CN105651398A - Infrared temperature measurement-based wall bushing fault monitoring device - Google Patents
Infrared temperature measurement-based wall bushing fault monitoring device Download PDFInfo
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- CN105651398A CN105651398A CN201610012927.6A CN201610012927A CN105651398A CN 105651398 A CN105651398 A CN 105651398A CN 201610012927 A CN201610012927 A CN 201610012927A CN 105651398 A CN105651398 A CN 105651398A
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- temperature
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- wall bushing
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- 238000012806 monitoring device Methods 0.000 title claims abstract description 12
- 238000009529 body temperature measurement Methods 0.000 title abstract description 3
- 238000012545 processing Methods 0.000 claims abstract description 27
- 238000005259 measurement Methods 0.000 claims abstract description 13
- 238000012544 monitoring process Methods 0.000 claims abstract 2
- 238000013461 design Methods 0.000 claims description 3
- 238000004590 computer program Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 4
- 230000006855 networking Effects 0.000 abstract description 2
- 230000004044 response Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 101100162020 Mesorhizobium japonicum (strain LMG 29417 / CECT 9101 / MAFF 303099) adc3 gene Proteins 0.000 description 1
- 101100434411 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ADH1 gene Proteins 0.000 description 1
- 101150102866 adc1 gene Proteins 0.000 description 1
- 101150042711 adc2 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention relates to an infrared temperature measurement-based wall bushing fault monitoring device. The device is used for monitoring a wall bushing in real time. The device comprises a temperature collection module, a signal processing module, a wireless transceiver module, a timing wake-up module and a PC terminal upper computer software. The temperature collection module and the signal processing module are in communication with each other based on the IIC protocol. The wireless transceiver module enables the CC110L RF wireless communication. Measured data are finally transmitted to a PC terminal and then are displayed in real time based on the upper computer software. The system of the device is extremely low in power consumption, fast in response, accurate in measurement, convenient in networking and simple in operation.
Description
Technical field
The present invention relates to a kind of wall bushing fault monitoring device based on infrared measurement of temperature.
Background technology
Traction substation is the core of electric railway, is responsible for the dual role of power transformation and distribution. Wall bushing is to make wire through the equipment of the dividing plate of ground connection, wall or electrical equipment shell in electric substation, plays fixing between insulating supporting and outer lead and interconnection function. High-voltage wall bushing is made up of porcelain piece, metal-ware, mounting flange and busbar. Porcelain piece belongs to breakables, is transporting often chipping with in installation process or is cracking, is overhauling department statistics survey result according to electric substation and show, circuit wall bushing Frequent Accidents, ratio of defects is in ascendant trend year by year. Owing to the randomness of high pressure equipment fault, stage and disguised three features make the discovery of fault or maintenance always delayed, so, it is provided that a kind of device that wall bushing fault is monitored in real time, just it is particularly important ensuring safety.
Summary of the invention
According to above the deficiencies in the prior art, the technical problem to be solved is to propose a kind of wall bushing fault monitoring device based on infrared measurement of temperature, by the lap joint of high-voltage wall bushing is carried out monitor in real time, promptly and accurately find out the high-voltage wall bushing broken down, ND hidden danger after solving high-voltage wall bushing fault, substantially increases reliability and the safety of high-voltage wall bushing.
To achieve these goals, the present invention adopts the following technical scheme that the present invention is a kind of wall bushing fault monitoring device based on infrared measurement of temperature, and it includes temperature collect module, signal processing module, radio receiving transmitting module, timing wake-up module and PC terminal upper computer software.
Described temperature collect module includes infrared temperature induction chip, described infrared temperature induction chip is a MLX90614 cake core, precision 0.02 DEG C, inside comprises infrared thermopile and DSP processing unit, by EEPROM design temperature scope, its ram cell can store environment and the testee temperature signal of collection, is connected with partial node processing module with clock line SCL by data wire SDA, adopts the digital temperature parameter signal that the transmission of SMBUS communication protocol gathers to partial node processing module.
Described signal processing module includes STC15W408AS-SOP28 chip. Output temperature value is transmitted to PC terminal upper computer program display by described signal processing module through wireless RF radio-frequency module, and described radio receiving transmitting module includes CC110L processor chips.
Described PC terminal upper computer software can be interrupted displays temperature value by timing and wall bushing is carried out monitor in real time.
Compared with the prior art, the invention has the beneficial effects as follows:
The present invention selects MLX90614 infrared measurement of temperature chip directly to export digital temperature signal to carry out non-contact temperature measuring, select CC110L high-performance, super low-power consumption, programmable type transceiving chip as the processor chips of radio receiving transmitting module, the host computer procedure that C# language is write is used to show the temperature value monitored in real time, owing to adopting such scheme, infrared measurement of temperature and RF Radio Transmission Technology are combined as a whole by the present invention, whole system is made without wiring and to have super low-power consumption, quickly response, accurately measure, networking is convenient, advantage simple to operate.
Accompanying drawing explanation
Accompanying drawing 1 is IR temperature measuring device of the present invention composition and structure.
Accompanying drawing 2 is temperature collect module circuit diagram of the present invention.
Accompanying drawing 3 is host computer main program block diagram of the present invention.
Accompanying drawing 4 is timing wake-up module frame chart of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail:
With reference to accompanying drawing 1, the present invention relates to a kind of wall bushing fault monitoring device based on infrared measurement of temperature, storage and the function such as printing, man-machine interaction of the management of upper PCs completion system, the collection of data and process, information in distributed frame.
Slave computer is each radio node, and is star structure between host computer, uses short distance wireless data communication technology to transfer data to wireless base station, and base station transfers data to host computer by Wireline.
Temperature measuring unit adopts lithium battery power supply, in order to extend the cycle changing battery, designs timing unit in the module, and each periodic system is waken up once, receives and dispatches a secondary data. The key technical indexes of system is: temperature measurement range :-20 DEG C��100 DEG C, precision �� 1.0 DEG C; Operating temperature range :-20 DEG C��60 DEG C; Safe distance: 1m; Wireless data transmission speed: 1200bps; Maximum transmission distance is 100m. Supplying cell is the lithium ion battery of capacity 2400mAh.
The described wall bushing fault monitoring device based on infrared measurement of temperature includes temperature collect module, signal processing module, radio receiving transmitting module, timing wake-up module and PC terminal upper computer software. Described temperature collect module includes a MLX90614 chip, described signal processing module includes STC15W408AS-SOP28 chip, described radio receiving transmitting module selects CC110L high-performance, super low-power consumption, programmable type transceiving chip as the processor chips of radio receiving transmitting module, and described PC terminal can run the host computer monitoring program write under Windows7 environment by C# language. It is connected with signal processing module by temperature collect module, described environment and key point temperature parameter signal transmission extremely described signal processing module will be gathered, after being processed by described signal processing module, after being processed by radio receiving transmitting module by described signal processing module, temperature value transmits to PC terminal, described ambient temperature and object temperature value is shown, it is achieved that the function that the collection of temperature data, process and transmission show by upper computer software.
Described signal processing module and temperature collect module are the core of whole system. With reference to accompanying drawing 2, including a MLX90614 chip inside described temperature collect module, described MLX90614 chip is four port devices, is internally integrated thermoelectric pile and DSP processing unit, running voltage 3.3V.Described port 1 is SCL port, it is achieved the transmission of clock signal, and described port 2 is SDA port, it is achieved the transmission of temperature data, and described port 3 is power vd D port, and described port 4 is ground connection VSS port; Described SDA port and SCL port meet power vd D through pull-up resistor R1, R2, and described vdd terminal mouth and VSS port connect C1 electric capacity. When working on power, described MLX90614 chip will output digital temperature voltage signal.
Described temperature collect module SCL port and SDA port are connected with partial node processing module P1_2 port and P1_3 port respectively, and described temperature collect module and signal processing module are communicated by IIC agreement. After described signal processing module and temperature collect module electrical connection, there is volume little, low in energy consumption, it is wirelessly transferred the feature that capacity of resisting disturbance is strong.
Including inside described signal processing module is a STC15W408AS-SOP28 chip, and device temperature and ambient temperature data are carried out A/D conversion by described STC15W408AS-SOP28 chip, passes to radio receiving transmitting module and controls the operation of whole system. The amplified input inputting the ADC3 of STC15W, ADC1 and ADC2 respectively of described two-way voltage signal. The AD reference voltage circuit of described STC15W408AS-SOP28 chip is made up of voltage-reference TLV431BIDBZ. Described signal processing module is powered by Large Copacity rechargeable lithium ion batteries.
Described radio receiving transmitting module includes CC110L processor chips, and described CC110L chip is the high-performance of TI production, super low-power consumption, transceiving chip able to programme. Described CC110L chip can be operated in 315/433/868/915MHz frequency range, has the sleep pattern being low to moderate 200nA electric current, simple with the interface of main control chip.
With reference to accompanying drawing 3,4, described timing wake module works in power supply continued power situation, and timing cycle is 60 times/h, makes MCU electrification reset in down trigger mode, enters duty.
The undeclared part related in the present invention is identical with prior art or adopts prior art to be realized.
Claims (4)
1. the wall bushing fault monitoring device based on infrared measurement of temperature, it is characterised in that including:
Temperature collect module, signal processing module, radio receiving transmitting module, timed reminding module and PC terminal upper computer software, wherein:
Described temperature collect module is connected with partial node processing module I/O port P1_3 and P1_2 by port SDA and port SCL, and the digital temperature parameter of temperature collect module output collection is to signal processing module; Output temperature value is transmitted to PC terminal upper computer program display by described signal processing module through wireless RF radio-frequency module; Described PC terminal upper computer software has the function of monitoring in real time.
2. a kind of wall bushing fault monitoring device based on infrared measurement of temperature according to claim 1, it is characterized in that, described temperature collect module includes: MLX90614 sensor, precision 0.02 DEG C, inside comprises infrared thermopile and DSP processing unit, by EEPROM design temperature scope.
3. a kind of wall bushing fault monitoring device based on infrared measurement of temperature according to claim 1, it is characterised in that described signal processing module includes STC15W408AS-SOP28 chip.
4. a kind of wall bushing fault monitoring device based on infrared measurement of temperature according to claim 1, it is characterised in that: wall bushing can be carried out monitor in real time by time display temperature value by described PC terminal upper computer software.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610012927.6A CN105651398A (en) | 2016-01-11 | 2016-01-11 | Infrared temperature measurement-based wall bushing fault monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610012927.6A CN105651398A (en) | 2016-01-11 | 2016-01-11 | Infrared temperature measurement-based wall bushing fault monitoring device |
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| CN105651398A true CN105651398A (en) | 2016-06-08 |
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| CN201610012927.6A Pending CN105651398A (en) | 2016-01-11 | 2016-01-11 | Infrared temperature measurement-based wall bushing fault monitoring device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107367697A (en) * | 2017-08-24 | 2017-11-21 | 武汉大学 | A kind of double detector lithium battery surface temperature detector and method |
| CN111999603A (en) * | 2020-08-31 | 2020-11-27 | 吉林省龙波电气技术有限公司 | Cable line distributed fault accurate positioning method and device |
| CN112179496A (en) * | 2020-09-15 | 2021-01-05 | 西安交通大学 | Infrared diagnosis operation and maintenance method for ultra-high voltage and extra-high voltage wall bushing with contact finger structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226679A (en) * | 2008-02-01 | 2008-07-23 | 鞍山市融庭科技开发有限公司 | Hot fault warning system device |
| CN103822719A (en) * | 2014-03-18 | 2014-05-28 | 上海电力学院 | LabVIEW-based online infrared temperature monitoring system of electrical equipment |
-
2016
- 2016-01-11 CN CN201610012927.6A patent/CN105651398A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226679A (en) * | 2008-02-01 | 2008-07-23 | 鞍山市融庭科技开发有限公司 | Hot fault warning system device |
| CN103822719A (en) * | 2014-03-18 | 2014-05-28 | 上海电力学院 | LabVIEW-based online infrared temperature monitoring system of electrical equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107367697A (en) * | 2017-08-24 | 2017-11-21 | 武汉大学 | A kind of double detector lithium battery surface temperature detector and method |
| CN111999603A (en) * | 2020-08-31 | 2020-11-27 | 吉林省龙波电气技术有限公司 | Cable line distributed fault accurate positioning method and device |
| CN112179496A (en) * | 2020-09-15 | 2021-01-05 | 西安交通大学 | Infrared diagnosis operation and maintenance method for ultra-high voltage and extra-high voltage wall bushing with contact finger structure |
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