CN105720313A - 能够进行nfc通信的电子装置 - Google Patents
能够进行nfc通信的电子装置 Download PDFInfo
- Publication number
- CN105720313A CN105720313A CN201510958737.9A CN201510958737A CN105720313A CN 105720313 A CN105720313 A CN 105720313A CN 201510958737 A CN201510958737 A CN 201510958737A CN 105720313 A CN105720313 A CN 105720313A
- Authority
- CN
- China
- Prior art keywords
- antenna
- electronic installation
- packaging body
- battery protecting
- protecting circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M10/4264—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing with capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4278—Systems for data transfer from batteries, e.g. transfer of battery parameters to a controller, data transferred between battery controller and main controller
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/04—Details of telephonic subscriber devices including near field communication means, e.g. RFID
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Battery Mounting, Suspending (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0183286 | 2014-12-18 | ||
KR1020140183286A KR20150131925A (ko) | 2014-05-15 | 2014-12-18 | Nfc 통신이 가능한 전자장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105720313A true CN105720313A (zh) | 2016-06-29 |
Family
ID=56134754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510958737.9A Pending CN105720313A (zh) | 2014-12-18 | 2015-12-17 | 能够进行nfc通信的电子装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9680973B2 (zh) |
CN (1) | CN105720313A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017221686A1 (ja) * | 2016-06-21 | 2017-12-28 | 株式会社村田製作所 | 携帯無線端末 |
GB201900417D0 (en) * | 2019-01-11 | 2019-02-27 | Dukosi Ltd | Electric battery assemblies |
JP1667617S (zh) * | 2019-07-05 | 2020-09-07 | ||
JP1667618S (zh) * | 2019-07-05 | 2020-09-07 | ||
JP1667632S (zh) * | 2019-07-05 | 2020-09-07 | ||
JP1667633S (zh) * | 2019-07-05 | 2020-09-07 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101180808A (zh) * | 2005-06-25 | 2008-05-14 | 株式会社Lg化学 | 移动设备中原厂电池产品的识别系统 |
CN102411720A (zh) * | 2011-11-12 | 2012-04-11 | 成都雷电微力科技有限公司 | Rfid天线系统 |
CN102804488A (zh) * | 2009-06-10 | 2012-11-28 | Lg伊诺特有限公司 | 使用双共振的近场通信天线 |
CN104064803A (zh) * | 2013-03-20 | 2014-09-24 | 三星Sdi株式会社 | 具有天线的电池包 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9195932B2 (en) * | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
KR101234301B1 (ko) | 2010-08-12 | 2013-02-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 통신단말장치 |
KR101133054B1 (ko) | 2011-06-23 | 2012-04-04 | 에이큐 주식회사 | 엔에프씨 안테나를 구비한 배터리팩 |
KR101279109B1 (ko) | 2011-10-11 | 2013-06-26 | 주식회사 아이티엠반도체 | 배터리 보호회로의 패키지모듈 |
KR101244193B1 (ko) | 2011-11-03 | 2013-03-21 | 수퍼나노텍(주) | Nfc용 루프안테나 장치의 제조방법 및 그에 따른 nfc용 루프안테나 장치 |
KR101609733B1 (ko) * | 2015-02-02 | 2016-04-06 | 주식회사 아이티엠반도체 | 안테나 모듈 패키지, 안테나 모듈 패키지 회로, 이를 포함하는 배터리 팩 및 이를 포함하는 모바일 장치 |
-
2015
- 2015-12-17 CN CN201510958737.9A patent/CN105720313A/zh active Pending
- 2015-12-17 US US14/972,324 patent/US9680973B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101180808A (zh) * | 2005-06-25 | 2008-05-14 | 株式会社Lg化学 | 移动设备中原厂电池产品的识别系统 |
CN102804488A (zh) * | 2009-06-10 | 2012-11-28 | Lg伊诺特有限公司 | 使用双共振的近场通信天线 |
CN102411720A (zh) * | 2011-11-12 | 2012-04-11 | 成都雷电微力科技有限公司 | Rfid天线系统 |
CN104064803A (zh) * | 2013-03-20 | 2014-09-24 | 三星Sdi株式会社 | 具有天线的电池包 |
Also Published As
Publication number | Publication date |
---|---|
US9680973B2 (en) | 2017-06-13 |
US20160181705A1 (en) | 2016-06-23 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: North Chungcheong Province Applicant after: ITM Semiconductor Co., Ltd Address before: North Chungcheong Province Applicant before: (strain) ITM semiconductor |
|
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Luo Hehui Inventor after: Huang Gaoshi Inventor after: Jin Rongshi Inventor after: Pu Chengfan Inventor after: An Shangxun Inventor after: Jin Shanhu Inventor before: Luo Gehui Inventor before: Huang Gaoshi Inventor before: Jin Rongshi Inventor before: Pu Chengfan Inventor before: An Shangxun Inventor before: Jin Shanhu |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160629 |