Disclosure of Invention
The technical problem to be solved by the invention is to effectively improve the isolation between the antennas through the device and the method for eliminating the mutual coupling of the antennas, solve the problem of common-frequency and adjacent-frequency interference between multiple antennas objectively existing in the communication terminals such as LTE and the like at present, and simultaneously meet the layout requirements of increasingly miniaturization and light weight of terminal products such as MiFi, a data card, a mobile phone and the like.
In order to solve the technical problem, the invention provides an antenna mutual coupling elimination device, which comprises a mutual interference elimination circuit, wherein the mutual interference elimination circuit is arranged between a pair of coupling antennas and forms a decoupling network with a matching circuit of the antennas, the mutual interference elimination circuit comprises a mutual interference elimination chip and a compensation circuit connected with the mutual interference elimination chip, and the compensation circuit is used for finely adjusting the Y of the coupling antennas21The position of the real zero crossing of the parameter.
The mutual interference elimination circuit arranged between the pair of coupling antennas and the matching circuit of the antennas form a decoupling network, so that the isolation between the antennas is effectively improved, the problems of same frequency and adjacent frequency interference among a plurality of antennas in various communication terminals can be solved, and the matching of the antennas is not influenced, so that the layout of the antennas becomes compact and flexible, and the increasingly miniaturized and light-weighted layout requirements of terminal products can be met. By setting a fine-tuning coupling antenna Y21The compensation circuit of the real part zero crossing point position of the parameter can enable the Y of the mutual interference elimination chip21The more accurate value offsets with the coupling antenna, strengthens the matching degree of freedom of two antennas simultaneously, makes the overall arrangement of antenna become compact flexible.
Furthermore, a first-order or multi-order T-shaped or PI-shaped structure circuit, a Y-shaped or PI-shaped structure circuit of the T-shaped or PI-shaped structure circuit are integrated in the mutual interference elimination chip21The sign of the parameter is positive or negative, and said Y21The slope of the imaginary part of the parameter is also a positive slope or a negative slope.
By integrating a first-order or multi-order T-type or PI-type structure circuit in the mutual interference elimination chip and enabling Y of the T-type or PI-type structure circuit21The sign of the parameter being positive or negative, Y21The slope of the imaginary part of the parameter is also positive or negative, and can correspondingly offset the Y of the coupled antenna21An imaginary part.
Further, the mutual interferenceEliminating Y with different symbols for T-type or PI-type structure circuit integrated in chip21Characteristics of the parameters, respectively corresponding to Y of different signs of the coupled antenna used21Parameter, when coupling Y of the antenna21With the imaginary part of the parameter being positive, the mutual interference being used to cancel Y of the chip internal structure21The imaginary part is negative and equal in absolute value; when coupling the Y of the antenna21When the imaginary part is negative, the mutual interference is used to eliminate Y of the internal structure of the chip21The imaginary part is positive and equal in absolute value.
By making T-type or PI-type structure circuit integrated in the mutual interference elimination chip possess Y with different symbols21The characteristics of the parameters can be applied to different symbols Y21Coupled antennas of the parameters.
Furthermore, the decoupling network comprises a T-shaped or PI-shaped structure circuit integrated in the mutual interference elimination chip, the T-shaped or PI-shaped structure circuit is a circuit which is formed by connecting capacitors or inductors in series or in parallel and has one-order or multi-order high-resistance characteristics, and the decoupling network presents open-circuit characteristics to signals in a frequency band above 1.5 GHz.
Because the mutual interference elimination chip has an open circuit characteristic for signals in a frequency band above 1.5GHz, the radiation and matching effects of signals in other frequency bands can not be deteriorated while the working frequency band is decoupled.
Furthermore, the compensation circuit is a phase compensation element, and the phase compensation element is a series capacitor or a series inductor and is used for adjusting the coupled antennaThe position of the zero crossing. The tuning effect is shown in fig. 5, which is realized by using series capacitors or inductorsThe position of the zero crossing point is shifted to high or low frequencies, thus ensuring Y of the coupled antenna21Y of parameter and interference elimination circuit21More accurate parameter compensation in working frequency bandAnd the design of the whole decoupling network is more flexible and controllable.
By arranging the phase compensation element formed by the series capacitor or the series inductor, the design of the antenna mutual coupling elimination device can be simplified, and meanwhile, the matching freedom degree of the two antennas can be enhanced, so that the layout of the antennas becomes compact and flexible.
Further, the matching circuit includes an inductor in parallel and a capacitor in series, or includes a capacitor in parallel and an inductor in series.
Because the connection mode of the capacitor and the inductor in the matching circuit can be flexibly changed according to the requirement, the matching freedom degree of the two antennas can be enhanced, and the layout of the antennas becomes compact and flexible.
Furthermore, the mutual interference elimination chip is formed by integrating a first-order or multi-order T-shaped or PI-shaped structure circuit into one chip based on at least one of LTCC multilayer technology, HTCC multilayer technology, CMOS technology, SOI technology, MEMS technology, GaAs technology and GaN technology.
By the technology, different topological structures can be realized in a smaller volume of the antenna mutual coupling elimination device, which is beneficial to enhancing the matching freedom of the two antennas, so that the layout of the antennas becomes compact and flexible.
The invention also provides an antenna mutual coupling elimination method, which is characterized in that a mutual interference elimination circuit is arranged between a pair of coupling antennas, the mutual interference elimination circuit and a matching network of the coupling antennas form a decoupling network, and mutual interference between the antennas is reduced through the decoupling network, wherein the mutual interference elimination circuit comprises a mutual interference elimination chip and a phase compensation circuit connected with the mutual interference elimination chip, and the compensation circuit is used for adjusting the Y of the coupling antennas21The position of the real zero crossing of the parameter.
Furthermore, a first-order or multi-order T-shaped or PI-shaped structure circuit is integrated in the mutual interference elimination chip, and the T-shaped or PI-shaped structure circuitY21The sign of the parameter is positive or negative, and said Y21The slope of the imaginary part of the parameter is also a positive slope or a negative slope.
The T-type or PI-type structure circuit integrated in the mutual interference elimination chip has Y with different symbols21Characteristics of parameters respectively corresponding to Y of different symbols of the coupled antenna21Parameter when Y of the coupled antenna21The imaginary part of the parameter is positive, and the Y of the internal structure of the mutual interference elimination chip is positive21The imaginary part of the parameter is negative and equal in absolute value; when Y of the coupled antenna21When the imaginary part of the parameter is negative, the Y of the internal structure of the mutual interference elimination chip21The imaginary part is positive and equal in absolute value.
By this antenna mutual coupling canceling method, the same technical effect as that of the antenna mutual coupling canceling device can be obtained.
Further, the antenna mutual coupling canceling device can be used in a wireless communication device. The wireless communication device can be an LTE data card, a 4G mobile phone and other 4G mobile terminals.
By adopting the mutual interference elimination chip and the antenna layout scheme, the isolation between the antennas can be effectively improved, the antenna efficiency and the channel throughput rate are improved, and the problem of co-frequency interference among a plurality of antennas in wireless terminal equipment such as an LTE data card and a 4G mobile phone is solved.
Examples
In the present invention, the following wireless communication apparatuses are exemplified, but the wireless communication apparatuses are not limited thereto and may be any type of wireless communication apparatuses. For example, the wireless communication device is a smart phone with a 4G main antenna, a diversity antenna, a GPS antenna, a Wi-Fi antenna, and the like, and the size of the smart phone is 152mm × 75 mm. Although the main and diversity antennas are already located at the top and bottom of the handset, respectively, there is still strong coupling in some specific frequency bands, and this mutual interference greatly affects the efficiency of the main and diversity antennas in that frequency band. Moreover, due to the size limitation of the mobile phone, the distance between the antennas has reached a maximum, and the isolation cannot be improved by pulling away the physical location. To solve this problem, the present invention proposes an antenna mutual coupling elimination apparatus and an antenna mutual coupling elimination method.
(antenna mutual coupling eliminating device)
Fig. 1 is a schematic structural diagram of an antenna mutual coupling cancellation apparatus and a coupled antenna in an embodiment of the present invention. As shown in fig. 1, the antenna mutual coupling canceling apparatus 7 of the present invention includes a mutual interference canceling circuit 2 disposed between a pair of coupled antennas 1, wherein the mutual interference canceling circuit 2 and matching circuits 3, 4 of the antennas 1 constitute a decoupling network 5.
Antenna 11 is the main antenna and antenna 12 is the diversity antenna, spaced apart by about 130 mm. The mutual interference elimination circuit 2 is a miniaturized passive chip, and includes a mutual interference elimination chip 22 and compensation circuits 21, 23 connected to the mutual interference elimination chip 22. As can be seen from fig. 1, two ends of the mutual interference cancellation chip 22 are respectively connected to a compensation circuit 21, 23, the mutual interference cancellation chip 22 is connected to the main antenna 11 through the compensation circuit 21, the mutual interference cancellation chip 22 is connected to the diversity antenna 12 through the compensation circuit 23, the matching circuit 3 is a matching circuit of the main antenna 11, and the matching circuit 4 is a matching circuit of the diversity antenna 12, which together form the decoupling network 5.
The mutual interference elimination chip 22 arranged between the pair of coupling antennas 1 and the matching circuits 3 and 4 of the antennas form a decoupling network 5, so that the isolation between the antennas can be effectively improved, the isolation does not need to be improved by pulling away the physical position between the two antennas, the problems of same frequency and adjacent frequency interference between a plurality of antennas in various communication terminals can be solved, and meanwhile, the matching of the antennas is not influenced, so that the layout of the antennas becomes compact and flexible, and the layout requirements of terminal products on increasing miniaturization and light weight can be met.
The compensation circuits 21, 23 are used to adjust (trim) the Y of the mutual interference cancellation chip21And the position of the parameter zero crossing point comprises a phase compensation element which is a series capacitor or a series inductor. By setting Y for adjusting mutual interference elimination chip21Compensation circuit for the position of the zero crossing of a parameter, able to couple with the Y of an antenna21The parameter values are cancelled without deteriorating the matching between the coupling antennas 1, and the degree of freedom in setting the antenna is provided.
As shown in fig. 1, due to practical space limitation, the antenna element spacing is often less than half a wavelength, and there is mutual interference between signals received by the antenna 11 and the antenna 22, and in principle, the closer the distance is, the stronger the coupling is, i.e., the stronger the interference is. This results in strong channel correlation, poor signal-to-noise ratio, and reduced antenna efficiency. However, in the present embodiment, one mutual interference canceling circuit 2 is connected in parallel to both ports of a pair of coupling antennas 1, so that mutual coupling between the two antennas in the antennas 1 can be cancelled, and the isolation between the two antennas can be improved. Furthermore, two decoupled ports are respectively cascaded with one matching network 3 and one matching network 4, so that the matching condition of the two antennas can be improved, and the influence of the mutual interference elimination circuit 2 on antenna matching is eliminated.
To sum up, after the signal received from the coupling antenna 1 passes through the decoupling network 5, not only the isolation is obviously improved, but also the correlation is obviously reduced, and simultaneously, the matching of each antenna is not affected. Compared with the decoupling system shown in fig. 9, the decoupling system has the advantages of low cost, simple structure and good compatibility.
In addition, according to the definition of the passive lossless two-port network, the following theoretical formula is provided:
wherein,representing a coupled antenna Y21The imaginary part of the parameter is then,represents Y21The real part of the parameter;representing a decoupling circuit Y21The imaginary part of the parameter is then,represents the real part thereof;representing the imaginary part of the whole system after the coupling antenna is connected with a decoupling circuit in parallel;represents the real part of the whole system;representing the isolation of the whole system after loading the decoupling circuit. From the formula, it can be seen that ifThen there isI.e. at frequency omegarA higher degree of isolation is achieved nearby. And because the decoupling chip is a passive lossless system, the decoupling chip hasThen at ωrNearbyRealize high isolationThe conditions of (a) are as follows: 1. antenna Y21Zero crossing of the real part of the parameter, i.e. 2. I.e. Y coupling the antenna and the decoupling circuit21The imaginary part of the parameter is of equal sign. For example, if the coupled antenna is at ωrAround 2.45GHzIt can be realized through the T-type network shown in fig. 2(a)As shown in fig. 2 (b). Recombined antenna Y21The real part of the parameter crosses zero, so that the decoupling can be realized near 2.45 GHz. Similarly, if the coupled antenna is near 2.45GHzThen go toThe PI type network shown in FIG. 3(a) can be implementedAs shown in fig. 3(b), high isolation can be achieved also around 2.45 GHz. It should be noted that by changing the capacitance inductance values in these two topologies, the performance can be improvedDifferent absolute values.
In the invention, Y of the coupled antenna can be obtained through simulation21Imaginary part as shown in FIG. 6, Y21Representing the mutual impedance between the two antennas. Correspondingly, the second-order T-shaped mutual interference elimination circuit 2 is selected to realize the Y with approximate equivalent opposite sign in the required working frequency band21Parameters, e.g. Y with different signs for T-or PI-type structural circuits integrated in the cross-talk cancellation chip 2221Characteristics of parameters respectively corresponding to Y of different symbols of the coupled antenna21Parameter, Y when coupling antenna 121With the imaginary part being positive, Y of the internal structure of the mutual interference cancellation chip 2221The imaginary part is negative and equal in absolute value; when coupling Y of antenna 121When the imaginary part is negative, the Y of the internal structure of the mutual interference elimination chip 2221The imaginary part is positive and equal in absolute value. Thereby satisfying the condition described in equation 3Namely, it isAnd mutual interference elimination is realized.
In addition, the T-type or PI-type structure circuit integrated in the mutual interference elimination chip has Y with different symbols21Parameter characteristics applicable to different symbols Y21Coupled antennas of the parameters, implementing the aforesaid
For example, if the antenna is coupled as shown in FIG. 4(b)With a more pronounced negative slope in the vicinity of 2.45GHz, i.e.The value decreases with increasing frequency, and the selection of a decoupling circuit configuration such as that shown in figure 4(a) may correspondingly produce a positive slopeRealizing frequency band near 2.45GHz Similarly, if the antenna is coupledThe slope is positive, then the corresponding one can be selectedThe structure of the decoupling chip circuit with negative slope is not described herein again.
(antenna mutual coupling eliminating method)
The antenna mutual coupling elimination method comprises the following steps: the mutual interference elimination circuit 2 is arranged between a pair of coupling antennas 1, wherein the mutual interference elimination circuit 2 and matching circuits 3 and 4 of the coupling antennas 1 form a decoupling network 5, and mutual interference between the antennas is reduced through the decoupling network 5.
By forming the decoupling network 5 by the mutual interference cancellation chip 22 disposed between the pair of coupled antennas 1 and the matching circuits 3 and 4 of the antennas, the isolation between the antennas can be effectively improved without increasing the isolation by pulling the physical position between the two antennas. The antenna mutual coupling elimination method is simple in structure and easy to realize, can solve the problems of same frequency and adjacent frequency interference among a plurality of antennas in various communication terminals, and does not influence the matching of the antennas, so that the layout of the antennas becomes compact and flexible, and the layout requirements of terminal products on increasingly miniaturization and light weight can be met. In addition, it should be noted that, the functional components used in the antenna mutual coupling elimination method are the same as those mentioned in the above antenna mutual coupling elimination device, and naturally, the same technical effects can also be brought, and are not described herein again.
Modification example
With the improvement of electronic integrated circuit technology, the following mode can be further adopted in the invention: the mutual interference elimination chip 22 and the compensation circuits 21 and 23 connected with the mutual interference elimination chip are integrated together and packaged into a chip. Therefore, the modular design can be carried out, the use is more convenient, and the installation efficiency is improved.
In the present invention, the compensation circuits 21, 23 are used forAdjusting the Y of the mutual interference elimination chip21The position of the zero-crossing point of the parameter may be any compensation circuit as long as the function can be realized, but specifically may be in the form of: the compensation circuits 21, 23 are both series capacitors; the compensation circuits 21, 23 are both series inductors; the compensation circuit 21 is a series capacitor, and the compensation circuit 23 is a series inductor; the compensation circuit 21 is a series inductor, and the compensation circuit 23 is a series capacitor; alternatively, the compensation circuits 21 and 23 are both T or PI type matching circuits integrated inside the mutual interference cancellation chip 22.
In addition, because it is inconvenient to adjust the value of the T or PI type matching circuit inside the integrated mutual interference cancellation chip 22, and the best mutual coupling cancellation effect cannot be achieved, the compensation circuits 21 and 23 can be divided into two parts, one part is integrated inside the mutual interference cancellation chip 22, and the other part is connected to two ends of the mutual interference cancellation chip 22 by using series capacitors or series inductors. It will be appreciated by those skilled in the art that the compensation circuits 21, 23 may be formed of several parts or a plurality of capacitors or inductors, as long as the actual impedance values are consistent.
It is well known to those skilled in the art that the mutual interference cancellation chip 22 can be formed by integrating first-order or multi-order T-type or PI-type structure circuits inside one chip based on LTCC multilayer technology, HTCC multilayer technology, CMOS technology, SOI technology, MEMS technology, GaAs technology, or GaN technology. LTCC (Low temperature Co-fired ceramic) multilayer technology is that low temperature sintering ceramic powder is made into a green ceramic tape with accurate thickness and compactness, the required circuit pattern is manufactured on the green porcelain tape by utilizing the processes of laser drilling, micropore grouting, precise conductor paste printing and the like, multiple passive components (such as low-capacitance capacitor, resistor, filter, impedance converter, coupler, etc.) are embedded in the multilayer ceramic substrate, and then laminated together, the inner and outer electrodes can respectively use metals such as silver, copper, gold, etc., sintering at 900 deg.C to obtain high-density circuit with noninterference three-dimensional space, or three-dimensional circuit substrate with built-in passive elements, the surface of the chip can be pasted with IC and active device to form passive/active integrated function module, the circuit can be further miniaturized and densified, and is particularly suitable for a module for high-frequency communication. The HTCC multilayer technology is high-temperature co-fired ceramic multilayer technology, and a high-temperature co-fired ceramic heating sheet manufactured by the HTCC multilayer technology is characterized in that high-temperature co-fired ceramic heating sheet is prepared by printing heating resistance slurry made of high-melting-point metals such as tungsten, molybdenum \ manganese and the like on 92-96% of alumina casting ceramic green bodies according to the design requirement of a heating circuit, superposing 4-8% of sintering aids in multiple layers, and co-firing at the high temperature of 1500-1600 ℃ into a whole, so that the high-temperature co-fired ceramic heating sheet has the advantages of corrosion resistance, high temperature resistance, long service life, high efficiency, energy conservation, uniform temperature, good heat conductivity, high heat compensation speed and the like, and does not contain harmful substances such as lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls. In the CMOS technology, CMOS is an abbreviation of Complementary Metal Oxide Semiconductor (CMOS), and refers to a technology for manufacturing a large-scale integrated circuit chip, and the chip manufactured by the technology is a readable and writable RAM chip on a computer motherboard or a mobile phone motherboard, and is used for storing data after BIOS sets hardware parameters of a computer on the computer motherboard or the mobile phone motherboard due to the readable and writable characteristics. SOI (Silicon-On-Insulator, Silicon On Insulator) technology introduces a buried oxide layer between the top Silicon and the backing substrate. A semiconductor film is formed on an insulator, and the SOI material has the advantages which cannot be compared with bulk silicon, can realize the medium isolation of components in an integrated circuit and thoroughly eliminates the parasitic latch-up effect in a bulk silicon CMOS circuit; the integrated circuit made of the material also has the advantages of small parasitic capacitance, high integration density, high speed, simple process, small short channel effect, particular application to low-voltage and low-power consumption circuits and the like, so that the SOI can possibly become the mainstream technology of deep submicron low-voltage and low-power consumption integrated circuits. MEMS Micro-Electro-mechanical systems (MEMS), also called Micro-electromechanical systems, microsystems, micromachines, etc., are developed based on microelectronic technologies (semiconductor manufacturing technologies), and high-tech electromechanical devices manufactured by combining technologies such as lithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining, and precision machining can be mass-produced, the system size is several millimeters or less, and the internal structure is generally in the micrometer or even nanometer level. For example, common MEMS products are typically 3mm by 1.5mm in size, and even smaller. GaAs technology refers to a technology for manufacturing radio frequency devices using GaAs. Similarly, the GaN technology refers to a technology for manufacturing a radio frequency device by using GaN, which is a semiconductor having a large forbidden band width, and belongs to a so-called wide forbidden band semiconductor, and is also a semiconductor having an important application value in a blue light emitting device. In the embodiment, the capacitors 21 and 23 are packaged by 0201, and the size value is adjusted according to the actual condition of the coupled antenna, so that the isolation between the antennas 11 and 12 is improved. The phase compensation can also be performed using an inductance as long as the actual impedance values are the same.
The following describes a structure without the antenna mutual coupling elimination device or the antenna mutual coupling elimination method of the present invention, and fig. 7 is a schematic diagram of the isolation between the front and rear antennas used by the decoupling circuit. As shown in FIG. 7, by simulation, the coupling of the two antennas at the B26 band (814-894MHz) is as high as-6 dB without the device using antenna mutual coupling cancellation. Obviously, such isolation is far from satisfactory for use. After the device for eliminating mutual coupling of the antennas is used, it can be seen that in the frequency band of B26, the isolation of the two antennas is improved by 15dB due to the existence of the decoupling circuit, and the design requirement is fully met.
The matching circuits 3 and 4 may be composed of parallel inductors and series capacitors, or may be composed of parallel capacitors and series inductors, where the number of the series and parallel inductors or capacitors is not limited, and may be one or more, and the matching circuits may be implemented as long as the actual impedance value meets the requirement. L-shaped matching circuits 3 and 4 with 0201 packaged as devices can be reserved at the output end of the coupling antenna 1 and the mutual interference elimination circuit 2 which are connected in parallel, and are used for improving the isolation and improving the matching condition of the two antennas.
The mutual interference elimination chip 22, the compensation circuits 21 and 23, and the matching circuits 3 and 4 of the antenna jointly form the whole decoupling network 5, wherein the mutual interference elimination chip is designed in structure and order, the capacitance value of the series capacitor or the inductance value of the series inductor in the compensation circuits 21 and 23 and the distance from the mutual interference elimination chip are designed, and the value of the matching network can be tuned according to the actual situation.
The decoupling network comprises a T-shaped or PI-shaped structure circuit integrated in the mutual interference elimination chip, the T-shaped or PI-shaped structure circuit is a circuit which is formed by connecting capacitors or inductors in series or in parallel and has one-order or multi-order high-resistance characteristics, and the decoupling network presents open-circuit characteristics to signals in a frequency band above 1.5 GHz.
Fig. 8 is a matching schematic diagram of the front antenna and the rear antenna of the decoupling circuit, and it can be seen that due to the open circuit characteristic of the decoupling circuit in the high frequency band, the antenna performance in the frequency bands of GPS, B40, Wi-Fi, etc. is not greatly affected.
In addition, for the antenna working in the adjacent or different frequency band ranges, the impedance bandwidth and the resonant frequency of the antenna can be adjusted by reserving antenna matching, series capacitance and antenna form on the PCB.
The coupling antenna 1 may be a 4G mobile phone antenna, a data card antenna, a router antenna, a base station antenna, a phased array antenna, or the like.
(radio communication device)
Finally, the invention also provides a wireless communication device, which includes but is not limited to a 4G mobile phone and a data card, and can be applied to other wireless communication terminals using a multi-antenna environment, such as a base station, a phased array radar, a T/R transceiver module, and the like.
The terms "mutual coupling", "crosstalk", "interference" are used for interference between antennas, i.e. the terms "mutual coupling", "crosstalk", "interference" in the present invention have the same meaning.
Finally, it should be noted that: although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that: modifications and equivalents may be made thereto without departing from the spirit and scope of the invention and it is intended to cover in the claims the invention as defined in the appended claims.