CN105704988A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN105704988A CN105704988A CN201610231479.9A CN201610231479A CN105704988A CN 105704988 A CN105704988 A CN 105704988A CN 201610231479 A CN201610231479 A CN 201610231479A CN 105704988 A CN105704988 A CN 105704988A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- electronic equipment
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention discloses an electronic device. The electronic device comprises an enclosure of which inner part is equipped with a cavity for mounting electronic components; a printed circuit board which is fixedly mounted in the enclosure; a heater which is arranged at one side of the printed circuit board; a fan which is located at the other side of the printed circuit board, wherein the blowing direction of the fan faces towards the heater; and a panel which is mounted on the other side of the printed circuit board. According to the electronic device, the temperature in the electronic device can be increased rapidly; under a condition of increasing the temperature, the evenness of the temperature in the electronic device is ensured; and the electronic components are prevented from being damaged by partial overtemperature.
Description
Technical field
The present invention relates to electronic technology field, particularly to a kind of electronic equipment。
Background technology
At present, the application of electronic product is more and more extensive。Mentioning the thermal design of electronic equipment, people naturally enough will recognize that the ventilation and heat of electronic equipment。This is because the operative practice of electronic equipment shows, along with the increase of temperature, the crash rate of components and parts is exponentially increased, and greatly reduces the reliability of equipment。People are devoted to the research to equipment ventilation and heat always。But, in recent years, along with surging of circuit integrated level, the raising etc. of equipment packing density so that this just harsh thermal environment of electronic equipment becomes more severe。Meanwhile, although the use environment of electronic equipment is deteriorated, but the requirement of its reliability is not had any change. at present, the people being engaged in Thermal Design of Electronic Equipments have encountered a new thorny topic, namely increasing electronic equipment is in certain circumstances, is desirable that when ambient temperature is for-40 DEG C and remains to normal operation。
Its hot adaptability of some components and parts also this practical situation poor for current domestic production, just create new thorny problem: that is how quickly to heat to electronic equipment and make it reach the temperature adaptation scope of components and parts in finite time, to work with ensureing electronic equipment normal reliable at low ambient temperatures。
Summary of the invention
The deficiency of low-temperature working cannot be adapted to make up above electronic equipment, the invention provides a kind of electronic equipment, to solve the problem in above-mentioned background technology。
The technical scheme is that
A kind of electronic equipment, including
Casing, described casing internal has to install the cavity of electronic devices and components;
Printed circuit board (PCB), described printed circuit board (PCB) is fixedly installed in described casing internal;
Heater, described heater is arranged at the side of described printed circuit board (PCB);
Fan, described fan is in the opposite side of described heater, and the blowing direction of described fan is towards described heater;
And panel, described panel is installed on the opposite side of described printed circuit board (PCB)。
As the technical scheme of a kind of optimization, the centre position of described printed circuit board (PCB) is provided with temperature sensor, and described temperature sensor controls the switch of described heater。
As the technical scheme of a kind of optimization, described casing internal is provided with air channel, and described air channel is arranged along the blowing direction of described fan。
As the technical scheme of a kind of optimization, described air channel has two, is respectively arranged at the both sides of described printed circuit board (PCB)。
As the technical scheme of a kind of optimization, described air channel offers some wind distributing holes towards described printed circuit board (PCB)。
As the technical scheme of a kind of optimization, described heater adopts spiral heating wire, and described spiral heating wire is installed in a high temperature resistant housing, and described housing connects with described air channel。
As the technical scheme of a kind of optimization, between described panel and described printed circuit board (PCB), it is provided with baffle plate。
As the technical scheme of a kind of optimization, described baffle plate is arc, has a flexure plane towards described panel。
Owing to have employed technique scheme, there is advantages that
A kind of electronic equipment provided by the invention, including casing, described casing internal has to install the cavity of electronic devices and components;Printed circuit board (PCB), described printed circuit board (PCB) is fixedly installed in described casing internal;Heater, described heater is arranged at the side of described printed circuit board (PCB);Fan, described fan is in the opposite side of described heater, and the blowing direction of described fan is towards described heater;And panel, described panel is installed on the opposite side of described printed circuit board (PCB)。Based on this structure, the present invention can quickly promote the temperature of electronic equipment internal, and while ensureing to promote temperature, it is ensured that the uniformity of electronic equipment internal temperature, it is to avoid the too high electronic devices and components caused of local temperature are impaired。
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。
Fig. 1 is the structural representation of the first embodiment of the present invention;
Fig. 2 is the structural representation of the second embodiment of the present invention;
Fig. 3 is the structural representation of the third embodiment of the present invention。
Detailed description of the invention
Describe the present invention below in conjunction with specific embodiment。
Embodiment 1
As it is shown in figure 1, a kind of electronic equipment, including
Casing 1, described casing 1 is internal has to install the cavity of electronic devices and components;
Printed circuit board (PCB) 2, it is internal that described printed circuit board (PCB) 2 is fixedly installed in described casing 1;
Heater 3, described heater 3 is arranged at the side of described printed circuit board (PCB) 2;
Fan 4, described fan 4 is in the opposite side of described heater 3, and the blowing direction of described fan 4 is towards described heater 3;
And panel 5, described panel 5 is installed on the opposite side of described printed circuit board (PCB) 2。
The centre position of described printed circuit board (PCB) 2 is provided with temperature sensor 9, and described temperature sensor 9 controls the switch of described heater 3。
In the present embodiment, heater 3 can promote temperature, the rotation of fan 4 enables to hot-air and is evenly distributed in casing 1, it is to avoid local temperature is too high。
Embodiment 2
As in figure 2 it is shown, a kind of electronic equipment, including
Casing 1, described casing 1 is internal has to install the cavity of electronic devices and components;
Printed circuit board (PCB) 2, it is internal that described printed circuit board (PCB) 2 is fixedly installed in described casing 1;
Heater 3, described heater 3 is arranged at the side of described printed circuit board (PCB) 2;
Fan 4, described fan 4 is in the opposite side of described heater 3, and the blowing direction of described fan 4 is towards described heater 3;
And panel 5, described panel 5 is installed on the opposite side of described printed circuit board (PCB) 2。
Different from embodiment 1 are in that, in the present embodiment, described casing 1 is internally provided with air channel 6, and described air channel 6 is arranged along the blowing direction of described fan 4。
Being uniformly dispersed in order to ensure hot-air, described air channel 6 has two, is respectively arranged at the both sides of described printed circuit board (PCB) 2。
Described air channel 6 offers some wind distributing holes towards described printed circuit board (PCB)。
Meanwhile, heater 3 adopts spiral heating wire, and described spiral heating wire is installed in a resistant to elevated temperatures housing 7, and described housing 7 connects with described air channel 6。
Embodiment 3
As it is shown on figure 3, as in figure 2 it is shown, a kind of electronic equipment, including
Casing 1, described casing 1 is internal has to install the cavity of electronic devices and components;
Printed circuit board (PCB) 2, it is internal that described printed circuit board (PCB) 2 is fixedly installed in described casing 1;
Heater 3, described heater 3 is arranged at the side of described printed circuit board (PCB) 2;
Fan 4, described fan 4 is in the opposite side of described heater 3, and the blowing direction of described fan 4 is towards described heater 3;
And panel 5, described panel 5 is installed on the opposite side of described printed circuit board (PCB) 2。
Described casing 1 is internally provided with air channel 6, and described air channel 6 is arranged along the blowing direction of described fan 4。
Being uniformly dispersed in order to ensure hot-air, described air channel 6 has two, is respectively arranged at the both sides of described printed circuit board (PCB) 2。
Described air channel 6 offers some wind distributing holes towards described printed circuit board (PCB)。
Meanwhile, heater 3 adopts spiral heating wire, and described spiral heating wire is installed in a resistant to elevated temperatures housing 7, and described housing 7 connects with described air channel 6。
Different from embodiment 2 are in that, in the present embodiment, are provided with baffle plate 8 between described panel 5 and described printed circuit board (PCB) 2。
Described baffle plate 8 is arc, has a flexure plane towards described panel 5, and namely the opening of flexure plane is towards printed circuit board (PCB) 2。
The above is only the better embodiment of the present invention, therefore all equivalences done according to the structure described in present patent application scope, feature and principle change or modify, and are all included within the scope of present patent application。
Claims (8)
1. an electronic equipment, it is characterised in that: include
Casing, described casing internal has to install the cavity of electronic devices and components;
Printed circuit board (PCB), described printed circuit board (PCB) is fixedly installed in described casing internal;
Heater, described heater is arranged at the side of described printed circuit board (PCB);
Fan, described fan is in the opposite side of described heater, and the blowing direction of described fan is towards described heater;
And panel, described panel is installed on the opposite side of described printed circuit board (PCB)。
2. a kind of electronic equipment as claimed in claim 1, it is characterised in that: the centre position of described printed circuit board (PCB) is provided with temperature sensor, and described temperature sensor controls the switch of described heater。
3. electronic equipment as claimed in claim 1 a kind of, it is characterised in that: described casing internal is provided with air channel, and described air channel is arranged along the blowing direction of described fan。
4. a kind of electronic equipment as claimed in claim 3, it is characterised in that: described air channel has two, is respectively arranged at the both sides of described printed circuit board (PCB)。
5. a kind of electronic equipment as claimed in claim 4, it is characterised in that: described air channel offers some wind distributing holes towards described printed circuit board (PCB)。
6. a kind of electronic equipment as claimed in claim 5, it is characterised in that: described heater adopts spiral heating wire, and described spiral heating wire is installed in a high temperature resistant housing, and described housing connects with described air channel。
7. a kind of electronic equipment as claimed in claim 1, it is characterised in that: it is provided with baffle plate between described panel and described printed circuit board (PCB)。
8. a kind of electronic equipment as claimed in claim 1, it is characterised in that: described baffle plate is arc, has a flexure plane towards described panel。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610231479.9A CN105704988A (en) | 2016-04-14 | 2016-04-14 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610231479.9A CN105704988A (en) | 2016-04-14 | 2016-04-14 | Electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105704988A true CN105704988A (en) | 2016-06-22 |
Family
ID=56216695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610231479.9A Pending CN105704988A (en) | 2016-04-14 | 2016-04-14 | Electronic device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105704988A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223880A (en) * | 1999-02-04 | 2000-08-11 | Teikoku Piston Ring Co Ltd | Cooling/heating device for dispenser device |
CN2914528Y (en) * | 2006-01-26 | 2007-06-20 | 深圳市艾立克电子有限公司 | Monitoring device heater assembly and sphericity camera with said assembly |
CN201765523U (en) * | 2010-07-27 | 2011-03-16 | 张焱 | Intelligent temperature control box |
CN204215121U (en) * | 2014-09-09 | 2015-03-18 | 张刚 | A kind of outdoor liquid crystal display heat abstractor |
-
2016
- 2016-04-14 CN CN201610231479.9A patent/CN105704988A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223880A (en) * | 1999-02-04 | 2000-08-11 | Teikoku Piston Ring Co Ltd | Cooling/heating device for dispenser device |
CN2914528Y (en) * | 2006-01-26 | 2007-06-20 | 深圳市艾立克电子有限公司 | Monitoring device heater assembly and sphericity camera with said assembly |
CN201765523U (en) * | 2010-07-27 | 2011-03-16 | 张焱 | Intelligent temperature control box |
CN204215121U (en) * | 2014-09-09 | 2015-03-18 | 张刚 | A kind of outdoor liquid crystal display heat abstractor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7724521B2 (en) | Systems and methods for Venturi fan-assisted cooling | |
CN102455760A (en) | Cabinet | |
CN207604129U (en) | A kind of PCB circuit board cabinet cooling device | |
CN102548347B (en) | Electronic equipment | |
CN204155199U (en) | A kind of heat-radiating chassis for computer | |
TW200516378A (en) | Computer device and heat dissipation module thereof | |
CN105704988A (en) | Electronic device | |
CN205266089U (en) | Novel network cabinet | |
CN206302348U (en) | A kind of radiating structure of frequency converter | |
CN103717034A (en) | Heat dissipation module and electronic device | |
CN103596411A (en) | Modularized combinable heat pipe cabinet | |
US20170231109A1 (en) | Communication system and communication device therefor | |
CN106163237A (en) | A kind of heat abstractor and electronic equipment | |
CN104902734A (en) | Dustproof electrical cabinet | |
CN204906947U (en) | Natural cooling formula servo driver switch board | |
CN209495292U (en) | Airport oriented identification | |
CN208369932U (en) | A kind of PCBA board with radiator structure | |
CN206855950U (en) | Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box | |
CN206100745U (en) | Forced air cooling circuit isolation structure | |
US20140049916A1 (en) | Heat dissipation fan and power device | |
CN101466239B (en) | Radiating module and electronic device applying the same | |
CN205227431U (en) | High -power electromagnetism stove heat abstractor of three -phase | |
CN107053623A (en) | Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system | |
CN207865533U (en) | The control device and heater of double temperature sensor | |
CN202151034U (en) | Radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |