CN107053623A - Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system - Google Patents
Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system Download PDFInfo
- Publication number
- CN107053623A CN107053623A CN201710304672.5A CN201710304672A CN107053623A CN 107053623 A CN107053623 A CN 107053623A CN 201710304672 A CN201710304672 A CN 201710304672A CN 107053623 A CN107053623 A CN 107053623A
- Authority
- CN
- China
- Prior art keywords
- temperature control
- control box
- temperature
- radiator
- mounting bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 15
- 230000037237 body shape Effects 0.000 claims description 9
- 210000002445 nipple Anatomy 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 235000012149 noodles Nutrition 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 9
- 238000007710 freezing Methods 0.000 abstract 1
- 230000008014 freezing Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7306—Control circuits therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
- B29C2045/2743—Electrical heating element constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
- B29C2045/2753—Heating means and cooling means, e.g. heating the runner nozzle and cooling the nozzle tip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76531—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76655—Location of control
- B29C2945/76732—Mould
- B29C2945/76752—Mould runners, nozzles
Abstract
The invention discloses a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system, the temperature control box includes being provided with one or more groups of semiconductor controlled silicon refrigeration heating constant-temperature equipments or SSR solid-state relay components being close together in shell body, the inner housing in shell body, inner housing；The semiconductor controlled silicon refrigeration heating constant-temperature equipment in cavity to freezing and heat being passed through into radiator heat-dissipation to outside, the SSR solid-state relays component need not freeze, it is to external cooling directly by radiator, wherein square or polygon-shaped fit shell can also be to external cooling, precision hot flow path temperature control box of the invention uses full-enclosed structure, traditional fan blade is not used directly to radiate with turning in casing, it can prevent dust from entering temperature control box, and then prevent dust electron element from bringing damage.Semiconductor controlled silicon refrigeration heating constant-temperature equipment is provided with temperature control box, can be effectively by the temperature control in temperature control box in the range of needs.
Description
Technical field
The present invention relates to injection moulding hot runner technical field, a kind of totally-enclosed, high efficiency and heat radiation precision is particularly related to
Hot flow path temperature control box and its control system.
Background technology
Existing hot flow path temperature control box has following weak point：
1. volume is big；
2. band fan blade in casing directly with turning on, dust easily enters in casing, and it is bad to radiate；
3. temperature control is unstable（Easily influenced by ambient temperature and temperature drift and deviation）；
4.SCR easily heating burn out and its signal conversion（Analog signal turns data signal）Cause temperature inaccurate untrue straight
See；
5. temperature deviation and skew are big；
6. fan directly can cause dust to enter the member that electronic component etc. in casing causes whole system above with conducting in casing
Part is accelerated aging life-span and shortened；
7. existing hot flow path temperature control（Card）The various cost of case complex circuit electronic component is higher.
The content of the invention
For deficiency of the prior art, the technical problem to be solved in the present invention is the provision of a kind of totally-enclosed, efficient
The accurate hot flow path temperature control box and its control system of radiating.
In order to solve the above technical problems, the present invention is realized by following scheme：A kind of totally-enclosed, high efficiency and heat radiation precision
Hot flow path temperature control box, the temperature control box includes shell body, the inner housing in shell body, and the shell body is square or polygon
Body shape, its front/rear end is perforate, has touching display screen or an eyeglass in the capping of its front end face, and touching display screen or eyeglass are by shell
Body front end face closure；
The inner housing includes preceding mounting bracket, rear mounting bracket and is arranged at square or polygon between preceding mounting bracket and rear mounting bracket
Shape box body, the preceding mounting bracket upper end is inwardly vertically turned down, and its front end face installs touch-control PCBA board, and the rear side of mounting bracket four is complete
Portion is inwardly vertically turned down, and it turns down and some screw holes are provided with side plate, and turnover side plate maintains an equal level with shell body opening surface, forms outer
In die cavity in the rear shrouding of housing, square or polygonal body shape box body, it is provided with and one or more groups of is close to semiconductor controlled silicon
Freeze heating constant-temperature equipment or SSR solid-state relay components, and the controllable silicon refrigeration heating constant-temperature equipment is by radiator to case
External radiating, the SSR solid-state relays component need not freeze, directly by radiator to external cooling；Wherein radiate
Mode radiates also by square or polygonal body shape box body shell to outside casing；
The semiconductor controlled silicon refrigeration heating constant-temperature equipment includes mounting bracket, cooling piece, thyristor, radiator, described
Mounting bracket outer end is provided with an aperture, radiator is installed on each aperture, radiator is screwed at mounting bracket aperture,
And radiator closes aperture, the whole temperature control box back side is set to form sealing surface；
Shell radiating that the hot face of the cooling piece is fitted and connected with the medial surface of radiator or cooling piece is fitted, the controllable silicon member
The huyashi-chuuka (cold chinese-style noodles) of part and cooling piece is fitted and connected.
Further, the shell body right flank is provided with aviation plug aperture, and its left surface is provided with PG nipple orifices, aviation
It is provided with plug aperture at aviation socket, PG nipple orifices and is provided with PG joints, the aviation socket, PG joints is installed on inner housing
On.
Further, the inner housing leaves one section of chamber and is used to install to be provided with Wiring module, the Wiring module
Air switch, the air switch is provided with inner casing outside.
Further, PCBA control panels are installed on the mounting bracket, the PCBA control panels are with its place with the half of intracavitary
Conductor controllable silicon refrigeration heating constant-temperature equipment be electrically connected with, for control semiconductor controlled silicon freeze heating constant-temperature equipment refrigeration or
Heated constant temperature, the PCBA control panels are electrically connected with Wiring module, and the PCBA control panels are provided with temperature control module and display mould
Block.
Further, the radiator at least includes aluminium radiator or copper radiator.
A kind of accurate hot flow path temperature control box control system, the control system is connected with touching display screen and semiconductor controlled silicon
Freeze heating constant-temperature equipment.
Further, the touching display screen is at least provided with temperature display module, current in temperature control box for showing
Temperature value.
Further,：The control system is complete digital signal SSR control systems.
Relative to prior art, the beneficial effects of the invention are as follows：Precision hot flow path temperature control box of the invention uses totally enclosed type
Structure, does not use traditional fan blade and is directly radiated with being turned in casing, can prevent dust from entering temperature control box, and then prevent ash
Dirt electron element brings damage and accelerated ageing.
Semiconductor controlled silicon refrigeration heating constant-temperature equipment is provided with temperature control box, can be effectively by the temperature in temperature control box
Degree control is in the range of needs, and temperature control box of the present invention is stable, and manufacturing cost is relatively low, smaller than traditional temperature control box volume
A lot, the space beside injection machine is prevented take up.
Due to totally enclosed type temperature control box, dust will not be entered, and then extend the service life of electronic component.
Brief description of the drawings
Fig. 1 is outward appearance leading flank stereogram of the present invention；
Fig. 2 is inner housing of the present invention and mounting bracket structural representation；
Fig. 3 is temperature control box right flank schematic diagram of the present invention；
Fig. 4 is temperature control box trailing flank schematic diagram of the present invention；
Fig. 5 is inner housing internal structure schematic diagram of the present invention；
Fig. 6 is semiconductor controlled silicon of the present invention refrigeration heating constant-temperature equipment schematic diagram；
Fig. 7 is semiconductor controlled silicon of the present invention refrigeration heating constant-temperature equipment stereogram；
Fig. 8 is warm control cabinet control system circuit theory diagram of the invention.
Fig. 9 is temperature control box control system circuit figure of the invention；
Figure 10 is aviation plug circuit of output terminal figure of the present invention；
Figure 11 is Fig. 9 a portions enlarged drawing；
Figure 12 is Fig. 9 b portions enlarged drawing；
Figure 13 is Fig. 9 c portions enlarged drawing；
Figure 14 is Fig. 9 d portions enlarged drawing；
Figure 15 is Fig. 9 e portions enlarged drawing；
Figure 16 is Fig. 9 f portions enlarged drawing；
Figure 17 is Fig. 9 g portions enlarged drawing；
Figure 18 is Fig. 9 h portions enlarged drawing；
Figure 19 is Fig. 9 i portions enlarged drawing；
Figure 20 is Fig. 9 j portions enlarged drawing；
Figure 21 is Fig. 9 K portions enlarged drawing；
Figure 22 is Fig. 9 l portions enlarged drawing；
Figure 23 is Figure 10 m portions enlarged drawing；
Figure 24 is Figure 10 n portions enlarged drawing；
Figure 25 is Figure 10 o portions enlarged drawing.
Embodiment
The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
It refer to accompanying drawing 1-7, a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box of the invention, the temperature control box
Inner housing 112 including shell body 101, in shell body, the shell body 101 is square or polygonal body shape, before and after it
End face is perforate, has touching display screen or eyeglass in the capping of its front end face, touching display screen or eyeglass seal shell body front end face
Close；
The inner housing 112 include preceding mounting bracket, rear mounting bracket and be arranged at square between preceding mounting bracket and rear mounting bracket or
Polygon box body, the preceding mounting bracket upper end is inwardly vertically turned down, and its front end face installs touch-control PCBA board, the rear mounting bracket four
Side all inwardly vertical turnovers, it is turned down and some screw holes is provided with side plate, and turnover side plate is held with the opening surface of shell body 101
It is flat, formed in the die cavity in the rear shrouding of shell body, square or polygonal body shape box body, be provided with and one or more groups of be close to partly lead
Body controllable silicon refrigeration heating constant-temperature equipment 109 or SSR solid-state relay components, the controllable silicon refrigeration heating constant-temperature equipment 109
Radiated by radiator 106 to outside casing, the SSR solid-state relays component need not freeze, directly by radiator 106 to
External cooling；The mode wherein radiated radiates also by square or polygonal body shape box body shell to outside casing；
Semiconductor controlled silicon refrigeration heating constant-temperature equipment 109 include mounting bracket 114, cooling piece 111, thyristor 110,
Radiator 106, the outer end of mounting bracket 114 is provided with an aperture, and radiator 106 is installed on each aperture, and radiator 106 passes through
Screw is fixed at the aperture of mounting bracket 114, and radiator 106 closes aperture, the whole temperature control box back side is formed sealing surface；
The radiating of the hot face of the cooling piece 111 is fitted and connected with the medial surface of radiator 106 or cooling piece is fitted shell, it is described can
The huyashi-chuuka (cold chinese-style noodles) of control silicon cell 110 and cooling piece 111 is fitted and connected.
The right flank of shell body 101 is provided with aviation plug aperture, and its left surface is provided with PG nipple orifices, aviation plug aperture
Place, which is provided with aviation socket 108, PG nipple orifices, is provided with PG joints 105, and the aviation socket 108, PG joints 105 are installed on
On inner housing 112.
The inner housing 112, which leaves one section of chamber, to be used to install to be provided with Wiring module 113, the Wiring module 113
Air switch 107, the air switch 107 is provided with the lateral surface of inner housing 112.
PCBA control panels are installed on the mounting bracket 114, the PCBA control panels can with the semiconductor where it with intracavitary
Control silicon refrigeration heating constant-temperature equipment 109 be electrically connected with, for control semiconductor controlled silicon freeze heating constant-temperature equipment 109 freeze or
Heated constant temperature, the PCBA control panels are electrically connected with Wiring module 113, and the PCBA control panels are provided with temperature control module and display
Module.
The radiator 106 at least includes aluminium radiator or copper radiator.
A kind of accurate hot flow path temperature control box control system of the present invention, the control system is connected with touching display screen and partly led
Body controllable silicon refrigeration heating constant-temperature equipment 109.
The touching display screen is at least provided with temperature display module, for showing temperature value current in temperature control box.
The control system is complete digital signal SSR control systems.
Precision hot flow path temperature control box of the invention uses full-enclosed structure, does not use traditional fan blade fan directly and case
Conducting radiating, can prevent dust from entering temperature control box, and then prevent dust electron element from bringing damage in vivo.
Semiconductor controlled silicon refrigeration heating constant-temperature equipment is provided with temperature control box, can be effectively by the temperature in temperature control box
Degree control is in the range of needs, and temperature control box of the present invention is stable precisely, and manufacturing cost is relatively low, than traditional temperature control box volume
It is much smaller, prevent take up the space beside injection machine.
Due to totally enclosed type temperature control box, dust will not be entered, and then extend the service life of electronic component.
As shown in Fig. 8-25, the control system circuit figure of temperature control box of the invention, including control circuit, the control circuit bag
Include CPU main circuits and the operation circuit circuit being electrically connected with CPU main circuits, represent loop circuit, output loop circuit, temperature
Circuit is determined, the output end of the temperature measuring circuit is electrically connected with cooling piece, and the cooling piece is also electrically connected with output loop
Circuit.
The preferred embodiment of the present invention is the foregoing is only, is not intended to limit the scope of the invention, every profit
The equivalent structure or equivalent flow conversion made with description of the invention and accompanying drawing content, or directly or indirectly it is used in other phases
The technical field of pass, is included within the scope of the present invention.
Claims (8)
1. a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box, the temperature control box includes shell body（101）, located at shell
Internal inner housing（112）, it is characterised in that：The shell body（101）For square or polygonal body shape, its front/rear end is to open
, there are touching display screen or an eyeglass in hole in the capping of its front end face, and touching display screen or eyeglass are by shell body front end face closure；
The inner housing（112）Including preceding mounting bracket, rear mounting bracket and it is arranged at square between preceding mounting bracket and rear mounting bracket
Or polygon box body, the preceding mounting bracket upper end inwardly vertically turns down, and its front end face installs touch-control PCBA board, the rear mounting bracket
The all inwardly vertical turnovers of four sides, it turns down and some screw holes is provided with side plate, turnover side plate and shell body（101）Opening surface
Maintain an equal level, formed in the die cavity in the rear shrouding of shell body, square or polygonal body shape box body, be provided with one or more groups of be close to partly
Conductor controllable silicon refrigeration heating constant-temperature equipment（109）Or SSR solid-state relay components, the controllable silicon refrigeration heating constant-temperature equipment
（109）Pass through radiator（106）Radiated to outside casing, the SSR solid-state relays component need not freeze, directly pass through radiating
Device（106）To external cooling；The mode wherein radiated dissipates also by square or polygonal body shape box body shell to outside casing
Heat；
The semiconductor controlled silicon refrigeration heating constant-temperature equipment（109）Including mounting bracket（114）, cooling piece（111）, controllable silicon member
Part（110）, radiator（106）, the mounting bracket（114）Outer end is provided with an aperture, and radiator is installed on each aperture（106）,
Radiator（106）It is screwed in mounting bracket（114）At aperture, and radiator（106）Aperture is closed, makes whole temperature control
The case back side forms sealing surface；
The cooling piece（111）Hot face and radiator（106）Medial surface be fitted and connected or cooling piece laminating shell radiating, institute
State thyristor（110）With cooling piece（111）Huyashi-chuuka (cold chinese-style noodles) be fitted and connected.
2. a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box according to claim 1, it is characterised in that：Institute
State shell body（101）Right flank is provided with aviation plug aperture, and its left surface is provided with PG nipple orifices, aviation plug aperture and is provided with
Aviation socket（108）, PG joints are provided with PG nipple orifices（105）, the aviation socket（108）, PG joints（105）It is installed on
Inner housing（112）On.
3. a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box according to claim 1, it is characterised in that：Institute
State inner housing（112）Leaving one section of chamber is used to install Wiring module（113）, the Wiring module（113）On be provided with air
Switch（107）, the air switch（107）It is provided with inner housing（112）Lateral surface.
4. a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box according to claim 3, it is characterised in that：Institute
State mounting bracket（114）On PCBA control panels are installed, the PCBA control panels with its where with intracavitary semiconductor controlled silicon freeze
Heating constant-temperature equipment（109）It is electrically connected with, for controlling semiconductor controlled silicon refrigeration heating constant-temperature equipment（109）Refrigeration is heated
Constant temperature, the PCBA control panels and Wiring module（113）It is electrically connected with, the PCBA control panels are provided with temperature control module and display mould
Block.
5. a kind of totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box according to claim 1, it is characterised in that：Institute
State radiator（106）At least include aluminium radiator or copper radiator.
6. a kind of accurate hot flow path temperature control box control system with described in claim 1-5 any one, it is characterised in that：The control
System processed is connected with touching display screen and semiconductor controlled silicon refrigeration heating constant-temperature equipment（109）.
7. control system according to claim 6, it is characterised in that：The touching display screen is shown at least provided with temperature
Module, for showing temperature value current in temperature control box.
8. control system according to claim 6, it is characterised in that：The control system controls for complete digital signal SSR
System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710304672.5A CN107053623A (en) | 2017-05-03 | 2017-05-03 | Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710304672.5A CN107053623A (en) | 2017-05-03 | 2017-05-03 | Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107053623A true CN107053623A (en) | 2017-08-18 |
Family
ID=59597668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710304672.5A Pending CN107053623A (en) | 2017-05-03 | 2017-05-03 | Totally-enclosed, high efficiency and heat radiation accurate hot flow path temperature control box and its control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107053623A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107643780A (en) * | 2017-11-10 | 2018-01-30 | 南京林业大学 | A kind of remote controlled temperature control system |
-
2017
- 2017-05-03 CN CN201710304672.5A patent/CN107053623A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107643780A (en) * | 2017-11-10 | 2018-01-30 | 南京林业大学 | A kind of remote controlled temperature control system |
| CN107643780B (en) * | 2017-11-10 | 2024-02-02 | 南京林业大学 | Remote-control temperature control system |
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