CN105629527B - A kind of probe block, detection device and display panel testing method - Google Patents

A kind of probe block, detection device and display panel testing method Download PDF

Info

Publication number
CN105629527B
CN105629527B CN201610007315.8A CN201610007315A CN105629527B CN 105629527 B CN105629527 B CN 105629527B CN 201610007315 A CN201610007315 A CN 201610007315A CN 105629527 B CN105629527 B CN 105629527B
Authority
CN
China
Prior art keywords
signal
signal line
line
signal wire
patch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610007315.8A
Other languages
Chinese (zh)
Other versions
CN105629527A (en
Inventor
盛化鹏
李世军
韦传兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201610007315.8A priority Critical patent/CN105629527B/en
Publication of CN105629527A publication Critical patent/CN105629527A/en
Application granted granted Critical
Publication of CN105629527B publication Critical patent/CN105629527B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The invention discloses a kind of probe block, detection device and display panel testing method, to solve in the prior art with the detection of the detection mode progress display panel of Drive IC combination COF, higher cost and the undesirable problem of detection effect.The probe block, including flexible circuit board, flexible circuit board includes the signal wire of several transmission detection signals, signal wire includes that the route in one end and liquid crystal display panel bonding wire disk overlaps the first signal wire and second signal line correspondingly, the other end and detection circuit board of first signal wire overlap, and the other end of second signal line is hanging;Flexible circuit board has positioned at the first Chip Area and the second Chip Area of non-end, first signal wire and second signal line are located at the exposure of the line segment in the first Chip Area and the second Chip Area, the line segment that first signal wire and second signal line are exposed is used to paste the patch being electrically connected by connecting line, so as to realize electrical connection between the first signal wire and second signal line of transmission same detection signal.

Description

A kind of probe block, detection device and display panel testing method
Technical field
The present invention relates to field of display technology more particularly to a kind of probe blocks, detection device and display panel testing method.
Background technique
In liquid crystal display panel manufacturing process, molding process is that the color film glass that will be completed and array glass paste It closes, obtains the liquid crystal display panel of specific dimensions after cutting, to reduce cost, most producer's selections are after at box, patch light polarizing film It is preceding that lighting inspection is carried out to panel, it can detecte out whether liquid crystal display panel has bad point in this stage, such as: bright spot or dim spot.
Existing probe block design combines flip chip (Chip On using special drive integrated circult (Drive IC) at present Film, COF) realize signal extension.As shown in Figure 1, when lighting checks liquid crystal display panel 100 is fixed on checks on base station first, The bonding wire disk (not shown) of flip chip 102 and liquid crystal display panel 100 in probe block 121 is overlapped, in such flip chip Signal line and liquid crystal display panel connection, wherein COF refers to integrated circuit (Integrated Circuit, IC) is solid Due to the crystal grain mantle in flexible circuit board.It include a plurality of connecting line 111, flexible circuit board (Flexible in COF 102 Printed Circuit Board, FPC) it include a plurality of connecting line 112 in 101, connecting line 111 and connecting line 112 correspond Connection, when carrying out lighting inspection to liquid crystal display panel, the signal generator 122 connecting with FPC 101 is to each in FPC 101 112 input signal of connecting line lights liquid crystal display panel.
But the detection mode of present technology, specific Drive IC combination COF, therefore higher cost are needed, and The delicate joint of Drive IC and FPC are unsatisfactory, and influence liquid crystal display panel lights detection effect.
Summary of the invention
The object of the present invention is to provide a kind of probe block, detection device and display panel testing methods, to solve existing skill Carry out the detection of display panel in art with the detection mode of specific Drive IC combination COF, higher cost and detection effect is paid no attention to The problem of thinking.
The purpose of the present invention is what is be achieved through the following technical solutions:
The embodiment of the present invention provides a kind of probe block, including flexible circuit board, and the flexible circuit board includes several biographies The signal wire of defeated detection signal, the signal wire include the first signal wire and second signal line, each first signal wire and each One end of the second signal line is overlapped with the route in liquid crystal display panel bonding wire disk correspondingly respectively, first signal wire The other end and detection circuit board overlap, the other end of the second signal line is hanging;
The flexible circuit board have positioned at non-end the first Chip Area and the second Chip Area, first signal wire and The second signal line be located at the line segment in first Chip Area and second Chip Area exposure, first signal wire and The line segment that the second signal line is exposed is used to paste the patch being electrically connected by connecting line, so that transmission same detection signal Electrical connection is realized between first signal wire and the second signal line.
In the present embodiment, by making the flexible circuit board of the probe block that there is exposure first signal wire and described the First Chip Area of binary signal line and second patch, to make line segment and the institute for first signal wire being exposed State second signal line line segment can directly paste by pre-provisioning request be electrically connected patch, realize with first signal wire and At least one matched the second signal line transmits identical detection signal, does not need specific Drive IC combination COF technology, drops Low cost;Meanwhile being attached with mount technology, there is good conduction, improve detection effect.
Preferably, the probe block further includes equal several first patches and several second patches of quantity, each described First patch is used to be covered on the exposure of corresponding first signal wire in first Chip Area and/or the second signal line Line segment on, each second patch is for being covered on corresponding first signal wire in second Chip Area and/or institute On the line segment for stating the exposure of second signal line;
Each first patch passes through connecting line with each second patch correspondingly and is electrically connected, and by same First patch and second patch of one connecting line electrical connection respectively correspond first signal wire and One second signal line;Or first patch and second patch being electrically connected by connecting line described in same Respectively correspond the second signal line of different two.
In the present embodiment, the line of first signal wire with first Chip Area and second patch exposure is provided Section patch corresponding with the line segment of the second signal line.
Preferably, all first signal wire is the first signal line group, and all the second signal line is second signal Line group, first signal line group and the second signal line group are without intersection;
Corresponding all described first signal wire in first Chip Area and all the second signal line, second patch Area only corresponds to the second signal line;Alternatively, first Chip Area only corresponds to the second signal line, second Chip Area Corresponding all described first signal wire and all the second signal line.
Preferably, all first signal wire is divided into two the first signal line groups, and all the second signal line is Second signal line group;The second signal line group is located between two first signal line groups, and with first signal wire Group is without intersection;
Whole first signal wire in corresponding first signal line group in first Chip Area and described the The whole of the binary signal line group second signal line, second Chip Area correspond to complete in another described first signal line group The whole of first signal wire described in portion and the second signal line group second signal line;Alternatively,
Corresponding all described first signal wire in first Chip Area and all the second signal line, second patch Area only corresponds to all second signal lines.
Preferably, the length of first signal wire and detection circuit board overlapped one end is beyond the second signal line Hanging one end.
Preferably, the item number of the second signal line is greater than or equal to the item number of first signal wire.
Preferably, the figure of the exposure of signal wire described in each in first Chip Area and second Chip Area is Rectangle.
Preferably, the material of the signal wire be copper, aluminium, platinum, gold and silver in any one or at least two mixing Metal.
The embodiment of the present invention has the beneficial effect that: by making the flexible circuit board of the probe block have exposure described first First Chip Area and second patch of signal wire and the second signal line, to make first letter being exposed Number line segment of line and the line segment of the second signal line can directly paste the patch being electrically connected by pre-provisioning request, realize with described First signal wire and the matched at least one second signal line transmit identical detection signal, do not need specific Drive IC In conjunction with COF technology, reduce costs;Meanwhile being attached with mount technology, there is good conduction, improve detection effect.
The embodiment of the present invention provides a kind of detection device, including providing the detection circuit board of detection signal with as described above Probe block.
The embodiment of the present invention has the beneficial effect that: by making the flexible circuit board of the probe block have exposure described first First Chip Area and second patch of signal wire and the second signal line, to make first letter being exposed Number line segment of line and the line segment of the second signal line can directly paste the patch being electrically connected by pre-provisioning request, realize with described First signal wire and the matched at least one second signal line transmit identical detection signal, do not need specific Drive IC In conjunction with COF technology, reduce costs;Meanwhile being attached with mount technology, there is good conduction, improve detection effect.
The embodiment of the present invention provides a kind of display panel testing method, and using detection device as described above, method includes:
It provides quantity equal several first patches and several second patches, each first patch is covered on described On the line segment of the exposure of corresponding first signal wire in first Chip Area and/or the second signal line, by each described Two patches are covered on the line segment of the exposure of corresponding first signal wire in second Chip Area and/or the second signal line On;Wherein, each first patch passes through connecting line with each second patch correspondingly and is electrically connected, and by same First patch and second patch of one connecting line electrical connection respectively correspond first signal wire and One second signal line, alternatively, first patch and second patch by the electrical connection of connecting line described in same Piece respectively corresponds the second signal line of different two;
Detection signal is provided to the first signal wire described in each, transmits the detection signal by first signal wire Route into overlapped the liquid crystal display panel bonding wire disk of the first signal wire described in this, and the detection signal is transmitted to and the institute Stating first patch pasted on the first signal wire or second patch has at least the one of direct or indirect connection relationship Second signal line described in item makes the detection signal be transmitted to this described at least one as at least one second signal line Route in second signal line overlapped liquid crystal display panel bonding wire disk.
The embodiment of the present invention has the beneficial effect that: by making the flexible circuit board of the probe block have exposure described first First Chip Area and second patch of signal wire and the second signal line, to make first letter being exposed Number line segment of line and the line segment of the second signal line can directly paste the patch being electrically connected by pre-provisioning request, realize with described First signal wire and the matched at least one second signal line transmit identical detection signal, utilize probe block described above It is detected, is not needed specific Drive IC combination COF technology, reduce costs;Meanwhile the institute being attached with mount technology The first signal wire and the second signal line are stated, there is good conduction, improves detection effect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that the probe block that the prior art provides is used for display panel lighting detection;
Fig. 2 is the structural schematic diagram of the first probe block provided in an embodiment of the present invention;
Fig. 3 is the structural schematic diagram of the set patch in the first probe block provided in an embodiment of the present invention;
Fig. 4 is the schematic diagram on the line segment for the exposure that set patch shown in Fig. 3 is covered on probe block shown in Fig. 2;
Fig. 5 is the arrangement mode and Chip Area combination of signal wire in the first probe block provided in an embodiment of the present invention Schematic diagram;
Fig. 6 is the arrangement mode and Chip Area combination of signal wire in second of probe block provided in an embodiment of the present invention Schematic diagram;
Fig. 7 provides the flow chart of the detection method of display panel for the embodiment of the present invention;
Fig. 8 is the schematic diagram of detection signal trend in probe block provided in an embodiment of the present invention.
Specific embodiment
The realization process of the embodiment of the present invention is described in detail with reference to the accompanying drawings of the specification.It should be noted that Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below It crosses the embodiment being described with reference to the drawings to be exemplary, for explaining only the invention, and be not considered as limiting the invention.
Referring to fig. 2, the embodiment of the present invention provides a kind of probe block, including flexible circuit board, and flexible circuit board includes several The signal wire of item transmission detection signal, signal wire include the first signal wire 1 and second signal line 2, each first signal wire 1 and Ge One end of binary signal line 2 is overlapped with the route in liquid crystal display panel bonding wire disk correspondingly respectively, the other end of the first signal wire 1 It is overlapped with detection circuit board, the other end of second signal line 2 is hanging;
Flexible circuit board has positioned at the first Chip Area 3 and the second Chip Area 4 of non-end, the first signal wire 1 and second Signal wire 2 is located at the exposure of the line segment in the first Chip Area 3 and the second Chip Area.Such as in Fig. 2, the first signal wire 1 is in the first patch The line segment 11 of the exposure of section 3, line segment 12 of first signal wire 1 in the exposure of the second Chip Area 4;Second signal line 2 is in the first patch The line segment 21 of the exposure of area 3, line segment 22 of the second signal line 2 in the exposure of the second Chip Area 4;
The line segment that first signal wire 1 and second signal line 2 are exposed is used to paste the patch being electrically connected by connecting line, so that It transmits and realizes electrical connection between the first signal wire 1 and second signal line 2 of same detection signal.
Since the first signal wire 1 and inspection can be made using the first signal wire 1 as the signal wire of detection signal is provided The length of slowdown monitoring circuit plate overlapped one end exceeds hanging one end of second signal line 2, can save space-efficient occupancy.
Preferably, the item number of second signal line 2 is greater than or equal to the item number of the first signal wire 1.
Preferably, the figure of each signal line exposure in the first Chip Area 3 and the second Chip Area 4 is rectangle.Certainly, The figure of each signal line exposure in first Chip Area 3 and the second Chip Area 4 may be other geometric figures, such as circle Shape, triangle, hexagon, trapezoidal etc., based on purpose easy to accomplish, preferably rectangle.
Preferably, the material of the first signal wire 1 and second signal line 2 be copper, aluminium, platinum, gold and silver in any one or At least two mixed metal.
In order to cooperate each signal line (such as the first signal wire 1 and second in the first Chip Area 3 and the second Chip Area 4 Signal wire 2) exposure line segment, corresponding set patch is provided.As shown in figure 3, probe block further includes equal several of quantity One patch 5 and several second patches 6, each first patch 5 for be covered on corresponding first signal wire 1 in the first Chip Area 3 and/ Or on the line segment (such as line segment 11 and/or line segment 21) of the exposure of second signal line 2, each second patch 6 is for being covered on the The line segment (such as line segment 12 and/or line segment 22) of the exposure of corresponding first signal wire 1 in two Chip Area 4 and/or second signal line 2 On;
Each first patch 5 is electrically connected by connecting line 7 correspondingly with each second patch 6, and passes through same The first patch 5 and the second patch 6 that the connecting line 7 is electrically connected respectively correspond first signal wire 1 and a second signal Line 2;Or the first patch 5 being electrically connected by connecting line 7 described in same and the second patch 6 respectively correspond different two articles the Binary signal line 2.In the present embodiment, the line segment and second of the first signal wire 1 with the first Chip Area 3 and the exposure of the second patch is provided The corresponding patch of the line segment of signal wire 2, the first patch 5 and the second patch 6 are covered on the of the first Chip Area 3 and the exposure of the second patch Schematic diagram on the line segment of one signal wire 1 and the line segment of second signal line 2 is as shown in Figure 4.
The present embodiment has the beneficial effect that: by making the flexible circuit board of probe block have the first signal wire 1 of exposure and the The first Chip Area 3 and the second Chip Area 4 of binary signal line 2, to make the line segment and second signal of the first signal wire 1 being exposed The line segment of line 2 can directly paste the patch being electrically connected by pre-provisioning request, realize with the first signal wire 1 and matched at least one Second signal line 2 transmits identical detection signal, does not need specific Drive IC combination COF technology, reduces costs;Meanwhile It is attached with mount technology, there is good conduction, improve detection effect.
Certainly, the first signal wire 1 and second signal line 2 can be there are many arrangement modes, corresponding first Chip Area 3 and the Two Chip Areas 4 also have the group matched with arrangement mode:
For example, as shown in figure 5, all the first signal wire 1 is divided into two the first signal line groups 13, whole second signal lines 2 be second signal line group 23;Second signal line group 23 is located between two the first signal line groups 13, and second signal line group 23 with First signal line group 13 is without intersection;
All the first signal wires 1 in corresponding 1 group of first signal wire in first Chip Area 3 and 2 groups of second signal line Whole second signal lines 2, the second Chip Area 4 correspond to all the first signal wires 1 and the second letter in 1 group of another first signal wire Numbers 2 groups of line of whole second signal lines 2;It can certainly corresponding all the first signal wires 1 in the first Chip Area 3 and whole second letters Number line 2, the second Chip Area 4 only corresponding whole second signal lines 2, details are not described herein.
In another example whole second signal lines 2 are the as shown in fig. 6, all the first signal wire 1 is the first signal line group 13 Binary signal line group 23, the first signal line group 13 is with second signal line group 23 without intersection;First Chip Area 3 only corresponds to second signal line 2, the second Chip Area 4 corresponds to all the first signal wires 1 and whole second signal lines 2;Can certainly the first Chip Area 3 it is corresponding complete The first signal wire of portion 1 and whole second signal lines 2, the second Chip Area 4 only corresponds to second signal line 2, and details are not described herein.
The arrangement mode of above-mentioned Fig. 5 and the first signal wire 1 and second signal line 2 shown in fig. 6, with 3 He of the first Chip Area The arrangement mode of second Chip Area 4 can according to need carry out modification, with can the different detection demand of adaptation.
The embodiment of the present invention has the beneficial effect that: by make probe block flexible circuit board have exposure the first signal wire and The first Chip Area and the second Chip Area of second signal line, to make the line segment and second signal line for the first signal wire being exposed Line segment can directly paste the patch being electrically connected by pre-provisioning request, realize with the first signal wire and matched at least one the second Signal wire transmits identical detection signal, does not need specific DriveIC combination COF technology, reduces costs;Meanwhile with patch Technology is attached, and has good conduction, improves detection effect.
The embodiment of the present invention provides a kind of detection device, including providing the detection circuit board of detection signal with probe as above Block.
The embodiment of the present invention has the beneficial effect that: by make probe block flexible circuit board have exposure the first signal wire and The first Chip Area and the second Chip Area of second signal line, to make the line segment and second signal line for the first signal wire being exposed Line segment can directly paste the patch being electrically connected by pre-provisioning request, realize with the first signal wire and matched at least one the second Signal wire transmits identical detection signal, does not need specific DriveIC combination COF technology, reduces costs;Meanwhile with patch Technology is attached, and has good conduction, improves detection effect.
Referring to Fig. 7, the embodiment of the present invention provides a kind of display panel testing method, using detection device as above, method Include:
201, it provides quantity equal several first patches and several second patches, each first patch is covered on first On the line segment of the exposure of corresponding first signal wire in Chip Area and/or second signal line, each second patch is covered on second On the line segment of the exposure of corresponding first signal wire in Chip Area and/or second signal line;Wherein, each first patch and each the Two patches are electrically connected by connecting line correspondingly, and pass through the first patch and second of the electrical connection of connecting line described in same Patch respectively corresponds first signal wire and a second signal line, alternatively, passing through the electrical connection of connecting line described in same First patch and the second patch respectively correspond two different second signal lines;
202, to the first signal wire of each provide detection signal, make detect signal by the first signal wire be transmitted to this first Route in signal wire overlapped liquid crystal display panel bonding wire disk, and will test signal and be transmitted to and pasted on first signal wire First patch or the second patch have at least one second signal line of direct or indirect connection relationship, make to detect signal by this extremely A few second signal line is transmitted at least one second signal line overlapped the route in liquid crystal display panel bonding wire disk.
The set shown in Fig. 4 that is covered with is provided and is pasted for the specific trend of clearer description detection signal referring to Fig. 7 That signal is detected in the probe block of piece moves towards schematic diagram, wherein detection signal is supplied to first signal wire by arrow 90 1, on the one hand through first signal wire 1 along 91 direction of arrow be transmitted to route in overlapped liquid crystal plate bonding wire disk, it is another Aspect is transmitted to the second signal line 2 being directly electrically connected (it can be appreciated that the first letter along 92 direction of arrow through connecting line 7 The second patch 6 on number line 1 transmits the detection signal through connecting line 7 with the first patch 5 on second signal line 2), the inspection later Survey the route that signal is transmitted in institute's overlapped liquid crystal plate bonding wire disk along 93 direction of arrow through the second signal line 2, and this Detection signal is transmitted to another second signal line 2 along 94 direction of arrow and 95 direction of arrow through the second signal line 2, and yet another the Binary signal line 2 repeats the transmission of above-mentioned second signal line 2.
The embodiment of the present invention has the beneficial effect that: by make probe block flexible circuit board have exposure the first signal wire and The first Chip Area and the second Chip Area of second signal line, to make the line segment and second signal line for the first signal wire being exposed Line segment can directly paste the patch being electrically connected by pre-provisioning request, realize with the first signal wire and matched at least one the second Signal wire transmits identical detection signal, is detected using above-mentioned probe block, does not need specific Drive IC combination COF skill Art reduces costs;Meanwhile the first signal wire and second signal line being attached with mount technology, there is good conducting Property, improve detection effect.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to include these modifications and variations.

Claims (10)

1. a kind of probe block, including flexible circuit board, the flexible circuit board includes the signal wire of several transmission detection signals, It is characterized by:
The signal wire includes the first signal wire and second signal line, each first signal wire and each second signal line One end is overlapped with the route in liquid crystal display panel bonding wire disk correspondingly respectively, the other end and detection electricity of first signal wire Road plate overlap joint, the other end of the second signal line are hanging;
The flexible circuit board has positioned at the first Chip Area and the second Chip Area of non-end, first signal wire and described Second signal line is located at the exposure of the line segment in first Chip Area and second Chip Area, first signal wire and described The line segment that second signal line is exposed is used to paste the patch being electrically connected by connecting line, so that transmission same detection signal is described Electrical connection is realized between first signal wire and the second signal line.
2. probe block as described in claim 1, which is characterized in that the probe block further includes equal several first patches of quantity Piece and several second patches, each first patch is for being covered on corresponding first signal wire in first Chip Area And/or on the line segment of the exposure of the second signal line, each second patch is for being covered on second Chip Area pair On the line segment of the exposure of first signal wire and/or the second signal line answered;
Each first patch passes through connecting line with each second patch correspondingly and is electrically connected, and passes through same First patch and second patch of the connecting line electrical connection respectively correspond first signal wire and one The second signal line;Or first patch being electrically connected by connecting line described in same and second patch are distinguished Corresponding two different second signal lines.
3. probe block as claimed in claim 1 or 2, which is characterized in that all first signal wire is the first signal line group, All the second signal line is second signal line group, and first signal line group and the second signal line group are without intersection;
Corresponding all described first signal wire in first Chip Area and all the second signal line, second Chip Area is only The corresponding second signal line;Alternatively, first Chip Area only corresponds to the second signal line, second Chip Area is corresponding All first signal wire and all the second signal line.
4. probe block as claimed in claim 1 or 2, which is characterized in that all first signal wire is divided into two first Signal line group, all the second signal line is second signal line group;The second signal line group is located at two first letters Between number line group, and with first signal line group without intersection;
Whole first signal wire and second letter in corresponding first signal line group in first Chip Area The whole second signal line of number line group, second Chip Area corresponds to the whole institute in another described first signal line group State the whole second signal line of the first signal wire and the second signal line group;Alternatively,
Corresponding all described first signal wire in first Chip Area and all the second signal line, second Chip Area is only The corresponding all described second signal line.
5. probe block as described in claim 1, which is characterized in that first signal wire and detection circuit board overlapped one end Length exceed the second signal line hanging one end.
6. probe block as described in claim 1, which is characterized in that article number of the second signal line is greater than or equal to described the The item number of one signal wire.
7. probe block as described in claim 1, which is characterized in that every in first Chip Area and second Chip Area The shape of the line segment of one signal wire exposure is rectangle.
8. probe block as described in claim 1, which is characterized in that the material of the signal wire is in copper, aluminium, platinum, gold and silver Any one or at least two mixed metal.
9. a kind of detection device, including providing the detection circuit board of detection signal, which is characterized in that the detection device further includes Probe block as described in any claim of claim 1-8.
10. a kind of display panel testing method, using detection device as claimed in claim 9, which is characterized in that method packet It includes:
It provides quantity equal several first patches and several second patches, each first patch is covered on described first On the line segment of the exposure of corresponding first signal wire in Chip Area and/or the second signal line, by each second patch Piece is covered on the line segment of the exposure of corresponding first signal wire in second Chip Area and/or the second signal line; Wherein, each first patch passes through connecting line with each second patch correspondingly and is electrically connected, and by same First patch and second patch of the electrical connection of connecting line described in item respectively correspond first signal wire and one Second signal line described in item, alternatively, passing through first patch and second patch of the electrical connection of connecting line described in same Respectively correspond the second signal line of different two;
Detection signal is provided to the first signal wire described in each, the detection signal is made to be transmitted to this by first signal wire Route in first signal wire overlapped liquid crystal display panel bonding wire disk, and the detection signal is transmitted to and described in this First patch or second patch pasted on one signal wire has at least one institute of direct or indirect connection relationship State second signal line, make the detection signal by at least one second signal line be transmitted to this at least one described second Route in signal wire overlapped liquid crystal display panel bonding wire disk.
CN201610007315.8A 2016-01-06 2016-01-06 A kind of probe block, detection device and display panel testing method Expired - Fee Related CN105629527B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610007315.8A CN105629527B (en) 2016-01-06 2016-01-06 A kind of probe block, detection device and display panel testing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610007315.8A CN105629527B (en) 2016-01-06 2016-01-06 A kind of probe block, detection device and display panel testing method

Publications (2)

Publication Number Publication Date
CN105629527A CN105629527A (en) 2016-06-01
CN105629527B true CN105629527B (en) 2019-01-08

Family

ID=56044623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610007315.8A Expired - Fee Related CN105629527B (en) 2016-01-06 2016-01-06 A kind of probe block, detection device and display panel testing method

Country Status (1)

Country Link
CN (1) CN105629527B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1152721A (en) * 1995-01-13 1997-06-25 精工爱普生株式会社 Liquid crystal display and making method
CN1263280A (en) * 1999-01-18 2000-08-16 精工爱普生株式会社 Connection wiring base board of electro-optical board, electro-optical device and electronic device
JP2002171031A (en) * 2000-11-30 2002-06-14 Optrex Corp Flexible wiring board and liquid crystal display
CN103582296A (en) * 2012-08-10 2014-02-12 乐金显示有限公司 Flexible printed circuit film and display device using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3751775B2 (en) * 1999-08-26 2006-03-01 鹿児島日本電気株式会社 Liquid crystal drive tape carrier package
US6433414B2 (en) * 2000-01-26 2002-08-13 Casio Computer Co., Ltd. Method of manufacturing flexible wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1152721A (en) * 1995-01-13 1997-06-25 精工爱普生株式会社 Liquid crystal display and making method
CN1263280A (en) * 1999-01-18 2000-08-16 精工爱普生株式会社 Connection wiring base board of electro-optical board, electro-optical device and electronic device
JP2002171031A (en) * 2000-11-30 2002-06-14 Optrex Corp Flexible wiring board and liquid crystal display
CN103582296A (en) * 2012-08-10 2014-02-12 乐金显示有限公司 Flexible printed circuit film and display device using the same

Also Published As

Publication number Publication date
CN105629527A (en) 2016-06-01

Similar Documents

Publication Publication Date Title
CN105632382A (en) Display device and method for detecting binding condition of binding area
CN205643942U (en) Circuit plate structure and display device
CN101216643B (en) LCD device array substrate, its mending method and LCD device
WO2018192017A1 (en) Narrow-bezel display panel and display
CN101847357A (en) Display panel, display device and test method thereof
CN102073159B (en) Repair circuit of display panel and repair method thereof
CN105319787A (en) Liquid crystal display module
CN101692329B (en) Impedance value detection method for display and display carrying structure
CN108761853A (en) A kind of the lighting detection device and method of liquid crystal display panel
CN107481619A (en) Display module and display device
CN102831852B (en) TFT-LCD (thin film transistor-liquid crystal display) array substrate and test method of TFT-LCD array substrate
CN105629527B (en) A kind of probe block, detection device and display panel testing method
CN105426015A (en) Array substrate, display panel as well as detection and repair method for display panel
CN205506989U (en) Point screen tool
CN103018936B (en) A kind of prober frame of array substrate detection equipment and checkout equipment
CN208609260U (en) Interface printed circuit board, printed circuit board and display device
CN208334229U (en) Printed IC board detection system
CN108646463A (en) Backlight module and detection backlight module whether the method and display device of heavy industry
CN101572045B (en) Flat display and measurement method thereof
KR101101807B1 (en) Semiconductor package, apparatus for testing semiconductor package and method using the same
CN103399457B (en) Camera module automatic focusing function test macro and method
CN102097158A (en) Anisotropic conductive film (ACF) structure
CN103257466A (en) Connector of display panel detection device, display panel detection device and display panel detection method
CN206627722U (en) COG LCD MODULEs
CN106939969B (en) A kind of light source, backlight and display device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190108

Termination date: 20220106