CN105648225B - Method for separating amphoteric metal in waste circuit boards - Google Patents
Method for separating amphoteric metal in waste circuit boards Download PDFInfo
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- CN105648225B CN105648225B CN201610185756.7A CN201610185756A CN105648225B CN 105648225 B CN105648225 B CN 105648225B CN 201610185756 A CN201610185756 A CN 201610185756A CN 105648225 B CN105648225 B CN 105648225B
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- leaching
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/008—Wet processes by an alkaline or ammoniacal leaching
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B13/00—Obtaining lead
- C22B13/04—Obtaining lead by wet processes
- C22B13/045—Recovery from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0065—Leaching or slurrying
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B19/00—Obtaining zinc or zinc oxide
- C22B19/20—Obtaining zinc otherwise than by distilling
- C22B19/24—Obtaining zinc otherwise than by distilling with leaching with alkaline solutions, e.g. ammonia
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B21/00—Obtaining aluminium
- C22B21/0015—Obtaining aluminium by wet processes
- C22B21/0023—Obtaining aluminium by wet processes from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Metallurgy (AREA)
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- Life Sciences & Earth Sciences (AREA)
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- General Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a method for separating amphoteric metal in waste circuit boards. The method includes the steps of firstly, adding multi-metal powder of the waste circuit boards into an alkali solution with the concentration being 0.5-2mol/L, stirring under 30-80 DEG C for leaching, and filtering to obtain low-alkali leaching residues and low-alkali leachate containing aluminum and zinc; secondly, adding the low-alkali leaching residues into an alkali solution with the concentration being 1-4mol/L, adding oxidizing agent with the amount being 1-10 times of the theoretical amount at the same time, stirring under 30-80 DEG C for leaching, and filtering to obtain high-alkali leaching residues and high-alkali leachate containing lead and tin. The method has the advantages that step-by-step alkali dissolution is performed on the amphoteric metal in the waste circuit boards, the metal is separated selectively, the leachate is simple in component, few in impurity and easy to separate, the recycled product is high in puerility and low in equipment corrosion, production cost is lowered, and production efficiency is increased.
Description
Technical field
The invention belongs to waste resource recovery technology field, more particularly to it is a kind of using the discarded circuit of step alkali solution separation
The method of amphoteric metal in plate.
Background technology
In recent years, as electronic product update speed is accelerated, China generates substantial amounts of electron wastes.These electricity
Sub- garbage complicated component, toxic chemical substance content are more, if directly filled, heavy metal therein can be to soil and water
Resource is polluted, if directly burning disposal, Organic substance therein can discharge Xiang bioxin, furan etc. through burning and be harmful to
Gas, works the mischief to natural environment and human body.Additionally, the metal containing a large amount of recoverables in electron wastes, such as aluminum,
Copper, lead, zinc, noble metal (gold, silver), platinum group metal, these metallic element abundant species, grade are high, have recovery value.With
Global resources shortage, the recycling of high-alkali resource is increasingly becoming focus of attention.Electron wastes, as important " city
City mine ", is also paid close attention to by people all the more.
The Chinese patent application of Publication No. CN102191383A, discloses employing " wet method sealing-off-disassemble classification-pyrogenic process
Burn " the recovering and processing discarded wiring board of the technique that combines, will move back tinbase plate and components and parts with nitric acid type tin stripping liquid in useless circuit board
Separate, spent solder stripper obtains stanniferous filtering residue and leaded filtrate by adjusting pH, stanniferous filtering residue Jing sodium sulfite reduces-add adjusting PH with base-add
Acid adjusts pH- condensing crystallizings that STANNOUS SULPHATE CRYSTALLINE crystal is obtained, and leaded filtrate is obtained lead sulfate tribasic product；The method will to equipment performance
Ask high, working environment is poor, stannum recovery process long flow path, metal recovery high cost.The China of Publication No. CN102747229A is specially
Profit application, the method for disclosing valuable metal in a kind of many metal enrichment powder of separation and recovery waste printed circuit board, using low-temperature alkaline
Property melting, water logging go out, Na2S is leached, and realizes the high efficiency separation of amphoteric metal and copper, but low-temperature alkali melting operation both sexes gold
Category is enriched with fused salt phase, and after water logging is filtered, ammonium acetate is complicated, is unfavorable for later separation operation, and smelting temperature is interval,
The toxic and harmfuls such as bioxin may be produced, environmental treatment is relatively costly.The Chinese patent of Publication No. CN104946894A,
Application discloses a kind of amphoteric metal method in separation useless circuit board, and using mixed phase alkali soluble, the molten leaching of chilling, amphoteric metal enters liquid
Xiang Zhong, copper and noble metal are enriched with slag phase, and it is 400～900 DEG C that the method smelting temperature is interval, easily generates bioxin, liquid phase
Complicated component, amphoteric metal are not readily separated.The Chinese patent application of Publication No. CN103320618A, discloses a kind of combination
The method of noble metal in reason separation-Bioleaching waste printed circuit board, using microorganism pseudomonass leaching reactor by discarded electricity
Road sheetmetal hybrid particles dissolving, obtains hybrid metal solion, successively that metal mixed is molten using metal displacement reaction device
Noble metal and common metal ion exchange in liquid is out.The method valuable metal process in retrieving circuit board has raw material
Poor selectivity, metal recovery rate are low, the problems such as working environment has high demands.
Both at home and abroad the recovery method of valuable metal in waste printed circuit board is had much at present, but mainly to copper and noble metal
Numerous studies are carried out, the separation and recovery research to amphoteric metal is less.
The content of the invention
The technical problem to be solved be overcome the shortcomings of background above technology in mention and defect, there is provided one
Kind short flow, metal selective are separated, subsequent treatment is simple, the utilization step alkali solution separation waste printed circuit board of clean and effective
The method of middle amphoteric metal, to realize amphoteric metal aluminum, zinc, lead, stannum and copper, noble metal clean and effective Selective Separation.
To solve above-mentioned technical problem, technical scheme proposed by the present invention is：
In a kind of separation useless circuit board, the method for amphoteric metal, comprises the following steps：
(1) in being the aqueous slkali of 0.5～2mol/L by useless circuit board many metal dusts addition concentration, in 30～80 DEG C of temperature
Under the conditions of filter after leaching, obtain low alkali leached mud and low alkali leaching liquor；Aluminum, zinc enter low alkali leaching liquor in, copper, lead,
Stannum and noble metal are entered in low alkali leached mud；
(2) in adding concentration to be the aqueous slkali of 1～4mol/L the low alkali leached mud, while adding theoretical amount (by lead
With stannum total overall reaction completely needed for consumption) 1～10 times of oxidant, the mistake after leaching under 30～80 DEG C of temperature conditionss
Filter, obtains high-alkali leached mud and high alkali leaching liquor；Lead, stannum enter high alkali leaching liquor, and copper and noble metal enter high-alkali leached mud.
Above-mentioned method, it is preferred that in the step (1), the time of leaching is 30～120min；Aqueous slkali and useless circuit
The solid mass ratio of the liquid of many metal dusts of plate is (10～20):1.
Above-mentioned method, it is preferred that in the step (1), the concentration of aqueous slkali is 1～2mol/L, and during leaching, temperature is
40～60 DEG C, the time of leaching is 30～90min.
Above-mentioned method, it is preferred that in the step (2), the solid mass ratio of liquid of aqueous slkali and low alkali leached mud is 10～
40:1。
Above-mentioned method, it is preferred that in the step (2), the concentration of aqueous slkali is 2～4mol/L, aqueous slkali and low alkali
The solid mass ratio of the liquid of leached mud is (10～20):1, extraction temperature is 50～70 DEG C, and extraction time is 90～180min.
Above-mentioned method, it is preferred that in the step (2), oxidant is H2O2、O2、NaClO、O3Or the one kind in air
Or it is several.
Above-mentioned method, it is preferred that the aqueous slkali is NaOH solution or KOH solution.
Above-mentioned method, it is preferred that in the low alkali leaching liquor after step (1) after addition aqueous slkali in return to step (1)
The many metal dusts of waste printed circuit board are leached, after valuable metal enrichment in low alkali leaching liquor, open circuit is reclaimed in leachate
Aluminum and zinc is (such as Na2The methods such as S is leached, control basicity crystallization are reclaimed).
The ultimate principle of the present invention：Amphoteric metal in useless circuit board is separated using step alkali solution technique, according to amphoteric metal electricity
Chemical property difference, is leached using low alkali to more active amphoteric metal (aluminum, zinc), the amphoteric metal weaker to activity (lead,
Stannum) using high-alkali Oxidation Leaching, reach amphoteric metal Selective Separation.In useless circuit board, copper, nickel etc. are in high-alkali Oxidation Leaching mistake
Cheng Zhongyou is oxidized on a small quantity, but its simple substance and oxide not with alkali reaction, be present in high-alkali leached mud.Noble metal is in step
Reaction is not involved in during alkali soluble, is also enriched with high-alkali leached mud.Two sections of ammonium acetates are simple, and impurity is few, can be by letter
Single Chemical Decomposition is (such as Na2S is leached, control basicity is crystallized etc.) amphoteric metal is separated and recovered, reclaim product purity high.
Compared with prior art, it is an advantage of the current invention that：
(1) present invention process short flow, metal recovery efficiency high, aluminum, zinc, lead, stannum conversion separation rate are up to 90%
More than, more than 99%, noble metal then 100% is enriched in highly basic slag accumulation rate of the copper in highly basic slag.
(2) using amphoteric metal in step alkali soluble waste printed circuit board, metal selective is separated the present invention, ammonium acetate letter
Single, impurity is few, can be easily separated, and reclaims obtained product purity height, little to equipment corrosion, and then reduces production cost, carries
High production efficiency.
(3) leachate that each step leaching process operation in the present invention is obtained, after valuable metal enrichment, separating, place
After reason, liquid can be recycled in the step operation, reduce reagent consumption, while reducing wastewater treatment and discharge capacity.It is existing
Beneficial to increasing economic efficiency, carrying capacity of environment is alleviated again.
(4) present invention compared with pyrogenic attack waste printed circuit board present invention obviates toxic and harmful generation, produce ring
Border is friendly.
In sum, according to waste circuit board value composition characteristic, the present invention proposes that step alkali soluble is processed, and low alkali is leached and divided
From aluminum and zinc, lead, stannum are separated by high-alkali Oxidation Leaching with copper, reach amphoteric metal Selective Separation purpose, and secondary leachate
Composition is simple, only need to be through the crystallization of control basicity or Na2S is precipitated, you can the higher product of prepared purity；Simultaneously compared to pyrogenic process
Useless circuit board is processed, the generation of the toxic and harmfuls such as bioxin is this method avoid, with environmental friendliness；Technological process is simple, gold
Category Selective Separation, production high-efficiency cleaning, are suitable to industrial applications.
Description of the drawings
Fig. 1 is the process chart of the present invention.
Fig. 2 is the XRD figure of many metal enrichment powder of useless circuit board selected by the embodiment of the present invention.
Fig. 3 is the XRD figure of the low alkali leached mud that the embodiment of the present invention 1 is obtained.
Fig. 4 is the XRD figure of the high-alkali leached mud that the embodiment of the present invention 1 is obtained.
Fig. 5 is the photo of the stannic acid sodium crystal that the embodiment of the present invention 1 is obtained.
Fig. 6 is the XRD figure of the stannic acid sodium crystal that the embodiment of the present invention 4 is obtained.
Specific embodiment
For the ease of understanding the present invention, more complete is done to the present invention below in conjunction with Figure of description and preferred embodiment
Face, meticulously describe, but protection scope of the present invention is not limited to specific examples below.
Unless otherwise defined, all technical terms used hereinafter are generally understood that implication phase with those skilled in the art
Together.Technical term used herein is intended merely to the purpose for describing specific embodiment, is not intended to limit the present invention's
Protection domain.
Unless otherwise specified, the various raw materials used in the present invention, reagent, instrument and equipment etc. can pass through city
Field is commercially available or can be prepared by existing method.
The many metal enrichment powder chemistry compositions of useless circuit board selected in following embodiments are as shown in table 1, XRD figure such as Fig. 2
It is shown.
The many metal enrichment powder chemistry compositions of 1 useless circuit board of table
| Element | Sn | Pb | Cu | Zn | Al | Other |
| Wt/% | 24.61 | 18.36 | 33.05 | 3.20 | 19.62 | 1.16 |
Embodiment 1：
It is a kind of the present invention separation useless circuit board in amphoteric metal method, its process chart as shown in figure 1, including with
Lower step：
(1) low alkali is leached：The many metal dusts of 500g useless circuit boards are taken, adds the NaOH solution that concentration is 2mol/L to leach
(NaOH solution is 10 with many metal dust liquid-solid ratioes:1), the leaching 30min under conditions of extraction temperature is for 50 DEG C, wherein
Power of agitator is 300r/min, filters, obtain low alkali leached mud and low alkali leaching liquor after leaching.Copper, lead, stannum and noble metal
Into in low alkali leached mud (its XRD figure is as shown in Figure 3)；Aluminum, zinc enter low alkali leaching liquor, leaching rate be respectively 98.31%,
97.14%.It is back to leaching step cycle to utilize after NaOH solution is added in low alkali leaching liquor, treats that valuable metal is enriched to one
After determining degree, aluminum, zinc are separated and recovered.
(2) high-alkali Oxidation Leaching：The low alkali leached mud that step (1) is obtained is taken, and concentration is added for the NaOH solution of 3mol/L
(NaOH solution is 15 with the solid mass ratio of low alkali leached mud liquid for leaching:1), added with constant flow pump control speed (12.5ml/min)
1.5L concentration is 30% oxidant H2O2(6 times for theoretical amount of oxidant), the stirring leaching under conditions of extraction temperature is for 50 DEG C
Go out 120min, wherein power of agitator is 300r/min, filters, high-alkali leached mud and high alkali leaching liquor is obtained after leaching；Its
Middle copper and noble metal are entered in high-alkali leached mud (its XRD figure is as shown in Figure 4)；Lead, stannum enter high alkali leaching liquor, leaching rate difference
For 92.52%, 97.37%.The adjusted basicity of high alkali leaching liquor, evaporation and concentration obtain stannic acid sodium crystal (as shown in Figure 5), stannic acid
Sodium crystal product meets GB/T 26040-2010 primary standards, and evaporation concentrated solution is circulated for the leaching to low alkali leached mud.
Embodiment 2：
It is a kind of the present invention separation useless circuit board in amphoteric metal method, its process chart as shown in figure 1, including with
Lower step：
(1) low alkali is leached：The many metal dusts of 500g useless circuit boards are taken, adds the NaOH solution that concentration is 1mol/L to leach
(NaOH solution is 20 with many metal dust liquid-solid ratioes:1), the leaching 90min under conditions of extraction temperature is for 60 DEG C, wherein
Power of agitator is 300r/min, filters, obtain low alkali leached mud and low alkali leaching liquor after leaching.Copper, lead, stannum and noble metal
Into in low alkali leached mud；Aluminum, zinc enter low alkali leaching liquor, and leaching rate is respectively 92.36%, 91.52%.In low alkali leaching liquor
It is back to leaching step cycle to utilize after adding NaOH solution, after valuable metal is enriched with to a certain extent, aluminum, zinc is separated back
Receive.
(2) high-alkali Oxidation Leaching：The low alkali leached mud that step (1) is obtained is taken, and concentration is added for the NaOH solution of 4mol/L
(NaOH solution is 10 with the solid mass ratio of low alkali leached mud liquid for leaching:1), with air pump with the flow of 7L/min constantly in solution
Air (10 times for oxidant theoretical amount of the intake of air) is blasted, while the stirring leaching under conditions of extraction temperature is for 30 DEG C
Go out 180min, wherein power of agitator is 300r/min, filters, high-alkali leached mud and high alkali leaching liquor is obtained after leaching；Its
Middle copper and noble metal are entered in high-alkali leached mud；Lead, stannum enter high alkali leaching liquor, and leaching rate is respectively 90.56%, 95.24%.
The adjusted basicity of high alkali leaching liquor, evaporation and concentration obtain stannic acid sodium crystal, and sodium stannate crystal product meets GB/T 26040-2010
Primary standard, evaporation concentrated solution are circulated for the leaching to low alkali leached mud.
Embodiment 3：
It is a kind of the present invention separation useless circuit board in amphoteric metal method, its process chart as shown in figure 1, including with
Lower step：
(1) low alkali is leached：The many metal dusts of 500g useless circuit boards are taken, adds the KOH solution that concentration is 2mol/L to leach
(KOH solution is 8 with many metal dust liquid-solid ratioes:1), the leaching 60min under conditions of extraction temperature is for 30 DEG C, wherein stirring
It is 300r/min to mix power, filters, obtain low alkali leached mud and low alkali leaching liquor after leaching.Copper, lead, stannum and noble metal enter
Enter in low alkali leached mud；Aluminum, zinc enter low alkali leaching liquor, and leaching rate is respectively 95.62%, 92.31%.Add in low alkali leaching liquor
It is back to leaching step cycle to utilize after entering KOH solution, after valuable metal is enriched with to a certain extent, aluminum, zinc is separated and recovered.
(2) high-alkali Oxidation Leaching：The low alkali leached mud that step (1) is obtained is taken, adds the KOH solution that concentration is 2mol/L to soak
Go out that (the solid mass ratio of KOH solution and low alkali leached mud liquid is 20:1) O is then constantly passed through in solution,3(O3Intake be oxygen
3 times of agent theoretical amount), while being leaching 120min under conditions of 60 DEG C in extraction temperature, wherein power of agitator is
300r/min, filters after leaching, obtains high-alkali leached mud and high alkali leaching liquor；Wherein copper and noble metal enter high-alkali leached mud
In；Lead, stannum enter high alkali leaching liquor, and leaching rate is respectively 91.33%, 96.62%.The adjusted basicity of high alkali leaching liquor, evaporation
Stannic acid sodium crystal is concentrated to give, sodium stannate crystal product meets GB/T 26040-2010 primary standards, and evaporation concentrated solution circulation is used
In the leaching to low alkali leached mud.
Embodiment 4：
It is a kind of the present invention separation useless circuit board in amphoteric metal method, its process chart as shown in figure 1, including with
Lower step：
(1) low alkali is leached：The many metal dusts of 500g useless circuit boards are taken, adds the NaOH solution that concentration is 0.5mol/L to leach
(NaOH solution is 40 with many metal dust liquid-solid ratioes:1), the leaching 120min under conditions of extraction temperature is for 80 DEG C, its
Middle power of agitator is 300r/min, filters, obtain low alkali leached mud and low alkali leaching liquor after leaching.Copper, lead, stannum and your gold
Category is in low alkali leached mud；Aluminum, zinc enter low alkali leaching liquor, and leaching rate is respectively 93.42%, 90.39%.Low alkali leaching liquor
In plus NaOH solution after be back to leaching step cycle utilize, after valuable metal be enriched with to a certain extent after, aluminum, zinc are separated back
Receive.
(2) high-alkali Oxidation Leaching：The low alkali leached mud that step (1) is obtained is taken, and concentration is added for the NaOH solution of 1mol/L
(NaOH solution is 40 with the solid mass ratio of low alkali leached mud liquid for leaching:1), then in leachate, addition 2L available chlorine contents are
8% NaClO solution (1 times for oxidant theoretical amount of the addition of NaClO solution), while in the bar that extraction temperature is 80 DEG C
Leaching 60min under part, wherein power of agitator are 300r/min, filter, obtain high-alkali leached mud and high-alkali leaching after leaching
Go out liquid；Wherein copper and noble metal are entered in high-alkali leached mud；Lead, stannum enter high alkali leaching liquor, leaching rate be respectively 90.33%,
94.62%.The adjusted basicity of high alkali leaching liquor, evaporation and concentration obtain stannic acid sodium crystal (its XRD analysis figure is as shown in Figure 6), stannum
Sour sodium product meets GB/T 26040-2010 primary standards, and evaporation concentrated solution is circulated for the leaching to low alkali leached mud.
Claims (6)
1. it is a kind of separate useless circuit board in amphoteric metal method, it is characterised in that comprise the following steps：
(1) in being the aqueous slkali of 0.5～2mol/L by useless circuit board many metal dusts addition concentration, in 30～80 DEG C of temperature conditionss
Filter after lower leaching, obtain low alkali leached mud and the low alkali leaching liquor containing aluminum, zinc；Wherein, the time of leaching be 30～
120min；Aqueous slkali is (10～20) with the solid mass ratio of the liquid of many metal dusts of useless circuit board:1；
(2) in adding concentration to be the aqueous slkali of 1～4mol/L the low alkali leached mud, while adding 1～10 times of theoretical amount
Oxidant, filters after leaching under 30～80 DEG C of temperature conditionss, obtains the high-alkali leaching of high-alkali leached mud and leaded, stannum
Liquid；Wherein, aqueous slkali and the solid mass ratio of the liquid of low alkali leached mud are (10～40):1；Extraction time is 90～180min.
2. the method for claim 1, it is characterised in that in the step (1), the concentration of aqueous slkali is 1～2mol/L,
During leaching, temperature is 40～60 DEG C, and the time of leaching is 30～90min.
3. the method for claim 1, it is characterised in that in the step (2), the concentration of aqueous slkali is 2～4mol/L,
Aqueous slkali is (10～20) with the solid mass ratio of the liquid of low alkali leached mud:1, extraction temperature is 50～70 DEG C.
4. the method for claim 1, it is characterised in that in the step (2), oxidant is H2O2、O2、NaClO、O3Or
One or more in air.
5. the method as described in any one of Claims 1 to 4, it is characterised in that the aqueous slkali is that NaOH solution or KOH are molten
Liquid.
6. the method as described in any one of Claims 1 to 4, it is characterised in that add in the low alkali leaching liquor after step (1)
The many metal dusts of waste printed circuit board are leached in return to step (1) after aqueous slkali, in treating low alkali leaching liquor, valuable metal is rich
After collection, open circuit reclaims the aluminum and zinc in leachate.
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| CN201610185756.7A CN105648225B (en) | 2016-03-29 | 2016-03-29 | Method for separating amphoteric metal in waste circuit boards |
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| CN201610185756.7A CN105648225B (en) | 2016-03-29 | 2016-03-29 | Method for separating amphoteric metal in waste circuit boards |
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| CN105648225B true CN105648225B (en) | 2017-05-03 |
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| CN114990337B (en) * | 2022-05-07 | 2023-11-03 | 江西铜业技术研究院有限公司 | Method for recovering tin in silver separating slag of copper anode slime by combining pyrogenic process and wet process |
| CN115323173B (en) * | 2022-07-06 | 2024-05-17 | 福建有道贵金属材料科技有限公司 | Cyanide-free recovery method for precious metal-containing solid waste |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747229A (en) * | 2012-07-31 | 2012-10-24 | 中南大学 | Method for separating and recycling valuable metals in powder rich in multiple metals of waste circuit board |
| CN104532005A (en) * | 2014-12-23 | 2015-04-22 | 清远市东江环保技术有限公司 | Resourceful comprehensive utilization method of waste printed circuit boards |
| CN105274358A (en) * | 2015-10-19 | 2016-01-27 | 中南大学 | Method of smelting and recycling tin in abandoned circuit board powder through multi-component mixed molten salt under alkaline environment |
-
2016
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Patent Citations (3)
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| CN102747229A (en) * | 2012-07-31 | 2012-10-24 | 中南大学 | Method for separating and recycling valuable metals in powder rich in multiple metals of waste circuit board |
| CN104532005A (en) * | 2014-12-23 | 2015-04-22 | 清远市东江环保技术有限公司 | Resourceful comprehensive utilization method of waste printed circuit boards |
| CN105274358A (en) * | 2015-10-19 | 2016-01-27 | 中南大学 | Method of smelting and recycling tin in abandoned circuit board powder through multi-component mixed molten salt under alkaline environment |
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