CN105648225A - Method for separating amphoteric metal in waste circuit boards - Google Patents
Method for separating amphoteric metal in waste circuit boards Download PDFInfo
- Publication number
- CN105648225A CN105648225A CN201610185756.7A CN201610185756A CN105648225A CN 105648225 A CN105648225 A CN 105648225A CN 201610185756 A CN201610185756 A CN 201610185756A CN 105648225 A CN105648225 A CN 105648225A
- Authority
- CN
- China
- Prior art keywords
- leaching
- alkali
- metal
- aqueous slkali
- low alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/008—Wet processes by an alkaline or ammoniacal leaching
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B13/00—Obtaining lead
- C22B13/04—Obtaining lead by wet processes
- C22B13/045—Recovery from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0065—Leaching or slurrying
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B19/00—Obtaining zinc or zinc oxide
- C22B19/20—Obtaining zinc otherwise than by distilling
- C22B19/24—Obtaining zinc otherwise than by distilling with leaching with alkaline solutions, e.g. ammonia
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B21/00—Obtaining aluminium
- C22B21/0015—Obtaining aluminium by wet processes
- C22B21/0023—Obtaining aluminium by wet processes from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a method for separating amphoteric metal in waste circuit boards. The method includes the steps of firstly, adding multi-metal powder of the waste circuit boards into an alkali solution with the concentration being 0.5-2mol/L, stirring under 30-80 DEG C for leaching, and filtering to obtain low-alkali leaching residues and low-alkali leachate containing aluminum and zinc; secondly, adding the low-alkali leaching residues into an alkali solution with the concentration being 1-4mol/L, adding oxidizing agent with the amount being 1-10 times of the theoretical amount at the same time, stirring under 30-80 DEG C for leaching, and filtering to obtain high-alkali leaching residues and high-alkali leachate containing lead and tin. The method has the advantages that step-by-step alkali dissolution is performed on the amphoteric metal in the waste circuit boards, the metal is separated selectively, the leachate is simple in component, few in impurity and easy to separate, the recycled product is high in puerility and low in equipment corrosion, production cost is lowered, and production efficiency is increased.
Description
Technical field
The invention belongs to waste resource recovery technology field, particularly relate to and a kind of utilize the method for amphoteric metal in step alkali solution separation waste printed circuit board.
Background technology
In recent years, along with electronic product update speed is accelerated, China creates substantial amounts of electron wastes. These electron wastes complicated components, toxic chemical substance content are more, if directly filled, soil and water resource can be polluted by heavy metal therein, if directly burning disposal, Organic substance therein can discharge as harmful gass such as two English, furan through burning, and natural environment and human body are worked the mischief. Additionally, containing the metal of a large amount of recoverables in electron wastes, such as aluminum, copper, lead, zinc, noble metal (gold, silver), platinum group metal, these metallic element abundant species, of high grade, have recovery value. Along with global resources shortage, the recycling of high-alkali resource is increasingly becoming the focus of concern. Electron wastes, as important " mine, city ", also receives all the more the concern of people.
Publication number is the Chinese patent application of CN102191383A, disclose the use of " wet method sealing-off-disassemble classification-pyrogenic process burning " recovering and processing discarded wiring board of the technique that combines, separate useless circuit board moves back tinbase plate with components and parts with nitric acid type tin stripping liquid, spent solder stripper obtains stanniferous filtering residue and leaded filtrate by adjusting pH, stanniferous filtering residue adjusts pH-condensing crystallizing to prepare STANNOUS SULPHATE CRYSTALLINE crystal through sodium sulfite reduction-Jia adjusting PH with base-acid adding, and leaded filtrate prepares lead sulfate tribasic product; Equipment performance is required height by the method, and working environment is poor, stannum recovery process long flow path, and metal recovery cost is high. Publication number is the Chinese patent application of CN102747229A, discloses a kind of method of valuable metal in waste printed circuit board many metal enrichments powder that separates and recovers, and use low-temperature alkali melting, water logging go out, Na2S leaches, achieve the high efficiency separation of amphoteric metal and copper, but low-temperature alkali melting operation amphoteric metal is in fused salt middle enrichment mutually, leachate complicated component after water logging filtration, it is unfavorable for later separation operation, and smelting temperature is interval, it is possible to create the toxic and harmfuls such as two English, environmental treatment is relatively costly.Publication number is the Chinese patent of CN104946894A, application discloses amphoteric metal method in the useless circuit board of a kind of separation, utilize the molten leaching of mixed phase alkali-soluble, chilling, amphoteric metal enters in liquid phase, copper and noble metal are enriched with mutually at slag, and the method smelting temperature interval is 400��900 DEG C, it is easy to generate two English, liquid phase ingredient is complicated, and amphoteric metal is not readily separated. Publication number is the Chinese patent application of CN103320618A, disclose and a kind of combine the method for noble metal in physical separation-Bioleaching waste printed circuit board, adopt microorganism pseudomonas Leaching reaction device by waste printed circuit board metal mixed grain dissolution, obtain hybrid metal solion, adopt metal displacement reaction device successively by the noble metal in metal mixed solution and common metal ion exchange out. It is poor that the method valuable metal process in retrieving circuit board also exists material choice, and metal recovery rate is low, and working environment requires the problems such as high.
Both at home and abroad the recovery method of valuable metal in waste printed circuit board is had much at present, but mainly copper and noble metal have been carried out big quantity research, the separation and recovery research of amphoteric metal is less.
Summary of the invention
The technical problem to be solved is, overcome the deficiency and defect mentioned in background above technology, there is provided a kind of short flow, metal selective to separate, subsequent treatment is simple, clean and effective utilize the method for amphoteric metal in step alkali solution separation waste printed circuit board, to realize amphoteric metal aluminum, zinc, lead, stannum and copper, noble metal clean and effective Selective Separation.
For solving above-mentioned technical problem, the technical scheme that the present invention proposes is:
A kind of separate the method for amphoteric metal in useless circuit board, comprise the following steps:
(1) many for useless circuit board metal dusts are added in the aqueous slkali that concentration is 0.5��2mol/L, filter after leaching under 30��80 DEG C of temperature conditions, obtain low alkali leached mud and low alkali leaching liquor; Aluminum, zinc enter in low alkali leaching liquor, and copper, lead, stannum and noble metal enter in low alkali leached mud;
(2) described low alkali leached mud is added in the aqueous slkali that concentration is 1��4mol/L, it is simultaneously introduced the oxidant of theoretical amount (by plumbous and that stannum total overall reaction is completely required consumption) 1��10 times, filter after leaching under the temperature conditions of 30��80 DEG C, obtain high-alkali leached mud and high alkali leaching liquor; Plumbous, stannum enters high alkali leaching liquor, copper and noble metal and enters high-alkali leached mud.
Above-mentioned method, it is preferred that in described step (1), the time of leaching is 30��120min; The liquid-solid mass ratio of aqueous slkali and the many metal dusts of useless circuit board is (10��20): 1.
Above-mentioned method, it is preferred that in described step (1), the concentration of aqueous slkali is 1��2mol/L, during leaching, temperature is 40��60 DEG C, and the time of leaching is 30��90min.
The liquid-solid mass ratio of above-mentioned method, it is preferred that in described step (2), aqueous slkali and low alkali leached mud is 10��40:1.
Above-mentioned method, it is preferred that in described step (2), the concentration of aqueous slkali is 2��4mol/L, and the liquid-solid mass ratio of aqueous slkali and low alkali leached mud is (10��20): 1, and extraction temperature is 50��70 DEG C, and extraction time is 90��180min.
Above-mentioned method, it is preferred that in described step (2), oxidant is H2O2��O2��NaClO��O3Or one or more in air.
Above-mentioned method, it is preferred that described aqueous slkali is NaOH solution or KOH solution.
Above-mentioned method, preferably, returning in step (1) after adding aqueous slkali in low alkali leaching liquor after step (1) and the many metal dusts of waste printed circuit board are leached, after valuable metal enrichment in low alkali leaching liquor, open circuit reclaims the aluminum and zinc in leachate (such as Na2S leaches, controls the method recovery such as basicity crystallization).
The ultimate principle of the present invention: adopt step alkali solution technique to separate amphoteric metal in useless circuit board, according to amphoteric metal electrochemical properties difference, low alkali is adopted to leach more active amphoteric metal (aluminum, zinc), the amphoteric metal (plumbous, stannum) that activity is more weak is adopted high-alkali Oxidation Leaching, reaches amphoteric metal Selective Separation. In useless circuit board, copper, nickel etc. have oxidized on a small quantity in high-alkali Oxidation Leaching process, but its simple substance and oxide all not with alkali reaction, be present in high-alkali leached mud. Noble metal is not involved in reaction in step alkali-soluble process, is also enriched with in high-alkali leached mud. Two sections of leachate compositions are simple, and impurity is few, can by simple Chemical Decomposition (such as Na2S leaches, controls basicity crystallization etc.) amphoteric metal is separated and recovered, reclaim product purity high.
Compared with prior art, it is an advantage of the current invention that:
(1) present invention process short flow, metal recovery efficiency are high, and aluminum, zinc, lead, stannum convert separation rate all up to more than 90%, and copper accumulation rate in highly basic slag is more than 99%, and noble metal then 100% is enriched in highly basic slag.
(2) present invention adopts amphoteric metal in step alkali-soluble waste printed circuit board, and metal selective separates, and leachate composition is simple, impurity is few, it is easy to separate, and reclaims the product purity prepared high, equipment corrosion is little, and then reduce production cost, improve production efficiency.
(3) each step in the present invention leaches the leachate that treatment process obtains, and after valuable metal enrichment, separating, after process, liquid all can recycle in this step operation, decreases reagent consumption, decreases wastewater treatment and discharge capacity simultaneously. Not only improve and increase economic efficiency, alleviate again carrying capacity of environment.
(4) present invention is compared with pyrogenic attack waste printed circuit board, present invention obviates toxic and harmful and generates, and production environment is friendly.
In sum, the present invention is according to waste circuit board value composition characteristic, it is proposed to step alkali-soluble processes, low alkali leaches and separates aluminum and zinc, and lead, stannum are separated by high-alkali Oxidation Leaching with copper, reach amphoteric metal Selective Separation purpose, and secondary leachate composition is simple, only need to through and control basicity crystallization or Na2S precipitates, and can be prepared by the product that purity is higher; Simultaneously compared to the useless circuit board of pyrogenic attack, this method avoid the toxic and harmfuls such as two English and generate, with environmental friendliness; Technological process is simple, metal selective separates, produce high-efficiency cleaning, is suitable to industrial applications.
Accompanying drawing explanation
Fig. 1 is the process chart of the present invention.
Fig. 2 is the XRD figure of the useless circuit board many metal enrichments powder selected by the embodiment of the present invention.
Fig. 3 is the XRD figure of the low alkali leached mud that the embodiment of the present invention 1 obtains.
Fig. 4 is the XRD figure of the high-alkali leached mud that the embodiment of the present invention 1 obtains.
Fig. 5 is the photo of the sodium stannate crystal that the embodiment of the present invention 1 obtains.
Fig. 6 is the XRD figure of the sodium stannate crystal that the embodiment of the present invention 4 obtains.
Detailed description of the invention
For the ease of understanding the present invention, the present invention is done more comprehensively below in conjunction with Figure of description and preferred embodiment, describes meticulously, but protection scope of the present invention is not limited to specific examples below.
Unless otherwise defined, to be generally understood that implication with those skilled in the art identical in all technical term used hereinafter. Technical term used herein is intended merely to the purpose describing specific embodiment, is not intended to limit the scope of the invention.
Unless otherwise specified, the various raw materials used in the present invention, reagent, instrument and equipment etc. all can be commercially available by market or can be prepared by existing method.
As shown in table 1, XRD figure is as shown in Figure 2 for the useless circuit board many metal enrichments powder chemistry composition selected in following embodiment.
Table 1 give up circuit board many metal enrichments powder chemistry composition
| Element | Sn | Pb | Cu | Zn | Al | Other |
| Wt/% | 24.61 | 18.36 | 33.05 | 3.20 | 19.62 | 1.16 |
Embodiment 1:
A kind of present invention separates the method for amphoteric metal in useless circuit board, and its process chart is as it is shown in figure 1, comprise the following steps:
(1) low alkali leaches: take the useless many metal dusts of circuit board of 500g, add the NaOH solution that concentration is 2mol/L and leach (NaOH solution and many metal dusts liquid-solid ratio are 10:1), the leaching 30min when extraction temperature is 50 DEG C, wherein power of agitator is 300r/min, filter after leaching, obtain low alkali leached mud and low alkali leaching liquor. Copper, lead, stannum and noble metal enter in low alkali leached mud (its XRD figure is as shown in Figure 3); Aluminum, zinc enter low alkali leaching liquor, leaching rate respectively 98.31%, 97.14%. It is back to leaching step cycle after low alkali leaching liquor adds NaOH solution to utilize, is enriched to after to a certain degree until valuable metal, by aluminum, zinc separation and recovery.
(2) high-alkali Oxidation Leaching: take the low alkali leached mud that step (1) obtains, add the NaOH solution that concentration is 3mol/L and leach (NaOH solution and the low liquid-solid mass ratio of alkali leached mud are 15:1), control speed (12.5ml/min) with constant flow pump and add the oxidant H that 1.5L concentration is 30%2O26 times of theoretical amount (oxidant be), the leaching 120min when extraction temperature is 50 DEG C, wherein power of agitator is 300r/min, filters, obtain high-alkali leached mud and high alkali leaching liquor after leaching; Wherein copper and noble metal enter in high-alkali leached mud (its XRD figure is as shown in Figure 4); Plumbous, stannum enters high alkali leaching liquor, leaching rate respectively 92.52%, 97.37%. High alkali leaching liquor is adjusted basicity, and evaporation and concentration obtains sodium stannate crystal (as shown in Figure 5), and sodium stannate crystal product meets GB/T26040-2010 primary standard, and evaporation and concentration liquid is cycled to used in the leaching to low alkali leached mud.
Embodiment 2:
A kind of present invention separates the method for amphoteric metal in useless circuit board, and its process chart is as it is shown in figure 1, comprise the following steps:
(1) low alkali leaches: take the useless many metal dusts of circuit board of 500g, add the NaOH solution that concentration is 1mol/L and leach (NaOH solution and many metal dusts liquid-solid ratio are 20:1), the leaching 90min when extraction temperature is 60 DEG C, wherein power of agitator is 300r/min, filter after leaching, obtain low alkali leached mud and low alkali leaching liquor. Copper, lead, stannum and noble metal enter in low alkali leached mud; Aluminum, zinc enter low alkali leaching liquor, leaching rate respectively 92.36%, 91.52%. It is back to leaching step cycle after low alkali leaching liquor adds NaOH solution to utilize, is enriched to after to a certain degree until valuable metal, by aluminum, zinc separation and recovery.
(2) high-alkali Oxidation Leaching: take the low alkali leached mud that step (1) obtains, add the NaOH solution that concentration is 4mol/L and leach (NaOH solution and the low liquid-solid mass ratio of alkali leached mud are 10:1), constantly in solution, air (10 times that the intake of air is oxidant theoretical amount) is blasted with the flow of 7L/min with air pump, the leaching 180min when extraction temperature is 30 DEG C simultaneously, wherein power of agitator is 300r/min, filter after leaching, obtain high-alkali leached mud and high alkali leaching liquor; Wherein copper and noble metal enter in high-alkali leached mud; Plumbous, stannum enters high alkali leaching liquor, leaching rate respectively 90.56%, 95.24%.High alkali leaching liquor is adjusted basicity, and evaporation and concentration obtains sodium stannate crystal, and sodium stannate crystal product meets GB/T26040-2010 primary standard, and evaporation and concentration liquid is cycled to used in the leaching to low alkali leached mud.
Embodiment 3:
A kind of present invention separates the method for amphoteric metal in useless circuit board, and its process chart is as it is shown in figure 1, comprise the following steps:
(1) low alkali leaches: take the useless many metal dusts of circuit board of 500g, add the KOH solution that concentration is 2mol/L and leach (KOH solution and many metal dusts liquid-solid ratio are 8:1), the leaching 60min when extraction temperature is 30 DEG C, wherein power of agitator is 300r/min, filter after leaching, obtain low alkali leached mud and low alkali leaching liquor. Copper, lead, stannum and noble metal enter in low alkali leached mud; Aluminum, zinc enter low alkali leaching liquor, leaching rate respectively 95.62%, 92.31%. It is back to leaching step cycle after low alkali leaching liquor adds KOH solution to utilize, is enriched to after to a certain degree until valuable metal, by aluminum, zinc separation and recovery.
(2) high-alkali Oxidation Leaching: take the low alkali leached mud that step (1) obtains, adds the KOH solution that concentration is 2mol/L and leaches (KOH solution and the low liquid-solid mass ratio of alkali leached mud are 20:1), then constantly pass into O in solution3(O3Intake is oxidant theoretical amount 3 times), the simultaneously leaching 120min when extraction temperature is 60 DEG C, wherein power of agitator is 300r/min, filters, obtain high-alkali leached mud and high alkali leaching liquor after leaching; Wherein copper and noble metal enter in high-alkali leached mud; Plumbous, stannum enters high alkali leaching liquor, leaching rate respectively 91.33%, 96.62%. High alkali leaching liquor is adjusted basicity, and evaporation and concentration obtains sodium stannate crystal, and sodium stannate crystal product meets GB/T26040-2010 primary standard, and evaporation and concentration liquid is cycled to used in the leaching to low alkali leached mud.
Embodiment 4:
A kind of present invention separates the method for amphoteric metal in useless circuit board, and its process chart is as it is shown in figure 1, comprise the following steps:
(1) low alkali leaches: take the useless many metal dusts of circuit board of 500g, add the NaOH solution that concentration is 0.5mol/L and leach (NaOH solution and many metal dusts liquid-solid ratio are 40:1), the leaching 120min when extraction temperature is 80 DEG C, wherein power of agitator is 300r/min, filter after leaching, obtain low alkali leached mud and low alkali leaching liquor. Copper, lead, stannum and noble metal enter in low alkali leached mud; Aluminum, zinc enter low alkali leaching liquor, leaching rate respectively 93.42%, 90.39%. It is back to leaching step cycle after low alkali leaching liquor adds NaOH solution to utilize, is enriched to after to a certain degree until valuable metal, by aluminum, zinc separation and recovery.
(2) high-alkali Oxidation Leaching: take the low alkali leached mud that step (1) obtains, add the NaOH solution that concentration is 1mol/L and leach (NaOH solution and the low liquid-solid mass ratio of alkali leached mud are 40:1), then in leachate, add the NaClO solution 1 times of oxidant theoretical amount (addition of NaClO solution be) that 2L available chlorine content is 8%, the leaching 60min when extraction temperature is 80 DEG C simultaneously, wherein power of agitator is 300r/min, filter after leaching, obtain high-alkali leached mud and high alkali leaching liquor; Wherein copper and noble metal enter in high-alkali leached mud; Plumbous, stannum enters high alkali leaching liquor, leaching rate respectively 90.33%, 94.62%. High alkali leaching liquor is adjusted basicity, and evaporation and concentration obtains sodium stannate crystal (its XRD analysis figure is as shown in Figure 6), and sodium stannate product meets GB/T26040-2010 primary standard, and evaporation and concentration liquid is cycled to used in the leaching to low alkali leached mud.
Claims (8)
1. one kind separates the method for amphoteric metal in useless circuit board, it is characterised in that comprise the following steps:
(1) many for useless circuit board metal dusts are added in the aqueous slkali that concentration is 0.5��2mol/L, filter after leaching under 30��80 DEG C of temperature conditions, obtain low alkali leached mud and the low alkali leaching liquor containing aluminum, zinc;
(2) described low alkali leached mud is added in the aqueous slkali that concentration is 1��4mol/L, it is simultaneously introduced the oxidant of theoretical amount 1��10 times, filter after leaching under the temperature conditions of 30��80 DEG C, obtain high-alkali leached mud and high alkali leaching liquor leaded, stannum.
2. the method for claim 1, it is characterised in that in described step (1), the time of leaching is 30��120min; The liquid-solid mass ratio of aqueous slkali and the many metal dusts of useless circuit board is (10��20): 1.
3. the method for claim 1, it is characterised in that in described step (1), the concentration of aqueous slkali is 1��2mol/L, during leaching, temperature is 40��60 DEG C, and the time of leaching is 30��90min.
4. the liquid-solid mass ratio of the method for claim 1, it is characterised in that in described step (2), aqueous slkali and low alkali leached mud is (10��40): 1.
5. the method for claim 1, it is characterised in that in described step (2), the concentration of aqueous slkali is 2��4mol/L, the liquid-solid mass ratio of aqueous slkali and low alkali leached mud is (10��20): 1, and extraction temperature is 50��70 DEG C, and extraction time is 90��180min.
6. the method for claim 1, it is characterised in that in described step (2), oxidant is H2O2��O2��NaClO��O3Or one or more in air.
7. the method as described in any one of claim 1��6, it is characterised in that described aqueous slkali is NaOH solution or KOH solution.
8. the method as described in any one of claim 1��6, it is characterized in that, returning in step (1) after adding aqueous slkali in low alkali leaching liquor after step (1) and the many metal dusts of waste printed circuit board are leached, after valuable metal enrichment in low alkali leaching liquor, open circuit reclaims the aluminum and zinc in leachate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610185756.7A CN105648225B (en) | 2016-03-29 | 2016-03-29 | Method for separating amphoteric metal in waste circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610185756.7A CN105648225B (en) | 2016-03-29 | 2016-03-29 | Method for separating amphoteric metal in waste circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105648225A true CN105648225A (en) | 2016-06-08 |
| CN105648225B CN105648225B (en) | 2017-05-03 |
Family
ID=56495654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610185756.7A Active CN105648225B (en) | 2016-03-29 | 2016-03-29 | Method for separating amphoteric metal in waste circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105648225B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990337A (en) * | 2022-05-07 | 2022-09-02 | 江西铜业技术研究院有限公司 | Method for recovering tin in silver separating slag of copper anode slime by combining pyrogenic process and wet process |
| CN115323173A (en) * | 2022-07-06 | 2022-11-11 | 福建有道贵金属材料科技有限公司 | Cyanide-free recovery method of solid waste containing precious metals |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747229A (en) * | 2012-07-31 | 2012-10-24 | 中南大学 | Method for separating and recycling valuable metals in powder rich in multiple metals of waste circuit board |
| CN104532005A (en) * | 2014-12-23 | 2015-04-22 | 清远市东江环保技术有限公司 | Resourceful comprehensive utilization method of waste printed circuit boards |
| CN105274358A (en) * | 2015-10-19 | 2016-01-27 | 中南大学 | Method of smelting and recycling tin in abandoned circuit board powder through multi-component mixed molten salt under alkaline environment |
-
2016
- 2016-03-29 CN CN201610185756.7A patent/CN105648225B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747229A (en) * | 2012-07-31 | 2012-10-24 | 中南大学 | Method for separating and recycling valuable metals in powder rich in multiple metals of waste circuit board |
| CN104532005A (en) * | 2014-12-23 | 2015-04-22 | 清远市东江环保技术有限公司 | Resourceful comprehensive utilization method of waste printed circuit boards |
| CN105274358A (en) * | 2015-10-19 | 2016-01-27 | 中南大学 | Method of smelting and recycling tin in abandoned circuit board powder through multi-component mixed molten salt under alkaline environment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990337A (en) * | 2022-05-07 | 2022-09-02 | 江西铜业技术研究院有限公司 | Method for recovering tin in silver separating slag of copper anode slime by combining pyrogenic process and wet process |
| CN114990337B (en) * | 2022-05-07 | 2023-11-03 | 江西铜业技术研究院有限公司 | Method for recovering tin in silver separating slag of copper anode slime by combining pyrogenic process and wet process |
| CN115323173A (en) * | 2022-07-06 | 2022-11-11 | 福建有道贵金属材料科技有限公司 | Cyanide-free recovery method of solid waste containing precious metals |
| CN115323173B (en) * | 2022-07-06 | 2024-05-17 | 福建有道贵金属材料科技有限公司 | Cyanide-free recovery method for precious metal-containing solid waste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105648225B (en) | 2017-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105779770B (en) | Method for recycling valuable metal in waste circuit board | |
| CN102491287B (en) | Process for separating and recovering selenium from selenium-containing material | |
| CN104017995B (en) | A kind of from containing the method reclaiming copper-indium-galliun-selenium copper-indium-galliun-selenium waste material | |
| CN105112674B (en) | A kind of waste printed circuit board Whote-wet method recovery process | |
| CN105112668B (en) | Method for separating and enriching valuable metals from copper anode mud | |
| CN108624759B (en) | Method for comprehensively recovering valuable metals from white smoke | |
| CN103589873B (en) | A kind of method of valuable metal in recover silver cadmia | |
| CN105969993A (en) | Comprehensive recycling method for high-arsenic soot | |
| CN105603190B (en) | A kind of method that cleaning copper electrolyte reclaims valuable metal | |
| CN105734299A (en) | Method for comprehensively recovering valuable metals through oxygen pressure treatment of tin anode mud | |
| CN101693952A (en) | Method for recovering manganese and lead from electrolytic manganese anode mud | |
| CN105506294A (en) | Method for comprehensively recovering manganese and lead from electrolytic manganese anode slime | |
| EP2147128B1 (en) | Process for producing pure metallic indium from zinc oxide and/or solution containing the metal | |
| CN102502531A (en) | Novel and environment-friendly method for extracting tellurium from tellurium slag | |
| CN103290221A (en) | Method for recovering copper, arsenium and antimony from black copper sludge | |
| CN104911366A (en) | Method for recovering valuable metals from silver-bismuth slag through using aqua regia | |
| CN104561558B (en) | Method for treating selenium-containing mercury acid mud | |
| CN105568002B (en) | Method of the bismuth enrichment with reclaiming in a kind of waste acid vulcanized slag | |
| CN105886785A (en) | Method for preparing high-purity silver powder from silver-rich residue containing high selenium and tellurium | |
| CN108486379B (en) | The efficient separation method of arsenic and alkali in a kind of arsenic alkaline slag | |
| CN108070722B (en) | Method for recovering valuable metals from copper precipitation slag of silver electrolysis mother liquor | |
| CN105648225B (en) | Method for separating amphoteric metal in waste circuit boards | |
| CN103233129B (en) | Wet-process open treatment method of arsenic in copper ashes | |
| CN106086414B (en) | A method of recycling lead from waste lead acid battery lead cream | |
| CN103880630A (en) | Method for preparing high-purity lead acetate and nanometer lead powder from waste lead paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Tian Qinghua Inventor after: Guo Xueyi Inventor after: Jiang Xiaojian Inventor after: Li Dong Inventor before: Guo Xueyi Inventor before: Jiang Xiaojian Inventor before: Li Dong Inventor before: Tian Qinghua |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |