CN105704953B - The processing method and electronic equipment of electronic equipment casing - Google Patents
The processing method and electronic equipment of electronic equipment casing Download PDFInfo
- Publication number
- CN105704953B CN105704953B CN201610221555.8A CN201610221555A CN105704953B CN 105704953 B CN105704953 B CN 105704953B CN 201610221555 A CN201610221555 A CN 201610221555A CN 105704953 B CN105704953 B CN 105704953B
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- shell
- support frame
- electronic equipment
- frame
- processing method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses the processing methods of the shell of a kind of electronic equipment comprising: 1) prepare support frame；2) so that the first shell of electronic equipment and second shell is assembled to form electronic component accommodating cavity, be located at support frame in above-mentioned electronic component accommodating cavity, and make support frame support between first shell and second shell, to enhance the intensity of first shell.There is the step of processing and setting support frame in the processing method, support frame can enhance the intensity of first shell, first shell is facilitated to be set as the smaller but light-weight plastic casing of intensity, it is lightening conducive to electronic equipment realization, and ensure that the intensity of first shell meets the actual use needs of electronic equipment.The present invention also provides a kind of electronic equipment, the shell of the electronic equipment is using shell made of above-mentioned processing method, light-weight plastic casing is used convenient for shell, had both facilitated the electronic equipment to realize lightening, and had also ensured that plastic casing met the intensity needs of practical application.
Description
Technical field
The present invention relates to Mechanical Industry Technology fields, more specifically to the processing side of the shell of a kind of electronic equipment
Method further relates to a kind of electronic equipment.
Background technique
With the development of society, electronic equipment is applied to people's production and life more and more widely.
Currently, electronic equipment develops to lightening direction, correspondingly, the shell of electronic equipment is intended to be taken by plastic shell
For existing metal shell, to mitigate the weight of electronic equipment, still, the intensity of plastic shell is smaller, it is difficult to meet electronics and set
Standby actual use needs.
In conclusion shell energy can either be also ensured that using light-weight plastic shell by how making the shell of electronic equipment
Enough meet intensity needs, is those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
In view of this, the present invention provides the processing method of the shell of a kind of electronic equipment, support frame is first prepared, then make to prop up
Support support between first shell and second shell, to enhance the intensity of first shell, facilitate first shell be set as intensity compared with
It is lightening to be conducive to electronic equipment realization for small but light-weight plastic casing.The present invention also provides a kind of electronic equipment, the electronics
The shell of equipment is to enable the first shell of shell using light-weight plastic cement using shell made of above-mentioned processing method
Shell had not only ensured that its intensity can satisfy actual use needs, but also lightening convenient for electronic equipment realization.
To achieve the above object, the invention provides the following technical scheme:
The processing method of the shell of a kind of electronic equipment, comprising:
1) support frame is prepared；
2) so that the first shell of electronic equipment and second shell is assembled to form electronic component accommodating cavity, make support frame as described above position
In in the electronic component accommodating cavity, and make support frame as described above support between the first shell and the second shell, to increase
The intensity of the strong first shell.
Preferably, in above-mentioned processing method, support frame as described above is frame like structure.
Preferably, in above-mentioned processing method, the step 1) are as follows:
11) carbon cloth is wrapped on mold and forms carbon fiber cloth frame；
12) solidify carbon fiber cloth frame by the way of heating pressurization；
13) make cured carbon fiber cloth frame by taking off on the mold, and the carbon fiber cloth frame is made to form support frame.
Preferably, " the carbon fiber cloth frame is made to form support frame " in above-mentioned processing method, in the step 13) specific
Are as follows:
By the carbon fiber cloth frame it is axially cutting along its be multiple frame like structure with preset thickness, and with above-mentioned through cutting
The frame like structure to be formed is cut as support frame.
Preferably, it in above-mentioned processing method, needs that the carbon fiber cloth frame is pressurizeed and is solidified into the step 12) to have
The carbon fiber cloth frame of default exterior contour.
Preferably, in above-mentioned processing method, the mode of heating pressurization refers in the first temperature range in the step 12)
To carbon fiber cloth frame pressurization preset time.
Preferably, in above-mentioned processing method, between the step 1) and the step 2) further include:
012) it is fixedly connected with support frame as described above with the first shell.
Preferably, in above-mentioned processing method, the first shell is plastic casing, the step 012) specifically: in institute
Stating makes support frame be combined as a whole by in-molded mode and the first shell in first shell injection moulding process.
A kind of electronic equipment, including shell, the shell include first shell, second shell and support frame；Described first
Shell is plastic casing, and support frame as described above is located at the electronic component accommodating that the first shell and the second shell are assembled to form
It is intracavitary, and support between the first shell and the second shell, for enhancing the intensity of the first shell；
Wherein, the shell is shell made of the processing method described in any one of above-mentioned technical proposal.
Preferably, in above-mentioned electronic equipment, support frame as described above is frame like structure, and support frame as described above circle is in the electronics
The periphery of the display screen of equipment.
The present invention provides the processing method of the shell of a kind of electronic equipment comprising: 1) prepare support frame；2) set electronics
Standby first shell and second shell is assembled to form electronic component accommodating cavity, and support frame is made to be located at above-mentioned electronic component accommodating cavity
It is interior, and make support frame support between first shell and second shell, to enhance the intensity of first shell.
There is the step of processing and setting support frame in the processing method, support frame can enhance the intensity of first shell,
Facilitate first shell to be set as the smaller but light-weight plastic casing of intensity, is conducive to electronic equipment and realizes lightening, and ensure the
The intensity of one shell meets the actual use needs of electronic equipment.
The present invention also provides a kind of electronic equipment, the shell of the electronic equipment is using shell made of above-mentioned processing method
Body uses light-weight plastic casing convenient for shell, has both facilitated the electronic equipment to realize lightening, also ensures that plastic casing meets
The intensity of practical application needs.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of the processing method of the shell of electronic equipment provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of electronic equipment provided in an embodiment of the present invention；
Fig. 3 is the cross-sectional view of A-A in Fig. 2；
Wherein, in Fig. 2-Fig. 3:
Support frame 101；First shell 102；Display screen 103；Second shell 104.
Specific embodiment
The embodiment of the invention discloses the processing methods of the shell of a kind of electronic equipment, first prepare support frame, then make to prop up
Support support between first shell and second shell, to enhance the intensity of first shell, facilitate first shell be set as intensity compared with
It is lightening to be conducive to electronic equipment realization for small but light-weight plastic casing.The embodiment of the invention also discloses a kind of electronic equipment,
The shell of the electronic equipment is to enable the first shell of shell using light-weight using shell made of above-mentioned processing method
Plastic casing, not only ensured its intensity can satisfy actual use needs, but also convenient for the electronic equipment realization it is lightening.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-Fig. 3 is please referred to, the embodiment of the present invention provides the processing method of the shell of a kind of electronic equipment comprising: 1)
Prepare support frame 101；2) first shell 102 and second shell 104 for making electronic equipment are assembled to form electronic component accommodating cavity, make
Support frame 101 is located in above-mentioned electronic component accommodating cavity, and make the support of support frame 101 first shell 102 and second shell 104 it
Between, to enhance the intensity of first shell 102.
There is the step of processing and setting support frame 101, support frame 101 can enhance first shell in the processing method
102 intensity facilitates first shell 102 to be set as the smaller but light-weight plastic casing of intensity, is conducive to electronic equipment and realizes gently
Thinning, and ensure that the intensity of first shell 102 meets the actual use needs of electronic equipment.
Above-mentioned steps 1) prepared by support frame 101 be preferably arranged to frame like structure, so that it is circumferentially supportted in first shell
Between body 102 and second shell 104, making first shell 102, intensity is enhanced everywhere, avoids first shell 102 because everywhere
Intensity is uneven and causes easy to damage at strength weak.Certainly, above-mentioned steps 1) prepared by support frame 101 may also be configured to item
Shape structure, the present embodiment are not specifically limited.
In order to further improve the lightening degree of electronic equipment, above-mentioned support frame 101 preferably uses light-weight material
Material is made, such as carbon cloth, correspondingly, step 1) specifically includes:
11) carbon cloth is wrapped on mold and forms carbon fiber cloth frame；
12) solidify carbon cloth by the way of heating pressurization；
13) make cured carbon fiber cloth frame by taking off on mold, and carbon fiber cloth frame is made to form the branch of above-mentioned frame like structure
Support 101.
It is small along axial size since support frame 101 is clipped between first shell 102 and second shell 104, therefore at it
The carbon cloth winding preparation of narrower width can be used in preparation process, but in order to improve preparation efficiency, reduce batch preparation branch
The spent energy, above-mentioned steps 11 during support 101) it is middle using the biggish carbon cloth of width, and it is wound in tubular
Carbon fiber cloth frame, correspondingly, " carbon fiber cloth frame is made to form support frame 101 " in step 13) specifically:
The carbon fiber cloth frame of tubular is axially cutting for multiple frame like structure with default axial width along its, and more than
The frame like structure formed through cutting is stated as support frame 101.CNC (Computerized Numerical can be used when cutting
Control Machine, calculator numerically-controlled machine tool) cutter head.
In order to cooperate the spatial form in electronic component accommodating cavity, in processing method provided by the above embodiment, step 12)
It is middle to pressurize to carbon fiber cloth frame and be allowed to finally be solidified into the carbon fiber cloth frame with default exterior contour, tool specifically can be used
There is the mold of default outer shape, directly carbon fiber cloth frame is pressed on above-mentioned mold when step 12).
" mode of heating pressurization " refers in the first preset range to carbon cloth in the step 12) of the embodiment above
Frame pressurization preset time.Above-mentioned first preset temperature range is set as 100 DEG C -200 DEG C, and preset time may be configured as 20min-1h
Any time in range.
Support frame 101 may be configured as only being clipped in without connecting with two housings between first shell 102 and second shell 104,
But it shakes in electronic component accommodating cavity and damages electronic component in order to prevent, and support frame 101 is preferably arranged to and first shell
Body 102 and/or second shell 104 are fixedly connected.
Further, support frame 101 is more preferably set as only solid with first shell 102 and 104 one of both of second shell
Fixed connection, to reduce to the accuracy of manufacture of first shell 102, second shell 104 and the requirement of assembly precision.
Specifically, between step 1) and step 2) further include:
012) it is fixedly connected with support frame 101 with first shell 102.
In above scheme, first shell 102 is plastic casing, is connected for the ease of first shell 102 and support frame 101 are fixed
It connects, step 012) may be configured as: support frame 101 being made to pass through in-molded mode and the in 102 injection moulding process of first shell
One shell 102 is combined as a whole；Even if support frame 101 is arranged in the mold for manufacturing first shell 102 as insertion piece,
And it is fixedly connected during so that plastic material is cured as first shell 102 with above-mentioned support frame 101.
Specifically, above-mentioned second shell 104 is equipped with the open-work for appearing display screen 103, need to make when step 2)
The support frame 101 of frame like structure encloses outside above-mentioned open-work.
The embodiment of the present invention also provides a kind of electronic equipment, including shell, and shell includes first shell 102, second shell
104 and support frame 101, first shell 102 is plastic casing, and support frame 101 is located at first shell 102 and the dress of second shell 104
It in electronic component accommodating cavity with formation, and supports between first shell 102 and second shell 104, for enhancing first shell
102 intensity, wherein shell is manufactured shell using processing method provided by the above embodiment.
Specifically, support frame 101 is frame like structure, and the circle of support frame 101 is in electronic equipment in above-mentioned electronic equipment
Power is transferred to display screen 103 by support frame 101 when for preventing 102 stress of first shell by the periphery of display screen 103, is prevented
Only display screen 103 is impaired.
Shell is made using processing method provided by the above embodiment in electronic equipment provided in an embodiment of the present invention, and first
Support has support frame 101 between shell 102 and second shell 104, uses light-weight plastic casing convenient for first shell 102, both
Facilitate the electronic equipment to realize lightening, and plastic casing is made to meet the intensity needs of practical application.Certainly, the embodiment of the present invention
The electronic equipment of offer also has other effects provided by the above embodiment in relation to processing method, and details are not described herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (8)
1. the processing method of the shell of a kind of electronic equipment characterized by comprising
1) support frame is prepared；
2) so that the first shell of electronic equipment and second shell is assembled to form electronic component accommodating cavity, support frame as described above is made to be located at institute
It states in electronic component accommodating cavity, and makes support frame as described above support between the first shell and the second shell, to enhance
State the intensity of first shell；
The step 1) are as follows:
11) carbon cloth is wrapped on mold and forms carbon fiber cloth frame；
12) solidify carbon fiber cloth frame by the way of heating pressurization；
13) make cured carbon fiber cloth frame by taking off on the mold, and the carbon fiber cloth frame is made to form support frame；
" the carbon fiber cloth frame is made to form support frame " in the step 13) specifically:
By the carbon fiber cloth frame along its it is axially cutting be multiple frame like structure with preset thickness, and with it is above-mentioned through cutting shape
At the frame like structure as support frame.
2. processing method according to claim 1, which is characterized in that support frame as described above is frame like structure.
3. processing method according to claim 1, which is characterized in that needed in the step 12) by the carbon fiber cloth frame
It pressurizes and is solidified into the carbon fiber cloth frame with default exterior contour.
4. processing method according to claim 1, which is characterized in that the mode of heating pressurization refers in the step 12)
In the first temperature range to carbon fiber cloth frame pressurization preset time.
5. processing method according to claim 1, which is characterized in that also wrapped between the step 1) and the step 2)
It includes:
012) it is fixedly connected with support frame as described above with the first shell.
6. processing method according to claim 5, which is characterized in that the first shell is plastic casing, the step
012) specifically: support frame is made to pass through in-molded mode and the first shell knot in the first shell injection moulding process
It is integrated.
7. a kind of electronic equipment, which is characterized in that including shell, the shell includes first shell, second shell and support frame；
The first shell is plastic casing, and support frame as described above is located at the electronics that the first shell and the second shell are assembled to form
It in element accommodating cavity, and supports between the first shell and the second shell, for enhancing the intensity of the first shell；
Wherein, the shell is the shell made of processing method as claimed in any one of claims 1 to 6.
8. electronic equipment according to claim 7, which is characterized in that support frame as described above is frame like structure, and the branch
Support circle is in the periphery of the display screen of the electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610221555.8A CN105704953B (en) | 2016-04-11 | 2016-04-11 | The processing method and electronic equipment of electronic equipment casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610221555.8A CN105704953B (en) | 2016-04-11 | 2016-04-11 | The processing method and electronic equipment of electronic equipment casing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105704953A CN105704953A (en) | 2016-06-22 |
| CN105704953B true CN105704953B (en) | 2019-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610221555.8A Active CN105704953B (en) | 2016-04-11 | 2016-04-11 | The processing method and electronic equipment of electronic equipment casing |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106112394B (en) * | 2016-06-27 | 2017-12-01 | 广东欧珀移动通信有限公司 | Shell-machining process and housing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202210908U (en) * | 2011-05-30 | 2012-05-02 | 黄春樱 | Structure combining composite material with plastic material |
| CN102618004A (en) * | 2011-01-26 | 2012-08-01 | 广州三星通信技术研究有限公司 | Reinforced support and portable terminal using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI304321B (en) * | 2002-12-27 | 2008-12-11 | Toray Industries | Layered products, electromagnetic wave shielding molded articles and method for production thereof |
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2016
- 2016-04-11 CN CN201610221555.8A patent/CN105704953B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618004A (en) * | 2011-01-26 | 2012-08-01 | 广州三星通信技术研究有限公司 | Reinforced support and portable terminal using the same |
| CN202210908U (en) * | 2011-05-30 | 2012-05-02 | 黄春樱 | Structure combining composite material with plastic material |
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| Publication number | Publication date |
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| CN105704953A (en) | 2016-06-22 |
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