CN105652598B - A kind of device and method for measuring mask aligner mask platform gradient and vertical degree - Google Patents
A kind of device and method for measuring mask aligner mask platform gradient and vertical degree Download PDFInfo
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- CN105652598B CN105652598B CN201410632668.8A CN201410632668A CN105652598B CN 105652598 B CN105652598 B CN 105652598B CN 201410632668 A CN201410632668 A CN 201410632668A CN 105652598 B CN105652598 B CN 105652598B
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Abstract
The present invention discloses a kind of device for measuring mask aligner mask platform gradient and vertical degree, it is characterised in that including：One light source, for providing equally distributed some hot spots located on a straight line to a mask, some hot spot orientations and described two parallel edge-perpendiculars of mask, two parallel sides aligned parallels another with the mask；One photodetector, for detecting vertical angle value of some hot spots after mask reflection；One processor, for calculating the dip deviation of mask platform according to some vertical angle value of hot spot.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, more particularly to a kind of measurement mask aligner mask platform gradient
With the device and method of vertical degree.
Background technology
Scanning mask aligner mask platform is in the horizontal direction in motion process, and its vertical performs device is due to mask platform marble
The limitation of machining accuracy, or because using speculum of interferometer measurement etc. not can keep parallel with preferable face, exist
Pattern rises and falls.Therefore during it is along level to the scan exposure moved, the mask that it is carried is relative to projection objective
Optimal object plane has certain height and dip deviation.Due to error term caused by such case, referred to as mask bench scanning inclination
Rolled with scanning.So to reach optimal exposure effect, it is necessary to measure the departure, mended in horizontal direction scanning motion
Mask platform height and inclined deviation are repaid, so as to ensure that mask remains at optimal object plane in scanning process.
Current patented technology CN201010114203.5 (titles：Mask bench scanning inclines in one kind measurement scanning litho machine
Oblique method), the inventive method measures the height tolerance of optimal object plane after scan exposure, with the method for alignment, is calculated
The scanning inclination of mask platform.Either patent CN200910045594.7 (titles：The measuring method and dress of mask bench scanning inclination
Put), this method is measured using the multiple row alignment mark on mask, and the vertical position of alignment mark aerial image is transformed into object plane
On, mask bench scanning inclination is calculated.
The content of the invention
Mask aligner mask platform gradient and the method and apparatus of vertical degree are measured it is an object of the invention to provide a kind of, should
For in scan exposure system.
In order to realize foregoing invention purpose, the present invention discloses a kind of dress for measuring mask aligner mask platform gradient and vertical degree
Put, it is characterised in that including：One light source, for providing equally distributed some hot spots located on a straight line to a mask
On, some hot spot orientations and described two parallel edge-perpendiculars of mask, two another with the mask are parallel
Sides aligned parallel；One photodetector, for detecting vertical angle value of some hot spots after mask reflection；At one
Device is managed, for calculating the dip deviation of mask platform according to some vertical angle value of hot spot.
Further, the light source and the photodetector are located at the both sides of a projection objective respectively, the light source,
The mask or the mask platform, and the photodetector three are located at three tops of the triangle of three formation
Point.
Further, the light source and the photodetector are located above or below the mask simultaneously.
Further, it is characterised in that when the mask platform can be with horizontal motion, some hot spot arrangement sides
To vertical with the mask bench scanning direction, for scanning inclination and scanning rolling.
Further, the dip deviation is turned over according to mask bench scanning inclination single order wedge shape, second order wedge shape, scanning
Rolling obtains.
Further, mask bench scanning inclination single order wedge shape wl, second order wedge shape wq, scanning rolling wrCalculation formula
For：
Wherein ZM1,ZM2。。。ZMnIt is each
The whole height position of mask bench scanning direction opening position mask platform, y1,y2…ynIt is mask platform positional value, c is constant term Z0、
Ry0。
Further, the ZMnCalculation beWherein n is the quantity of hot spot.
The present invention discloses a kind of method for measuring mask bench scanning inclination and scanning rolling, including：It is located at Step 1: providing
On equally distributed some hot spots a to mask on one straight line, some hot spot orientations and the mask bench scanning direction
Vertically；Step 2: the mask platform along y levels to scanning motion is done, records the hot spot after the mask or mask platform reflection
Vertical angle value；Step 3: according to the hot spot through the mask or the mask platform reflection after vertical angle value and the mask platform position
Put the dip deviation for calculating the mask platform.
Further, the dip deviation obtains according to mask bench scanning inclination single order wedge shape, second order wedge shape, scanning rolling
.
Further, mask bench scanning inclination single order wedge shape wl, second order wedge shape wq, scanning rolling wrCalculation formula
For：
Wherein ZM1,ZM2。。。ZMnIt is each
The whole height position of mask bench scanning direction opening position mask platform, y1,y2…ynIt is mask platform positional value, c is constant term Z0、
Ry0。
Further, the ZMnCalculation beWherein n is the quantity of hot spot.
Compared with prior art, method and device provided by the present invention is except including the scanning inclination in existing invention
Outside, the scanning rolling of mask platform is further comprises, higher precision can be reached in the compensation for optimal object plane.Measurement process
The device and measurement procedure used are different from existing inventive method.Existing invention all employ coaxillay aligned method, and participating in should
The subsystem of measuring system further comprises object lens, work stage with being directed at subsystem in addition to mask platform itself.The present invention uses
Focusing and leveling measuring system, the vertical variations of mask platform can be measured directly on the basis of complete machine Inner-world, be by difference point
The influence of system is smaller.Overall structure is simple.
Brief description of the drawings
It can be obtained further by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
Solution.
Fig. 1 is the structural representation for measuring mask bench scanning inclination and the device of scanning rolling involved in the present invention；
Fig. 2 is to measure the schematic diagram that hot spot is distributed under mask platform zero-bit coordinate system；
Fig. 3 is that hot spot and the schematic diagram of measurand are measured in measurement process；
Fig. 4 is the method flow diagram for measuring mask bench scanning inclination and scanning rolling involved in the present invention.
Embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
The present invention provides a kind of measurement mask aligner mask platform gradient and the method for vertical degree, applied to scan exposure system
In.It is as shown in Figure 1 that the measurement apparatus that the inventive method is used includes a kind of focusing and leveling system for measuring mask mesa shape.This is
The schematic diagram for the photodetection structure that may be used of uniting, the system can also use the mode of optical grating construction, air pressure, electric capacity or machinery
Realize.The structure realizes the survey changed to mask height and position during mask platform horizontal movement with the principle of triangulation
Amount.Including light source, photodetector.Light source is distributed in object lens both sides with photodetector.Illustrate two kinds as shown in Figure 1
Possible distribution mode.The measurement structure is characterised by, the measuring system can measure in mask platform mask space of a whole page shape with Y
To the change during horizontal movement.A figures and b figures are the measurement mask bench scanning inclination and the dress of scanning rolling respectively in Fig. 1
The two kinds of embodiments put.As shown in a figures, mask platform 20 is located at the top of projection objective 1, and mask 21 is located at mask platform 20
Top, mask platform 20 carry mask 21.Light source 10 and photodetector 30 are located at the lower section of mask platform 20.Scheme light source 10 in b
It is located at the top of mask platform 20 with photodetector 30.
R1 as shown in Figure 2, R2 ... R6 are that 6 measurement hot spots of the focusing and leveling system are distributed in mask platform zero-bit coordinate system
(RZCS) schematic diagram under, each hot spot point can measure height value Z1n, Z2n ... of the mask platform horizontally in motion process
Z6n.Hot spot shown in this schematic diagram is 6 along X to distribution, as long as meeting the number of 2 or more in actual use, it is possible to
Meets the needs of measurement scanning rolling.Hot spot Spreading requirements as shown in Figure 2 are just giving mask horizontal movement direction Y, Ge Geguang
Spot Y-direction position keeps constant, and X is uniformly distributed to identical interval a, and coverage mask version X as much as possible is to surface.It is tested
Object is the mask adsorbed in mask platform or mask platform.For mask platform level into motion process height and position measure cover
Masterplate is as shown in Figure 2.The measured zone of 6 hot spots meets the position of reflectivity requirements to illustrate outside graph area or graphics field
Put, the mask platform datum plate for being not limited to horizontally be distributed on mask or mask platform for the measurement object.
Fig. 3 is that hot spot and the schematic diagram of measurand are measured in measurement process.6 Y-direction coordinates are consistent, are distributed in X direction
Hot spot, interval is uniform.6 hot spot R1 to R6 are respectively positioned on mask 21, wherein 4 hot spots are located in graphics field, R1 with
R6 is located at outside graphics field.
Mask aligner mask platform gradient of the present invention and the measuring method of vertical degree comprise the following steps, referring to Fig. 4：
S401：Mask is uploaded, due to mask platform in level to adsorbing mask all the time during scanning motion, so
The measurement result of mask can consider to be consistent with the high variable quantity of mask platform.
S402：Initial position of the mobile mask platform to level to scanning.The position is scanning initial position, it is necessary to meet to survey
Measure requirement of the hot spot in effective measurement range.
S403：Horizontally y does scanning motion to mask platform.When the general scanning motion process is with etching system actual exposure
Scanning motion process be consistent.
S404：Each facular height value of focusing and leveling sensor is recorded, along y into motion process, 6 measurement facula measurements arrive
Height value be Z1n,Z2n…Z6n.Wherein n be mask platform along horizontal y into motion process, the measurement point that gets of measurement hot spot
Number, the general measurement point number are greater than 10, and the precision of measurement point more at most measurement result is also higher.
S405：Model calculates.The height value Z that each facula measurement obtains1n,Z2n…Z6n, mask platform position y1,y2…yn.Respectively
Individual y to the whole height position of opening position mask platform be ZM1,ZM2。。。ZMn。
Then mask platform is to the height of opening position in each y：
Wherein 6 be the number of measurement hot spot.
ZR=-RyX+c ... ... ... ... ... ... ... (2)
By the height value Z of 6 measurement hot spots1n,Z2n…Z6nAnd the horizontal level X of each hot spot passes through a most young waiter in a wineshop or an inn for people
Ry can be obtained by multiplying fitting.Had according to the vertical Controlling model of mask platform：
ZM=wly+wqy2+Z0…………………………………(3)
RyM=wry+Ry0……………………………………(4)
Wherein, wl、wq、wrIt is exactly required mask bench scanning inclination single order wedge shape, second order wedge shape, scanning rolling.Formula
(3) and (4) can be rewritten as matrix form respectively, and c is constant term Z0、Ry0：
Respectively by the position y of mask platformi(i=1,2,3 ... ..n) are substituted into, and w can be obtained by least square fittingl、wq、
wr。
Compared with prior art, method and device provided by the present invention is except including the scanning inclination in existing invention
Outside, the scanning rolling of mask platform is further comprises, higher precision can be reached in the compensation for optimal object plane.Measurement process
The device and measurement procedure used are different from existing inventive method.Existing invention all employ coaxillay aligned method, and participating in should
The subsystem of measuring system further comprises object lens, work stage with being directed at subsystem in addition to mask platform itself.The present invention uses
Focusing and leveling measuring system, the vertical variations of mask platform can be measured directly on the basis of complete machine Inner-world, be by difference point
The influence of system is smaller.Overall structure is simple.
The preferred embodiment of the simply present invention described in this specification, above example is only illustrating the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical scheme of experiment, all should be within the scope of the present invention.
Claims (4)
- A kind of 1. device for measuring mask aligner mask platform gradient and vertical degree, it is characterised in that including：One light source, for providing equally distributed some hot spots located on a straight line to a mask, some hot spots Orientation and described two parallel edge-perpendiculars of mask, two parallel sides aligned parallels another with the mask；One photodetector, for detecting vertical angle value of some hot spots after mask reflection；One processor, for calculating the dip deviation of mask platform according to some vertical angle value of hot spot, and according to the inclination Deviation calculates the mask bench scanning inclination single order wedge shape, second order wedge shape, scanning rolling；Specifically, when the mask platform is moved in the horizontal direction, some hot spot orientations and the mask bench scanning side To vertical, it is Z to record the height value that some hot spots measure when mask platform is moved1n,Z2n…Zmn, wherein m is hot spot Quantity, n are the measurement point number that some hot spots are got along scanning direction in mask platform motion process；By the height value Z of some hot spots1n,Z2n…ZmnAnd the edge horizontal level X vertical with scanning direction of each hot spot Substitute into ZR=-RyX+c, dip deviation Ry can be obtained by least square fitting,Required mask bench scanning inclination single order wedge shape w is calculated further according to the vertical Controlling model of mask platforml, second order wedge shape wq, sweep Retouch rolling wr：ZM=wly+wqy2+Z0……………………………………RyM=wry+Ry0………………………………………Above-mentioned formula can be rewritten as matrix form respectively, and c is constant term Z0、Ry0：<mrow> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mn>1</mn> <mn>2</mn> </msubsup> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mn>2</mn> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mn>2</mn> <mn>2</mn> </msubsup> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mi>n</mi> <mn>2</mn> </msubsup> </mtd> </mtr> </mtable> </mfenced> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>w</mi> <mi>l</mi> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>w</mi> <mi>q</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>+</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> </mtable> </mfenced> <mo>=</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mn>1</mn> </mrow> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mn>2</mn> </mrow> </msub> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mi>n</mi> </mrow> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>...</mo> <mrow> <mo>(</mo> <mn>1</mn> <mo>)</mo> </mrow> </mrow><mrow> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mn>2</mn> </msub> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mrow> <mo>(</mo> <msub> <mi>w</mi> <mi>r</mi> </msub> <mo>)</mo> </mrow> <mo>+</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> </mtable> </mfenced> <mo>=</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>R</mi> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> </mtr> <mtr> <mtd> <mrow> <msub> <mi>Ry</mi> <mn>2</mn> </msub> </mrow> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>R</mi> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>...</mo> <mrow> <mo>(</mo> <mn>2</mn> <mo>)</mo> </mrow> </mrow>Respectively by the position y along scanning direction of mask platformi(i=1,2,3 ... ..n) are substituted into, and can be asked by least square fitting Go out wl、wq、wr；Wherein described ZMnCalculation be
- 2. the device of measurement mask platform gradient and vertical degree as claimed in claim 1, it is characterised in that the light source and institute State the both sides that photodetector is located at a projection objective respectively, the light source, the mask or the mask platform, and the light Electric explorer three is located at three summits of the triangle of three formation.
- 3. the device of measurement mask platform gradient and vertical degree as claimed in claim 2, it is characterised in that the light source and institute State photodetector while above or below the mask.
- 4. a kind of measure mask aligner mask platform gradient and the method for vertical degree, it is characterised in that including：Step 1: provide on equally distributed some hot spots a to mask located on a straight line, some hot spot arrangements Direction is vertical with the mask bench scanning direction；Step 2: the mask platform along y levels to scanning motion is done, records the hot spot through the mask or the mask platform Vertical angle value Z after reflection1n,Z2n…Zmn, wherein m is the quantity of hot spot, and n is some hot spots in mask platform motion process The measurement point number got along scanning direction；Step 3: according to the hot spot through the mask or the mask platform reflection after vertical angle value and the mask platform position The dip deviation for calculating the mask platform is put, specifically, by the height value Z of some hot spots1n,Z2n…ZmnAnd each light The edge of the spot horizontal level X vertical with scanning direction is for people ZR=-RyX+c, inclination can be obtained by least square fitting Deviation Ry, wherein c are constant terms；Step 4: the mask bench scanning inclination single order wedge shape w is calculated according to the dip deviationl, second order wedge shape wq, scanning turn over Roll wr；ZM=wly+wqy2+Z0…………………………………RyM=wry+Ry0……………………………………Above-mentioned formula can be rewritten as matrix form respectively, and c is constant term Z0、Ry0：<mrow> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mn>1</mn> <mn>2</mn> </msubsup> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mn>2</mn> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mn>2</mn> <mn>2</mn> </msubsup> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> <mtd> <msubsup> <mi>y</mi> <mi>n</mi> <mn>2</mn> </msubsup> </mtd> </mtr> </mtable> </mfenced> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>w</mi> <mi>l</mi> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>w</mi> <mi>q</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>+</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> </mtable> </mfenced> <mo>=</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mn>1</mn> </mrow> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mn>2</mn> </mrow> </msub> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>z</mi> <mrow> <mi>M</mi> <mi>n</mi> </mrow> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>...</mo> <mrow> <mo>(</mo> <mn>3</mn> <mo>)</mo> </mrow> </mrow><mrow> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mn>2</mn> </msub> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mrow> <mo>(</mo> <msub> <mi>w</mi> <mi>r</mi> </msub> <mo>)</mo> </mrow> <mo>+</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>c</mi> </mtd> </mtr> </mtable> </mfenced> <mo>=</mo> <mfenced open = "(" close = ")"> <mtable> <mtr> <mtd> <mi>R</mi> <msub> <mi>y</mi> <mn>1</mn> </msub> </mtd> </mtr> <mtr> <mtd> <mrow> <msub> <mi>Ry</mi> <mn>2</mn> </msub> </mrow> </mtd> </mtr> <mtr> <mtd> <mo>...</mo> </mtd> </mtr> <mtr> <mtd> <mi>R</mi> <msub> <mi>y</mi> <mi>n</mi> </msub> </mtd> </mtr> </mtable> </mfenced> <mo>...</mo> <mrow> <mo>(</mo> <mn>4</mn> <mo>)</mo> </mrow> </mrow>Respectively by the position y along scanning direction of mask platformi(i=1,2,3 ... ..n) are substituted into, and can be asked by least square fitting Go out wl、wq、wr；Wherein described ZMnCalculation be
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1448797A (en) * | 2002-04-02 | 2003-10-15 | 佳能株式会社 | Exposure device |
| CN1476629A (en) * | 2000-11-22 | 2004-02-18 | 株式会社尼康 | Aligner, aligning method and method for fabricating device |
| CN102768469A (en) * | 2011-05-03 | 2012-11-07 | 上海微电子装备有限公司 | Focusing and bisecting system and adjustment method thereof |
| CN103885295A (en) * | 2012-12-19 | 2014-06-25 | 上海微电子装备有限公司 | Exposure apparatus and focusing and leveling method thereof |
-
2014
- 2014-11-11 CN CN201410632668.8A patent/CN105652598B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1476629A (en) * | 2000-11-22 | 2004-02-18 | 株式会社尼康 | Aligner, aligning method and method for fabricating device |
| CN1448797A (en) * | 2002-04-02 | 2003-10-15 | 佳能株式会社 | Exposure device |
| CN102768469A (en) * | 2011-05-03 | 2012-11-07 | 上海微电子装备有限公司 | Focusing and bisecting system and adjustment method thereof |
| CN103885295A (en) * | 2012-12-19 | 2014-06-25 | 上海微电子装备有限公司 | Exposure apparatus and focusing and leveling method thereof |
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