CN105636389B - Vacuum seal structure and its manufacturing method - Google Patents
Vacuum seal structure and its manufacturing method Download PDFInfo
- Publication number
- CN105636389B CN105636389B CN201610139713.5A CN201610139713A CN105636389B CN 105636389 B CN105636389 B CN 105636389B CN 201610139713 A CN201610139713 A CN 201610139713A CN 105636389 B CN105636389 B CN 105636389B
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- China
- Prior art keywords
- casting glue
- seal casinghousing
- chamber
- seal structure
- closing device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drying Of Semiconductors (AREA)
- Casings For Electric Apparatus (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Abstract
The invention discloses a kind of vacuum seal structure and its manufacturing methods, the vacuum seal structure includes seal casinghousing (2), casting glue (6) and closing device (7), seal casinghousing (2) has chamber, the chamber has side wall and an open end, and for accommodating deflation element (1)；Casting glue (6) is filled in the chamber of the seal casinghousing (2) and wraps up the deflation element (1)；Closing device (7) is used to close the open end of the chamber of the seal casinghousing (2), and is in close contact with the side wall of casting glue (6) and seal casinghousing (2).The present invention proposes the low-melting alloy of liquid being covered in the casting glue (6) above, forms sealing plate (71) after cooled and solidified and be used as closing device (7).The present invention can avoid nonmetallic sealing element itself deflation and generate pollution gas, reduces the wall thickness of vacuum seal structure, reduces the deflation area of vacuum seal structure, reduce the possibility of gas residue.
Description
Technical field
The present invention relates to a kind of vacuum seal structure, the vacuum for being particularly suitable for the mechanical grade electronic system of extreme ultraviolet is close
Seal structure.
Background technology
Extreme ultraviolet photolithographic (EUVL) be at present in the world it is most potential, CD14nm can be met with the light of lower node IC volume productions
Lithography.Since most of gas all absorbs the extreme ultraviolet of 13.5nm, the especially gases such as hydrocarbon, vapor are in pole
It is decomposed under action of ultraviolet light, Carbon deposition and the oxidation of extreme ultraviolet mirror surface multilayer film can be caused, and influence reflectivity, therefore
It is provided to the clean vacuum environment of litho machine.
There is a large amount of plate grade electronic system, pcb board and electronic component therein are true inside extreme ultra violet lithography
A large amount of pollution gas and particle can be released under Altitude, it is serious to destroy litho machine working environment, it is therefore desirable to be plate grade
Electronic system designs vacuum seal structure, is directly entered inside litho machine with the pollution gas and particle that prevent it from releasing
Working environment.
In use, being the dry air or nitrogen of 1 atmospheric pressure inside vacuum seal structure, outside in extreme ultra violet lithography
Portion is vacuum environment.Sealing structure needs to bear the internal pressure of 1 atmospheric pressure.It is existing for the sealing problem of plate grade electronic system
There is the vacuum seal structure of technology as shown in Figure 1.Circuit board 1 is assemblied on the seal casinghousing 2 with flange arrangement, and flange 3 is logical
It crosses bolt 5 to connect with seal casinghousing 2, sealing element 4 can be rubber ring, quoit, polytetrafluoro gasket either soft metal pad
Piece etc..When sealing element 4 is rubber ring or polytetrafluoro gasket, it is dirty that its own deflation will produce hydrocarbon and vapor etc.
Metachromia gas.When sealing element 4 is quoit or metal gasket, to ensure that sealing effect, seal casinghousing 2 and flange 4 need
Larger thickness is used, so that it is with preferable rigidity, such sealing structure can be very heavy；In addition, only applying
Larger power can just make quoit or metal gasket generate suitable deformation, this more bolt 5 and screw thread need to set, from
And increase the deflation area of vacuum seal structure, and increase the possibility of gas residue.
Invention content
The present invention is a kind of vacuum seal structure of plate grade electronic system, is mainly used for solving following technical problem：(1)
When existing vacuum seal structure uses nonmetallic sealing element, nonmetallic sealing element itself, which is deflated, generates pollution gas,
To pollute vacuum cavity；(2) when existing vacuum seal structure uses metallic seal element, flange wall is thicker than big.(3) existing
Vacuum seal structure need to bear the internal pressure of 1 atmospheric pressure, the wall thickness of vacuum seal structure is excessive.
In order to solve the above technical problems, the present invention proposes a kind of vacuum seal structure, including seal casinghousing, casting glue and envelope
Mouth device, wherein there is the seal casinghousing chamber, the chamber to have side wall and an open end, and for accommodating deflation member
Part；The casting glue is filled in the chamber of the seal casinghousing and wraps up the deflation element；The closing device is for sealing
The open end of the chamber of the seal casinghousing is closed, and is in close contact with the side wall of casting glue and seal casinghousing.
A preferred embodiment of the invention, the closing device are the sealing plates formed by low-melting alloy.
A preferred embodiment of the invention further includes cover board, which is formed in the outside of the sealing plate
And it is fitted closely with the sealing plate.
A preferred embodiment of the invention, the side edge thereof are provided with one or more overflow launders.
The fusing point of a preferred embodiment of the invention, the low-melting alloy is 45 DEG C~95 DEG C.
A preferred embodiment of the invention, the closing device include flange, wherein the flange has bottom
Portion and boss portion from base projections, boss portion has smaller size relative to bottom, so as to stretch into the capsul
The open end of body, and the size of bottom is more than the size of the open end of seal casinghousing so that the edge of bottom can be supported on institute
State the end of the side wall of seal casinghousing.
A preferred embodiment of the invention, the closing device further include sealing element and bolt, the method
The edge of blue bottom is supported on the end of the side wall of the seal casinghousing by the sealing element, and the bolt is by the bottom of flange
Portion is connect with the end of the side wall of the seal casinghousing.
The present invention also proposes a kind of manufacturing method of vacuum seal structure, includes the following steps：The assembly of deflation element is existed
In the chamber of one seal casinghousing, which has side wall and an open end；The casting glue being in a liquid state is poured into the sealing
In shell, so that the casting glue is filled in the chamber of the seal casinghousing and wrap up the deflation element；Keep the casting glue solid
Change；It is bonded the casting glue in the open end of the seal casinghousing and assembles the closing device.
The low-melting alloy of liquid is covered in above the casting glue by a preferred embodiment of the invention,
Sealing plate is formed after its cooled and solidified as closing device.
A preferred embodiment of the invention, formed closing device the step of include：By the boss of a flange
Portion is placed in the open end of the chamber of the seal casinghousing, and is fitted closely with the casting glue, keeps the edge of the bottom of flange logical
Cross the end that a sealing element is supported on the side wall of the seal casinghousing, by bolt by the bottom of the flange with it is described close
The end of the side wall of capsule body connects.
Compared with prior art, one aspect of the present invention can avoid nonmetallic sealing element itself deflation and generate pollution gas
On the other hand body can also reduce the wall thickness of vacuum seal structure, reduce the deflation area of vacuum seal structure, reduce gas residue
Possibility.
Description of the drawings
Fig. 1 is the schematic diagram of the vacuum seal structure of the prior art.
Fig. 2 is the structural schematic diagram of the vacuum seal structure of the present invention；
Fig. 3 A~3C are the structural schematic diagram of one embodiment of the vacuum seal structure of the present invention；
Fig. 4 is the structural schematic diagram of another embodiment of the vacuum seal structure of the present invention.
Specific implementation mode
A kind of vacuum seal structure of present invention proposition and its manufacturing method, the vacuum seal structure may be applicable to putting
The occasion that gas element is sealed, deflation element are, for example, the plate grade electronic system of extreme ultraviolet photolithographic.
Fig. 2 is the structural schematic diagram of the vacuum seal structure of the present invention, as shown in Fig. 2, the vacuum seal structure of the present invention
Including seal casinghousing 2, casting glue 6 and closing device 7.There is the seal casinghousing 2 chamber, chamber to have side wall and an opening
End, and for accommodating deflation element 1；Casting glue 6 is filled in the chamber of the seal casinghousing 2 and wraps up the deflation element 1；
The closing device 7 be used for close the seal casinghousing 2 chamber open end, and with the side wall of casting glue 6 and seal casinghousing
It is in close contact.
The manufacturing method of the vacuum seal structure includes：First, deflation element 1 is assembled to the chamber in seal casinghousing 2
Interior, chamber has side wall and an open end；Then, the casting glue 6 being in a liquid state is poured into the seal casinghousing 2, makes casting glue 6
It is filled in the chamber of the seal casinghousing 2 and wraps up the deflation element 1；Then, casting glue 6 is made to cure；Finally described
Open end is bonded the casting glue 6 and assembles the closing device 7.
The closing device 7 can be the sealing plate that low-melting alloy is formed.After casting glue 6 is fully cured, by liquid
Low-melting alloy be covered in 6 surface of casting glue, keep liquid low-melting alloy and the side wall of casting glue 6 and seal casinghousing 2 close
Fitting；Finally, so that the low-melting alloy is cooled into sealing plate, complete the making of vacuum seal structure.
The cover board fitted closely with sealing plate can also be formed in the outside for the sealing plate that low-melting alloy is formed.
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in further detail.
Fig. 3 A~3C are the manufacturing process structural schematic diagram of one embodiment of the vacuum seal structure of the present invention, the implementation
The vacuum seal structure of example is used to carry out vacuum sealing to the circuit board 1 of extreme ultraviolet photolithographic.As shown in Figure 3A, the vacuum sealing knot
Structure includes the cover board 8 that the sealing plate 71 that seal casinghousing 2, casting glue 6 and low-melting alloy are formed and metal are formed.
Seal casinghousing 2 is the rectangular configuration of one end open, and internal as the chamber for accommodating circuit board 1, i.e. circuit board 1 assembles
In the chamber of seal casinghousing 2.Seal casinghousing 2 uses the metal material of low deflation rate, such as aluminium alloy, stainless steel.It is making
When, the casting glue 6 of liquid is poured into mechanical or manual mode in the seal casinghousing 2 equipped with circuit board 1, in room temperature or fire-bar
It is set to be solidified into the insulating polymeric material haveing excellent performance under part.Casting glue 6 can play insulation, heat conduction, anticorrosion, heatproof, prevent
The effects that shake.However, casting glue 6 can equally release a large amount of pollution gas and particle under vacuum conditions.Casting glue 6 is complete
After all solidstate, the low-melting alloy of liquid is covered in above casting glue 6, forms sealing plate 71 after cooled and solidified.Sealing plate
71 have lower deflation rate, will not release hydrocarbon, can be directly exposed under the vacuum environment of extreme ultraviolet photolithographic.Sealing
Plate 71 and the material of seal casinghousing 2 should have preferable caking property and compatibility, should have preferable compatibility with casting glue 6.
In addition, the material selection of sealing plate 71 is also contemplated that the heat resistance of circuit board 1 and casting glue 6 and the reality of vacuum seal structure
Border operating temperature.For extreme ultraviolet photolithographic, the fusing point of low-melting alloy is more suitable between 45 DEG C~95 DEG C.
The work of circuit board 1 also needs to signal of powering and transmit.Trepanning is to introduce power cord or signal wire on seal casinghousing 2
Equal (not shown), using low-melting alloy hermetically-sealed cable hole.
The vacuum seal structure of the embodiment is entity structure, and inside does not have gas, is not subject to internal pressure, 2 He of seal casinghousing
Relatively thin wall thickness can be used in low-melting alloy sealing plate 7.Seal casinghousing 2 and low-melting alloy sealing plate 71 pass through cementation phase
Connection, compared with bolt connecting mode, reduces the deflation area of sealing structure, reduces the possibility of gas residue.
In the embodiment, to further decrease the surface discharge quantity of vacuum seal structure, formed in low-melting alloy close
Cover board 8 made of the lower metal of outer side covering deflation rate of sealing plate 71, as shown in Figure 3A.The material of metal cover board 8 can be
Aluminium alloy, stainless steel etc..Fig. 3 B are the enlarged drawings to circle A in Fig. 3 A.As shown in figs. 3 b and 3 c, 8 edge of metal cover board is provided with
One or more overflow launders 9.When sealing structure is assembled, metal cover board 8, extra eutectic are pressed on liquid low-melting alloy
Point alloy is flowed out from overflow launder 9, and metal cover board 8 is fitted closely with seal casinghousing 2.After low-melting alloy cooled and solidified, by metal
Cover board 8 is bonded together with seal casinghousing 2.The vacuum seal structure outer surface of the embodiment is mostly low deflation rate metal
Material only has minimal amount of low-melting alloy at overflow launder 9 so that and vacuum seal structure has less surface discharge quantity,
And it is released without hydrocarbon.
Fig. 4 is the structural schematic diagram of another embodiment of the present invention.As shown in figure 4, the vacuum similar with previous embodiment
Sealing structure includes mainly seal casinghousing 2 and casting glue 6, but unlike, the closing device 7 of the embodiment includes flange 3, close
Seal element 4 and bolt 5.It includes rectangular base and the boss portion from base projections that the flange 3, which has, and boss portion is relative to bottom
With smaller size, so as to stretch into the open end of seal casinghousing 2, and the size of bottom is more than the opening of seal casinghousing 2
The inside dimension at end so that the edge of bottom can be supported on the end of the side wall of the seal casinghousing 2.
Equally, circuit board 1 is assemblied on seal casinghousing 2, and the casting glue 6 of liquid is poured into mechanical or manual mode and is equipped with
In the seal casinghousing 2 of circuit board 1.The boss portion of flange 3 is placed in the open end of the chamber of the seal casinghousing 2 and with the filling
Sealing 6 fits closely, and the edge of the bottom of flange 3 is made to pass through the end that sealing element 4 is supported on the side wall of the seal casinghousing 2
Portion.The bottom of flange 3 is connect with the end of the side wall of seal casinghousing 2 by bolt 5.Then make under room temperature or heating condition
Casting glue 6 cures.Casting glue 6 is filled substantially with sealing structure inner space, and seal casinghousing 2 and flange 3 no longer undertake internal pressure, can adopt
With relatively thin wall thickness.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect
Describe in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the protection of the present invention
Within the scope of.
Claims (5)
1. a kind of vacuum seal structure, including seal casinghousing (2), casting glue (6) and closing device (7), wherein：
There is the seal casinghousing (2) chamber, the chamber to have side wall and an open end, and for accommodating deflation element；
The casting glue (6) is filled in the chamber of the seal casinghousing (2) and wraps up the deflation element；
The closing device (7) be used for close the seal casinghousing (2) chamber open end, and with casting glue (6) and sealing
The side wall of shell (2) is in close contact；
The closing device (7) is the sealing plate (71) formed by low-melting alloy, the forming step packet of the sealing plate (71)
It includes：After casting glue (6) is fully cured, the low-melting alloy of liquid is covered in the casting glue (6) above, after cooled and solidified
Form sealing plate (71).
2. vacuum seal structure as described in claim 1, which is characterized in that further include cover board, which is formed in described
The outside of sealing plate (71) is simultaneously fitted closely with the sealing plate (71).
3. vacuum seal structure as claimed in claim 2, which is characterized in that cover board (8) edge is provided with one or more
Overflow launder (9).
4. vacuum seal structure as claimed any one in claims 1 to 3, which is characterized in that the low-melting alloy melts
Point is 45 DEG C~95 DEG C.
5. a kind of manufacturing method of vacuum seal structure, includes the following steps：
By the assembly of deflation element in the chamber of a seal casinghousing (2), which has side wall and an open end；
The casting glue being in a liquid state (6) is poured into the seal casinghousing (2), the casting glue (6) is made to be filled in the seal casinghousing
(2) in chamber and the deflation element is wrapped up；
The casting glue (6) is set to cure；
It is bonded casting glue (6) the assembly closing device (7) in the open end of the seal casinghousing (2)；
Wherein, the low-melting alloy of liquid is covered in the casting glue (6) above, forms sealing plate (71) after cooled and solidified
As closing device (7), the closing device (7) is in close contact with the side wall of casting glue (6) and seal casinghousing (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610139713.5A CN105636389B (en) | 2016-03-11 | 2016-03-11 | Vacuum seal structure and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610139713.5A CN105636389B (en) | 2016-03-11 | 2016-03-11 | Vacuum seal structure and its manufacturing method |
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| Publication Number | Publication Date |
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| CN105636389A CN105636389A (en) | 2016-06-01 |
| CN105636389B true CN105636389B (en) | 2018-09-11 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106439020B (en) * | 2016-09-28 | 2018-10-02 | 中国科学院光电研究院 | Rectangular seal device and encapsulating method in a kind of vacuum environment |
| CN106286831B (en) * | 2016-09-28 | 2018-07-03 | 中国科学院光电研究院 | Elastic metallic rectangular seal device and encapsulating method in a kind of vacuum environment |
| DE102018101966A1 (en) * | 2018-01-30 | 2019-08-01 | Meyer Burger (Germany) Gmbh | Vacuum chamber and method for producing a vacuum chamber |
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| JP6042427B2 (en) * | 2011-06-28 | 2016-12-14 | ディーエムエス ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハーＤＭＳ Ｄｙｎａｍｉｃ Ｍｉｃｒｏ Ｓｙｓｔｅｍｓ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｅｑｕｉｐｍｅｎｔ ＧｍｂＨ | Semiconductor stocker system and semiconductor stock method |
| CN104244650B (en) * | 2014-09-28 | 2017-02-01 | 江南工业集团有限公司 | Anti-high-overload protection box for electronic circuits |
| CN104961093B (en) * | 2015-04-29 | 2017-01-04 | 大连理工大学 | A kind of method using low-melting alloy to seal micro heat pipe fill orifice |
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Effective date of registration: 20200814 Address after: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee after: Research Institute of aerospace information innovation, Chinese Academy of Sciences Address before: 100094, No. 9 Deng Nan Road, Beijing, Haidian District Patentee before: Academy of Opto-Electronics, Chinese Academy of Sciences Effective date of registration: 20200814 Address after: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee after: Institute of Microelectronics, Chinese Academy of Sciences Address before: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee before: Research Institute of aerospace information innovation, Chinese Academy of Sciences |