CN105648491B - A kind of System and method for of electrical-chemistry method 3-dimensional metal micro-structural - Google Patents
A kind of System and method for of electrical-chemistry method 3-dimensional metal micro-structural Download PDFInfo
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- CN105648491B CN105648491B CN201610170808.3A CN201610170808A CN105648491B CN 105648491 B CN105648491 B CN 105648491B CN 201610170808 A CN201610170808 A CN 201610170808A CN 105648491 B CN105648491 B CN 105648491B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
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Abstract
Patent of the present invention discloses a kind of System and method for of electrical-chemistry method 3-dimensional metal micro-structural, belongs to micro-NTM field.The system includes electro-deposition subsystem, electrolysis subsystem and conductive substrates.Electro-deposition subsystem includes shower nozzle and electro-deposition power supply.Electrolysis subsystem includes negative electrode（Crossbeam negative electrode, left side negative electrode and right side negative electrode）With Electrolyzed Processing power supply.Electro-deposition power cathode and Electrolyzed Processing positive source are both connected to conductive substrates, and electro-deposition positive source is connected with shower nozzle, and Electrolyzed Processing power cathode is connected with negative electrode.Based on the system, first pass through jet electro-deposition processing and layer of metal is deposited in substrate, electrochemical dissolution processing is carried out to deposited metal surface with negative electrode again, the defects of to remove its surface buildup, burr, then redeposited metal, then to new metal level Electrolyzed Processing ... so alternately, until reaching processing request.The present invention is simple in construction, and operation is easy, and cost is low, can preferably solve the problems, such as that jet sedimentary is present.
Description
Technical field
The present invention relates to a kind of electrical-chemistry method system and method, more particularly to one kind to be used for 3-dimensional metal micro-structural electrification
Learn the system and method for processing.
Background technology
Electro-deposition is a kind of special warfare technology for implementing metal level/part preparation based on electrochemical deposition principle, in industry
There is quite varied application in field.Jet electro-deposition is a kind of electrodeposition technology of special shape.It is will to contain metal ion
Electrolyte in the form of high-speed jet, carry out regioselectivity electro-deposition process technology.Jet electro-deposition techniques have heavy
The process advantages such as product speed is fast, the operation free degree is big, attract attention and pay attention in some application fields, especially in three-dimensional metal part
Quick manufacturing field.But jet electro-deposition techniques are due to itself intrinsic characteristic so that it is inevitably present deposition region
Electric field and Flow Field Distribution uneven phenomenon, cause sedimentary uneven thickness distribution, surface irregularity, buildup and hair generally occur
The problems such as thorn.Conventional solution method is to interrupt electrodeposition process repeatedly, using the method for secondary operation, is gone by machining
Except surface buildup and burr, secondary deposition is carried out after polishing to maintain the lasting progress of electro-deposition.
In order to overcome disadvantage mentioned above, Patent No. CN101994137A patent of invention also discloses a kind of revolving parts
High-speed jet injection electroforming process and device.The patent removes jet electrodeposition process online by the method for grinding
In caused buildup and the defects of burr, improve the machining accuracy of jet electro-deposition to a certain extent.But the patent institute
Processing of the method and apparatus being related to for intergrated system of no-rotating part and fine metal part, its applicability face huge challenge.Cause
This, present invention proposition is a kind of to be directed to the precision machined new electrical-chemistry method System and method for of 3-dimensional metal micro-structural.
The content of the invention
In view of the above-mentioned problems, the purpose of the present invention is to be difficult to Continuous maching for existing jet electro-deposition method to go out surface
The deficiency of the high 3-dimensional metal micro-structural of smooth, dense structure, precision, proposes a kind of electrical-chemistry method 3-dimensional metal micro-structural
System and method for.
In order to solve the above technical problems, the technical scheme is that：
A kind of system of electrical-chemistry method 3-dimensional metal micro-structural, it is characterised in that：It includes electro-deposition subsystem, electrolysis
Subsystem, conductive substrates and electrolyte layer, described electro-deposition subsystem include shower nozzle and electro-deposition power supply, described electro-deposition
The negative pole of power supply is connected with conductive substrates, and the positive pole of electro-deposition power supply is connected with shower nozzle, described shower nozzle and described conductive base
Bottom face is set, and described electrolysis subsystem includes negative electrode and Electrolyzed Processing power supply, and described negative electrode includes crossbeam negative electrode, left side
Negative electrode and right side negative electrode, described left side negative electrode and right side negative electrode are arranged on crossbeam negative electrode, described negative electrode and conductive substrates
Face set, the medial surface of left side negative electrode it is parallel with the medial surface of right side negative electrode and with crossbeam cathode vertical, described electrolysis
The positive pole of processing power source is connected with conductive substrates, and the negative pole of described Electrolyzed Processing power supply is connected with negative electrode, described electrolyte
Layer is covered in conductive substrates.
Described electro-deposition subsystem also includes nozzle boss, and described shower nozzle is fixed on nozzle boss and nozzle boss electricity is exhausted
Edge.
Described crossbeam negative electrode is movably disposed on nozzle boss.
The distance between described left side negative electrode and right side negative electrode are adjustable.
Described crossbeam negative electrode lower surface is plane, and even number mounting hole is provided with crossbeam negative electrode, it is therefore preferable to 4
Or 6 or 8 or 10, and described mounting hole is with its center symmetric setting, described left side negative electrode and the installation of right side negative electrode
In different mounting holes.
It is arranged on described crossbeam negative electrode described left side negative electrode and right side cathode vertical.
The axis of described left side negative electrode and right side negative electrode each parallel to shower nozzle.
A kind of processing method of electrical-chemistry method 3-dimensional metal micro-structural, it comprises the following steps：
S1, adjustment shower nozzle are 5mm~10mm relative to the height of conductive substrates, open the switch of shower nozzle, allow and sprayed by shower nozzle
The electro-hydraulic beam gone out is perpendicular to conductive substrates；
While S2, connection electro-deposition power supply, shower nozzle is set to make scanning motion relative to conductive substrates by planned course, in electricity
Electro-deposition goes out layer of metal in conductive substrates in the presence of, when planned course terminal is arrived in shower nozzle scanning, disconnects electro-deposition
Power supply, and shower nozzle is exited processing district；
S3, adjust respectively between crossbeam negative electrode, left side negative electrode, right side negative electrode and the metal level of step S2 electro-deposition away from
From it is 0.1~0.9mm, left side negative electrode to make distance of the crossbeam negative electrode lower surface apart from the metal level upper surface of step S2 electro-deposition
Distance respectively apart from the metal level two side of step S2 electro-deposition of medial surface, the medial surface of right side negative electrode be 0.1~
0.9mm, conductive substrates are reduced, the metal level of step S2 electro-deposition is totally submerged in electrolyte layer；
S4, Electrolyzed Processing power supply is connected, negative electrode is made scanning motion along the given planned courses of step S2, in step S2
Corrosion dissolution processing is made in the metal level upper surface of electro-deposition and two side, when negative electrode running position exceedes the gold deposited in step S2
When belonging to layer, stop scanning motion, simultaneously switch off Electrolyzed Processing power supply；
S5, rise conductive substrates, allow the metal level upper surface of step S4 Electrolyzed Processings to be completely exposed electrolyte layer；
S6, repeat electrical-chemistry method by step S1, S2, S3, S4, S5 successively, until the part processed reaches institute
It is required that height when terminate all operations.
The present invention has advantages below compared with prior art：
It is 1st, simple in construction, it is easy to accomplish, cost is low.It need to be only simply in conventional jet electro-deposition system additional structure
The electrolysis electrode and Electrolyzed Processing power supply of Electrochemical Smoothing processing, just can preferably solve asking present in jet electro-deposition part/layer
Topic, process costs are low.
2nd, machining accuracy is high, and surface quality is good.Processed relative to conventional jet electro-deposition, add real-time Electrochemical Smoothing
Procedure of processing, so, a variety of deposition defects of electrodeposition step formation can be eliminated in time, and then improve adding for electro-deposition part/layer
Work precision and surface quality, while preferable basic condition is provided for subsequent deposition process, avoid the accumulation of negative effect.
Brief description of the drawings
Fig. 1 is a kind of installation diagram of the system of electrical-chemistry method 3-dimensional metal micro-structural of the present invention.
Label and title in figure：1st, conductive substrates 2, electro-hydraulic beam 3, shower nozzle 4, electro-deposition power supply 5, nozzle boss 6, side
Groove 7, crossbeam negative electrode 8, left side negative electrode 9, mounting hole 10, negative electrode 11, Electrolyzed Processing power supply 12, medial surface 13, right side
Negative electrode 14, medial surface 15, electrolyte layer.
Embodiment
The implementation of 1 pair of patent of the present invention is further described below in conjunction with the accompanying drawings.
A kind of system of electrical-chemistry method 3-dimensional metal micro-structural, it is characterised in that：It includes electro-deposition subsystem, electrolysis
Subsystem, material are for stainless steel SUS304 conductive substrates 1 and containing nickel sulfamic acid (350g/L), nickel chloride (10g/L), boric acid
The electrolyte layer 15 of (40g/L), electro-deposition subsystem include the shower nozzle 3 and electro-deposition power supply 4 of stainless steel SUS304 materials, and electricity is heavy
The negative pole of product power supply 4 is connected with conductive substrates 1, and the positive pole of electro-deposition power supply 4 is connected with shower nozzle 3, and shower nozzle 3 and conductive substrates 1
Face is set, and electrolysis subsystem includes negative electrode 10 and Electrolyzed Processing power supply 11, and negative electrode 10 includes crossbeam negative electrode 7, the and of left side negative electrode 8
Right side negative electrode 13, left side negative electrode 8 and right side negative electrode 13 are arranged on crossbeam negative electrode 7, and negative electrode 10 is set with the face of conductive substrates 1,
The medial surface 12 of left side negative electrode 8 is parallel with the medial surface 14 of right side negative electrode 13 and vertical with crossbeam negative electrode 7, Electrolyzed Processing power supply
11 positive pole is connected with conductive substrates 1, and the negative pole of Electrolyzed Processing power supply 11 is connected with negative electrode 10, and electrolyte layer 15 is covered in conduction
In substrate 1.Crossbeam negative electrode 7, left side negative electrode 8 and right side negative electrode 13 are metal platinum.
Electro-deposition subsystem also includes nozzle boss 5 made of electrically insulating material polypropylene, and shower nozzle 3 is coaxially fixed on nozzle boss
On 5.
Crossbeam negative electrode 7 is fixedly linked in the square groove 6 of nozzle boss 4 by holding screw and can adjust it as needed in side
Position in groove 6.
The lower surface of crossbeam negative electrode 7 is plane, and the lower end of crossbeam negative electrode 7 is provided with even number mounting hole 9, mounting hole 9
Number is 6, and mounting hole 9 is arranged on different mounting holes 9 with its center symmetric setting, left side negative electrode 8 and right side negative electrode 13
It is interior.
Left side negative electrode 8 and right side negative electrode 13 are vertically installed on crossbeam negative electrode 7, by install in different mounting holes 9 come
Adjust the distance between they.
The axis of left side negative electrode 8 and right side negative electrode 13 each parallel to shower nozzle 3.
A kind of processing method of electrical-chemistry method 3-dimensional metal micro-structural, it comprises the following steps：
S1, adjustment shower nozzle 3 are 10mm relative to the height of conductive substrates 1, open the switch of shower nozzle 3, allow and sprayed by shower nozzle 3
Electro-hydraulic beam 2 perpendicular to conductive substrates 1；
While S2, connection electro-deposition power supply 4（Now shower nozzle 3 is anode, and conductive substrates 1 are negative electrode）, make shower nozzle 3 by setting
Scanning motion is made in meter track relative to conductive substrates 1, and the nickel ion in electro-hydraulic beam 2 in the presence of electric field is just reduced into metallic nickel
Atom is simultaneously deposited on electronegative in conductive substrates 1, the metal level of one layer of nickel material of formation, when planned course is arrived in the scanning of shower nozzle 3
During terminal, electro-deposition power supply 4 is disconnected, and shower nozzle 3 is exited processing district, now electrodeposition process stops；
S3, crossbeam negative electrode 7, left side negative electrode 8 and right side negative electrode 13 and the nickel material metal of step S2 electro-deposition are adjusted respectively
The distance between layer, makes distance of the lower surface of crossbeam negative electrode 7 apart from the nickel material metal level upper surface of step S2 electro-deposition be
0.2mm, the medial surface 12 of left side negative electrode 8 and right side negative electrode 13 medial surface 14 are respectively apart from the nickel material gold of step S2 electro-deposition
The distance for belonging to layer two side is 0.2mm, reduces conductive substrates 1, is totally submerged the nickel material metal level of step S2 electro-deposition
In electrolyte layer 15, the electrochemical dissolution step so for subsequent step S4 creates necessary processing gap and electrolysis pendular ring
Border；
S4, connect Electrolyzed Processing power supply 11（Now crossbeam negative electrode 7, left side negative electrode 8, right side negative electrode 13 are negatively charged, for the moon
Pole, and the nickel material metal layer strip positive electricity of step S2 electro-deposition, it is anode）, make shower nozzle 3 along step S2 give planned course from
Terminal reversely makees scanning motion, and at the same time, the upper surface and two side of the nickel material metal level of step S2 electro-deposition are in electrification
Constantly it is dissolved successively in the presence of and removes a part of metal, according to electrochemical dissolution principle, the dissolving of jut is gone
Except speed faster so that the buildup and uneven defect that the nickel material layer on surface of metal of step S2 electro-deposition is formed are removed,
The nickel material layer on surface of metal more finishing of step S2 electro-deposition, so as to provide more preferable surface strip for follow-up electrodeposition step
Part；When starting point of the crossbeam negative electrode 7 just above planned course, stop scanning motion, simultaneously switch off Electrolyzed Processing power supply 11, now
Electrochemical dissolution process terminates；
S5, rise conductive substrates 1, allow the nickel material metal level upper surface of step S4 Electrolyzed Processings to be completely exposed electrolyte layer
15；
S6, successively by step S1, S2, S3, S4, S5, repeat electrical-chemistry method, until the part processed reaches institute
It is required that height when terminate all operations.Operated through such mode（Electro-deposition-electrochemical dissolution alternate repetition is carried out）, electrochemistry
Process the metal micro structure element precision prepared and surface quality is all more satisfactory.
Claims (10)
- A kind of 1. system of electrical-chemistry method 3-dimensional metal micro-structural, it is characterised in that：It includes electro-deposition subsystem, electrolysis System, conductive substrates（1）And electrolyte layer（15）, described electro-deposition subsystem includes shower nozzle（3）With electro-deposition power supply（4）, Described electro-deposition power supply（4）Negative pole and conductive substrates（1）Connection, described electro-deposition power supply（4）Positive pole and shower nozzle（3） Connection, described shower nozzle（3）With described conductive substrates（1）Face is set, and described electrolysis subsystem includes negative electrode（10）With Electrolyzed Processing power supply（11）, described negative electrode（10）Including crossbeam negative electrode（7）, left side negative electrode（8）With right side negative electrode（13）, it is described Left side negative electrode（8）With right side negative electrode（13）It is arranged on crossbeam negative electrode（7）On, described negative electrode（10）With conductive substrates（1）Just To setting, described left side negative electrode（8）Medial surface（12）With right side negative electrode（13）Medial surface（14）It is parallel and and crossbeam Negative electrode（7）Vertically, described Electrolyzed Processing power supply（11）Positive pole and conductive substrates（1）Connection, described Electrolyzed Processing power supply （11）Negative pole and negative electrode（10）Connection, described electrolyte layer（15）It is covered in conductive substrates（1）On.
- A kind of 2. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 1, it is characterised in that：Described Electro-deposition subsystem also includes nozzle boss（5）, described shower nozzle（3）Coaxially it is fixed on nozzle boss（5）Upper and nozzle boss（5）It is electric exhausted Edge.
- A kind of 3. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 2, it is characterised in that：Described Crossbeam negative electrode（7）It is movably disposed at nozzle boss（5）On.
- A kind of 4. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 1, it is characterised in that：Described Left side negative electrode（8）With right side negative electrode（13）The distance between it is adjustable.
- A kind of 5. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 1 or 4, it is characterised in that：Institute The crossbeam negative electrode stated（7）Lower surface is plane, and crossbeam negative electrode（7）On be provided with even number mounting hole（9）, described mounting hole （9）With crossbeam negative electrode（7）Center symmetric setting, described left side negative electrode（8）With right side negative electrode（13）Installed in different peaces Fill hole（9）It is interior.
- A kind of 6. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 1, it is characterised in that：Described Left side negative electrode（8）With right side negative electrode（13）It is vertically disposed at described crossbeam negative electrode（7）On.
- A kind of 7. system of electrical-chemistry method 3-dimensional metal micro-structural according to claim 1, it is characterised in that：Described Left side negative electrode（8）With right side negative electrode（13）Each parallel to shower nozzle（3）Axis.
- A kind of 8. method of electrical-chemistry method 3-dimensional metal micro-structural, it is characterised in that：It comprises the following steps：S1, adjustment shower nozzle（3）Relative to conductive substrates（1）Height, open shower nozzle（3）Switch, allow by shower nozzle（3）Spray Electro-hydraulic beam（2）Vertically it is ejected into conductive substrates（1）；S2, connect electro-deposition power supply（4）, make shower nozzle（3）By setting track relative to conductive substrates（1）Make scanning motion, in electricity In conductive substrates in the presence of（1）Upper electro-deposition goes out layer of metal, works as shower nozzle（3）When scanning planned course terminal, disconnect Electro-deposition power supply（4）, and make shower nozzle（3）Exit processing district；S3, crossbeam negative electrode is adjusted respectively（7）, left side negative electrode（8）, right side negative electrode（13）With the metal level of electro-deposition in step S2 it Between distance, and reduce conductive substrates（1）, the metal level of electro-deposition in step S2 is totally submerged in electrolyte layer（15）In；S4, connect Electrolyzed Processing power supply（11）, make negative electrode（10）The planned course given along step S2 makees scanning motion, to step Corrosion dissolution processing is made in the metal level upper surface of electro-deposition in S2 and two side, is deposited when negative electrode running position exceedes in step S2 Metal level when, stop scanning motion, simultaneously switch off Electrolyzed Processing power supply（11）；S5, rise conductive substrates（1）, allow the metal level upper surface of step S4 Electrolyzed Processings to be completely exposed electrolyte layer（15）；S6, repeat electrical-chemistry method according to step S1, S2, S3, S4, S5 successively, wanted until the part processed reaches Terminate all operations during the height asked.
- A kind of 9. method of electrical-chemistry method 3-dimensional metal micro-structural according to claim 8, it is characterised in that：Described Shower nozzle in step S1（3）Relative to conductive substrates（1）Height be 5mm~10mm.
- A kind of 10. method of electrical-chemistry method 3-dimensional metal micro-structural according to claim 8, it is characterised in that：It is described Step S3 middle cross beam negative electrodes（7）The distance of lower surface metal level upper surface of electro-deposition in step S2 be 0.1~ 0.9mm, left side negative electrode（8）Medial surface（12）, right side negative electrode（13）Medial surface（14）The electro-deposition in step S2 respectively The distance of metal level two side be 0.1~0.9mm.
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| CN105951141A (en) * | 2016-07-04 | 2016-09-21 | 江苏大学 | Three-dimensional surface shot peening jet electrodeposition manufacturing method and device |
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| CN108103541B (en) * | 2017-11-09 | 2019-11-22 | 河南理工大学 | A kind of metal three-dimensional increasing material manufacturing apparatus and method |
| CN110230078B (en) * | 2019-06-17 | 2021-04-02 | 南京航空航天大学 | Method for manufacturing electrochemical micro additive by dynamically regulating and controlling constrained electric field of double-potential tool electrode |
| CN110306210B (en) * | 2019-07-16 | 2021-07-02 | 吉林大学 | Electrochemical 3D printing device and method for metal-based composite material part |
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| CN102544744A (en) * | 2011-10-28 | 2012-07-04 | 深圳光启高等理工研究院 | Metamaterial with three-dimensional microstructure |
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