioning through hole (not marked in Fig. 4-5) that position bar (not marked in Fig. 4-5) can just penetrate on display panel 20.At this point,
Display panel 20 is fixed by locating rod, will not be crimped.
It is tied up it should be noted that can also be adsorbed on display panel 20 by the vacuum sucking holes 111 on binding platform
On fixed platform, the planarization of display panel is further increased.
Step 407, by aligning the contraposition of component progress display panel and chip and being bound.
After being placed on display panel on binding platform, pair of display panel and chip can be carried out by aligning component
It is simultaneously bound position.Specifically, the fringe region of display panel can be provided with bound flag (English：Bonding mark),
The contraposition of display panel and chip can be completed by bound flag.Wherein, chip can be affixed on glass substrate
Chip (English：chip on glass；Referred to as：COG chip (the English) or in chip on film：chip on film；
Referred to as：COF).
Binding method provided in an embodiment of the present invention can be applied to binding flexible display panels.Flexible display panels can be with
It is OLED display panel.
In addition, binding method provided in an embodiment of the present invention can be applied to bind the Flexible Displays face of uncut sheet
Plate, large stretch of flexible display panels are very easy to curling, and binding method provided in an embodiment of the present invention can be kept away by locating rod
Exempt from large stretch of flexible display panels to crimp.In addition, binding speed can be accelerated by being bound to large stretch of flexible display panels
Degree improves binding efficiency.
In conclusion binding method provided in an embodiment of the present invention, positioning is drilled out by expansion bit on a display panel
The locating rod bound on platform is penetrated the positioning through hole later, avoids display panel from crimping, solve related skill by through-hole
In art when display panel is display panel flexible, the display panel on binding platform is easy to happen curling, curling
The problem of contraposition of display panel and chip is difficult to complete, then be difficult to be bound, having reached display panel will not roll up
Song, display panel are easy to be aligned with chip, are then easy to the effect bound.
Fig. 5 is the structural schematic diagram of another binding device provided in an embodiment of the present invention, which includes：
Align component 51, binding platform 52 and lower flattening bench 53.
At least two expansion bit 52a, at least two expansion bit 52a are provided on binding platform 52 in lower pressing
At least two positioning through hole are drilled out under the support of platform 53 on a display panel.
Contraposition component 51 is used to carry out the contraposition of display panel and chip.
Optionally, it binds on platform 52 and is provided with multiple vacuum sucking holes 521, which can be in binding platform
52 on a display panel bore positioning through hole when, adsorb display panel, avoid display panel drilling when crimp.
Optionally, it can be provided on lower flattening bench 53 corresponding blind with the positions expansion bit 52a bound on platform 52
Hole 531, the diameter of the blind hole 531 are more than the diameter of expansion bit 52a, for facilitating expansion bit 52a fixed in display surface twist drill
When the through-hole of position, it can be drilled out from display panel, it is ensured that through-hole can be drilled out on a display panel.
Expansion bit 52a can be punching press drill bit.
It can be imaging sensor to align component 51.Imaging sensor is the important component for forming digital camera.
According to the difference of element, CCD and CMOS two major classes can be divided into.
Optionally, it can be 4 to bind the expansion bit 52a on platform 52, and 4 expansion bit 52a and display panel
4 corner locations correspond to, i.e. this 4 expansion bit 52a can drill out 4 positioning through hole in 4 corners of display panel, will
4 corners of display panel are fixed, and display panel is avoided to crimp.
In conclusion binding device provided in an embodiment of the present invention, by binding the expansion bit on platform in display surface
Positioning through hole is drilled out on plate, and the positioning through hole is penetrated come fixed display panel by expansion bit, avoids display panel
Curling solves the display panel when display panel is display panel flexible, being located in the related technology on binding platform and holds
It easily crimps, the problem of contraposition of the display panel and chip of curling is difficult to complete, then be difficult to be bound, has reached aobvious
Show that panel will not crimp, display panel is easy to be aligned with chip, is then easy to the effect bound.
Fig. 6-1 is the flow chart of another binding method provided in an embodiment of the present invention, which can be used for Fig. 5
Shown in binding device, which includes：
Step 601, the display panel being located on binding platform is pushed by lower flattening bench.
When using binding method provided in an embodiment of the present invention, it can push to be located to bind by lower flattening bench first and put down
Display panel on platform makes the display panel on binding platform be in formation state, and coordinates expansion bit to display panel
It drills.
Step 602, at least two expansion bits stretched out on binding platform drill out at least two positioning on a display panel
Through-hole.
After pushing the display panel being located on binding platform by lower flattening bench, it can stretch out on binding platform extremely
Few two expansion bits drill out at least two positioning through hole on a display panel.
The vacuum sucking holes on platform are bound to adsorb display panel when expansion bit bores positioning through hole and avoid showing
Panel crimps.
As in fig. 6-2, be binding platform 52 at least two expansion bit 52a drilled out on display panel 60 to
The schematic diagram of few two positioning through hole, after expansion bit 52a drills out positioning through hole on display panel 60, can not withdraw, and tie up
The state for penetrating positioning through hole is held, with fixed display panel 60.Expansion bit 52a can drill out display when boring positioning through hole
Panel 60, and stretch into binding platform 52 on blind hole 531 some, to guarantee to drill out through-hole.
Step 603, lower flattening bench is removed.
After expansion bit drills out positioning through hole on a display panel, lower flattening bench can be removed, subsequently to prepare.
As shown in Fig. 6-3, after removing lower flattening bench, display panel 60 is located at the schematic diagram on binding platform 52,
Wherein, expansion bit 52a maintains the state for penetrating positioning through hole (Fig. 6-3 is not marked) to avoid showing with fixed display panel 60
Panel 60 crimps, and vacuum sucking holes 521 can adsorb display panel 60, further avoids display panel 60 and crimps.
Step 604, by aligning the contraposition of component progress display panel and chip and being bound.
After removing lower flattening bench, the contraposition of display panel and chip can be carried out by aligning component and tied up
Fixed, expansion bit has penetrated positioning through hole at this time, and display panel will not crimp, and can be relatively easy to complete display panel
With the contraposition and binding of chip.
In conclusion binding method provided in an embodiment of the present invention, by binding the expansion bit on platform in display surface
Positioning through hole is drilled out on plate, and the positioning through hole is penetrated come fixed display panel by expansion bit, avoids display panel
Curling solves the display panel when display panel is display panel flexible, being located in the related technology on binding platform and holds
It easily crimps, the problem of contraposition of the display panel and chip of curling is difficult to complete, then be difficult to be bound, has reached aobvious
Show that panel will not crimp, display panel is easy to be aligned with chip, is then easy to the effect bound.
In several embodiments provided herein, it should be understood that disclosed device and method can pass through it
Its mode is realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the unit, only
Only a kind of division of logic function, formula that in actual implementation, there may be another division manner, such as multiple units or component can be tied
Another system is closed or is desirably integrated into, or some features can be ignored or not executed.Another point, it is shown or discussed
Mutual coupling, direct-coupling or communication connection can be the INDIRECT COUPLING or logical by some interfaces, device or unit
Letter connection can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
One of ordinary skill in the art will appreciate that realizing that all or part of step of above-described embodiment can pass through hardware
It completes, relevant hardware can also be instructed to complete by program, the program can be stored in a kind of computer-readable
In storage medium, storage medium mentioned above can be read-only memory, disk or CD etc..
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (14)
1. a kind of binding device, which is characterized in that the binding device includes：
Bind platform, contraposition component, lower flattening bench and material loading platform；
Moving assembly and at least two expansion bits are provided on the lower flattening bench, at least two expansion bit is used for
Display panel is shown under the support of the material loading platform described after being pushed on the material loading platform by the lower flattening bench
Show and drill out at least two positioning through hole on panel, the moving assembly is for moving the display panel；
At least two locating rod corresponding with the expansion bit position is provided on the binding platform, described at least two is fixed
Position bar can be each passed through at least two positioning through hole；
The contraposition component is used to carry out the contraposition of the display panel and chip.
2. binding device according to claim 1, which is characterized in that the shape of the lower flattening bench and the display panel
It is identical, and the size of the lower flattening bench is less than the display panel.
3. binding device according to claim 2, which is characterized in that the expansion bit is 4, and 4 described flexible
Drill bit is located at 4 corners of the lower flattening bench.
4. binding device according to claim 1, which is characterized in that the moving assembly includes multiple vacuum sucking holes.
5. binding device according to claim 1, which is characterized in that the diameter of the locating rod is less than or equal to described stretch
The diameter of contracting drill bit.
6. binding device according to claim 1, which is characterized in that be provided with multiple vacuum on the binding platform and inhale
Hole.
7. binding device according to claim 1, which is characterized in that the contraposition component is imaging sensor.
8. binding device according to any one of claims 1 to 7, which is characterized in that at least two expansion bit is used for
At least two positioning through hole are drilled out on the garbage area of the display panel under the support of the material loading platform.
9. a kind of binding method, which is characterized in that the method includes：
The display panel being located on material loading platform is pushed by lower flattening bench；
At least two positioning are drilled out on said display panel by least two expansion bits being arranged on the lower flattening bench
Through-hole；
The display panel is moved on binding platform, at least two locating rods on the binding platform are each passed through described
At least two positioning through hole；
The contraposition of the display panel and chip is carried out by contraposition component and is bound.
10. according to the method described in claim 9, it is characterized in that, the lower flattening bench is rectangle, and the lower flattening bench
Size is less than the display panel,
It is described to drill out at least two positioning through hole on said display panel by least two expansion bits, including：
It is whether smooth that the display panel is detected according to the part that the display panel exposes；
When the display panel is smooth, by least two expansion bit drill out on said display panel it is described at least
Two positioning through hole.
11. according to the method described in claim 9, it is characterized in that, it is described by the display panel be moved to binding platform on,
Including：
The display panel is moved to above the binding platform；
At least two positioning through hole and at least two locating rod are aligned by imaging sensor；
The display panel is placed on the binding platform, at least two locating rods on the binding platform are each passed through
At least two positioning through hole.
12. according to any method of claim 9 to 11, which is characterized in that described by being arranged on the lower flattening bench
At least two expansion bits drill out at least two positioning through hole on said display panel, including：
It is drilled out at least on the garbage area of the display panel by least two expansion bits being arranged on the lower flattening bench
Two positioning through hole.
13. a kind of binding device, which is characterized in that the binding device includes：
Align component, binding platform and lower flattening bench；
At least two expansion bits are provided on the binding platform, at least two expansion bit is used in display panel quilt
The lower flattening bench bores after pushing on the binding platform under the support of the lower flattening bench on said display panel
Go out at least two positioning through hole；
The contraposition component is used to carry out the contraposition of the display panel and chip.
14. a kind of binding method, which is characterized in that the method includes：
The display panel being located on binding platform is pushed by lower flattening bench；
At least two expansion bits stretched out on the binding platform drill out at least two positioning through hole on said display panel；
Remove the lower flattening bench；
The contraposition of the display panel and chip is carried out by contraposition component and is bound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279986.XA CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279986.XA CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105741690A CN105741690A (en) | 2016-07-06 |
| CN105741690B true CN105741690B (en) | 2018-09-14 |
Family
ID=56287685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610279986.XA Expired - Fee Related CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105741690B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1987558A (en) * | 2006-07-24 | 2007-06-27 | 友达光电股份有限公司 | Method for combining display panel and back light module |
| CN102378568A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board fixing clamp |
| CN203851371U (en) * | 2014-05-12 | 2014-09-24 | 洛阳伟信电子科技有限公司 | Flexible circuit board clamp |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3942025B2 (en) * | 2002-12-09 | 2007-07-11 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
-
2016
- 2016-04-28 CN CN201610279986.XA patent/CN105741690B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1987558A (en) * | 2006-07-24 | 2007-06-27 | 友达光电股份有限公司 | Method for combining display panel and back light module |
| CN102378568A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board fixing clamp |
| CN203851371U (en) * | 2014-05-12 | 2014-09-24 | 洛阳伟信电子科技有限公司 | Flexible circuit board clamp |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105741690A (en) | 2016-07-06 |
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