CN105741690A - Binding device and method - Google Patents
Binding device and method Download PDFInfo
- Publication number
- CN105741690A CN105741690A CN201610279986.XA CN201610279986A CN105741690A CN 105741690 A CN105741690 A CN 105741690A CN 201610279986 A CN201610279986 A CN 201610279986A CN 105741690 A CN105741690 A CN 105741690A
- Authority
- CN
- China
- Prior art keywords
- display floater
- binding
- positioning
- hole
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a binding device and method and belongs to the technical field of display. The binding device comprises a binding platform, an alignment assembly, a pressing-down platform and a feeding platform, wherein the pressing-down platform is provided with a movable assembly and at least two retractable drill bits; the binding platform is provided with at least two positioning rods corresponding to the positions of the retractable drill bits; the at least two positioning rods can penetrate through at least two positioning through holes respectively; the alignment assembly is used for aligning a display panel and a chip. The positioning through holes are drilled in the display panel through the retractable drill bits and then the positioning rods on the binding platform penetrate into the positioning through holes, so that the display panel is prevented from crimping, and the problems in a related technology that the display panel located on the binding platform is easily crimped, and the crimped display panel and the chip are difficult to align and are difficult to bind are solved; the effects that the display panel is not crimped, and the crimped display panel and the chip are easy to align and are easy to bind are realized.
Description
Technical field
The present invention relates to Display Technique field, particularly to a kind of binding device and method.
Background technology
Binding is (English: bonding) to typically refer to the technique being combined by display floater with chip.
Correlation technique has a kind of binding device, it is (English: loadstage) that this device includes material loading platform, binding platform is (English: bondingstage), imageing sensor and moving assembly, material loading platform is placed with display floater (the big display floater that this display floater can be made up of uncut multiple single display floaters, can also be the single display floater after cutting), by moving assembly, display floater is moved to binding platform, then on binding platform, display floater is adjusted, display floater is made to arrive predeterminated position, complete the para-position between display floater and binding platform, the para-position of panel and chip can be displayed afterwards by imageing sensor, finally bind.
In the process realizing the present invention, inventor have found that prior art at least there is problems in that when the display floater that display floater is flexibility, the display floater being positioned on binding platform is susceptible to curling, and the para-position of curling display floater and chip has been difficult to, and is then difficult to binding.
Summary of the invention
In order to solve in prior art when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, the problem being then difficult to binding, embodiments provides a kind of binding device and method.Described technical scheme is as follows:
According to the first aspect of the invention, it is provided that a kind of binding device, described binding device includes:
Binding platform, para-position assembly, lower flattening bench and material loading platform；
Being provided with moving assembly and at least two expansion bit on described lower flattening bench, described at least two expansion bit for getting out at least two positioning through hole on a display panel under the support of described material loading platform, and described moving assembly is used for moving described display floater；
Being provided with at least two location bar corresponding with described expansion bit position on described binding platform, described at least two location bar can be each passed through described at least two positioning through hole；
Described para-position assembly is for carrying out the para-position of described display floater and chip.
Alternatively, the shape of described lower flattening bench is identical with described display floater, and described lower flattening bench be smaller in size than described display floater.
Alternatively, described expansion bit is 4, and 4 described expansion bits lay respectively at 4 corners of described lower flattening bench.
Alternatively, described moving assembly includes multiple vacuum sucking holes.
Alternatively, the diameter of described location bar is less than or equal to the diameter of described expansion bit.
Alternatively, described binding platform is provided with multiple vacuum sucking holes.
Alternatively, described para-position assembly is imageing sensor.
Alternatively, described at least two expansion bit for getting out at least two positioning through hole under the support of described material loading platform on the garbage area of described display floater.
According to the second aspect of the invention, it is provided that a kind of binding method, described method includes:
The display floater being positioned at material loading platform is pressed down by lower flattening bench；
At least two positioning through hole is got out on said display panel by least two expansion bit arranged on described lower flattening bench；
Being moved by described display floater to binding platform, at least two location bar on described binding platform is each passed through described at least two positioning through hole；
Carry out the para-position of described display floater and chip by para-position assembly and bind.
Alternatively, described lower flattening bench is rectangle, and described lower flattening bench be smaller in size than described display floater,
Described get out at least two positioning through hole on said display panel by least two expansion bit, including:
Whether smooth according to the part described display floater of detection that described display floater exposes；
When described display floater is smooth, get out described at least two positioning through hole on said display panel by described at least two expansion bit.
Alternatively, described described display floater is moved to binding platform on, including:
Described display floater is moved above described binding platform；
By imageing sensor, described at least two positioning through hole is carried out para-position with described at least two location bar；
Being placed on by described display floater on described binding platform, at least two location bar on described binding platform is each passed through described at least two positioning through hole.
Alternatively, the described at least two expansion bit by arranging on described lower flattening bench gets out at least two positioning through hole on said display panel, including:
On the garbage area of described display floater, at least two positioning through hole is got out by least two expansion bit arranged on described lower flattening bench.
According to the third aspect of the invention we, it is provided that a kind of binding device, described binding device includes:
Para-position assembly, binding platform and lower flattening bench；
Being provided with at least two expansion bit on described binding platform, described at least two expansion bit for getting out at least two positioning through hole on said display panel under the support of described lower flattening bench；
Described para-position assembly is for carrying out the para-position of described display floater and chip.
According to the fourth aspect of the invention, it is provided that a kind of binding method, described method includes:
The display floater being positioned at binding platform is pressed down by lower flattening bench；
At least two expansion bit stretched out on described binding platform gets out at least two positioning through hole on said display panel；
Remove described lower flattening bench；
Carry out the para-position of described display floater and chip by described para-position assembly and bind.
The technical scheme that the embodiment of the present invention provides has the benefit that
Positioning through hole is got out on a display panel by expansion bit, afterwards the location bar on binding platform is penetrated this positioning through hole, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, are then prone to the effect carrying out binding.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of binding device that the invention process exemplifies；
Fig. 2-1 is the structural representation of the another kind of binding device that the invention process exemplifies；
Fig. 2-2 is that in binding device shown in Fig. 2-1, lower flattening bench is pressed in the schematic diagram on the display floater being positioned on material loading platform；
Fig. 2-3 is the rearview of lower flattening bench shown in Fig. 2-2；
Fig. 3 is the flow chart of a kind of binding method that the embodiment of the present invention provides；
Fig. 4-1 is the flow chart of the another kind of binding method that the embodiment of the present invention provides；
Fig. 4-2 is lower flattening bench pressure schematic diagram on a display panel in Fig. 4-1 illustrated embodiment；
Fig. 4-3 is the schematic diagram that in Fig. 4-1 illustrated embodiment, expansion bit gets out positioning through hole on a display panel；
Fig. 4-4 is the schematic diagram moved by display floater in Fig. 4-1 illustrated embodiment above binding platform；
Schematic diagram when Fig. 4-5 is that in Fig. 4-1 illustrated embodiment, display floater is positioned on binding platform；
Fig. 5 is the structural representation of the another kind of binding device that the embodiment of the present invention provides；
Fig. 6-1 is the flow chart of the another kind of binding method that the embodiment of the present invention provides；
Fig. 6-2 is the schematic diagram that in Fig. 6-1 illustrated embodiment, expansion bit bores positioning through hole on a display panel；
Fig. 6-3 is the schematic diagram after removing lower flattening bench in Fig. 6-1 illustrated embodiment.
In each accompanying drawing above-mentioned, the implication of accompanying drawing labelling can be: 11-binds platform, 12-para-position assembly, flattening bench under 13-, 14-material loading platform, 132-moving assembly, 131-expansion bit, 111-positions bar, vacuum sucking holes on 132a-moving assembly, 11a-binds the vacuum sucking holes on platform, 20-display floater, the region that L-display floater exposes, 141-blind hole, 21-positioning through hole, 51-para-position assembly, 52-binds platform, flattening bench under 53-, 52a-expansion bit, 521-vacuum sucking holes, 531-blind hole, 60-display floater.
By above-mentioned accompanying drawing, it has been shown that the embodiment that the present invention is clear and definite, will there is more detailed description hereinafter.These accompanying drawings and word are described and are not intended to be limited by any mode the scope of present inventive concept, but by idea of the invention being described with reference to specific embodiment for those skilled in the art.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
In correlation technique when display floater is bound, carry out again after usually large stretch of display floater is cut into the display floater of small pieces, and the display floater in each embodiment of the present invention can be the display floater of small pieces, it is also possible to be the display floater of uncut sheet.
Fig. 1 is the structural representation of a kind of binding device that the invention process exemplifies.This binding device may include that
Binding platform 11, para-position assembly 12, lower flattening bench 13 and material loading platform 14.
Lower flattening bench 13 is provided with moving assembly 132 and at least two expansion bit 131, at least two expansion bit 131 for getting out at least two positioning through hole under the support of material loading platform 14 in display floater (not shown in figure 1), and moving assembly 132 is for mobile display panel.
Being provided with at least two location bar 111 corresponding with expansion bit 131 position on binding platform 11, at least two location bar 111 can be each passed through at least two positioning through hole on display floater.
Para-position assembly 12 is for displaying the para-position of panel and chip.
Position relationship between the assemblies such as binding platform 11, para-position assembly 12, lower flattening bench 13 and material loading platform 14 is not made restriction by Fig. 1.
In sum, the binding device that the embodiment of the present invention provides, positioning through hole is got out on a display panel by expansion bit, afterwards the location bar on binding platform is penetrated this positioning through hole, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
Further, refer to Fig. 2-1, it illustrates the structural representation of the another kind of binding device that the embodiment of the present invention provides, this binding device adds preferred parts on the basis of the binding device shown in Fig. 1, so that the binding device that the embodiment of the present invention provides has better performance.
Alternatively, moving assembly 132 includes multiple vacuum sucking holes 132a.Moving assembly 132 can adsorb display floater mobile display panel by vacuum sucking holes 132a.Additionally, this moving assembly 132 can also lower flattening bench pressure on a display panel time, adsorb display floater, it is to avoid when expansion bit is holed on a display panel, display floater occur curling.
Alternatively, binding platform 11 is provided with multiple vacuum sucking holes 11a.Vacuum sucking holes 11a on binding platform 11 can adsorb display floater, improves display floater planarization on binding platform 11.
Alternatively, the shape of lower flattening bench 13 is identical with display floater, and lower flattening bench 13 be smaller in size than display floater.Display floater is generally rectangular, the size of lower flattening bench 13 can less than display floater, when so descending flattening bench 13 to press on a display panel, display floater can expose a part, can judge that whether the display floater being pressed under lower flattening bench 13 is smooth by this part exposed, and when display floater is smooth, then hole, to ensure the accuracy of positioning through hole position.The lower flattening bench of suitable dimension can be selected according to the size of display floater carrying out binding.
As shown in Fig. 2-2, it is the schematic diagram that lower flattening bench 13 is pressed on the display floater 20 being positioned on material loading platform 14, and display floater 20 has the region L exposed not being pressed down platform covering.
It should be noted that lower flattening bench pressure on a display panel time, it is possible to make the center of lower flattening bench and the center superposition of display floater.
Alternatively, as Figure 2-3, it is the rearview of the lower flattening bench shown in Fig. 2-2, and in Fig. 2-3, expansion bit 131 is 4, and 4 expansion bits 131 lay respectively at 4 corners of lower flattening bench 13.4 expansion bits 131 just can get out 4 positioning through hole in 4 corners of display floater, and positioning through hole is positioned at the corner of display floater and can further avoid display floater generation curling.Not shown moving assembly in Fig. 2-3.
Expansion bit 131 can be punching press drill bit.
As shown in Fig. 2-1, the diameter of location bar 111 is less than or equal to the diameter of expansion bit 131.So can conveniently position bar 111 and penetrate the positioning through hole that expansion bit 131 gets out on a display panel.
Alternatively, para-position assembly 12 is imageing sensor.Imageing sensor is the important component part of composition digital camera.Difference according to element, can be divided into charge coupled cell (English: ChargeCoupledDevice；It is called for short: CCD), and metal oxide semiconductor device is (English: ComplementaryMetal-OxideSemiconductor；It is called for short: CMOS) two big class.
Alternatively, at least two expansion bit 131 for getting out at least two positioning through hole under the support of material loading platform 14 on the garbage area of display floater.Wherein, garbage area is the region that display floater exists in the fabrication process, and this region there is no actual functional capability, it is possible to is cut out in subsequent technique, thus bores positioning through hole at garbage area and can't display floater be impacted.
Optionally, material loading platform 14 can be provided with the blind hole 141 corresponding with expansion bit 131 position on lower flattening bench 13, the diameter of this blind hole 141 is more than the diameter of expansion bit 131, for facilitating expansion bit 131 when display surface twist drill positioning through hole, can get out from display floater, it is ensured that through hole can be got out on a display panel.
The binding device that the embodiment of the present invention provides can apply to flexible display panels.Flexible display panels can be that Organic Light Emitting Diode is (English: OrganicLight-EmittingDiode；It is called for short: OLED) display floater.
In addition, the binding device that the embodiment of the present invention provides can apply to the flexible display panels of uncut sheet, large stretch of flexible display panels is very easy to curling, and the binding device that the embodiment of the present invention provides can avoid the flexible display panels of sheet to occur curling by positioning bar.
In sum, the binding device that the embodiment of the present invention provides, positioning through hole is got out on a display panel by expansion bit, afterwards the location bar on binding platform is penetrated this positioning through hole, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
Fig. 3 is the flow chart of a kind of binding method that the embodiment of the present invention provides, and this binding method can be applied in the binding device shown in Fig. 2-1, and the method includes:
Step 301, presses down the display floater being positioned at material loading platform by lower flattening bench.
Step 302, gets out at least two positioning through hole on a display panel by least two expansion bit arranged on lower flattening bench.
Step 303, moves display floater to binding platform, and at least two location bar on binding platform is each passed through at least two positioning through hole.
Step 304, displays the para-position of panel and chip by para-position assembly and binds.
In sum, the binding method that the embodiment of the present invention provides, positioning through hole is got out on a display panel by expansion bit, afterwards the location bar on binding platform is penetrated this positioning through hole, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
Fig. 4-1 is the flow chart of the another kind of binding method that the embodiment of the present invention provides, and this binding method can be applied in the binding device shown in Fig. 2-1, and the method includes:
Step 401, presses down the display floater being positioned at material loading platform by lower flattening bench.
When the binding method using the embodiment of the present invention to provide, first can pass through lower flattening bench and press down the display floater being positioned at material loading platform.Display floater so can be made to tend to smooth, and prepare for follow-up boring.
Optionally, lower flattening bench is rectangle, and lower flattening bench be smaller in size than display floater, lower flattening bench pressure on a display panel time, display floater can expose a part.
As shown in the Fig. 4-2, it is the schematic diagram that lower flattening bench 13 is pressed in the display floater 20 being positioned at material loading platform 14, and L is that display floater 20 is not pressed down platform 13 and covers the region exposed.
It should be noted that lower flattening bench pressure on a display panel time, it is possible to make the center of lower flattening bench and the center superposition of display floater.
Step 402, whether smooth according to the part detection display floater that display floater exposes.
After being pressed in, at lower flattening bench, the display floater being positioned at material loading platform, it is possible to whether smooth according to the part detection display floater that display floater exposes.
For Fig. 4-2 situation about illustrating, it is possible to by observing, whether the subregion L that exposes of display floater is smooth determines that whether display floater 20 is smooth.
Step 403, when display floater is smooth, gets out at least two positioning through hole on a display panel by least two expansion bit.
When display floater is smooth, it is possible to get out at least two positioning through hole on a display panel by least two expansion bit.
When being holed on a display panel by least two expansion bit, it is possible to get out at least two positioning through hole on the garbage area of display floater.Garbage area is the region that display floater exists in the fabrication process, and this region there is no actual functional capability, it is possible to is cut out in subsequent technique, thus bores positioning through hole at garbage area and can't display floater be impacted.
Optionally, expansion bit can be 4, and 4 expansion bits are positioned at 4 corners of lower flattening bench, this makes it possible to get out positioning through hole in 4 corners of display floater.Positioning through hole is positioned at the corner of display floater and can further avoid display floater generation curling.
As shown in Fig. 4-3, it stretches out for expansion bit, get out the schematic diagram of positioning through hole on a display panel, wherein, material loading platform 14 is provided with the blind hole 141 corresponding with expansion bit 131 position on lower flattening bench 13, the diameter of this blind hole 141 is more than the diameter of expansion bit 131, expansion bit 131 extends through display floater 20 and pierces blind hole 141, this blind hole 141 can facilitate expansion bit 131 when display floater 20 bores positioning through hole, can get out from display floater 20, it is ensured that through hole can be got out on display floater 20.
When boring positioning through hole on a display panel by expansion bit, it is possible to adsorb display floater by the vacuum sucking holes on material loading platform, it is to avoid display floater occurs curling when boring, improves the accuracy of positioning through hole position.
Additionally, when display floater out-of-flatness, it is possible to above put flattening bench and display floater is adjusted, performing step 401 afterwards.
After expansion bit 131 gets out positioning through hole on display floater 20, it is possible to retract.
Step 404, moves display floater above binding platform.
Expansion bit is after display surface gets out positioning through hole on you, it is possible to fixed by display floater by the moving assembly on lower flattening bench, and is moved by display floater above binding platform.
As shown in Fig. 4-4, it is the schematic diagram moved by display floater 20 above binding platform 11, and display floater 20 exists the positioning through hole 21 got out by expansion bit.In Fig. 4-4, the implication of other labellings is referred to Fig. 2-1, does not repeat them here.
Step 405, carries out para-position by least two positioning through hole with at least two location bar by imageing sensor.
Display floater is being moved to binding after above platform, it is possible to by imageing sensor, at least two positioning through hole is carried out para-position with at least two location bar.Imageing sensor is the important component part of composition digital camera.Difference according to element, can be divided into the big class of CCD and CMOS two.The process being carried out para-position by imageing sensor is referred to correlation technique, does not repeat them here.
Step 406, is placed on binding platform by display floater, and at least two location bar on binding platform is each passed through at least two positioning through hole.
After completing at least two positioning through hole and the para-position of at least two location bar, it is possible to accurate being placed on by display floater is bound on platform, and at least two location bar on binding platform is each passed through at least two positioning through hole.
As illustrated in figures 4-5, it is the schematic diagram that display floater 20 is positioned at when binding on platform 11, and the location bar (not marking in Fig. 4-5) on binding platform 11 can just penetrate in the positioning through hole (not marking in Fig. 4-5) on display floater 20.Now, display floater 20 is positioned bar and fixes, and will not occur curling.
It should be noted that can also be adsorbed on binding platform by display floater 20 by the vacuum sucking holes 111 on binding platform, improve the planarization of display floater further.
Step 407, displays the para-position of panel and chip by para-position assembly and binds.
After display floater being placed on binding platform, it is possible to display the para-position of panel and chip by para-position assembly and bind.Concrete, it is (English: Bondingmark), it is possible to completed the para-position of display floater and chip by bound flag that the marginal area of display floater can be provided with bound flag.Wherein, the chip that chip can be affixed on glass substrate is (English: chiponglass；COG) or to be positioned at chip in chip on film (English: chiponfilm it is called for short:；It is called for short: COF).
The binding method that the embodiment of the present invention provides can apply to binding flexible display panels.Flexible display panels can be OLED display panel.
In addition, the binding method that the embodiment of the present invention provides can apply to bind the flexible display panels of uncut sheet, large stretch of flexible display panels is very easy to curling, and the binding method that the embodiment of the present invention provides can avoid the flexible display panels of sheet to occur curling by positioning bar.Additionally, large stretch of flexible display panels is carried out binding can accelerate binding speed, improve binding efficiency.
In sum, the binding method that the embodiment of the present invention provides, positioning through hole is got out on a display panel by expansion bit, afterwards the location bar on binding platform is penetrated this positioning through hole, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
Fig. 5 is the structural representation of the another kind of binding device that the embodiment of the present invention provides, and this binding device includes:
Para-position assembly 51, binding platform 52 and lower flattening bench 53.
Binding platform 52 is provided with at least two expansion bit 52a, at least two expansion bit 52a for getting out at least two positioning through hole on a display panel under the support of lower flattening bench 53.
Para-position assembly 51 is for displaying the para-position of panel and chip.
Optionally, binding platform 52 being provided with multiple vacuum sucking holes 521, this vacuum sucking holes 521 when binding platform 52 and boring positioning through hole on a display panel, can adsorb display floater, it is to avoid display floater occurs curling when boring.
Optionally, the blind hole 531 that the expansion bit 52a position that can be provided with on lower flattening bench 53 and bind on platform 52 is corresponding, the diameter of this blind hole 531 diameter more than expansion bit 52a, for facilitating expansion bit 52a when display surface twist drill positioning through hole, can get out from display floater, it is ensured that through hole can be got out on a display panel.
Expansion bit 52a can be punching press drill bit.
Para-position assembly 51 can be imageing sensor.Imageing sensor is the important component part of composition digital camera.Difference according to element, can be divided into the big class of CCD and CMOS two.
Optionally, expansion bit 52a on binding platform 52 can be 4, and 4 expansion bit 52a are corresponding with the 4 of display floater corner location, namely these 4 expansion bit 52a can get out 4 positioning through hole in corner, the 4 of display floater, the 4 of display floater corners are fixed, it is to avoid display floater occurs curling.
In sum, the binding device that the embodiment of the present invention provides, positioning through hole is got out on a display panel by binding the expansion bit on platform, and penetrate this positioning through hole by expansion bit and fix display floater, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
Fig. 6-1 is the flow chart of the another kind of binding method that the embodiment of the present invention provides, and this binding method may be used in the binding device shown in Fig. 5, and this binding method includes:
Step 601, presses down the display floater being positioned at binding platform by lower flattening bench.
When the binding method using the embodiment of the present invention to provide, first can pass through lower flattening bench and press down the display floater being positioned at binding platform, make the display floater on binding platform be in formation state, and coordinate expansion bit that display floater is holed.
Step 602, at least two expansion bit stretched out on binding platform gets out at least two positioning through hole on a display panel.
After pressure is positioned at the display floater of binding platform under by lower flattening bench, it is possible at least two expansion bit stretched out on binding platform gets out at least two positioning through hole on a display panel.
Vacuum sucking holes on binding platform when expansion bit bores positioning through hole, can adsorb display floater and avoid display floater generation curling.
As in fig. 6-2, it gets out the schematic diagram of at least two positioning through hole at least two expansion bit 52a on binding platform 52 on display floater 60, after expansion bit 52a gets out positioning through hole on display floater 60, can not regain, maintain the state penetrating positioning through hole, with fixed display panel 60.Expansion bit 52a is when boring positioning through hole, it is possible to get out display floater 60, and stretch into the blind hole 531 on binding platform 52 some, to guarantee to get out through hole.
Step 603, removes lower flattening bench.
After expansion bit gets out positioning through hole on a display panel, it is possible to lower flattening bench is removed, prepare for follow-up.
As shown in Fig. 6-3, it is for after removing lower flattening bench, display floater 60 is positioned at the schematic diagram on binding platform 52, wherein, expansion bit 52a maintains the state penetrating positioning through hole (Fig. 6-3 does not mark), with fixed display panel 60, it is to avoid display floater 60 occurs curling, vacuum sucking holes 521 can adsorb display floater 60, avoids display floater 60 to occur further curling.
Step 604, displays the para-position of panel and chip by para-position assembly and binds.
After removing lower flattening bench, the para-position of panel and chip can be displayed by para-position assembly and bind, now expansion bit has penetrated positioning through hole, and display floater will not occur curling, it is possible to be relatively easy to para-position and the binding of display floater and chip.
In sum, the binding method that the embodiment of the present invention provides, positioning through hole is got out on a display panel by binding the expansion bit on platform, and penetrate this positioning through hole by expansion bit and fix display floater, display floater is avoided to occur curling, solve in correlation technique when display floater is flexible display floater, the display floater being positioned on binding platform is susceptible to curling, the para-position of curling display floater and chip has been difficult to, then the problem being difficult to binding, reach display floater and will not occur curling, display floater and chip easily carry out para-position, then the effect carrying out binding it is prone to.
In several embodiments provided herein, it should be understood that disclosed apparatus and method, it is possible to realize by another way.Such as, device embodiment described above is merely schematic, such as, the division of described unit, being only a kind of logic function to divide, actual can have other dividing mode when realizing, for instance multiple unit or assembly can in conjunction with or be desirably integrated into another system, or some features can ignore, or do not perform.Another point, shown or discussed coupling each other or direct-coupling or communication connection can be through INDIRECT COUPLING or the communication connection of some interfaces, device or unit, it is possible to be electrical, machinery or other form.
The described unit illustrated as separating component can be or may not be physically separate, and the parts shown as unit can be or may not be physical location, namely may be located at a place, or can also be distributed on multiple NE.Some or all of unit therein can be selected according to the actual needs to realize the purpose of the present embodiment scheme.
One of ordinary skill in the art will appreciate that all or part of step realizing above-described embodiment can be completed by hardware, can also be completed by the hardware that program carrys out instruction relevant, described program can be stored in a kind of computer-readable recording medium, storage medium mentioned above can be read only memory, disk or CD etc..
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (14)
1. a binding device, it is characterised in that described binding device includes:
Binding platform, para-position assembly, lower flattening bench and material loading platform；
Being provided with moving assembly and at least two expansion bit on described lower flattening bench, described at least two expansion bit for getting out at least two positioning through hole on a display panel under the support of described material loading platform, and described moving assembly is used for moving described display floater；
Being provided with at least two location bar corresponding with described expansion bit position on described binding platform, described at least two location bar can be each passed through described at least two positioning through hole；
Described para-position assembly is for carrying out the para-position of described display floater and chip.
2. binding device according to claim 1, it is characterised in that the shape of described lower flattening bench is identical with described display floater, and described lower flattening bench be smaller in size than described display floater.
3. binding device according to claim 2, it is characterised in that described expansion bit is 4, and 4 described expansion bits lay respectively at 4 corners of described lower flattening bench.
4. binding device according to claim 1, it is characterised in that described moving assembly includes multiple vacuum sucking holes.
5. binding device according to claim 1, it is characterised in that the diameter of described location bar is less than or equal to the diameter of described expansion bit.
6. binding device according to claim 1, it is characterised in that be provided with multiple vacuum sucking holes on described binding platform.
7. binding device according to claim 1, it is characterised in that described para-position assembly is imageing sensor.
8. according to the arbitrary described binding device of claim 1 to 7, it is characterised in that described at least two expansion bit for getting out at least two positioning through hole under the support of described material loading platform on the garbage area of described display floater.
9. a binding method, it is characterised in that described method includes:
The display floater being positioned at material loading platform is pressed down by lower flattening bench；
At least two positioning through hole is got out on said display panel by least two expansion bit arranged on described lower flattening bench；
Being moved by described display floater to binding platform, at least two location bar on described binding platform is each passed through described at least two positioning through hole；
Carry out the para-position of described display floater and chip by para-position assembly and bind.
10. method according to claim 9, it is characterised in that described lower flattening bench is rectangle, and described lower flattening bench be smaller in size than described display floater,
Described get out at least two positioning through hole on said display panel by least two expansion bit, including:
Whether smooth according to the part described display floater of detection that described display floater exposes；
When described display floater is smooth, get out described at least two positioning through hole on said display panel by described at least two expansion bit.
11. method according to claim 9, it is characterised in that described described display floater is moved to binding platform on, including:
Described display floater is moved above described binding platform；
By imageing sensor, described at least two positioning through hole is carried out para-position with described at least two location bar；
Being placed on by described display floater on described binding platform, at least two location bar on described binding platform is each passed through described at least two positioning through hole.
12. according to the arbitrary described method of claim 9 to 11, it is characterised in that the described at least two expansion bit by arranging on described lower flattening bench gets out at least two positioning through hole on said display panel, including:
On the garbage area of described display floater, at least two positioning through hole is got out by least two expansion bit arranged on described lower flattening bench.
13. a binding device, it is characterised in that described binding device includes:
Para-position assembly, binding platform and lower flattening bench；
Being provided with at least two expansion bit on described binding platform, described at least two expansion bit for getting out at least two positioning through hole on said display panel under the support of described lower flattening bench；
Described para-position assembly is for carrying out the para-position of described display floater and chip.
14. a binding method, it is characterised in that described method includes:
The display floater being positioned at binding platform is pressed down by lower flattening bench；
At least two expansion bit stretched out on described binding platform gets out at least two positioning through hole on said display panel；
Remove described lower flattening bench；
Carry out the para-position of described display floater and chip by described para-position assembly and bind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279986.XA CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279986.XA CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105741690A true CN105741690A (en) | 2016-07-06 |
| CN105741690B CN105741690B (en) | 2018-09-14 |
Family
ID=56287685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610279986.XA Expired - Fee Related CN105741690B (en) | 2016-04-28 | 2016-04-28 | binding device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105741690B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004193194A (en) * | 2002-12-09 | 2004-07-08 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| CN1987558A (en) * | 2006-07-24 | 2007-06-27 | 友达光电股份有限公司 | Method for combining display panel and back light module |
| CN102378568A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board fixing clamp |
| CN203851371U (en) * | 2014-05-12 | 2014-09-24 | 洛阳伟信电子科技有限公司 | Flexible circuit board clamp |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
-
2016
- 2016-04-28 CN CN201610279986.XA patent/CN105741690B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004193194A (en) * | 2002-12-09 | 2004-07-08 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| CN1987558A (en) * | 2006-07-24 | 2007-06-27 | 友达光电股份有限公司 | Method for combining display panel and back light module |
| CN102378568A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board fixing clamp |
| CN203851371U (en) * | 2014-05-12 | 2014-09-24 | 洛阳伟信电子科技有限公司 | Flexible circuit board clamp |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105741690B (en) | 2018-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105762280A (en) | Flexible display panel separating method and device | |
| US9741952B2 (en) | Display device and method of manufacturing the same | |
| CN105044956B (en) | The preparation method of display panel, binding cutter device | |
| EP3712228A1 (en) | Display device and manufacturing method thereof | |
| CN105469710B (en) | Panel includes the display equipment and its manufacturing method of the panel | |
| US9570693B2 (en) | Display device and method of manufacturing the same | |
| CN103979359B (en) | A kind of equipment for coating film and film covering method | |
| JP2016203257A (en) | Substrate cutting method and display manufacturing method | |
| US9393769B2 (en) | Flexible display panel peeling apparatus and peeling method using the same | |
| CN106292004B (en) | The binding device and binding method of chip on film and display panel | |
| CN107422895A (en) | The manufacture method of GFF structure touch-screens | |
| CN207481371U (en) | A kind of location type TPU protective films | |
| CN206260135U (en) | A kind of pcb board with bad panel sign | |
| CN105741690A (en) | Binding device and method | |
| CN101969747A (en) | Hinge clamp positioning method for printed board processing | |
| CN105864665A (en) | Soft substrate lamp tube sticking machine | |
| CN110426903A (en) | Display panel, the production method of display panel and display terminal | |
| CN203434131U (en) | Chip positioning module | |
| CN105035398A (en) | Movable film pressing mechanism of film attachment machine | |
| CN202491505U (en) | Pressing machine | |
| CN202799406U (en) | Printed circuit board with multiple positioning systems | |
| CN107340691A (en) | A kind of method of raising LDI exposure machine exposure efficiencies | |
| CN105856799B (en) | A kind of flexible membrane layer separation method | |
| CN101782725A (en) | Printed circuit board positioning exposure device and positioning exposure method | |
| TWI630382B (en) | Optical inspection method for a display cell of a thin film structure and false terminal unit for use with the method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |