CN105633249A - Luminescable privacy coating film glass and binding method - Google Patents
Luminescable privacy coating film glass and binding method Download PDFInfo
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- CN105633249A CN105633249A CN201610150155.2A CN201610150155A CN105633249A CN 105633249 A CN105633249 A CN 105633249A CN 201610150155 A CN201610150155 A CN 201610150155A CN 105633249 A CN105633249 A CN 105633249A
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- glass
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- film
- conductive
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- 239000011521 glass Substances 0.000 title claims abstract description 143
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000001681 protective effect Effects 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000741 silica gel Substances 0.000 claims description 21
- 229910002027 silica gel Inorganic materials 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000012528 membrane Substances 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 229910002340 LaNiO3 Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005816 glass manufacturing process Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims 2
- 239000010408 film Substances 0.000 abstract description 62
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000012788 optical film Substances 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 244000247747 Coptis groenlandica Species 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 240000005319 Sedum acre Species 0.000 description 1
- 235000014327 Sedum acre Nutrition 0.000 description 1
- -1 and binding LED Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention provides luminescable privacy coating film glass and a binding method. A vehicle sunroof window is arranged on a roof, can effectively circulate internal air, increases entrance of fresh air and brings about healthy and comfortable enjoyment for an owner. Meanwhile, a vehicle window can expand the view and can be frequently applied to the shooting requirements of mobile photography and video recording. The luminescable privacy coating film glass comprises an LED, a glass substrate (1), a bus and a privacy coating film (2), wherein conductive film (3) is evenly attached to the upper surface of the glass substrate; the privacy coating film is evenly attached to the lower surface of the glass substrate; the upper surface of the glass substrate is covered with a protective film (4); the LED is arranged on the conductive glass substrate comprising the glass substrate and the conductive film through conductive adhesives (5); the LED is one of a finished LED (7) or an LED chip (8); and the finished LED or the LED chip is sealed through a sealant (6). The luminescable privacy coating film glass is applied to the field of optical film and semiconductor encapsulation.
Description
Technical field:
The present invention relates to a kind of can be luminous privacy coated glass and binding method, be applied to the vehicles or building field and there is the glass of illumination and privacy function, automobile skylight glass on a vehicle is especially installed.
Background technology:
Vehicle dormer window is installed on roof, it is possible to effectively make car inner air flow, increases entering of fresh air, for car owner brings health, comfortable enjoyment. Automotive window can also widen the vision simultaneously, is also usually used in the shooting demand of mobile photography and vedio recording. Along with vehicle dormer window is changed to panoramic roofs by half red-spotted stonecrop window, popular aesthetic level improves constantly, skylight is replaced as fluorescent glass by we, it is possible not only to see star pyrotechnics all over the sky in pitch-dark night, also can be used as car intraoral illumination to use, also can not see circuit when not lighting, can not entire effect attractive in appearance.
Fluorescent glass, also known as LED glass or light source glass, is a application patent electrically conducting transparent technology, the high-end customization photoelectric glass being glued at by LED (photodiode) structural sheet between layer glass. According to application demand, LED can be designed to the various different arrangement mode such as star shape, matrix, word, pattern, decorative pattern. LED glass has all characteristics of shatter proof glass, and follows that LED is efficiently luminous, the advantage of low-carbon energy-saving, the two is perfect merge after present penetrating texture, without wire outward appearance and bright radiance, more allow the high-end glassy product of this money be full of science and technology sense and following feel. The brand-new Application Areas of glass started by LED glass; Also the brand-new revolution of light fixture materials industry has been led. There is penetrating, anti-riot, waterproof, antiultraviolet, the feature such as can design. It is mainly used in interior/exterior decoration, furniture design, fluorescent tube illumination Design, the outdoor field such as cladding glass, the design of sunlight room.
Summary of the invention:
It is an object of the invention to provide a kind of can be luminous privacy coated glass and binding method.
Above-mentioned object is realized by following technical scheme:
A kind of can be luminous privacy coated glass, its composition comprises: LED, glass substrate, bus, privacy plated film, the upper surface of described glass substrate is pasted with conducting film uniformly, the lower surface of described glass substrate is pasted with described privacy plated film uniformly, described glass substrate upper surface is covered by protective membrane, the upper surface of the conducting glass substrate that described LED is arranged on described glass substrate by conductive resin and described conducting film is formed, described LED is the one in finished product LED or LED chip, described finished product LED or LED chip are sealed by seal gum.
Described can be luminous privacy coated glass, described finished product LED is bound on described glass substrate by binding machine platform by described finished product LED, drips by a glue machine on described finished product LED by heat curing-type transparent silica gel.
Described can be luminous privacy coated glass, described LED chip plates metal level on the conducting film described in the both sides of pre-binding, described metal level length and width are less than 50um*50um, described LED chip draws conductive resin with described metal level in pre-die bond region by binding machine platform, make to be bound on described glass substrate by described LED chip, by a glue machine, heat curing-type transparent silica gel is dripped on described LED chip, gold thread, described LED chip are sealed in silica gel all completely.
Described can be luminous privacy coated glass, described conducting film is transparent conductive oxide film layer to be the one in FTO, ITO, AZO, ATO, IZO, GZO and LaNiO3 or serves as conductor for metal grill or nano-silver thread.
Described can be luminous privacy coated glass, described privacy coating is metallic membrane or burning film.
Described can be luminous privacy coated glass, described bus is conductive resin or silver slurry or elargol or metallic foil, and described metallic foil appearance arranges tin coating, and surface arranges metal wire joint.
Described can be luminous privacy coated glass, described protective membrane is PVB or EVA, its thickness range 1mm 5mm, and described conductive glass resistance per square is 1 ~ 100 Europe/side.
Described can be luminous privacy coated glass, containing circuit on described conductive glass, described circuit uses laser scribe, etching or mask plating method to make, described circuit, according on load voltage and LED rated current voltage, calculates total electrical resistance needed for circuit, according to resistance formula, calculating line width, 90 �� of corners are by 1/2nd resistance calculations, and described bus and described metal wire joint can be determined according to design.
Described can be luminous the binding method of privacy coated glass, the method comprises the steps:
Finished product LED binds
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design.
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed.
(3) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus. And make metal wire joint.
(4) bind: use binding machine platform to be bound on the glass making circuit by finished product LED.
(5) rubber seal dress is put: use some glue machine to drip on finished product LED by heat curing-type transparent silica gel, LED is sealed in silica gel completely, shields.
(6) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm.
(7) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure.
Chip bonding
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design.
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed.
(3) PAD point makes: according to LED location, plating metal level on the both sides conducting film of pre-binding, metal level length and width are less than 50um*50um.
(4) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus. And make metal wire joint.
(5) bind: use binding machine platform to take metal level as PR, draw conductive resin in pre-die bond region, make to be bound on conductive glass by LED chip.
(6) line is played: use wire bonding machine table, be connected with conductive glass by LED chip.
(7) rubber seal dress is put: use some glue machine to drip on LED chip by heat curing-type transparent silica gel, gold thread, LED chip are sealed in all completely in silica gel, shield.
(8) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm.
(9) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure.
The useful effect of the present invention:
1. inventive design will make circuit on conductive glass, and binding LED, pastes middle layer, lid secret glass. Electric current realizes lighting LED by conducting film, conductive resin. Bus can according to the profile (inked areas) of skylight glass, and the corresponding distance of inside indentation along edge, remains that bus is within inked areas, thus bus is invisible by opaque inked areas is covered after making product, ensure that aesthetics.
More than the present invention describe on automobile skylight glass and then discuss, but, it is to be understood that being not limited within the scope of automobile skylight glass applies, but can implement in the field of any expectation, such as build (containing house and commercial building) window, electrical equipment form and/or under water, the water surface, ground, aviation, the space flight vehicles transparent window etc. The transmitance of visible ray can be reached 0% ~ 90% by transparent window as above.
The technical problem that the present invention solves makes LED luminous on glass, eliminates wire influence glass transmitance and reduces problem, improves LED and binds mode and simplify wire manufacturing process flow process, it is provided that a kind of can be luminous secret glass.
The technical problem that the present invention solves makes LED luminous on glass, eliminates wire influence glass transmitance and reduces problem, improves LED and binds mode and simplify wire manufacturing process flow process.
Accompanying drawing illustrates:
The finished product LED that accompanying drawing 1 is the present invention binds sectional structure schematic diagram.
Accompanying drawing 2 is the LED chip binding sectional structure schematic diagram of the present invention.
Embodiment:
Embodiment 1:
A kind of can be luminous privacy coated glass, its composition comprises: LED, glass substrate 1, bus, privacy plated film 2, the upper surface of described glass substrate is pasted with conducting film 3 uniformly, the lower surface of described glass substrate is pasted with described privacy plated film uniformly, described glass substrate upper surface is covered by protective membrane 4, the upper surface of the conducting glass substrate that described LED is arranged on described glass substrate by conductive resin 5 and described conducting film is formed, described LED is the one in finished product LED7 or LED chip 8, described finished product LED or LED chip are sealed by seal gum 6.
Embodiment 2:
According to embodiment 1 can be luminous privacy coated glass, described finished product LED is bound on described glass substrate by binding machine platform by described finished product LED, drips by a glue machine on described finished product LED by heat curing-type transparent silica gel.
Embodiment 3:
According to embodiment 1 or 2 can be luminous privacy coated glass, described LED chip plates metal level 9 on the conducting film described in the both sides of pre-binding, described metal level length and width are less than 50um*50um, described LED chip draws conductive resin with described metal level in pre-die bond region by binding machine platform, make to be bound on described glass substrate by described LED chip, by a glue machine, heat curing-type transparent silica gel is dripped on described LED chip, gold thread 10, described LED chip are sealed in silica gel all completely.
Embodiment 4:
According to embodiment 1 or 2 or 3 can be luminous privacy coated glass, described conducting film is transparent conductive oxide film layer to be the one in FTO, ITO, AZO, ATO, IZO, GZO and LaNiO3 or serves as conductor for metal grill or nano-silver thread.
Embodiment 5:
According to embodiment 1 or 2 or 3 or 4 can be luminous privacy coated glass, described privacy coating is metallic membrane or burning film.
Embodiment 6:
According to embodiment 1 or 2 or 3 or 4 or 5 can be luminous privacy coated glass, described bus is conductive resin or silver slurry or elargol or metallic foil, and described metallic foil appearance arranges tin coating, and surface arranges metal wire joint.
Embodiment 7:
According to embodiment 1 or 2 or 3 or 4 or 5 or 6 can be luminous privacy coated glass, described protective membrane is PVB or EVA, its thickness range 1mm 5mm, and described conductive glass resistance per square is 1 ~ 100 Europe/side.
Embodiment 8:
According to embodiment 1 or 2 or 3 or 4 or 5 or 6 or 7 can be luminous privacy coated glass, containing circuit on described conductive glass, circuit uses laser scribe, etching or mask plating method to make, described circuit, according on load voltage and LED rated current voltage, calculate total electrical resistance needed for circuit, according to resistance formula, calculating line width, 90 �� of corners are by 1/2nd resistance calculations. Bus and metal wire joint can be determined according to design.
Embodiment 9:
This novel a kind of can be luminous secret glass, comprise a slice glass substrate, one side plate conducting film, another side plating privacy film, conducting film face also comprises LED and bus.
Scheme one: finished product LED binds
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design.
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed.
(3) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus. And make metal wire joint.
(4) bind: use binding machine platform to be bound on the glass making circuit by finished product LED.
(5) rubber seal dress is put: use some glue machine to drip on finished product LED by heat curing-type transparent silica gel, LED is sealed in silica gel completely, shields.
(6) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm.
(7) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure.
Scheme two: LED chip is bound
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design.
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed.
(3) PAD point makes: according to LED location, plating metal level on the both sides conducting film of pre-binding, metal level length and width are less than 50um*50um.
(4) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus. And make metal wire joint.
(5) bind: use binding machine platform to take metal level as PR, draw conductive resin in pre-die bond region, make to be bound on conductive glass by LED chip.
(6) line is played: use wire bonding machine table, be connected with conductive glass by LED chip.
(7) rubber seal dress is put: use some glue machine to drip on LED chip by heat curing-type transparent silica gel, gold thread, LED chip are sealed in all completely in silica gel, shield.
(8) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm.
(9) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure.
Embodiment 10:
Above content a kind of can be described by luminous secret glass of the present invention; but the present invention is not by the limitation of embodiment content described above and corresponding embodiment; so all technical essentials according to the present invention carry out any improvement, equivalent modifications and replacement etc., all belong to the scope of protection of the invention.
Claims (9)
1. one kind can be luminous privacy coated glass, its composition comprises: LED, glass substrate, bus, privacy plated film, it is characterized in that: the upper surface of described glass substrate is pasted with conducting film uniformly, the lower surface of described glass substrate is pasted with described privacy plated film uniformly, described glass substrate upper surface is covered by protective membrane, the upper surface of the conducting glass substrate that described LED is arranged on described glass substrate by conductive resin and described conducting film is formed, described LED is the one in finished product LED or LED chip, described finished product LED or LED chip are sealed by seal gum.
2. according to claim 1 can be luminous privacy coated glass, it is characterized in that: described finished product LED is bound on described glass substrate by binding machine platform by described finished product LED, drips by a glue machine on described finished product LED by heat curing-type transparent silica gel.
3. according to claim 1 and 2 can be luminous privacy coated glass, it is characterized in that: described LED chip plates metal level on the conducting film described in the both sides of pre-binding, described metal level length and width are less than 50um*50um, described LED chip draws conductive resin with described metal level in pre-die bond region by binding machine platform, make to be bound on described glass substrate by described LED chip, by a glue machine, heat curing-type transparent silica gel is dripped on described LED chip, gold thread, described LED chip are sealed in silica gel all completely.
4. according to claim 1 or 2 or 3 can be luminous privacy coated glass, it is characterized in that: described conducting film is transparent conductive oxide film layer to be the one in FTO, ITO, AZO, ATO, IZO, GZO and LaNiO3 or serve as conductor for metal grill or nano-silver thread.
5. according to claim 1 or 2 or 3 or 4 can be luminous privacy coated glass, it is characterized in that: described privacy coating is metallic membrane or burning film.
6. according to claim 1 or 2 or 3 or 4 or 5 can be luminous privacy coated glass, it is characterized in that: described bus is conductive resin or silver slurry or elargol or metallic foil, and described metallic foil appearance arranges tin coating, and surface arranges metal wire joint.
7. according to claim 1 or 2 or 3 or 4 or 5 or 6 can be luminous privacy coated glass, it is characterized in that: described protective membrane is PVB or EVA, its thickness range 1mm 5mm, described conductive glass resistance per square is 1 ~ 100 Europe/side.
8. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 can be luminous privacy coated glass, it is characterized in that: containing circuit on described conductive glass, described circuit uses laser scribe, etching or mask plating method to make, described circuit, according on load voltage and LED rated current voltage, calculate total electrical resistance needed for circuit, according to resistance formula, calculate line width, 90 �� of corners are by 1/2nd resistance calculations, and described bus and described metal wire joint can be determined according to design.
9. what one of claim 18 was described can be luminous the binding method of privacy coated glass, it is characterized in that: the method comprises the steps:
Finished product LED binds
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design;
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed;
(3) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus; And make metal wire joint;
(4) bind: use binding machine platform to be bound on the glass making circuit by finished product LED;
(5) rubber seal dress is put: use some glue machine to drip on finished product LED by heat curing-type transparent silica gel, LED is sealed in silica gel completely, shields;
(6) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm;
(7) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure;
LED chip is bound
(1) plated film: glass is substrate, it may also be useful to the plated film mode glass such as vacuum plating plate conducting film, and glass is conducted electricity, by privacy film on another plated surface of glass, privacy film transmitance is according to product design;
(2) circuit is made: use laser scribe, etching or mask plating method to be made on conductive glass in the circuit designed;
(3) PAD point makes: according to LED location, plating metal level on the both sides conducting film of pre-binding, metal level length and width are less than 50um*50um;
(4) bus makes: according to design, it may also be useful to conductive resin or silver slurry utilize mode of printing to make bus; Or use metallic foil to make bus; And make metal wire joint;
(5) bind: use binding machine platform to take metal level as PR, draw conductive resin in pre-die bond region, make to be bound on conductive glass by LED chip;
(6) line is played: use wire bonding machine table, be connected with conductive glass by LED chip;
(7) rubber seal dress is put: use some glue machine to drip on LED chip by heat curing-type transparent silica gel, gold thread, LED chip are sealed in all completely in silica gel, shield;
(8) pasting protective film: being attached to by protective membrane (PVB or EVA) on the conductive glass film face posting LED face completely, its thickness is LED thickness+0.1mm ~ 1mm;
(9) layer pressure: glass coated with protective film is faced, high temperature cloth on covering, it may also be useful to laminating machine or vacuum still equipment are to gas producing formation pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610150155.2A CN105633249A (en) | 2016-03-16 | 2016-03-16 | Luminescable privacy coating film glass and binding method |
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Cited By (1)
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| CN106927698A (en) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
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