Polypropylene cellular board compound hot melt adhesive film and preparation method thereof
Technical field
The present invention relates to polypropylene cellular board compound hot melt adhesive film, be specifically related to polypropylene cellular board compound hot melt adhesive film and preparation method thereof.
Background technology
Functional, light material is the theme of current new material, and more low-gravity polypropylene (PP) plastics collocation honeycomb texture will bring the application performance of more excellence, is with a wide range of applications.
PP cellular board is the panel relatively thin by two pieces, is bonded in honeycomb core two sides one layer thicker securely and the sheet material made, also known as honeycomb sandwich construction. This structure, due to the advantage such as lightweight Gao Gang, asepsis environment-protecting, damping cold-resistant, sound-insulating, moisture-proof heat-insulation, is widely used in interior trim position, the electromotor Turnover Boxes etc. such as the boot-lid panel of medium-to-high grade passenger car, baggage-compartment partition, baggage compartment carpet substrate, side wall decorative board, ceiling. Such as, current auto parts and components Turnover Box is mainly produced by Germany, Japan, though domestic enterprise starts to walk, but comes still without the marketization 2 years more.
A big technical barrier prepared by PP cellular board is compound. Use traditional glue, although can compound, but on the one hand owing to not meeting the theory of environmental protection; Glue mostly is curing type system on the one hand, and low temperature embrittlement ratio is more serious, and performance cannot ensure. And the product of PUR type is at present still without the glue being suitable for five layers of combination process.
1) hot melt adhesive film of modified EVA type, although adhesion strength is suitable for client with combination process, but cannot promote due to low softening point fatal for EVA.
2) although the TPE of encapsulated type may be used for cladding PP material, but this technique mainly adopts the method that injection moulding is encapsulated, and encapsulated temperature is high, is coated with, is not suitable for the continuous process of laminating machine under PP soft state. Additionally, TPE types of material film property is poor, even if the TPE of oil-filled property, the speed of casting films is still very slow, it is impossible to the marketization.
Summary of the invention
The present invention is directed to the problems referred to above, it is provided that a kind of polypropylene cellular board compound hot melt adhesive film and preparation method thereof is to solve the problems referred to above.
For solving above-mentioned technical problem, the present invention adopt a technical scheme be: polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 40% ~ 70%, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resins, the high molecular PP wax of 2% ~ 15%, the closure silane attaches power accelerator of 2 �� ~ 8 �� and 1 �� ~ 2 �� antioxidant.
Preferred as such scheme, the fusing point of described ternary polymerized polypropylene is 90-120 DEG C.
The preparation method of polypropylene cellular board compound hot melt adhesive film, ternary polymerized polypropylene by the low melting point of 40% ~ 70%, the ethylene-propylene of 20% ~ 40% or ethylene-butene copolymer, the C5/C9 copolymer resins of 5% ~ 20%, the high molecular PP wax of 2% ~ 15% and 1 �� ~ 2 �� antioxidant be placed in kneader and carry out banburying process, after system is melted, repeatedly add closure silane attaches power accelerator and carry out kneading process, kneading complete after discharging and carry out water ring pelletize process make hot melt adhesive tablet, hot melt adhesive tablet is carried out after screw extruder is extruded curtain coating process and makes hot melt adhesive film.
Preferred as such scheme, the total amount of the closure silane attaches power accelerator repeatedly added is 2 �� ~ 8 ��, and the amount of the closure silane attaches power accelerator every time added is identical.
Preferred as such scheme, kneading time 5 ~ 8min when kneading processes.
The invention has the beneficial effects as follows:
1) matrix adopts ternary polymerization low melting point polypropylene blending modified, modified PUR can meet 80 DEG C of applied environment requirements do not come unglued, again can 150 ~ 160 DEG C of firm compounds of temperature range, it is possible to meet client and carry out compound when PP cellular board not softening transform.
2) present invention adopts ethylene-propylene or ethylene-butene copolymer, it is possible to improve the low temperature flexibility of PUR, the problem solving current product cold cracking.
3) C5/C9 copolymer resins, high molecular PP wax imparting PUR have good initial bonding strength and base material digestibility, polypropylene (PP) material of low-surface-energy there is splendid digestibility, material surface, without putting the surface treatments such as dizzy, plasma, reduces operation, also reduces cost simultaneously.
4) closure silane attaches power accelerator can be bonded with the inorganic reinforcing filler in PP cellular board, improves bonding strength.
5) hot melt adhesive film of this formula system is due to good film-forming property, crystallization soon, is beneficial to employing casting technique and produces glued membrane, it is not necessary to lining paper, cost reduce, are beneficial to popularization.
Detailed description of the invention
Below in conjunction with embodiment, the specific embodiment of the present invention is further described.
Polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 40% ~ 70%, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resins, the high molecular PP wax of 2% ~ 15%, the closure silane attaches power accelerator of 2 �� ~ 8 �� and 1 �� ~ 2 �� antioxidant.
Wherein, the fusing point of ternary polymerized polypropylene is 90-120 DEG C.
The preparation method of polypropylene cellular board compound hot melt adhesive film, ternary polymerized polypropylene by the low melting point of 40% ~ 70%, the ethylene-propylene of 20% ~ 40% or ethylene-butene copolymer, the C5/C9 copolymer resins of 5% ~ 20%, the high molecular PP wax of 2% ~ 15% and 1 �� ~ 2 �� antioxidant be placed in kneader and carry out banburying process, after system is melted, four addition total amounts are divided to be the closure silane attaches power accelerator of 2 �� ~ 8 �� and carry out kneading process, mediate after 5 ~ 8min discharging and carry out water ring pelletize and process and make hot melt adhesive tablet, hot melt adhesive tablet is carried out after screw extruder is extruded curtain coating process and makes hot melt adhesive film.
Wherein, the amount of the closure silane attaches power accelerator every time added is identical.
Embodiment one:
Polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 50%, 30% ethylene-propylene or ethylene-butene copolymer, the C5/C9 copolymer resins of 15%, the closure silane attaches power accelerator of 5 �� and 2 �� antioxidant.Surplus is high molecular PP wax.
Embodiment two:
Polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 70%, 20% ethylene-propylene or ethylene-butene copolymer, the C5/C9 copolymer resins of 5%, the closure silane attaches power accelerator of 8 �� and 1 �� antioxidant. Surplus is high molecular PP wax.
Embodiment three:
Polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 40%, 30% ethylene-propylene or ethylene-butene copolymer, the C5/C9 copolymer resins of 20%, the closure silane attaches power accelerator of 8 �� and 2 �� antioxidant. Surplus is high molecular PP wax.
Embodiment four:
Polypropylene cellular board compound hot melt adhesive film, including the material of following weight fraction: the ternary polymerized polypropylene of the low melting point of 40%, 40% ethylene-propylene or ethylene-butene copolymer, the C5/C9 copolymer resins of 10%, the closure silane attaches power accelerator of 8 �� and 2 �� antioxidant. Surplus is high molecular PP wax.
For a person skilled in the art; still the technical scheme described in foregoing embodiments can be modified; or wherein portion of techniques feature is carried out equivalent replacement; all within the spirit and principles in the present invention; any amendment of being made, equivalent replacement, improvement etc., should be included within protection scope of the present invention.