CN105710215A - Punching and bending die for laptop electronic component fixing plate - Google Patents
Punching and bending die for laptop electronic component fixing plate Download PDFInfo
- Publication number
- CN105710215A CN105710215A CN201610201057.7A CN201610201057A CN105710215A CN 105710215 A CN105710215 A CN 105710215A CN 201610201057 A CN201610201057 A CN 201610201057A CN 105710215 A CN105710215 A CN 105710215A
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- China
- Prior art keywords
- punching
- fixing plate
- bending
- electronic device
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a punching and bending die for a laptop electronic component fixing plate, and relates to the technical field of sheet metal punching. The punching and bending die comprises an upper die and a lower die, wherein the upper die comprises an upper die seat, an upper clamping plate and an upper die plate which are sequentially connected with one another from top to bottom; the upper die seat is connected with the upper die plate through an elastic part; the upper clamping plate is fixed below the upper die seat; a plurality of punching needles are fixedly mounted in the upper clamping plate; the end parts of the punching needles penetrate through the upper die plate; four bending punches are fixedly arranged along the front, rear, left and right edges of the bottom of the upper die plate; the lower die comprises a lower die seat and a lower die plate fixed above the upper die seat; a plurality of punching grooves matched with the punching needles are formed in the upper die plate; and four bending grooves matched with the bending punches are formed in the front, rear, left and right edges of the top of the lower die plate. By adoption of the punching and bending die provided by the invention, the punching and bending process is completed at a time, the manufacturing procedure is simplified, the quantity of required dies and the production cost are reduced, the working efficiency is improved, and the continuous production is facilitated.
Description
Technical field
The present invention relates to sheet metal component stamping technology field, be specifically related to a kind of punching Bending Mould for the fixing plate of notebook electronic device.
Background technology
The fixing plate of notebook electronic device is used to sheet metal component that is fixing and that support notebook computer internal electronic device, and intermediate portion offers multiple aperture adapted with notebook internal structure, and four marginal portion turnovers have crimp (as shown in Figure 1).Special construction due to the fixing plate of notebook electronic device, existing production method is usually and is first placed on punching die by the product of first one-step forming to be punched out, then pass through mechanical hand to be moved into by product in a set of Bending Mould, the edge of product side is carried out bending, again product is transferred to successively in other three sets Bending Mould afterwards, the other three edge is carried out bending, and final processing obtains required finished product.This processing mode operation bothers, it is necessary to many molds, multiple forcing press just can complete, and not only equipment cost is higher, and owing to intermediate demand shifts product, it is easy to cause the problems such as production is discontinuous, work efficiency is relatively low, the position deviation in hole is bigger.
Summary of the invention
It is an object of the invention to propose a kind of punching Bending Mould for the fixing plate of notebook electronic device, disposable can complete punching and the bending process of the fixing plate of notebook electronic device, to solve in existing processing method that equipment cost is high, it is discontinuous to produce, inefficiency, problem that punching position deviation is big.
For reaching this purpose, the present invention by the following technical solutions:
A kind of punching Bending Mould for the fixing plate of notebook electronic device, including upper die and lower die, wherein said upper mould includes the upper bolster, train wheel bridge and the cope match-plate pattern that are sequentially connected with from top to bottom, described upper bolster is connected with cope match-plate pattern by elastic component, described train wheel bridge is fixed on the lower section of upper bolster, being installed with multiple punching needle in described train wheel bridge, the end of described punching needle is through cope match-plate pattern, and the bottom of described cope match-plate pattern is installed with four Bending punches respectively along four edges all around；Described counterdie includes die shoe and is fixed on the lower bolster above die shoe, and described lower bolster has the punching groove that multiple and described punching needle matches, and the top of described lower bolster has, along four edges all around, the bending groove matched with described Bending punch.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, the top of described upper bolster is provided with die shank, for being connected with forcing press.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, between described upper bolster and train wheel bridge, it is connected with upper padding plate.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, described cope match-plate pattern offers multiple longitudinal hole, is used for through described punching needle.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, described elastic component is provided with multiple, is evenly distributed on the edge of cope match-plate pattern.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, described elastic component is nitrogen spring.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, described upper bolster being installed with guide pin bushing, described die shoe is installed with guide pillar, described guide pillar matches with guide pin bushing.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, four bending grooves at described lower bolster top are sequentially connected with and through.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, between described die shoe and lower bolster, it is connected with lower bolster.
As the preferred version of a kind of punching Bending Mould for the fixing plate of notebook electronic device, the material of described cope match-plate pattern, lower bolster and punching needle is Cr12MoV.
The invention have the benefit that
The present invention is in punching course, moved down by upper mould, punching needle is made to contact with product to be processed, thus realizing the punching processing to the fixing plate of notebook electronic device, go up mould to continue to move down simultaneously, by all around four Bending punches, the four of product edges are respectively pressed in corresponding bending groove, it is achieved the Bending Processing of product；The disposable punching bending technique completing the fixing plate of notebook electronic device of the present invention, enormously simplify manufacturing process, decrease number of molds, reduce production cost, improve work efficiency, be conducive to continuous prodution, and the method that punching bending is processed simultaneously it also avoid the problem that location, hole is inaccurate.
Accompanying drawing explanation
For the explanation embodiments of the invention become apparent or technical scheme of the prior art, simply introduce the accompanying drawing used required in embodiment or description of the prior art is done one below, drawings discussed below is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the fixing plate of notebook electronic device in prior art；
Fig. 2 is the sectional structure chart of the punching Bending Mould for the fixing plate of notebook electronic device that embodiment of the present invention provides；
Fig. 3 is the main TV structure schematic diagram of the cope match-plate pattern involved by embodiment of the present invention；
Fig. 4 be the cope match-plate pattern involved by embodiment of the present invention look up structural representation；
Fig. 5 is the main TV structure schematic diagram of the lower bolster involved by embodiment of the present invention；
Fig. 6 is the plan structure schematic diagram of the lower bolster involved by embodiment of the present invention.
In figure:
1, upper bolster；2, guide pin bushing；3, elastic component；4, cope match-plate pattern；5, guide pillar；6, die shoe；7, lower bolster；8, punching groove；9, lower bolster；10, bending groove；11, the fixing plate of notebook electronic device；12, Bending punch；13, punching needle；14, train wheel bridge；15, die shank；16, upper padding plate.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.It is understood that specific embodiment described herein is used only for explaining the present invention, but not limitation of the invention.It also should be noted that, for the ease of describing, accompanying drawing illustrate only part related to the present invention but not entire infrastructure, and accompanying drawing is only for the purpose of description, and map not according to life size.
As shown in Fig. 2-Fig. 6, present embodiments provide for a kind of punching Bending Mould being preferably used in the fixing plate of notebook electronic device, this mould includes upper die and lower die, wherein go up upper bolster 1, train wheel bridge 14 and cope match-plate pattern 4 that mould includes being sequentially connected with from top to bottom, upper bolster 1 is connected with cope match-plate pattern 4 by elastic component 3, train wheel bridge 14 is fixed on the lower section of upper bolster 1, multiple punching needle 13 it is installed with in train wheel bridge 14, the end of punching needle 13 is through cope match-plate pattern 4, and the bottom of cope match-plate pattern 4 is installed with four Bending punches 12 respectively along four edges all around；Counterdie includes die shoe 6 and is fixed on the lower bolster 9 above die shoe 6, and lower bolster 9 has multiple punching groove 8 matched with punching needle 13, and the top of lower bolster 9 has, along four edges all around, the bending groove 10 matched with Bending punch 12.
When the fixing plate of the notebook electronic device shown in Fig. 1 is carried out punching press, as shown in Figure 2, moved down by upper mould, punching needle 13 is made to contact with product to be processed, thus realizing the punching processing to the fixing plate of notebook electronic device, go up mould to continue to move down simultaneously, by all around four Bending punches 12, the four of product edges are respectively pressed in corresponding bending groove 10, it is achieved the Bending Processing of product；The disposable punching bending technique completing the fixing plate of notebook electronic device of the present invention, enormously simplify manufacturing process, decrease number of molds, reduce production cost, improve work efficiency, be conducive to continuous prodution, and the method that punching bending is processed simultaneously it also avoid location, hole is inaccurate, easily to produce position deviation problem.After the hole on the fixing plate of notebook electronic device and four flangings machine, successfully fixing for notebook electronic device plate can be separated from cope match-plate pattern 4 under the effect of elastic component 3, carry out next step processing.
For convenience of being connected with the pressure part on forcing press, the top of upper bolster 1 is also equipped with die shank 15.Specifically, forcing press is provided with shank hole, and die shank 15 is arranged in shank hole by the mode of interference fit, and is fixedly clamped by die shank 15 by the slide block on forcing press.It should be noted that and should first die shank 15 be pressed in upper bolster 1 before fit on clamping plate 14 and backing plate 16, and die shank 15 should match with the shank hole of selected forcing press when Design of Dies, to ensure being smoothed out of punching course.
Further; upper padding plate 16 it is connected with between upper bolster 1 and train wheel bridge 14; the setting of upper padding plate 16 can effectively prevent train wheel bridge 14 to be applied directly to by active force on upper bolster 1; thus causing that upper bolster 1 produces breakage or deformation, therefore upper padding plate 16 can play the effect of shock absorbing, protection upper bolster 1.In like manner; lower bolster 7 it is connected with between die shoe 6 and lower bolster 9; the setting of lower bolster 7 can effectively prevent lower bolster 9 to be applied directly on die shoe 6 by active force, thus causing that die shoe 6 produces breakage or deformation, therefore lower bolster 7 can play the effect of shock absorbing, protection die shoe 6.
As preferably, cope match-plate pattern 4 offering multiple longitudinal hole, for extending there through for multiple punching needles 13；Further, multiple elastic component 3 also it is evenly distributed with at the edge of cope match-plate pattern 4, one end of these elastic components 3 is fixing with upper bolster 1 to be connected, the other end is affixed with cope match-plate pattern 4, stamping pressure can be effectively transmitted in arranging of elastic component 3, complete the punching Bending Processing of sheet metal component, after formation product can be departed from again cope match-plate pattern 4 simultaneously.Preferably, the elastic component of present embodiment selects nitrogen spring, and nitrogen spring is a kind of novel elastic assembly being working media with high pressure nitrogen, has that volume is little, elastic force big, stroke length, stable working, manufacture precision, long service life (1,000,000 times), spring curve is mild, and does not need the feature of pretension, Design of Dies and manufacture can be simplified, facilitate mould to install and adjust, extending the mold use life-span, it is ensured that stablizing of product quality.Certainly in other cases, the elastic component 3 of the present invention can also select metal coil spring or polyurethane spring etc..
It is preferred that, upper bolster 1 being installed with guide pin bushing 2, die shoe 6 is installed with guide pillar 5, guide pillar 5 matches with guide pin bushing 2, thus the movement of upper mould is led, finally makes punching needle 13 be properly inserted in punching groove 8, and Bending punch 12 is properly inserted in bending groove 10.Here, it is also possible to being arranged on die shoe 6 by guide pin bushing 2, guide pillar 5 is arranged on upper bolster 1, and guide pin bushing 2 can also replace with the pilot hole matched with guide pillar 5, as long as its guide function can be realized.
Further, for convenience of mould processing, reducing cost of manufacture, four bending grooves 10 at lower bolster 9 top are the structure being sequentially connected with and being mutually communicated.It addition, the material of cope match-plate pattern 4, lower bolster 9 and red needle 13 is preferably Cr12MoV in present embodiment.Cr12MoV is high-carbon high-chromium steel, and wearability is higher, deforms only small during quenching, and quenching degree is good, can be used for the mould produced in enormous quantities.
The work process of the present invention is as follows:
First, driving upper mould entirety to move down by forcing press, punching needle 13 contacts with the fixing plate 11 of notebook electronic device to be processed, and upper mould continues to move down, and punching needle 13 matches with punching groove 8, and the mid portion of product is punched out；Meanwhile, four Bending punches 12 on cope match-plate pattern 4 contact with the marginal portion of the fixing plate 11 of notebook electronic device respectively, and the four of product edge bendings are pressed in corresponding bending groove 10 with the movement of upper mould, complete Forging Process；Afterwards, forcing press drives upper mould to move up, and product is wrapped on punching needle 13 due to the effect of stamping press, and at this moment, elastic component 3 pushes down on cope match-plate pattern 4, thus product detaches cope match-plate pattern 4 and punching needle 13, carries out next step processing.
Obviously, the above embodiment of the present invention is only used to the clear example of the present invention that illustrates, and is not the restriction to embodiment of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.All any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within the protection domain of the claims in the present invention.
Claims (10)
1. the punching Bending Mould for the fixing plate of notebook electronic device, including upper die and lower die, it is characterized in that, described upper mould includes the upper bolster (1) being sequentially connected with from top to bottom, train wheel bridge (14) and cope match-plate pattern (4), described upper bolster (1) is connected with cope match-plate pattern (4) by elastic component (3), described train wheel bridge (14) is fixed on the lower section of upper bolster (1), multiple punching needle (13) it is installed with in described train wheel bridge (14), end traverse cope match-plate pattern (4) of described punching needle (13), the bottom of described cope match-plate pattern (4) is installed with four Bending punches (12) respectively along four edges all around；Described counterdie includes die shoe (6) and is fixed on the lower bolster (9) of die shoe (6) top, having the punching groove (8) that multiple and described punching needle (13) is matched on described lower bolster (9), the top of described lower bolster (9) has, along four edges all around, the bending groove (10) matched with described Bending punch (12).
2. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 1, it is characterised in that the top of described upper bolster (1) is provided with die shank (15), for being connected with forcing press.
3. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 2, it is characterised in that be connected with upper padding plate (16) between described upper bolster (1) and train wheel bridge (14).
4. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 1, it is characterised in that described cope match-plate pattern offers multiple longitudinal hole on (4), is used for through described punching needle (13).
5. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 4, it is characterised in that described elastic component (3) is provided with multiple, is evenly distributed on the edge of cope match-plate pattern (4).
6. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 5, it is characterised in that described elastic component (3) is nitrogen spring.
7. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 1, it is characterized in that, described upper bolster (1) is installed with guide pin bushing (2), being installed with guide pillar (5) on described die shoe (6), described guide pillar (5) matches with guide pin bushing (2).
8. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 1, it is characterised in that four bending grooves (10) at described lower bolster (9) top are sequentially connected with and through.
9. the punching Bending Mould for the fixing plate of notebook electronic device according to claim 1, it is characterised in that be connected with lower bolster (7) between described die shoe (6) and lower bolster (9).
10. the punching Bending Mould for the fixing plate of notebook electronic device according to any one of claim 1-9, it is characterised in that the material of described cope match-plate pattern (4), lower bolster (9) and punching needle (13) is Cr12MoV.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610201057.7A CN105710215A (en) | 2016-04-01 | 2016-04-01 | Punching and bending die for laptop electronic component fixing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610201057.7A CN105710215A (en) | 2016-04-01 | 2016-04-01 | Punching and bending die for laptop electronic component fixing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105710215A true CN105710215A (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610201057.7A Pending CN105710215A (en) | 2016-04-01 | 2016-04-01 | Punching and bending die for laptop electronic component fixing plate |
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| Country | Link |
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| CN (1) | CN105710215A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363078A (en) * | 2016-09-30 | 2017-02-01 | 东莞市联洲知识产权运营管理有限公司 | Lithium battery base plate punching mechanism of new energy vehicle |
| CN106391852A (en) * | 2016-09-30 | 2017-02-15 | 东莞市联洲知识产权运营管理有限公司 | Forming mechanism of lithium battery base plate of new energy automobile |
| CN106799431A (en) * | 2017-03-27 | 2017-06-06 | 盐城市港城特种玻璃制品有限公司 | A kind of metalwork for door and window manufacture suppresses apparatus for bending |
| CN107234166A (en) * | 2017-06-05 | 2017-10-10 | 昆山钣源冲压技术有限公司 | A kind of high speed stamping micropore mold |
| CN108580660A (en) * | 2018-03-27 | 2018-09-28 | 苏州事达同泰汽车零部件有限公司 | Plurality of specifications punching die |
| CN112676458A (en) * | 2020-11-05 | 2021-04-20 | 安徽墙煌彩铝科技有限公司 | Compound mould of adjustable angle sign indicating number size |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2065516U (en) * | 1989-07-12 | 1990-11-14 | 吴书圣 | Synchronous punching and pressing die for aluminum cover |
| WO2014090264A1 (en) * | 2012-12-13 | 2014-06-19 | Bernd Klug | Device having at least one arrangement for adjusting guide play |
| CN203711643U (en) * | 2014-03-05 | 2014-07-16 | 艾柯豪博（苏州）电子有限公司 | Shielding cover continuous punching die with bending function |
| CN204867115U (en) * | 2015-08-25 | 2015-12-16 | 无锡诺飞高新技术有限公司 | Slide rail tablet mould |
| CN205463950U (en) * | 2016-04-01 | 2016-08-17 | 昆山市飞鹏金属工业有限公司 | A mould of bending that punches a hole for notebook electron device fixed plate |
-
2016
- 2016-04-01 CN CN201610201057.7A patent/CN105710215A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2065516U (en) * | 1989-07-12 | 1990-11-14 | 吴书圣 | Synchronous punching and pressing die for aluminum cover |
| WO2014090264A1 (en) * | 2012-12-13 | 2014-06-19 | Bernd Klug | Device having at least one arrangement for adjusting guide play |
| CN203711643U (en) * | 2014-03-05 | 2014-07-16 | 艾柯豪博（苏州）电子有限公司 | Shielding cover continuous punching die with bending function |
| CN204867115U (en) * | 2015-08-25 | 2015-12-16 | 无锡诺飞高新技术有限公司 | Slide rail tablet mould |
| CN205463950U (en) * | 2016-04-01 | 2016-08-17 | 昆山市飞鹏金属工业有限公司 | A mould of bending that punches a hole for notebook electron device fixed plate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363078A (en) * | 2016-09-30 | 2017-02-01 | 东莞市联洲知识产权运营管理有限公司 | Lithium battery base plate punching mechanism of new energy vehicle |
| CN106391852A (en) * | 2016-09-30 | 2017-02-15 | 东莞市联洲知识产权运营管理有限公司 | Forming mechanism of lithium battery base plate of new energy automobile |
| CN106363078B (en) * | 2016-09-30 | 2018-03-20 | 郑招才 | A kind of lithium battery bedplate punching mechanism of new-energy automobile |
| CN106799431A (en) * | 2017-03-27 | 2017-06-06 | 盐城市港城特种玻璃制品有限公司 | A kind of metalwork for door and window manufacture suppresses apparatus for bending |
| CN107234166A (en) * | 2017-06-05 | 2017-10-10 | 昆山钣源冲压技术有限公司 | A kind of high speed stamping micropore mold |
| CN108580660A (en) * | 2018-03-27 | 2018-09-28 | 苏州事达同泰汽车零部件有限公司 | Plurality of specifications punching die |
| CN112676458A (en) * | 2020-11-05 | 2021-04-20 | 安徽墙煌彩铝科技有限公司 | Compound mould of adjustable angle sign indicating number size |
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