CN105704929B - Printed circuit board, ic package and the method for manufacturing printed circuit board - Google Patents
Printed circuit board, ic package and the method for manufacturing printed circuit board Download PDFInfo
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- CN105704929B CN105704929B CN201610191858.XA CN201610191858A CN105704929B CN 105704929 B CN105704929 B CN 105704929B CN 201610191858 A CN201610191858 A CN 201610191858A CN 105704929 B CN105704929 B CN 105704929B
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- Prior art keywords
- substrate
- circuit board
- printed circuit
- upside
- moisture barrier
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A kind of printed circuit board, ic package and the method for manufacturing printed circuit board are provided, the printed circuit board includes substrate, circuit pattern, moisture barrier and moist absorbing layer.Wherein, circuit pattern is formed on the upper side and lower side of substrate with respectively with being electrically connected by the chip being formed on the upside and by the protrusion being formed on the downside.The outside of circuit pattern of the moisture barrier close to the edge of substrate and on the upside of substrate is formed in, is arranged on the upside of substrate around the circuit pattern, to prevent wet infiltration.The inside of moisture barrier of the moist absorbing layer on the upside of substrate is formed in is around the chip being formed on the upside of substrate is arranged on the upside of substrate, to absorb moisture.
Description
Technical field
An exemplary embodiment of the present invention relates to a kind of printed circuit board, a kind of integrated circuits including the printed circuit board
Packaging part and it is a kind of manufacture the printed circuit board method, in particular, be related to it is a kind of reduce moisture be impregnated with printed circuit board,
A kind of ic package including the printed circuit board and a kind of method for manufacturing the printed circuit board.
Background technology
With the extensive use of integrated circuit (IC) product, people propose higher want to the life and reliability of IC products
It asks.And the service life of IC products is largely influenced by moisture.Technique regardless of the IC package part for forming IC products, IC
Moisture infiltration inevitably occurs in encapsulating structure, can especially pass through epoxy molding compounds (EMC) and printing electricity
Interface between the plate of road and permeate, cause the degeneration of IC package part electrical property, so as to cause the deteriorated reliability of IC, and shorten and make
Use the service life.
Fig. 1 is the sectional view for showing integrated circuit (IC) packaging part 100 according to prior art.With reference to Fig. 1, IC package
Chip 120 and the setting that part 100 generally includes printed circuit board (PCB) 110, is adhered to by adhesion layer 160 on PCB 110
On PCB 110 and the encapsulated layer 130 of chip 120 is encapsulated, wherein, PCB 110 includes substrate 1101, is formed in substrate 1101
Circuit pattern (or pad) 1102 on side and the circuit pattern (or pad) 1103 being formed on the opposite side of substrate 1101.
Multiple solder bumps 140 are formed on circuit pattern or pad 1103 to be electrically connected with outside.Chip 120 can pass through key
It closes lead (as shown in Figure 1) or convex block (not shown) is electrically connected to pad 1102.In the IC package part of the above-mentioned prior art,
Moisture can penetrate into the inside of IC package part from external environment by the interface between encapsulated layer 130 and printed circuit board 110,
So as to increase the moisture content inside IC package part, make the electrical property of packaging part reduce, and shorten the service life of IC package part.
Accordingly, it is desirable to provide a kind of new printed circuit board to reduce moisture infiltration, thus improve IC package part can
By property and prolong the service life.
Invention content
In order to solve the above-mentioned problems in the prior art, exemplary embodiment of the present invention is designed to provide one
The improved printed circuit board of kind.
According to an aspect of the present invention, a kind of printed circuit board is provided, the printed circuit board includes substrate, circuit diagram
Case, moisture barrier and moist absorbing layer.Wherein, circuit pattern is formed on the upper side and lower side of substrate with respectively with that will be formed
Chip on the upside and the protrusion electrical connection that will be formed on the downside.Moisture barrier close to the edge of substrate simultaneously
The outside of circuit pattern on the upside of substrate is formed in is arranged on around the circuit pattern on the upside of substrate, with
Prevent wet infiltration.The inside of moisture barrier of the moist absorbing layer on the upside of substrate is formed in, which surrounds, will be formed in substrate
Chip on upside and be arranged on the upside of substrate, to absorb moisture.
The height of moisture barrier is more than 10 μm.
Moisture barrier is zigzag pattern.
The surface of moisture barrier is similar to the surface of lotus leaf to realize hydrophobic function.
Moisture barrier is utilized to be applied with the cream of nano SiO 2 particle wrapped up with hydrophobic group by dry solidification
It applies on the upside of substrate.
The height of moist absorbing layer is more than 10 μm.
Moist absorbing layer is in dendritic shape.
Moist absorbing layer is utilized to be applied with the cream of nano SiO 2 particle wrapped up with hydrophilic group by dry solidification
It applies on the upside of substrate.
According to an aspect of the present invention, a kind of method for manufacturing printed circuit board is provided, method includes：Prepare substrate；
Circuit pattern is formed on the upper side and lower side of substrate, with respectively with by the chip being formed on the upside and institute will be formed in
State the protrusion electrical connection on downside；Close to the edge of substrate and the outside of the circuit pattern on the upside of substrate is formed in, enclose
Moisture barrier is formed on the upside of substrate around the circuit pattern, to prevent moisture infiltration；And it is being formed in substrate
Upside on circuit pattern inside, moist absorbing layer is formed in substrate around by the chip being formed on the upside of substrate
Upside on, to absorb moisture.
In the step of forming moisture barrier, by the first cream is applied and is then dried curing come
Moisture barrier is formed on the upside of substrate.
In the step of forming moist absorbing layer, by the second cream is applied and is then dried curing come
Moist absorbing layer is formed on the upside of substrate.
First cream has the nano SiO 2 particle wrapped up with hydrophobic group.
Second cream has the nano SiO 2 particle wrapped up with hydrophilic group.
According to an aspect of the present invention, a kind of ic package is provided, ic package includes：Above-mentioned print
Printed circuit board；Chip is attached to by adhesion layer on the upside of printed circuit board；Bonding wire, electrical connection chip and printing electricity
Road plate；Encapsulated layer is arranged on the upside of printed circuit board and encapsulates chip；And solder bump, it is arranged on printed circuit board
Downside on.
Ic package further includes insulating layer, and insulating layer is formed on the downside of printed circuit board, so as to be formed in
Circuit pattern and exterior insulation on the downside of printed circuit board.
Description of the drawings
By the way that below in conjunction with description of the attached drawing to embodiment, these and/or other aspects will be apparent and be easier to manage
Solution, in the accompanying drawings：
Fig. 1 is the sectional view for showing ic package according to prior art.
Fig. 2 is the sectional view for showing IC package part accoding to exemplary embodiment.
Fig. 3 is the plan view for showing PCB accoding to exemplary embodiment.
Fig. 4 A to Fig. 4 C are the plan views of the method for the manufacture PCB of exemplary embodiment according to the present invention.
Specific embodiment
Now with reference to the attached drawing embodiment that the present invention is more fully described, the invention is shown in the accompanying drawings exemplary
Embodiment.However, the present invention can be embodied in many different forms, and it should not be construed as being limited to implementation set forth herein
Example.In the accompanying drawings, for clarity, the size and relative size of layer and region may be exaggerated.
For illustrative purposes, can be used herein such as " ... below ", " in ... lower section ", " under ", " ...
Top ", " on " etc. spatially relative terms the pass of elements or features and other elements or features as illustrated in the drawing described
System.Spatially relative term is intended to comprising the device other than the orientation being described in the drawings in using, operating and/or manufacturing
Different direction.For example, if the device in attached drawing is reversed, be described as other elements or features " lower section " or " below "
Element will then be positioned as " " other elements or features " top ".Therefore, exemplary term can wrap " in ... lower section "
Include " in ... top " and " in ... lower section " two kinds of orientation.In addition, described device can be by addition positioning (for example, being rotated by 90 °
Or in other orientation), and therefore correspondingly explain spatial relative descriptor used herein.Now hereinafter with reference to attached
The present invention is more fully described for figure.
Fig. 2 is the sectional view for showing IC package part accoding to exemplary embodiment.Reference Fig. 2, accoding to exemplary embodiment
IC package part 200 generally include printed circuit board (PCB) 210, the chip on PCB 210 be adhered to by adhesion layer 260
220 and the encapsulated layer 230 of chip 220 is arranged on PCB 210 and encapsulates, wherein, PCB 210 includes substrate 2101, is formed in
Circuit pattern (or pad) 2102 on the side of substrate 2101 and be formed on the opposite side of substrate 2101 circuit pattern (or
Pad) 2103.Substrate 2101 can be PCB commonly used in the art, be not particularly limited herein.Multiple solder bumps 240 are formed
To be electrically connected with outside on circuit pattern or pad 2103.Chip 220 can by bonding wire (as shown in Figure 2) or
Convex block (not shown) is electrically connected to pad 2102.
With reference to Fig. 2, moisture barrier 270 is close to the edge of substrate 2101 and positioned at being formed on the upside of substrate 2101
The outside of circuit pattern 2102 is arranged on the upside of substrate 2101 around circuit pattern 2102, to prevent moisture infiltration from arriving
The inside of IC package part.The height of the moisture barrier 270 of exemplary embodiment is arranged on about 10 μm or more, to stop moisture
Infiltration.It is however, without being limited thereto according to the height of the moisture barrier 270 of the exemplary embodiment of invention.With utilizing existing PCB's
Packaging technology is compared, and the use of moisture barrier 270 does not change the packaging technology of PCB.
Moist absorbing layer 280 can be on the upside of substrate 2101 be formed in moisture barrier 270 inside, and surround
The chip 220 being formed on the upside of substrate 2101 is arranged on the upside of substrate 2101, so as to absorb may pass through it is wet
Barrier layers and the moisture not being blocked so as to protect the chip of IC package part from the influence of moisture, extend IC package part
Service life.Specifically, the inside for the circuit pattern 2102 that moist absorbing layer 280 can be on the upside of substrate 2101 be formed in
And it surrounds and the chip 220 being formed on the upside of substrate 2101 is arranged on the upside of substrate 2101.Exemplary embodiment
The height of moist absorbing layer 280 be arranged on about 10 μm or more, to stop moisture infiltration.However, according to the exemplary of invention
The height of the moist absorbing layer 280 of embodiment is without being limited thereto.Compared with using the packaging technology of existing PCB, moist absorbing layer 280
Use do not change the packaging technology of PCB.The height of moist absorbing layer 280 can be equal with the height of moisture barrier 270,
It can be unequal.
Chip 220 can be adhered to or on the top surface of PCB 210 by adhesion layer 260.According to some examples reality
Example is applied, adhesion layer 260 can be adhesiveness film or liquid epoxies adhesive.But exemplary embodiment of the present invention is not
It is limited to this.
With reference to shown in Fig. 2, chip 220 can be electrically connected by bonding wire 250 (for example, gold thread) with PCB 210.So
And the present invention is not limited thereto, for example, chip 220 can pass through the interconnection of soldered ball, salient point, solder bump or copper bump etc.
Part realization is electrically connected with PCB's 210.In some embodiments, solder ball can be attached to the top surface of PCB 210 by pad.
In embodiments of the present invention, chip 220 is the silicon bare die for the top surface that PCB 210 is attached to by adhesion layer 260.Chip 220
PCB 210 is electrically connected to by bonding wire 250 and circuit pattern 2102.Circuit pattern 2102 can be positioned at the wet of PCB 210
Between barrier layers 270 and moist absorbing layer 280.According to other embodiments of the invention, circuit pattern 2102 may be located on
Between moist absorbing layer 280 and chip 220 or partial circuit pattern 2102 is located at moisture barrier 270 and moist absorbing layer
Between 280, partial circuit pattern 2102 is between moist absorbing layer 280 and chip 220.
Encapsulated layer 230 can be arranged on being attached on the surface of chip 220, and encapsulate entire PCB's for PCB 210
Upside so that chip 220 and makes chip 220 and exterior insulation from the influence of external environment (for example, moisture and/or air).
In other exemplary embodiments, encapsulated layer 230 can encapsulate chip 220.In addition, encapsulated layer 230 can include epoxy resin
Molding compounds, however the present invention is not limited thereto.
Multiple solder bumps 240 can be arranged on the downside of PCB 210, can utilize means commonly used in the art or method
Form multiple solder bumps 240.
Fig. 3 is the plan view of the PCB for the IC package part for showing Fig. 2 accoding to exemplary embodiment.Include with reference to Fig. 3, PCB
Substrate 2101, moisture barrier 270 and moist absorbing layer 280 and chip 220.
With reference to Fig. 3, moisture barrier 270 accoding to exemplary embodiment sets along the boundary of substrate 2101 and around core
Piece 220 and moist absorbing layer 280.Moisture barrier 270 is in quadrangle, however, the present invention is not limited thereto.Moisture barrier 270
Can be round, ellipse or hexagon etc..The edge of moisture barrier 270 forms zigzag pattern.In other exemplary implementations
In example, the edge of moisture barrier 270 can be zigzag, dendron shape, mandruka shape etc..Such as silk-screen printing can be passed through
Coating method by the SiO including being wrapped up with hydrophobic group R12On the cream patterning to the surface of substrate 2101 of nano particle, and
Moisture barrier 270 is obtained after dry solidification, wherein, hydrophobic group R1 can be silicate, but hydrophobic group R1 is without being limited thereto.According to
Lotus leaf surface is imitated with hydrophobicity, chip to be protected to be impregnated with from moisture in the surface of the moisture barrier 270 of exemplary embodiment.
With reference to Fig. 3, moist absorbing layer 280 is set between chip 220 and moisture barrier 270, and around chip 220
It puts.Moist absorbing layer has quadrangle form, however, the present invention is not limited thereto.Moist absorbing layer 280 can be round, oval
Shape or hexagon etc..The edge formation of moist absorbing layer 280 accoding to exemplary embodiment extends to the branch chart of chip 220
Case.In other exemplary embodiments, the edge of moist absorbing layer 280 can be zigzag, dendron shape, mandruka shape etc..It can
With by the coating of such as silk-screen printing by the SiO including being wrapped up with hydrophilic group R22The cream of nano particle is patterned to substrate
On 2101 surface, and moist absorbing layer 280 is obtained after dry solidification, the wet of moisture barrier 270 can be penetrated to absorb
Gas.So as to further chip be protected to be impregnated with from moisture.Hydrophilic group R2 can be hydrophilic group well known to those skilled in the art.
Fig. 4 A to Fig. 4 C are the plan views of the method for the manufacture PCB of exemplary embodiment according to the present invention.
With reference to Fig. 4 A, can substrate be prepared by the common method or technological means of this field, specifically, prepare base
Plate simultaneously forms circuit pattern on the upper side and lower side of substrate, with respectively with will be formed in upside on chip and will be formed in down
Solder bump electrical connection on side.Next, with reference to Fig. 4 B, close to the edge of substrate and the electricity on the upside of substrate is formed in
The outside of road pattern surrounds circuit pattern, and the first cream of the nano SiO 2 particle wrapped up with hydrophobic group is passed through such as silk
The coating method of wire mark brush is coated onto on the upside of substrate, is subsequently dried curing and is obtained moisture barrier, to prevent moisture infiltration.
With reference to Fig. 4 C, the inside of the moisture barrier on the upside of substrate is formed in surrounds the core that will be formed on the upside of substrate
Second cream of the nano SiO 2 particle wrapped up with hydrophilic group is coated onto base by piece by the coating method of such as silk-screen printing
On the upside of plate, curing is subsequently dried to obtain moist absorbing layer, to absorb moisture.
However, exemplary embodiment is without being limited thereto.Moist absorbing layer can be first prepared, then prepares moisture barrier.In addition,
The coating method of the coating method of second cream related with moist absorbing layer and first cream related with moisture barrier can not
It is limited to this.And the coating of the coating method of second cream related with moist absorbing layer and first cream related with moisture barrier
Method can be different.
Although being specifically illustrated in reference to exemplary embodiment of the present invention and describing the present invention, this field is general
It is logical the skilled person will understand that, in the spirit and model for not departing from the present invention limited such as the appended claims and their equivalents
It, can be in form and details can be made herein various changes in the case of enclosing.Should only in the sense that descriptive rather than
Consider embodiment for purposes of limitation.Therefore, the scope of the present invention is limited by the specific embodiment of the present invention,
But be defined by the claims, all differences in the range of this are to be interpreted as being included in the invention.
Claims (10)
1. a kind of printed circuit board, which is characterized in that the printed circuit board includes：
Substrate；
Circuit pattern is formed on the upper side and lower side of substrate with respectively with that the chip that will be formed on the upside and will be formed
Protrusion electrical connection on the downside；
Moisture barrier, close to the edge of substrate and the outside of the circuit pattern on the upside of substrate is formed in, around described
Circuit pattern and be arranged on the upside of substrate, to prevent moisture infiltration；And
Moist absorbing layer, the inside of the moisture barrier on the upside of substrate is formed in surround and will be formed on the upside of substrate
Chip and be arranged on the upside of substrate, to absorb moisture,
Wherein, the surface of moisture barrier has hydrophobicity.
2. printed circuit board according to claim 1, which is characterized in that the height of moisture barrier is more than 10 μm.
3. printed circuit board according to claim 1, which is characterized in that moisture barrier is zigzag pattern.
4. printed circuit board according to claim 1, which is characterized in that the surface of moisture barrier is similar to the surface of lotus leaf
To realize hydrophobic function.
5. printed circuit board according to claim 1, which is characterized in that moisture barrier includes wrapped up with hydrophobic group two
Silica nano particle.
6. printed circuit board according to claim 1, which is characterized in that the height of moist absorbing layer is more than 10 μm.
7. printed circuit board according to claim 1, which is characterized in that moist absorbing layer is in dendritic shape.
8. printed circuit board according to claim 1, which is characterized in that moist absorbing layer includes wrapped up with hydrophilic group two
Silica nano particle.
A kind of 9. method for manufacturing printed circuit board, which is characterized in that the method includes：
Prepare substrate；
Circuit pattern is formed on the upper side and lower side of substrate, with respectively with that the chip that will be formed on the upside and will be formed
Protrusion electrical connection on the downside；
Close to the edge of substrate and the outside of the circuit pattern on the upside of substrate is formed in, utilized around the circuit pattern
The nano SiO 2 particle of hydrophobic group package is applied and curing is then dried to be formed on the upside of substrate
Moisture barrier, to prevent moisture infiltration；And
The inside of moisture barrier on the upside of substrate is formed in is utilized around the chip that will be formed on the upside of substrate
The nano SiO 2 particle of hydrophilic group package is applied and curing is then dried to be formed on the upside of substrate
Moist absorbing layer, to absorb moisture.
10. a kind of ic package, which is characterized in that the ic package includes：
Printed circuit board according to any one of claim 1 to 8；
Chip is attached to by adhesion layer on the upside of printed circuit board；
Bonding wire is electrically connected chip and printed circuit board；
Encapsulated layer is arranged on the upside of printed circuit board and encapsulates chip；
Solder bump is arranged on the downside of printed circuit board；And
Insulating layer is formed on the downside of printed circuit board so that the circuit pattern being formed on the downside of printed circuit board with
Exterior insulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191858.XA CN105704929B (en) | 2016-03-30 | 2016-03-30 | Printed circuit board, ic package and the method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191858.XA CN105704929B (en) | 2016-03-30 | 2016-03-30 | Printed circuit board, ic package and the method for manufacturing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105704929A CN105704929A (en) | 2016-06-22 |
| CN105704929B true CN105704929B (en) | 2018-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610191858.XA Active CN105704929B (en) | 2016-03-30 | 2016-03-30 | Printed circuit board, ic package and the method for manufacturing printed circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148410B (en) * | 2018-07-23 | 2020-05-19 | 肇庆久量光电科技有限公司 | Integrated circuit board and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200419820A (en) * | 2003-03-18 | 2004-10-01 | Windell Corp | Nanometer complex glue material for OLED package |
| CN102237319A (en) * | 2010-04-23 | 2011-11-09 | 三星半导体(中国)研究开发有限公司 | Package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227194A (en) * | 2007-03-14 | 2008-09-25 | Hitachi Cable Ltd | Tape carrier for semiconductor device and its manufacturing method |
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2016
- 2016-03-30 CN CN201610191858.XA patent/CN105704929B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200419820A (en) * | 2003-03-18 | 2004-10-01 | Windell Corp | Nanometer complex glue material for OLED package |
| CN102237319A (en) * | 2010-04-23 | 2011-11-09 | 三星半导体(中国)研究开发有限公司 | Package |
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| CN105704929A (en) | 2016-06-22 |
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