CN105693102A - Mask for quartz glass acid etching and acid etching method for quart glass pendulous reed - Google Patents
Mask for quartz glass acid etching and acid etching method for quart glass pendulous reed Download PDFInfo
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- CN105693102A CN105693102A CN201610019313.0A CN201610019313A CN105693102A CN 105693102 A CN105693102 A CN 105693102A CN 201610019313 A CN201610019313 A CN 201610019313A CN 105693102 A CN105693102 A CN 105693102A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L23/28—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/26—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment
- C08J2323/28—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The invention provides a mask for quartz glass acid etching and an acid etching method for a quart glass pendulous reed.Fluorocarbon rubber serves as a matrix of the mask, and the properties of a coating are adjusted by adding, by mass, 5-15% of a curing agent and 1-20% of diluent, wherein fluorocarbon rubber is polymer obtained by substituting part of or all hydrogen atoms in polyethylene or polypropylene with fluorine atoms.The mask is excellent in hydrofluoric acid resistance, by means of the acid etching method of the mask, no special brass or tetrafluoroethylene mold is needed, dimensional precision is high, and machining cost can be lowered.
Description
Technical field
The present invention relates to a kind of mask and the preparation method of quartz glass pendulum, particularly relate to a kind of acid etch method of quartz glass acid etch mask and quartz glass pendulum。
Background technology
At present, etched mold and acidproof fluorosioloxane rubber mask protection that quartz glass pendulum flexible beam acid etch technique employing pyrite, tetrafluoroethene etc. is special do not need etched portions, make acidproof mask and quartz glass close contact by pressing mould；Mask is processed by the method for mechanical compaction or cut, so as to identical with platen shape, only expose rectangular opening with etch quartz glass pendulum flexible beam, then be placed in the hydrofluoric acid solution of finite concentration and temperature and carry out acid etch。
But said method having the disadvantage that, (1) fluorosioloxane rubber cannot hydrofluoric acid resistant for a long time；(2) for ensureing that pendulum flexible beam is unanimous between the higher and lower levels and bilateral symmetry, the dimensional accuracy of special die center platen is high, thus causing that mould processing cost is high；(3) in installation process, also it is difficult to ensure that pressing plate, mask, pendulum three assemble alignment, batch concordance difference。
Summary of the invention
Present invention is primarily targeted at, a kind of acid etch method of quartz glass acid etch mask and quartz glass pendulum is provided, to be solved technical problem is that makes quartz glass acid etch mask that Fluohydric acid. to have long tolerance, and make it can apply in the acid etch method of quartz glass pendulum, thus more suitable for practicality。
The object of the invention to solve the technical problems realizes by the following technical solutions。The present invention proposes a kind of quartz glass acid etch mask, with fluorine carbon paste for substrate, by adding the diluent adjustment latex film property of the firming agent of its mass fraction 5-15%, 1-20%；Wherein, described fluorine carbon paste is the polymer that fluorine atom replaces that the part or all of hydrogen atom in polyethylene or polypropylene obtains。
Preferably, quartz glass acid etch mask, it is by described fluorine carbon paste, firming agent and mixing diluents, stirring, stands what 30-45min obtained。
The present invention also proposes a kind of acid etch method of quartz glass pendulum, comprises the following steps:
(1) mask coating: at quartz glass substrate surface-coated mask, described mask covers all surfaces of described quartz glass substrate, and described mask is aforesaid quartz glass acid etch mask；
(2) cutting pattern: after described mask carries out spontaneous curing on described quartz glass substrate, cut out predetermined pattern on described mask, remove the mask in predetermined pattern, expose quartz glass substrate；
(3) it is heating and curing: the quartz glass substrate of the described mask with predetermined pattern is heated, increases the adhesive force of mask and Quartz glass surfaces；
(4) etching: insert in hydrofluoric acid solution and perform etching；
(5) demoulding: after etching, removes whole masks of Quartz glass surfaces。
Preferably, the acid etch method of described quartz glass pendulum, wherein said mask coating includes: the first surface at quartz glass substrate is coated with mask, and carries out spontaneous curing；Then, it is coated with mask at the second surface of quartz glass and side。
Preferably, the acid etch method of described quartz glass pendulum, described cutting pattern includes, and adopts cut, the mask on described laser two surfaces of glass-cutting substrate simultaneously。
Preferably, the acid etch method of described quartz glass pendulum, described laser to the transmitance of described quartz glass substrate more than 85%。
Preferably, the acid etch method of described quartz glass pendulum, described in be heating and curing and include: glass substrate and glued membrane are heated to 50-80 DEG C, and keep 30-180min。
Preferably, the acid etch method of described quartz glass pendulum, described demoulding includes: being soaked in organic solvent by the pendulum after etching, be completely dissolved to mask, described organic solvent is ethanol or acetone。
Preferably, the acid etch method of described quartz glass pendulum, the mask coating thickness of described Quartz glass surfaces is 0.05-0.2mm。
Preferably, the acid etch method of described quartz glass pendulum, described hydrofluoric acid solution performs etching and includes: etch rate 1.0-2.0um/min, etch period is more than 250min。
By technique scheme, the acid etch method of quartz glass acid etch mask of the present invention and quartz glass pendulum at least has the advantage that
The quartz glass acid etch mask that the present invention proposes, by adopt fluorine carbon paste as primary raw material and by with the coordinating of firming agent and diluent, successfully obtain a kind of mask glue that Fluohydric acid. is had well tolerable performance, can life-time service at-50-120 DEG C, the tolerance time that concentration is 40% Fluohydric acid. is long, glued membrane thick for 0.1mm, at 20 DEG C, soaks in 40% levels of hydrogen fluorspar acid solution that 20 hours anacidities are swollen, deformation occurs。
The acid etch method of the quartz glass pendulum of the present invention, by being coated with above-mentioned quartz glass acid etch mask, save pyrite of the prior art and Teflon mold, avoid owing to pressing plate and mask, pressing plate are asymmetric with the uneven pendulum etched features caused in pressing plate location, can pass through to adopt excision forming of upper and lower mask the high saturating laser of quartz glass, improve the dimensional accuracy of quartz glass pendulum。
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention, and can be practiced according to the content of description, below with presently preferred embodiments of the present invention describe in detail as after。
Detailed description of the invention
For further setting forth that the present invention reaches technological means and effect that predetermined goal of the invention is taked, below in conjunction with preferred embodiment, preparation method to a kind of quartz glass pendulum acid etch mask proposed according to the present invention, its detailed description of the invention, structure, feature and effect thereof, describe in detail as after。In the following description, what different " embodiments " or " embodiment " referred to is not necessarily same embodiment。Additionally, special characteristic in one or more embodiment, structure or feature can be combined by any suitable form。
Embodiment 1
Embodiments of the invention propose a kind of quartz glass acid etch mask, with fluorine carbon paste for substrate, by adding the diluent adjustment latex film property of the firming agent of its mass fraction 5-15%, 1-20%；Wherein, described fluorine carbon paste is the polymer that fluorine atom replaces that the part or all of hydrogen atom in polyethylene or polypropylene obtains, and solid content is more than 50%。The concrete preparation method of above-mentioned quartz glass acid etch mask is, by described fluorine carbon paste, firming agent and mixing diluents, stirring, stands 30-45min, discharges bubble in glue。Described firming agent and diluent and above-mentioned fluorine carbon paste with the use of: the required material that F-C paint dries is not only by firming agent, especially the important composition composition of fluorine carbon paste film forming matter；The effect of diluent be regulate gelatin viscosity, in order to coating or spraying with glass surface and control film thickness, amount of diluent is more high, get over be readily obtained relatively pellicle。The fluorine carbon paste of described hydrofluoric acid resistant, firming agent, diluent are the DB-60 series that Shanghai reaches that Bhopal new material Science and Technology Ltd. produces, wherein fluorine carbon paste is the hydrogen moiety in polyethylene or Polypropylene structural or the fluoroolefins vinyl ether co-polymer being all replaced by fluorine atoms formation, and its molecular formula is as follows:
Wherein, Oil repellent, more than 19%, regulates glue weatherability；R1 and R2 is alkyl, scalable glue solubility, the transparency, glossiness, hardness and pliability；R3 and R4 is alkylidene, regulates glue curable, tack and pigment mark respectively。
Formed thin film-50-120 DEG C can life-time service, hydrofluoric acid resistant solution。
Firming agent, for aliphatic isocyanates, and the hydroxyl generation cross-linking reaction on fluorine carbon paste strand, form-NH-CO-key。
Diluent, for butyl acetate, it is possible to be dissolved into membrane polymer, adjusts viscosity and the rheological characteristic of glue。
Method according to the above embodiments, the following instance of the quartz glass acid etch mask prepared, its concrete composition and the tolerance time of Fluohydric acid. is as shown in table 1 below, wherein said tolerance time refers to that glued membrane thick for 0.1mm soaks the time starting to occur coming off in 40% Fluohydric acid., 20 DEG C of hydrofluoric acid solutions。
The composition that table 1 quartz glass acid etch mask is concrete and the tolerance time to Fluohydric acid.
Embodiment 2
Embodiments of the invention also propose a kind of acid etch method of quartz glass pendulum flexible beam, specifically include that mask coating, cutting pattern, be heating and curing, etch and the step such as demoulding。
Described mask coating step is, at quartz glass substrate surface-coated mask, described mask covers all surfaces of described quartz glass substrate, and described mask is above-mentioned quartz glass acid etch mask, and the mask coating thickness of described Quartz glass surfaces is 0.05-0.2mm；Preferably, first it is coated with mask at the first surface of quartz glass substrate, and carries out spontaneous curing；Then, at second surface and the side coating mask of quartz glass, then spontaneous curing is carried out。Described spontaneous curing refers at room temperature environment, and glued membrane about 8-10h under firming agent effect completes to solidify, flexible through the glued membrane of spontaneous curing, more weak with glass substrate adhesive force, is easily peeled off under external force。
Described cutting pattern step is, after described mask carries out spontaneous curing on described quartz glass substrate, cuts out predetermined pattern on described mask, removes the mask in predetermined pattern, expose quartz glass substrate；Preferably, described cutting pattern adopts cut, and described laser is to adopt near ultraviolet to near-infrared laser, in the transmitance of this wave band quartz glass more than 85%, laser can the glued membrane on simultaneously glass-cutting substrate two sides, so that it is guaranteed that the concordance of the etching position on quartz glass two sides。Peel off glued membrane with tweezers or other instruments after cut, make glass substrate expose the position needing acid etch。
Described heat-curing step is, is heated by the quartz glass substrate of the described mask with predetermined pattern, increases the adhesive force of mask and Quartz glass surfaces；Preferably, it is slowly heated glass substrate and glued membrane to 50-80 DEG C, constant temperature 30-180min, thoroughly gets rid of the diluent components in glued membrane；After being heating and curing, glued membrane hardness increases, and also increases with glass attachment power, and glued membrane can not be peeled off by External Force Acting。
Described etch step, inserts the quartz glass substrate after solidification in hydrofluoric acid solution and performs etching, and described hydrofluoric acid concentration is 40% (mass fraction), and 20 DEG C of etch rate 1.0-2.0um/min, etch period is more than 250min。
Described demoulding step, after etching, removes whole masks of Quartz glass surfaces。Being soaked 8-24 hour in organic solvent by pendulum after etching, or be completely dissolved to mask, described organic solvent is ethanol or acetone。
Example 6
The acid etch method of quartz glass pendulum flexible beam, first prepares the mask glue described in example 1。Clean glass substrate and remove the impurity such as dust, greasy dirt, and with non-dust cloth, substrate wiping is clean。Centrifugal sol evenning machine is used to be coated with the mask glue described in example 1 to glass substrate。Described glass substrate area is 380mm2, every required glue amount is 0.05ml；Glass substrate is fixed on sol evenning machine and is set to shelves (2-5rad/s) at a slow speed, draw 0.05ml epoxy glue with suction pipe and drop in glass substrate first surface center, treat that mask glue is uniformly coated with and take off spontaneous curing 8h to substrate outer。Reconfiguring the mask glue described in examples detailed above 1 again, with same method to second surface gluing, described glued membrane is that 0.12mm is thick。After mask glue spontaneous curing, Useful UV laser cuts。Cut 3.8*10.8mm rectangle in pendulum flexible beam position, with tweezers, the rectangle on glass substrate two sides is peeled off, etch mask and the molding of pendulum flexible beam。Being placed on electric furnace by the substrate of mask molding, be slowly heated to 50 DEG C, take off substrate natural cooling after baking 60min, mask fabrication completes。At temperature 20 DEG C, hydrofluoric acid concentration 40%, quartz glass etch rate 1.0um/min, when flexible beam etch period 300min, flexible beam is thinned to 30um, and mask does not permeate, deforms。After pendulum acid etch completes, being soaked 8h in ethanol, glued membrane is completely dissolved, and cleans up and just can carry out next step operation。
Example 7
The acid etch method of quartz glass pendulum flexible beam, first prepares the mask glue described in example 5。Clean glass substrate and remove the impurity such as dust, greasy dirt, and with non-dust cloth, substrate wiping is clean。Use centrifugal sol evenning machine to glass substrate gluing。Described glass substrate area is 380mm2, every required glue amount is 0.03ml；Glass substrate is fixed on sol evenning machine and is set to shelves (2-5rad/s) at a slow speed, draw 0.03ml epoxy glue with suction pipe and drop in substrate first surface center, treat that glue is uniformly coated with and take off spontaneous curing 10h to substrate outer。Reconfiguring above-mentioned glue again, with same method to second surface gluing, described film thickness is 0.07mm。After glued membrane spontaneous curing, Useful UV laser cuts。Cut 3.8*10.8mm rectangle in pendulum flexible beam position, with tweezers, the rectangle on glass substrate two sides is peeled off, etch mask and the molding of pendulum flexible beam。Being placed on electric furnace by the substrate of mask molding, be slowly heated to 50 DEG C, take off substrate natural cooling after baking 30min, mask fabrication completes。At temperature 20 DEG C, hydrofluoric acid concentration 40%, quartz glass etch rate 1.2um/min, when flexible beam etch period 300min, flexible beam is thinned to 30um, and mask does not permeate, deforms。After pendulum acid etch completes, being soaked 8h in ethanol, glued membrane is completely dissolved, and cleans up and just can carry out next step operation。
Example 8:
The acid etch method of quartz glass pendulum flexible beam, first prepares the mask glue described in example 3。Clean glass substrate and remove the impurity such as dust, greasy dirt, and with non-dust cloth, substrate wiping is clean。Use centrifugal sol evenning machine to glass substrate gluing。Known glass chip area is 380mm2, every required glue amount is 0.07ml；Glass substrate is fixed on sol evenning machine and is set to shelves (2-5rad/s) at a slow speed, draw 0.07ml epoxy glue with suction pipe and drop in substrate first surface center, treat that glue is uniformly coated with and take off spontaneous curing 9h to substrate outer。Reconfiguring above-mentioned glue again, with same method to second surface gluing, described film thickness is 0.17mm。After glued membrane spontaneous curing, Useful UV laser cuts。Cut 3.8*10.8mm rectangle in pendulum flexible beam position, with tweezers, the rectangle on glass substrate two sides is peeled off, etch mask and the molding of pendulum flexible beam。Being placed on electric furnace by the substrate of mask molding, be slowly heated to 80 DEG C, take off substrate natural cooling after baking 60min, mask fabrication completes。At temperature 20 DEG C, hydrofluoric acid concentration 40%, quartz glass etch rate 2.0um/min, when flexible beam etch period 300min, flexible beam is thinned to 30um, and mask does not permeate, deforms。After pendulum acid etch completes, being soaked 10h in ethanol, glued membrane is completely dissolved, and cleans up and just can carry out next step operation。
The above, it it is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, according to any simple modification, equivalent variations and modification that above example is made by the technical spirit of the present invention, all still falls within the scope of technical solution of the present invention。
Claims (10)
1. a quartz glass acid etch mask, it is characterised in that comprising: with fluorine carbon paste for substrate, by adding the diluent adjustment latex film property of the firming agent of its mass fraction 5-15%, 1-20%；Wherein, described fluorine carbon paste is the polymer that fluorine atom replaces that the part or all of hydrogen atom in polyethylene or polypropylene obtains。
2. quartz glass acid etch mask according to claim 1, it is characterised in that by described fluorine carbon paste, firming agent and mixing diluents, stirring, stand 30-45min。
3. the acid etch method of a quartz glass pendulum, it is characterised in that including:
Mask is coated with: at quartz glass substrate surface-coated mask, described mask covers all surfaces of described quartz glass substrate, and described mask is the quartz glass acid etch mask described in claim 1 or 2；
Cutting pattern: after described mask carries out spontaneous curing on described quartz glass substrate, cut out predetermined pattern on described mask, remove the mask in predetermined pattern, expose quartz glass substrate；
It is heating and curing: be heated the described quartz glass substrate with predetermined pattern mask solidifying, increase the adhesive force of mask and Quartz glass surfaces；
Etching: insert in hydrofluoric acid solution and perform etching；
Demoulding: after etching, removes whole masks of Quartz glass surfaces。
4. the acid etch method of quartz glass pendulum according to claim 3, it is characterised in that described mask coating includes: the first surface at quartz glass substrate is coated with mask, and carries out spontaneous curing；Then, it is coated with mask at the second surface of quartz glass and side。
5. the acid etch method of quartz glass pendulum according to claim 3, it is characterised in that described cutting pattern includes, adopts cut, the mask on described laser two surfaces of glass-cutting substrate simultaneously。
6. the acid etch method of quartz glass pendulum according to claim 5, it is characterised in that described laser to the transmitance of described quartz glass substrate more than 85%。
7. the acid etch method of quartz glass pendulum according to claim 3, it is characterised in that described in be heating and curing and include: glass substrate and glued membrane are heated slowly to 50-80 DEG C, and keep 30-180min。
8. the acid etch method of quartz glass pendulum according to claim 3, it is characterised in that described demoulding includes: being soaked in organic solvent by the pendulum after etching, be completely dissolved to mask, described organic solvent is ethanol or acetone。
9. the acid etch method of the quartz glass pendulum according to any one of claim 3-8, it is characterised in that the mask coating thickness of described Quartz glass surfaces is 0.05-0.2mm。
10. the acid etch method of the quartz glass pendulum according to any one of claim 3-8, it is characterised in that perform etching in described hydrofluoric acid solution and include: etch rate 1.0-2.0um/min, etch period is more than 250min。
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| CN201610019313.0A CN105693102B (en) | 2016-01-12 | 2016-01-12 | The harsh etching method of quartz glass acid etch mask and quartz glass pendulum |
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| CN107915202A (en) * | 2017-11-13 | 2018-04-17 | 东南大学 | A kind of quick method for determining any tangential wet etching structure and morphology of quartz |
| CN108101386A (en) * | 2017-12-18 | 2018-06-01 | 信利光电股份有限公司 | A kind of mobile terminal cover board lithographic method and mobile terminal cover board |
| CN111847847A (en) * | 2020-07-30 | 2020-10-30 | 保定开拓精密仪器制造有限责任公司 | Preparation method of quartz pendulous reed |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11114309B2 (en) * | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11114309B2 (en) * | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
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| CN108101386A (en) * | 2017-12-18 | 2018-06-01 | 信利光电股份有限公司 | A kind of mobile terminal cover board lithographic method and mobile terminal cover board |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN111847847A (en) * | 2020-07-30 | 2020-10-30 | 保定开拓精密仪器制造有限责任公司 | Preparation method of quartz pendulous reed |
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| CN105693102B (en) | 2018-08-24 |
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