CN105682362A - Flexible circuit board and displayer thereof - Google Patents
Flexible circuit board and displayer thereof Download PDFInfo
- Publication number
- CN105682362A CN105682362A CN201610200257.0A CN201610200257A CN105682362A CN 105682362 A CN105682362 A CN 105682362A CN 201610200257 A CN201610200257 A CN 201610200257A CN 105682362 A CN105682362 A CN 105682362A
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- China
- Prior art keywords
- layer
- flexible
- circuit board
- installing hole
- insulating protective
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Abstract
The invention provides a flexible circuit board and a displayer adopting the flexible circuit board. According to the flexible circuit board, installation holes for installing components run into the inner portion of the flexible circuit board. Compared with the prior art, the depth of each installation hole is deeper, so that the installation holes can accommodate the components better, the overall thickness of the flexible circuit board can be reduced, installation space is saved, space utilization rate of the product is improved, and design requirement for smaller or higher-density installation can be met.
Description
Technical field
The present invention relates to display field, particularly relate to a kind of flexible PCB and the display comprising this flexible PCB.
Background technology
Flexible PCB is that the one made based on polyimides or mylar has height reliability, excellent flexible printed circuit, it is called for short soft board or FPC (FlexiblePrintedCircuit), there is the features such as distribution density is high, thickness is thin, be mainly used in a lot of product such as mobile phone, notebook computer, PDA, digital camera and LCD MODULE.
Element device on existing FPC is generally adopted surface-pasted mode and installs; by etching until exposing the upper surface of Upper conductive layer from the insulating protective layer of side, the upper surface of the lower surface of components and parts with Upper conductive layer is electrically connected the attachment realizing components and parts.
But, the thickness of FPC base material determines that, the height of its surface-pasted components and parts also determines that, causes that the thickness of whole FPC is thicker, therefore has certain limitation.
Therefore, how reducing FPC thickness, meeting more highdensity mounting design demand is this area problem demanding prompt solution.
Summary of the invention
For solving above-mentioned technical problem, one aspect of the present invention provides a kind of flexible PCB, it includes the first insulating protective layer and the second insulating protective layer that relatively stacking is arranged, stacking is arranged on the flexible circuit board between described first insulating protective layer and described second insulating protective layer, and the components and parts electrically connected with described flexible circuit board, described flexible circuit board includes at least one of which flexible substrate layer and at least two conductive layers, and described flexible PCB is provided with the installing hole for housing at least part of described components and parts; Described installing hole be in a thickness direction run through described first insulating protective layer and the through hole of described second insulating protective layer and described flexible circuit board between the two, and the sidewall of described installing hole at least exposes the electrical connection section of wherein one layer of described conductive layer thus electrically connecting with described components and parts; Or; described installing hole is in a thickness direction, is through to the blind hole of the inside of described flexible circuit board from described first insulating protective layer or described second insulating protective layer always; and described installing hole at least runs through one layer of described conductive layer and one layer of described flexible substrate layer; and; the sidewall of described installing hole exposes the electrical connection section of wherein one layer of described conductive layer thus electrically connecting with described components and parts; and/or, the diapire of described installing hole exposes the electrical connection section of the one layer of described conductive layer not run through thus electrically connecting with described components and parts.
Another aspect of the present invention provides a kind of display, and it adopts above-mentioned flexible PCB.
In the flexible PCB of the present invention, the installing hole of mounting related components has extended through the inside of flexible circuit board, compared with prior art, the degree of depth of installing hole is deeper, components and parts can be housed better, it is possible to reduce the integral thickness of flexible PCB, save installing space, improve the space availability ratio of product, more small-sized or more high-density installation design requirement can be met.
Accompanying drawing explanation
Fig. 1 is the sectional view of the flexible PCB of embodiment 1;
Fig. 2 is the sectional view of the flexible PCB of embodiment 2.
Detailed description of the invention
Describe the present invention below with reference to detailed description of the invention shown in the drawings. But these embodiments are not limiting as the present invention, those of ordinary skill in the art is all contained in protection scope of the present invention according to the made structure of these embodiments, method or conversion functionally.
It is described more fully with example embodiment referring now to accompanying drawing. But, example embodiment can be implemented in a variety of forms, and is not understood as limited to embodiment set forth herein; On the contrary, it is provided that these embodiments make the present invention will fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly. Accompanying drawing labelling identical in the drawings represents same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be combined in one or more embodiment in any suitable manner. In the following description, it is provided that many details are thus providing fully understanding embodiments of the present invention. But, one of ordinary skill in the art would recognize that, it does not have one or more in specific detail, or adopt other method, constituent element, material etc., it is also possible to put into practice technical scheme. In some cases, known features, material or operation are not shown in detail or describe to avoid the fuzzy present invention.
Specifically described herein " be formed at/be positioned at/be arranged on/... on (it) " should be understood to include directly contact " be formed at/be positioned at/be arranged on/... on (it) " and be not directly contacted with " be formed at/be positioned at/be arranged on/... on (it) ".
The accompanying drawing of the present invention is only used for illustrating relative position relation and electrical connection, the thickness at some position to have employed the plotting mode lavished praise on oneself that the thickness in accompanying drawing does not represent the proportionate relationship of actual thickness so that understanding.
Embodiment 1
As shown in Figure 1; Fig. 1 is the sectional view of the flexible PCB of embodiment 1; the flexible PCB 100 of embodiment 1; it includes the first insulating protective layer 10 and the second insulating protective layer 20 that relative stacking is arranged; stacking is arranged on the flexible circuit board 30 between the first insulating protective layer 10 and the second insulating protective layer 20 and components and parts S1, S2, S3 of electrically connecting with flexible circuit board 30.
Flexible circuit board 30 includes at least one of which flexible substrate layer and at least two conductive layers.
In the present embodiment, flexible circuit board 30 includes a first flexible base board unit 30a, first flexible base board unit 30a includes n layer flexible substrate layer 31 and (n+1) layer conductive layer 32,33, and there is flexible substrate layer 31 and the alternately laminated structure covered of conductive layer 32,33, wherein, n is the integer be more than or equal to 1.
In the present embodiment, flexible circuit board 30 only has a first flexible base board unit 30a.
In the present embodiment, in the first flexible base board unit 30a, n=1, namely as it is shown in figure 1, this unit includes one layer of flexible substrate layer 31 and covers the conductive layer 32,33 in the both sides up and down of this flexible substrate layer 31.
Optionally, n is the integer more than 1, for instance, the first flexible base board unit 30a has five layers or more multi-layered (odd-level) structure.
In the present embodiment, conductive layer 32,33 is copper foil layer.
In the present embodiment, the thickness range of conductive copper layers of foil 32,33 is 8 microns～20 microns, it is preferable that 12 microns.
In the present embodiment, it is possible to make to communicate between upper and lower two conductive layers 32,33 by the mode holed at thickness direction, realize the electrical connection of upper and lower two conductive layers again through electroplating technology. Then, it is possible to upper and lower two conductive layers 32,33 is exposed etch process, unwanted partial electroconductive layer (Copper Foil) is removed thus obtaining required circuit pattern (not shown).
As it is shown in figure 1, flexible circuit board 30 offers installing hole H1, H2, H3 for housing at least part of components and parts S1, S2, S3.
In the present embodiment, about the installing hole H1 housing components and parts S1, as shown in Figure 1, its in a thickness direction, from the first insulating protective layer 10, be through to the blind hole of the inside of flexible circuit board 30 always, and installing hole H1 has sequentially passed through the conductive layer 32 on upper strata (relative to the first insulating protective layer 10, the conductive layer 32 on upper strata is in the conductive layer of shallower position) and flexible substrate layer 31, until exposing the conductive layer 33 (relative to the first insulating protective layer 10, the conductive layer 33 of lower floor is in the conductive layer of deep place) of lower floor; The diapire of installing hole H1 exposes the bottom of the electrical connection section L1 of the conductive layer 33 of lower floor, electrical connection section L1 and components and parts S1 and electrically connects thus realizing the electrical connection of components and parts S1 and flexible circuit board 30.
In the present embodiment, about the installing hole H2 housing components and parts S2, as shown in Figure 1, its in a thickness direction, from the first insulating protective layer 10, be through to the blind hole of the inside of flexible circuit board 30 always, and installing hole H1 has sequentially passed through conductive layer 32 and the flexible substrate layer 31 on upper strata, until exposing the conductive layer 33 of lower floor; The sidewall of installing hole H2 exposes a sidepiece of the electrical connection section L2 of the conductive layer 32 on upper strata, electrical connection section L2 and components and parts S2 and electrically connects thus realizing the electrical connection of components and parts S2 and flexible circuit board 30.
Certainly, as it is shown in figure 1, the left side wall of installing hole H2 electrically connects with the left side of components and parts S2. Optionally, it is also possible to be that the right side wall of installing hole H2 electrically connects with the right side of components and parts S2.
In the present embodiment; about the installing hole H3 housing components and parts S3; as shown in Figure 1; installing hole H3 is the through hole running through the first insulating protective layer 10 and the second insulating protective layer 20 and flexible circuit board between the two 30 in a thickness direction; and the sidewall of installing hole S3 exposes the electrical connection section L3 of the conductive layer 32 on upper strata and the electrical connection section L4 of underlying conductive layer 33, together electrically connect with components and parts S3.
Optionally, it is also possible to be that the electrical connection section of the conductive layer 32 exposing lower floor on the sidewall of installing hole S3 is thus electrically connecting with components and parts S3; Can also be that the electrical connection section simultaneously exposing two conductive layers 31,32 on the sidewall of installing hole S3 electrically connects with components and parts S3.
Optionally, installing hole is blind hole, has run through whole flexible circuit board 30, but do not run through the second insulating protective layer 20 from the first insulating protective layer 10; This situation is similar with installing hole S3, the sidewall of installing hole exposes the conductive layer 32 being positioned at shallower position and/or is positioned at the electrical connection section of conductive layer 33 of deep place thus electrically connecting with components and parts.
Adopt the flexible PCB 100 of said structure, installing hole has extended through the inside of flexible circuit board 30, compared with prior art, the degree of depth of installing hole is deeper, components and parts can be housed better, it is possible to reduce the integral thickness of flexible PCB 100, save installing space, improve the space availability ratio of product, more small-sized or more high-density installation design requirement can be met.
Optionally, installing hole can from the second insulating protective layer 20 opening.
In the present embodiment, the opening direction of installing hole H1 and H2 is identical, and namely the exposed direction of components and parts S1 and S2 is identical. Several installing holes are opened in the same side, it is possible to realize the reduction of flexible PCB 100 integral thickness better.
Optionally, the opening direction of several installing holes can be different, for instance, it is also possible to being one or more installing hole from the first insulating protective layer 10 opening, one or more installing hole S2 are from the second insulating protective layer 20 opening. As n=1, such as three layers flexible circuit board 30 structure of the present embodiment, must stagger in the position of the installing hole that opening direction is different, could realize the reduction of flexible PCB 100 integral thickness. When the n integer being more than 1, for instance when flexible circuit board 30 has five layers or more multi-layered (odd-level) structure, can stagger in the position of the installing hole that opening direction is different, it is also possible to do not stagger; Preferably, position of mounting hole different for opening direction is staggered, so can reduce the integral thickness of flexible PCB 100 better.
In the present embodiment, the both side surface up and down of flexible circuit board 30 is fitted with the first insulating protective layer 10 and the second insulating protective layer 20 respectively by adhesive phase 41,42.
Optionally, the mode that the both side surface up and down of flexible circuit board 30 is connected by pressing with fit with the first insulating protective layer 10 and the second insulating protective layer 20 respectively.
In the present embodiment, flexible substrate layer 31 adopts polyimide material to make, and the thickness range of flexible substrate layer 31 is 10 microns～50 microns. Preferably, 25 microns.
In the present embodiment, the first insulating protective layer 10 and the second insulating protective layer 20 all adopt polyimide material to make.
Embodiment 2
As shown in Figure 2; the flexible PCB 100 ' of embodiment 2; it includes the first insulating protective layer 10 ' and the second insulating protective layer 20 ' that relative stacking is arranged; stacking is arranged on the flexible circuit board 30 ' between the first insulating protective layer 10 ' and the second insulating protective layer 20 ' and the components and parts S1 ', the S2 ' that electrically connect with flexible circuit board 30 '.
Flexible circuit board 30 ' includes two the first flexible base board unit: is positioned at the first flexible base board unit 30a ' of shallower position and is positioned at the first flexible base board unit 30b ' of deep place, is separated by a layer insulating 30c ' between the two.
Two the first flexible base board unit 30a ', 30b ' are by respectively covering one layer of conductive layer formation in the both sides up and down of one layer of flexible substrate layer, concrete identical with the first flexible base board unit 30a of embodiment 1, specifically repeat no more.
Insulating barrier 50 ' can adopt polyimide material to make.
As in figure 2 it is shown, flexible circuit board 30 ' offers for housing at least part of components and parts S1 ', the installing hole H1 ' of S2 ', H2 '.
About the installing hole H1 ' housing components and parts S1 ', as shown in Figure 2, its in a thickness direction, from the first insulating protective layer 10 ', be through to the blind hole of the inside of flexible circuit board 30 ' always, installing hole has sequentially passed through the first insulating protective layer 10 ', adhesive layer 41 ', whole first flexible base board unit 30a ', and insulating barrier 50 ', until expose the Upper conductive layer 32b ' of the first flexible base board unit 30b ' being positioned at deep place;The diapire of installing hole H1 ' exposes the bottom of the electrical connection section L1 ' of conductive layer 32b ', electrical connection section L1 ' and components and parts S1 ' and electrically connects thus realizing the electrical connection of components and parts S1 ' and flexible circuit board 30 '.
About the installing hole H2 ' housing components and parts S2 ', as shown in Figure 2, its in a thickness direction, from the first insulating protective layer 10 ', be through to the blind hole of the inside of flexible circuit board 30 ' always, installing hole has sequentially passed through the first insulating protective layer 10 ', adhesive layer 41 ', insulating barrier 50 ' and the conductive layer 32b ' that part is above-mentioned; The bottom of electrical connection section L2 ', electrical connection section L2 ' and components and parts S2 ' that the sidewall of installing hole H2 ' exposes the Upper conductive layer 32a ' of the first flexible base board unit 30a ' electrically connects thus realizing the electrical connection of components and parts S2 ' and flexible circuit board 30 '.
About flexible circuit board, it is possible to include several base board unit, each base board unit can be the first flexible base board unit, it is also possible to be the second flexible base board unit, and, interval at least one of which insulating barrier between adjacent two described base board units.
Wherein, the first flexible base board unit includes the described flexible substrate layer of n layer and the described conductive layer of (n+1) layer, and has described conductive layer and the alternately laminated structure covered of described flexible substrate layer, and wherein, n is the integer be more than or equal to 1.
Wherein, the second flexible base board unit includes the described flexible substrate layer of m layer and the described conductive layer of m layer, and has described conductive layer and the alternately laminated structure covered of described flexible substrate layer, and wherein, m is the integer be more than or equal to 1. Such as, the second flexible base board unit by a flexible substrate layer and covers the conductive layer in this flexible substrate layer one side surface and forms. Optionally, m is 1,2,3,4 or 5.
Optionally, flexible circuit board can include 3 or more first flexible base board unit. Such as, being further added by one or more first flexible base board unit on the basis of embodiment 2, concrete structure repeats no more.
Optionally, flexible circuit board can include more than 2 the second flexible base board unit. Such as, the two of embodiment 2 the first flexible base board unit being replaced to two the second flexible base board unit, concrete structure repeats no more.
Optionally, flexible circuit board can include at least one first flexible base board unit and at least one second flexible base board unit, such as, the first flexible base board unit being positioned at deep place in embodiment 2 being replaced to the second flexible base board unit, concrete structure repeats no more.
The electronic equipment such as the flexible PCB of the present invention display that can apply to such as liquid crystal display being example with above-described embodiment 1 and 2.
It is to be understood that, although this specification is been described by according to embodiment, but not each embodiment only comprises an independent technical scheme, this narrating mode of description is only for clarity sake, description should be made as a whole by those skilled in the art, technical scheme in each embodiment through appropriately combined, can also form other embodiments that it will be appreciated by those skilled in the art that.
The a series of detailed description of those listed above is only for illustrating of the feasibility embodiment of the present invention; they also are not used to limit the scope of the invention, and all should be included within protection scope of the present invention without departing from the skill of the present invention equivalent implementations made of spirit or change.
Claims (11)
1. a flexible PCB; it includes the first insulating protective layer and the second insulating protective layer that relatively stacking is arranged; stacking is arranged on the flexible circuit board between described first insulating protective layer and described second insulating protective layer and the components and parts electrically connected with described flexible circuit board
Described flexible circuit board includes at least one of which flexible substrate layer and at least two conductive layers,
It is characterized in that:
Described flexible PCB is provided with the installing hole for housing at least part of described components and parts;
Described installing hole be in a thickness direction run through described first insulating protective layer and the through hole of described second insulating protective layer and described flexible circuit board between the two, and the sidewall of described installing hole at least exposes the electrical connection section of wherein one layer of described conductive layer thus electrically connecting with described components and parts; Or,
Described installing hole is in a thickness direction, is through to the blind hole of the inside of described flexible circuit board from described first insulating protective layer or described second insulating protective layer always; and described installing hole at least runs through one layer of described conductive layer and one layer of described flexible substrate layer; and; the sidewall of described installing hole exposes the electrical connection section of wherein one layer of described conductive layer thus electrically connecting with described components and parts; and/or, the diapire of described installing hole exposes the electrical connection section of the one layer of described conductive layer not run through thus electrically connecting with described components and parts.
2. flexible PCB as claimed in claim 1, it is characterised in that:
Described flexible circuit board includes a first flexible base board unit, described first flexible base board unit includes n layer flexible substrate layer and (n+1) layer conductive layer, and there is described flexible substrate layer and the alternately laminated structure covered of described conductive layer, wherein, n is the integer be more than or equal to 1.
3. flexible PCB as claimed in claim 2, it is characterised in that: described flexible circuit board is made up of a first flexible base board unit, and described n is equal to 1,
Described installing hole is in a thickness direction, is through to the blind hole of the inside of described flexible circuit board from described first insulating protective layer or described second insulating protective layer,
And described installing hole has run through a conductive layer being positioned at shallower position, and it is positioned at the electrical connection section of conductive layer of shallower position described in the sidewall of described installing hole exposes thus electrically connecting with described components and parts; Or,
Described installing hole is positioned at the conductive layer of shallower position and described flexible substrate layer described in having sequentially passed through, and exposes the electrical connection section of another conductive layer being positioned at deep place on the diapire of described installing hole thus electrically connecting with described components and parts; Or,
Described installing hole is positioned at the conductive layer of shallower position, described flexible substrate layer and the described conductive layer being positioned at deep place described in having sequentially passed through, and be positioned at described in the sidewall of described installing hole exposes shallower position conductive layer and/or described in be positioned at the electrical connection section of conductive layer of deep place thus electrically connecting with described components and parts.
4. flexible PCB as claimed in claim 1, it is characterised in that:
Described flexible circuit board includes several base board unit, and each described base board unit is selected from the first flexible circuit board unit or the second flexible circuit board unit,
Described first flexible base board unit includes the described flexible substrate layer of n layer and the described conductive layer of (n+1) layer, and has described conductive layer and the alternately laminated structure covered of described flexible substrate layer, and wherein, n is the integer be more than or equal to 1;
Described second flexible circuit board unit includes the described flexible substrate layer of m layer and the described conductive layer of m layer, and has described conductive layer and the alternately laminated structure covered of described flexible substrate layer, and wherein, m is the integer be more than or equal to 1;
Further, interval at least one of which insulating barrier between adjacent two described base board units.
5. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
Described flexible PCB offers the described installing hole that several opening direction is identical.
6. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
Offering several described installing hole on described flexible PCB, wherein, the different described position of mounting hole of opening direction staggers mutually.
7. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
Described conductive layer is copper foil layer, and the thickness of described conductive layer is 8 microns～20 microns.
8. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
Described flexible substrate layer adopts polyimide material to make, and the thickness of described flexible substrate layer is 10 microns～50 microns.
9. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
Described first insulating protective layer and the second insulating protective layer adopt polyimide material to make.
10. flexible PCB as described in any one in Claims 1-4, it is characterised in that:
The both side surface of described flexible circuit board is fitted with described first insulating protective layer and described second insulating protective layer respectively by adhesive phase; Or,
The mode that the both side surface of described flexible circuit board is connected by pressing with respectively with described first insulating protective layer and described second insulating protective layer laminating.
11. a display, it adopts the flexible PCB as described in any one in claim 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610200257.0A CN105682362B (en) | 2016-03-31 | 2016-03-31 | A kind of flexible circuit board and its display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610200257.0A CN105682362B (en) | 2016-03-31 | 2016-03-31 | A kind of flexible circuit board and its display |
Publications (2)
| Publication Number | Publication Date |
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| CN105682362A true CN105682362A (en) | 2016-06-15 |
| CN105682362B CN105682362B (en) | 2019-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610200257.0A Active CN105682362B (en) | 2016-03-31 | 2016-03-31 | A kind of flexible circuit board and its display |
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| Country | Link |
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| CN (1) | CN105682362B (en) |
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| CN106328683A (en) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | Flexible OLED display and the preparing method thereof |
| CN110730562A (en) * | 2019-10-12 | 2020-01-24 | Oppo（重庆）智能科技有限公司 | Circuit substrate, circuit board and display screen assembly |
| CN110875156A (en) * | 2018-08-30 | 2020-03-10 | 群光电子股份有限公司 | Thin film switch device and keyboard device |
| CN114710879A (en) * | 2022-03-29 | 2022-07-05 | 电子科技大学 | Flexible circuit board and manufacturing method thereof, display screen and electronic equipment |
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| CN105027691A (en) * | 2012-12-26 | 2015-11-04 | Lg伊诺特有限公司 | Printed circuit board, and method for manufacturing same |
| CN205510539U (en) * | 2016-03-31 | 2016-08-24 | 上海中航光电子有限公司 | Flexible circuit board and display thereof |
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| JP2001102743A (en) * | 1999-09-29 | 2001-04-13 | Oki Electric Ind Co Ltd | Single-piece board surface |
| CN1991428A (en) * | 2005-12-23 | 2007-07-04 | 国际商业机器公司 | Opto-electronic board and manufacture method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106328683A (en) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | Flexible OLED display and the preparing method thereof |
| WO2018068380A1 (en) * | 2016-10-11 | 2018-04-19 | 武汉华星光电技术有限公司 | Flexible oled display and manufacturing method therefor |
| US10243163B2 (en) | 2016-10-11 | 2019-03-26 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Flexible OLED display and manufacturing method thereof |
| CN106328683B (en) * | 2016-10-11 | 2019-04-30 | 武汉华星光电技术有限公司 | Flexible OLED display and preparation method thereof |
| CN110875156A (en) * | 2018-08-30 | 2020-03-10 | 群光电子股份有限公司 | Thin film switch device and keyboard device |
| CN110730562A (en) * | 2019-10-12 | 2020-01-24 | Oppo（重庆）智能科技有限公司 | Circuit substrate, circuit board and display screen assembly |
| CN110730562B (en) * | 2019-10-12 | 2021-09-07 | Oppo（重庆）智能科技有限公司 | Circuit substrate, circuit board and display screen assembly |
| CN114710879A (en) * | 2022-03-29 | 2022-07-05 | 电子科技大学 | Flexible circuit board and manufacturing method thereof, display screen and electronic equipment |
| CN114710879B (en) * | 2022-03-29 | 2024-01-30 | 电子科技大学 | Flexible circuit board, manufacturing method thereof, display screen and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN105682362B (en) | 2019-04-23 |
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