CN105705272B - Allow the die device of metal forming under high-vacuum environment - Google Patents
Allow the die device of metal forming under high-vacuum environment Download PDFInfo
- Publication number
- CN105705272B CN105705272B CN201580002543.XA CN201580002543A CN105705272B CN 105705272 B CN105705272 B CN 105705272B CN 201580002543 A CN201580002543 A CN 201580002543A CN 105705272 B CN105705272 B CN 105705272B
- Authority
- CN
- China
- Prior art keywords
- seal
- knock pin
- module core
- mother module
- moveable die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/15—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting by using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/08—Cold chamber machines, i.e. with unheated press chamber into which molten metal is ladled
- B22D17/12—Cold chamber machines, i.e. with unheated press chamber into which molten metal is ladled with vertical press motion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/14—Machines with evacuated die cavity
- B22D17/145—Venting means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2218—Cooling or heating equipment for dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2236—Equipment for loosening or ejecting castings from dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D29/00—Removing castings from moulds, not restricted to casting processes covered by a single main group; Removing cores; Handling ingots
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
The present invention is a kind of die device for allowing metal forming under high-vacuum environment.Die device has:Fixing mould;The top of the fixing mould is connected on to form the moveable die of mother module core;And run through moveable die and arrive at the knock pin of mother module core.In the case of producing vacuum environment after by using exhaust apparatus by the air discharge of mother module core, metal is melted into soup injection and is molded, and the product being therefore molded is pushed out and is stripped using knock pin.Closed plate is snugly placed on the top of the moveable die and allows the knock pin to sequentially pass through the closed plate and the moveable die, installs seal on the hole that knock pin runs through described in the closed plate and prevents extraneous air from flowing into the mother module core.Isolation space is formed between the moveable die and the seal and prevents heat transfer to the seal.Shaped device of the present invention can prevent the physical property of metal molten soup when metal melts soup ingress of air from changing.
Description
Technical field
The present invention is on a kind of metal forming mold device, especially, allows the metal forming mold device of metal forming.
Background technology
Metal can pass through various methods and be molded, and wherein typical method is casting and forging method based on mould.Casting
Or forging is adapted to a large amount of productions due to can rapidly and accurately allow metal forming.
Casting or forging are with die device generally by forming mother module core (cavity) after moveable die and fixing mould zoarium
And as allowing the space of formed product, molten metal after METAL HEATING PROCESS melt soup inject in the mother module core fill (casting) or plus
After pressure solidification (forging), moveable die is allowed to separate the product stripping of relief shaping with fixing mould.
Here, the stripping means of the shaped article are as follows, the product after shaping is allowed using knock pin (ejector pin)
Separated from moveable die.Allow moveable die to depart from fixing mould aftershaping product and be in the state for being bonded at moveable die, knock pin
Length through moveable die and arrive at mother module core enough and advance the product after promoting the shaping towards mother module core by cylinder
And separated from moveable die.
On the other hand, when allowing the metal to melt soup shaping, metal abrupt oxidization and can allow foreign matter to invade after melting soup contact air
Metal melts soup and generates scum silica frost (Dross).Although scum silica frost somewhat possesses the effect for preventing contact air, can be in metal molten
During hamper it is lasting stirring operation and be difficult to high-quality molten metal without interruption melt soup.In order to solve the problem and by elder generation
Preceding technology discloses allows the die device of metal forming under vacuum conditions.For example, patent gazette the 10-2004-0103251st
(2004.12.8) is disclosed " die casting equipment that the vacuum by improving is provided in operations for forming ".
However, allow under vacuum conditions as previously mentioned metal forming die device in through knock pin allow shaping after
The device of product stripping is more difficult to allow mother module core to form high vacuum.Because in order to allow knock pin to run through moveable die
Ground is installed and moved back and forth, inevitably will be formed between the hole that knock pin and knock pin are run through it is small between
Gap, extraneous air can then pass through the gap and flow into mother module core.
The content of the invention
The technical problem solved
Present invention seek to address that foregoing problems, it is an object of the invention to provide a kind of die device, the die device are effective
Ground prevents the gap between the hole that extraneous air is run through through knock pin and knock pin from flowing into mother module core and be able in mother module core
Maintain to allow metal forming in the state of high vacuum.
Solves the technical scheme of technical problem
The present invention installs seal and is able in mother module core in the gap between the hole that knock pin and knock pin are run through
Portion prevents extraneous air from flowing into mother module core when forming vacuum.
The present invention allows the die device of metal forming under high-vacuum environment, including:Fixing mould;Moveable die, phase
The top of the fixing mould is connected to form mother module core;And knock pin, through the moveable die and arrive at the master mold
Benevolence;The molten Tang Bingcheng of metal is inserted being extracted out using exhaust apparatus from the mother module core in the state of air forms vacuum environment
Type, then the product after shaping is promoted to realize the demoulding using the knock pin, closed plate is snugly placed in the moveable die
Top on and allow the knock pin to sequentially pass through the closed plate and the moveable die, pushed up described in the closed plate
Go out on the hole that pin runs through and seal is installed and prevents that extraneous air from flowing into the mother module core, in the moveable die and the sealing
Isolation space is formed between part and prevents heat transfer to the seal.
Invention effect
According to the present invention, forming metal in the case of allowing the space of metal forming to turn into high vacuum and to prevent
Only metal melts physical property change of the soup caused by ingress of air.Moreover, it can be avoided to prevent extraneous air from flowing into as far as possible
Metal forming space and the seal installed are, usually, thermically destroyed, so as to be realized using cheap seal and possessed economy
Die device.
Brief description of the drawings
Fig. 1 is the diagrammatic illustration for the schematic configuration for showing the die device of the present invention.
Fig. 2 is the exploded view of Fig. 1 part A.
Fig. 3 is the sectional view of Fig. 1 part A.
Fig. 4 is the sectional view of Fig. 1 part B.
Fig. 5 is the sectional view of Fig. 1 C portion.
Fig. 6 is the diagrammatic illustration of the schematic configuration for the die device for showing other embodiments of the present invention.
Fig. 7 to Figure 10 is the diagrammatic illustration of process for showing to be molded by metal product using the die device of the present invention.
Embodiment
Between the present invention is provided between a kind of hole for effectively preventing extraneous air from being run through through knock pin and knock pin
Clearance flow enters mother module core and is able to allow the die device of metal forming in the state of mother module core maintains high vacuum,
It is provided by the present invention that the die device of metal forming is allowed under high-vacuum environment in fixing mould and But moving die
Have joint and form mother module core, possess and arrive at the knock pin of mother module core through the moveable die, and pass through exhaust apparatus handle
The mother module core inserts metal and melts soup and be molded in the state of building into vacuum environment, after then promoting shaping using knock pin
Product realizes the demoulding,
Seal is installed between the hole that the knock pin and knock pin are run through to be prevented when forming vacuum environment
Extraneous air flows into mother module core, moreover, forming isolation space in front of the seal and being able to completely cut off from the seal and be transmitted through
The heat come.
The present invention is described in detail with reference to schema Fig. 1 to Figure 10.
Fig. 1 is the diagrammatic illustration for the schematic configuration for showing the die device of the present invention, and Fig. 2 is the exploded view of Fig. 1 part A,
Fig. 3 is the sectional view of Fig. 1 part A, and Fig. 4 is the sectional view of Fig. 1 part B, and Fig. 5 is the sectional view of Fig. 1 C portion.
As illustrated, the die device of the present invention possesses fixing mould 110 and moveable die 120, in fixing mould 110 and
The joint of moveable die 120 forms mother module core 130, and the mother module core 130 is a kind of space for inserting metal and melting soup and being molded it.
The downside of mother module core 130 forms emits oral area 132 METAL HEATING PROCESS, emits and pressure plunger 170 is provided with oral area 132 to handle
The metal generated in oral area 132 is emitted to melt in soup push-in mother module core 130.
The mould that the fixing mould 110 is fixed in position, moveable die 120 can be towards the sides away from fixing mould 110
Draw back or advance towards close to the direction of fixing mould 110, mother module core 130 opens during retrogressing.
Knock pin 140 is installed in moveable die 120, the knock pin 140 is to the product being molded in the mother module core 130
It is stripped.Knock pin 140 is in rod state, it is preferable that one or more is equipped with the form of section is rounded, it is through described
Mother module core 130 is arrived in moveable die 120 and end.End with can towards mother module core 130 protrude direction advance or towards its
Opposite direction retreats ground and formed, and end protrudes in mother module core 130 and the product after being molded is isolated from moveable die 120.
Mother module core 130 builds into vacuum environment.Extracted out through the exhaust apparatus 190 being separately equipped with from the mother module core 130
Air builds vacuum environment.Exhaust apparatus 190 extracts air out through at least one blast pipe and builds mother module core 130 and come true
Altitude.
Here, in the gabarit installation seal P3 of moveable die 120 and the joint of fixing mould 110 along mother module core 130.
Referring to Fig. 5, whereby, mother module core 130 completely cuts off extraneous air stream after as the process of vacuum environment or as vacuum environment
Enter mother module core 130.
Further, the present invention installs seal P1 between the hole that the knock pin 140 and knock pin 140 are run through,
Therefore can also completely cut off may pass through the hole leaked-in air that knock pin 140 is run through, so as to which mother module core 130 is built into
High-vacuum environment.
The seal P1 can be formed at the entrance in the hole that knock pin 140 is run through.Now, Fig. 2 and Fig. 3 are referred to,
Placement seal P1 seal groove 122 is then formed at the entrance in the hole and allows seal P1 in the state of outside is not exposed to
Installation is housed by the seal groove 122.At the same time, in order to avoid seal P1 drops from seal groove 122 and anti-decylization 124
Sandwich the entrance of seal groove 122.
The entrance of the seal groove 122 is wider and more more reduces in funnel shape to interior diameter and is opened in a certain place
Beginning forms same diameter, is forming the part placement seal P1 of the same diameter.In the case where being equipped with anti-decylization 124,
Anti-decylization 124 together resettlement can also be formed.Seal P1 can be sandwiched seal groove 122 more easily through the structure
Install on ground.
On the other hand, metal soup is melted to insert mother module core 130 and allow the die device of the invention of formed product in product
Suitable heat can occur in forming process.Especially, it is heated to prevent metal thermal deformation drastically in moveable die 120
Shaped article in the state of to 200~300 DEG C of high temperature, the sealing installed on the hole that foregoing heat is then run through to knock pin 140
Part P1 is impacted and so that seal P1 is damaged.
In order to prevent the phenomenon, the present invention forms the isolation space 180 for preventing heat from being passed to seal P1.Isolation is empty
Between 180 be formed between seal P1 and moveable die 120 and so that the heat of moveable die 120 can not be delivered to seal P1.
The isolation space 180 can be realized through closed plate 150.Closed plate 150 turns into plate shape state and is placed in described
The top of moveable die 120, the isolation space 180 are formed between moveable die 120 and closed plate 150.For example, closed plate
150 in the place for the moveable die 120 that connects when forming recessed space, will self-assembling formation isolation space 180.
Referring to Fig. 4, preferably, pacify between closed plate 150 and moveable die 120 along the gabarit in isolation space 180
Fill seal P2 and be able to the isolation space 180 that closing is formed as previously described.
In the structure for foring closed plate 150, knock pin 140 sequentially passes through closed plate 150, isolation space 180 and can
Mother module core 130 is arrived at after moving mold 120.Moreover, seal P1 is passed through in the upper surface of closed plate 150 installed in knock pin 140
The entrance in the hole worn.Now, installed in closed plate 150 and seal groove 122 is formed at the seal P1, anti-decylization 124 is then pressed from both sides
Enter seal groove 122.
Exhaust apparatus 190 extracts air out simultaneously in the mother module core 130 and the isolation space 180.
Isolation space 180 is the space of inner hollow and prevents the heat transfer that on moveable die 120 to seal
P1.Therefore seal P1 can be prevented to be partially damaged by heat, and envelope will not be also allowed even with the relatively low cheap product of resistance to heat
Performance reduction is closed, so as to cost-effective and obtain economic benefit.
Supporting plate 160 can be disposed on the top for the closed plate 150 being formed as previously described.Supporting plate 160 is plate shape state
And the ground of the closed plate that connects 150 disposes, and can be formed separately with closed plate 150.In the drawings, supported when lifting upward
Plate 160 departs from and risen from closed plate 150.In this state, it can install or change the seal P1.
According to the above, seal P1 is arranged between closed plate 150 and supporting plate 160 and pressed by supporting plate 160
Press and obtain firm support, as a result, seal P1 installment state can be maintained stably.
Fig. 6 is the diagrammatic illustration of the schematic configuration for the die device for showing other embodiments of the invention.
As illustrated, the die device of other embodiments of the invention have be adjacent to the moveable die 120 top and
The closed plate 150 of placement, the isolation space 180 are then formed between moveable die 120 and closed plate 150.Moreover, knock pin
140 sequentially pass through closed plate 150 and moveable die 120.The supporting plate 160 for eliminating previous embodiment refers to Fig. 1.
In this embodiment it is possible to the entrance installation in the hole that knock pin 140 runs through is described close at the bottom surface of closed plate 150
Sealing P1.Now, ball rod 126 is installed in order to prevent seal P1 from departing from.Ball rod 126 is in the isolation space 180 by upper
End support seal P1 and give compressing and lower end then by moveable die 120 support erect.Therefore knock pin 140 runs through institute
State ball rod 126 and run through moveable die 120, ball rod 126 not only prevents seal P1 from departing from, moreover it is possible to isolation space 180 and top
Go out pin 140 to completely cut off.
Preferably, the ball rod 126 is formed by the material for possessing thermal insulation, but is not limited to this.
Unaccounted symbol is identical with previous embodiment in schema, therefore its explanation is omitted below.
The process of the molten soup shaped article of metal is utilized the following detailed description of the die device of the present invention.Fig. 7 to Figure 10 is to show
Go out the diagrammatic illustration for the process being molded using the die device of the present invention by metal product.
First, referring to Fig. 7, allowing moveable die 120 to rise and cleaning mother module core 130 and be formed at mother module core 130
Bottom emits oral area 132.Pressure-air is sprayed to implement to clean, and releasing agent and lubricating oil are sprayed after cleaning.
After cleaning, the inside for metal input being emitted oral area 132 is heated and allows moveable die 120 to decline.Refer to figure
8, start exhaust apparatus 190 after moveable die 120 and the zoarium of fixing mould 110 and simultaneously from mother module core 130 and isolation space 180
Extract air out, valve is closed after air is completely drawn out and builds high-vacuum environment.
After the metal of input is sufficiently heated and melted, referring to Fig. 9, allowing pressure plunger 170 to rise and a melting
Metal, that is, metal melts soup and inserts the inside of mother module core 130.Then, certain time is placed to be cooled down so that metal is pressed
It is molded according to the shape of mother module core 130.In this process, moveable die 120 is heated to certain temperature, and moveable die 120
The heat of upper generation is isolated space 180 and prevents it from transmitting.
Afterwards, referring to Fig. 10, allowing moveable die 120 to rise again after cooling.Now, the product after shaping is attached to
Moveable die 120 and rise together with moveable die 120, knock pin 140 is towards before the product side after shaping and then from moveable die
120 isolate the product after shaping and realize the demoulding.
Finally, through product is completed after the post processing such as tint is ground to the product after the demoulding, above-mentioned mistake is repeated
Journey and be able to make metal continuously shaped under high-vacuum environment.
Claims (2)
- A kind of 1. die device for allowing metal forming under high-vacuum environment, it is characterised in that including:Fixing mould (110);Moveable die (120), the top of the fixing mould (110) is connected on to form mother module core (130);AndKnock pin (140), through the moveable die (120) and arrive at the mother module core (130);Gold is inserted being extracted out using exhaust apparatus (190) from the mother module core (130) in the state of air forms vacuum environment The molten soup of category is simultaneously molded, and then promotes the product after shaping to realize the demoulding using the knock pin (140),Closed plate (150) is snugly placed on the top of the moveable die (120) and allows the knock pin (140) successively Through the closed plate (150) and the moveable die (120), knock pin (140) runs through described in the closed plate (150) Hole on seal (P1) is installed and prevents that extraneous air from flowing into the mother module core (130),Isolation space (180) is formed between the moveable die (120) and the seal (P1) and prevents heat transfer to institute Seal (P1) is stated,Wherein described seal (P1) is arranged on the bottom surface of the closed plate (150) and position is run through in the knock pin (140) The entrance in the hole, have isolation space (180) support the seal (P1) by upper end and give compressing and under The ball rod (126) that end is then supported by moveable die (120), so that the knock pin (140) runs through the ball rod (126),In the knock pin (140) on direction, the height of isolation space (180) is more than the seal (P1) Height and the height of the ball rod (126) are more than the height of the seal (P1).
- 2. the die device according to claim 1 for allowing metal forming under high-vacuum environment, wherein the exhaust dress (190) are put from the mother module core (130) and isolation space (180) while extract air out.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140086829A KR101483717B1 (en) | 2014-07-10 | 2014-07-10 | A mold device of forming a metal under vacuum environment |
KR10-2014-0086829 | 2014-07-10 | ||
PCT/KR2015/005676 WO2016006828A1 (en) | 2014-07-10 | 2015-06-05 | Mold apparatus for molding metal in high vacuum environment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105705272A CN105705272A (en) | 2016-06-22 |
CN105705272B true CN105705272B (en) | 2017-12-19 |
Family
ID=52590759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580002543.XA Active CN105705272B (en) | 2014-07-10 | 2015-06-05 | Allow the die device of metal forming under high-vacuum environment |
Country Status (25)
Country | Link |
---|---|
US (1) | US9821370B2 (en) |
EP (1) | EP3167977B1 (en) |
JP (1) | JP6309693B2 (en) |
KR (1) | KR101483717B1 (en) |
CN (1) | CN105705272B (en) |
AU (1) | AU2015288553B2 (en) |
CA (1) | CA2947945A1 (en) |
CL (1) | CL2016002871A1 (en) |
DK (1) | DK3167977T3 (en) |
ES (1) | ES2763127T3 (en) |
HK (1) | HK1224250A1 (en) |
HU (1) | HUE047869T2 (en) |
IL (1) | IL250020A0 (en) |
MA (1) | MA39403A1 (en) |
MX (1) | MX2016014662A (en) |
MY (1) | MY182872A (en) |
PE (1) | PE20170108A1 (en) |
PH (1) | PH12017500063B1 (en) |
PL (1) | PL3167977T3 (en) |
PT (1) | PT3167977T (en) |
SA (1) | SA516380126B1 (en) |
SG (1) | SG11201608807VA (en) |
SI (1) | SI3167977T1 (en) |
TW (1) | TWI529015B (en) |
WO (1) | WO2016006828A1 (en) |
Families Citing this family (2)
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CN109732066B (en) * | 2019-01-03 | 2021-05-07 | 长沙有色冶金设计研究院有限公司 | Taper pin type automatic demoulding and pin removing equipment and method for metal ingot |
JP7032353B2 (en) * | 2019-05-16 | 2022-03-08 | 株式会社メッツ | Casting equipment |
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2014
- 2014-07-10 KR KR1020140086829A patent/KR101483717B1/en active IP Right Grant
-
2015
- 2015-06-05 PL PL15818576T patent/PL3167977T3/en unknown
- 2015-06-05 SG SG11201608807VA patent/SG11201608807VA/en unknown
- 2015-06-05 DK DK15818576.9T patent/DK3167977T3/en active
- 2015-06-05 WO PCT/KR2015/005676 patent/WO2016006828A1/en active Application Filing
- 2015-06-05 EP EP15818576.9A patent/EP3167977B1/en active Active
- 2015-06-05 PT PT158185769T patent/PT3167977T/en unknown
- 2015-06-05 US US14/906,748 patent/US9821370B2/en active Active
- 2015-06-05 SI SI201531044T patent/SI3167977T1/en unknown
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AU2015288553A1 (en) | 2016-11-03 |
SG11201608807VA (en) | 2017-01-27 |
MA39403A1 (en) | 2017-06-30 |
JP2017517400A (en) | 2017-06-29 |
PE20170108A1 (en) | 2017-04-02 |
PL3167977T3 (en) | 2020-06-15 |
SI3167977T1 (en) | 2020-03-31 |
DK3167977T3 (en) | 2019-12-16 |
PH12017500063A1 (en) | 2017-05-15 |
EP3167977A4 (en) | 2018-03-07 |
WO2016006828A1 (en) | 2016-01-14 |
EP3167977B1 (en) | 2019-09-25 |
EP3167977A1 (en) | 2017-05-17 |
KR101483717B1 (en) | 2015-01-16 |
TWI529015B (en) | 2016-04-11 |
CL2016002871A1 (en) | 2017-06-16 |
PT3167977T (en) | 2020-01-08 |
PH12017500063B1 (en) | 2017-05-15 |
TW201601857A (en) | 2016-01-16 |
HUE047869T2 (en) | 2020-05-28 |
US9821370B2 (en) | 2017-11-21 |
MX2016014662A (en) | 2017-05-04 |
IL250020A0 (en) | 2017-03-30 |
US20170106439A1 (en) | 2017-04-20 |
SA516380126B1 (en) | 2019-11-20 |
HK1224250A1 (en) | 2017-08-18 |
CA2947945A1 (en) | 2016-01-14 |
CN105705272A (en) | 2016-06-22 |
MY182872A (en) | 2021-02-05 |
ES2763127T3 (en) | 2020-05-27 |
JP6309693B2 (en) | 2018-04-11 |
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